CN219959031U - Light-emitting chip packaging structure and light-emitting device - Google Patents

Abstract

The utility model relates to a light-emitting chip packaging structure and a light-emitting device, wherein the light-emitting chip packaging structure comprises a plurality of light-emitting chips which are arranged at intervals, a first roughened surface is formed on the light-emitting side of the light-emitting chips, and a plurality of concave patterns are formed on the first roughened surface; a light-transmitting substrate, on which a second roughened surface is formed, the second roughened surface including a plurality of raised patterns thereon; the bonding layer is arranged between the light-emitting chip and the light-transmitting substrate to fix the light-emitting chip and the light-transmitting substrate, and the light-emitting side of the light-emitting chip is arranged opposite to the second roughened surface of the light-transmitting substrate. Can provide better lighting angle and brightness in some implementations.

Description

Light-emitting chip packaging structure and light-emitting device

Technical Field

The present utility model relates to the field of LEDs, and in particular, to a light emitting chip package structure and a light emitting device.

Background

Micro LED (Micro Light Emitting Diode ) meets the requirements of various pixel densities and various size displays, such as AR (Augmented Reality )/VR (Virtual Reality), smart watch, large screen television, etc., by virtue of the characteristics of low power consumption, high brightness, high contrast and high reliability. As the area of the LED (Light Emitting Diode ) chip is continuously reduced, the wafer utilization rate per unit area is greatly improved, which means that the cost of the LED chip is continuously reduced. For better application, some related technologies package a plurality of light emitting chips such as LEDs into an integrated package structure, so as to facilitate the later production, for example MIP (Micro LED in Package) is a novel package structure based on Micro LEDs, and the package structure is a small-pitch display product of king cards with long-term experience, which can be called as an organic combination of Micro LEDs and discrete devices. When the light emitting chip package structure is applied to large-screen display, the light emitting angle and the brightness of the light emitting chip package structure also need to be further improved.

Therefore, how to increase the light emitting angle and brightness of the light emitting chip package structure is a problem to be solved.

Disclosure of Invention

In view of the above-mentioned drawbacks of the related art, an object of the present utility model is to provide a light emitting chip package structure and a light emitting device, which aim to solve the problem that the light emitting angle and the luminance of the light emitting chip package structure need to be further improved.

A light emitting chip package structure, comprising: the light emitting device comprises a plurality of light emitting chips arranged at intervals, wherein a first roughened surface is formed on the light emitting side of the light emitting chips, and the first roughened surface comprises a plurality of concave patterns;

a light-transmitting substrate, wherein a second roughened surface is formed on the light-transmitting substrate, and the second roughened surface comprises a plurality of raised patterns;

and the bonding layer is arranged between the light-emitting chip and the light-transmitting substrate to fix the light-emitting chip and the light-transmitting substrate, and the light-emitting side of the light-emitting chip is arranged opposite to the second roughened surface of the light-transmitting substrate.

According to the light-emitting chip packaging structure, through the light-emitting chips and the two roughened surfaces on the light-transmitting substrates for packaging the light-emitting chips, the overall luminous angle and luminous brightness of the light-emitting chip packaging structure are effectively improved, patterns on the first roughened surface and the second roughened surface are in different shapes of one convex and one concave, the patterns on the first roughened surface on the light-emitting chips are formed into a concave structure, and better improvement of luminous brightness can be achieved in some implementation processes.

Optionally, the inner wall of the concave pattern is inclined, and the inner diameter of the concave pattern increases from a side away from the light-transmitting substrate to a side close to the light-transmitting substrate.

The concave pattern with the inclined inner wall can have a good luminous angle and a good brightness improving effect.

Optionally, the sidewalls of the protrusion patterns are inclined, and the outer diameters of the protrusion patterns increase from a side away from the light-transmitting substrate to a side close to the light-transmitting substrate.

The convex patterns with inclined side walls can have better luminous angles and brightness improving effects.

Optionally, the light emitting chip package structure at least includes red, green and blue light emitting chips with different light emitting colors, the light emitting chip package structure further includes a routing layer, the routing layer includes a first pad area connected with a first pole of the light emitting chip, and a second pad area connected with a second pole of the light emitting chip, and the first pad area and the second pad area are pad areas electrically connected with the light emitting chip package structure.

The light emitting chip package structure comprising the light emitting chips of the optical three primary colors can be used as at least one independent pixel unit for displaying, and the light emitting chips of various colors are packaged and led out of the pad area, so that the subsequent processing and production can be simplified.

Based on the same inventive concept, the utility model also provides a light emitting device, which comprises the light emitting chip packaging structure and a circuit substrate, wherein the light emitting chip packaging structure is arranged on the circuit substrate, and a conductive circuit on the circuit substrate is electrically connected with the light emitting chip in the light emitting chip packaging structure.

The light-emitting chip packaging structure enables the light-emitting device to have better brightness in some implementation processes, and is large in light-emitting angle and good in light-emitting effect.

Drawings

Fig. 1 is a schematic structural diagram of a light emitting chip package structure according to an embodiment of the present utility model;

fig. 2 is an enlarged schematic diagram of a partial structure of a light emitting chip package structure according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a light emitting chip according to an embodiment of the present utility model;

fig. 4 is another schematic structural diagram of a light emitting chip package structure according to an embodiment of the present utility model;

fig. 5 is a schematic diagram of a trace layer of a light emitting chip package structure according to an embodiment of the present utility model;

reference numerals illustrate:

101-a light-transmitting substrate; 102-a bonding layer; 103-a raised pattern; 104-a light emitting chip; 1041-a growth substrate; 1042-a first semiconductor layer; 1043-an active layer; 1044-a second semiconductor layer; 1045-a transparent conductive layer; 1046-a passivation layer; 1047-electrodes; 105-a pattern of depressions; 106, a wiring layer; 1061—a first pad region; 1062-a second pad region; 1063-connection path; 107-a planar layer; 108-an encapsulation layer.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

In the related art, the light emitting angle and the brightness of the light emitting chip package structure need to be further improved.

Based on this, the present utility model is intended to provide a solution to the above technical problem, the details of which will be described in the following examples.

Examples:

in this embodiment, referring to the example of fig. 1 to 5, the light emitting chip package structure includes, but is not limited to, a plurality of light emitting chips 104 disposed at intervals, and in order to increase the brightness and the light emitting angle of the light emitting chips 104, a first roughened surface is formed on the light emitting side, and a plurality of concave patterns are included on the first roughened surface. The light emitting chip package structure further includes a light transmissive substrate 101, and a bonding layer 102 for fixing each light emitting chip 104 to the light transmissive substrate 101, wherein the bonding layer 102 may be disposed between the light transmissive substrate 101 and the light emitting chip 104 to connect the two. In order to further secure the overall light emitting angle and brightness of the light emitting chip package structure, a second roughened surface is formed on the light transmissive substrate 101, and the second roughened surface includes a plurality of protrusion patterns 103 thereon. In this embodiment, the light emitting side of the light emitting chip 104 is opposite to the second roughened surface of the transparent substrate 101, that is, the side of the light emitting chip 104 with the first roughened surface is opposite to the side of the transparent substrate 101 with the second roughened surface.

In the light emitting chip package structure of the present embodiment, through the light emitting chips 104 and the two roughened surfaces on the light transmitting substrate 101 on which the light emitting chips 104 are disposed, the light emitting angle and the light emitting brightness of the whole light emitting chip package structure are effectively improved, and it should be noted that, compared with the case that the roughened surfaces all adopt the conventional convex roughened patterns, the patterns on the first roughened surface and the second roughened surface in the present embodiment have different shapes of a convex shape and a concave shape, and the patterns on the first roughened surface on the light emitting chips 104 are formed into a concave structure, which can improve the light emitting brightness in some implementation processes.

In some embodiments, the inner wall of the concave pattern of the first roughened surface is inclined, and the inner diameter of the concave pattern increases from a side away from the light-transmissive substrate 101 to a side close to the light-transmissive substrate 101. The inclination of the inner wall of the concave pattern may be uniform or may vary, for example, the profile of a side cross section of the inner wall may be arc-shaped. For example, the space shape of the concave pattern may be at least one of a portion of a sphere, a mesa, and a cone.

In some embodiments, the sidewalls of the raised pattern 103 on the second roughened surface are sloped, and the outer diameter of the raised pattern 103 increases from a side away from the light transmissive substrate 101 to a side closer to the light transmissive substrate 101. The inclination of the sidewalls of the protrusion patterns 103 may be uniform or may be varied, for example, a side cross-sectional profile of the sidewalls may be arc-shaped. Illustratively, the protrusion pattern 103 may be at least one of a portion of a sphere, a mesa, and a cone.

Illustratively, the slope of the inner wall/sidewall of the concave pattern 105 and/or the convex pattern 103 may be set to 35-55 degrees, for example, 40 degrees, 45 degrees, 50 degrees, etc., and in actual production, the shape of the concave pattern 105 and/or the convex pattern 103 may not be perfectly regular and flat, the sidewall thereof may also form an arc surface, and in actual application, the slope of the line from the bottom edge of the concave pattern 105 and/or the convex pattern 103 to the apex thereof (or the top end of the sidewall) may also be regarded as the slope thereof.

The arrangement density of the concave patterns 105 may be the same as or different from the arrangement density of the convex patterns 103. The arrangement density of the concave patterns 105 and the convex patterns 103 corresponds to the number of concave patterns 105 and convex patterns 103 per unit area. In some examples, the arrangement density of the concave patterns 105 and the convex patterns 103 may be made different, so as to form inconsistent roughened surfaces on the first transparent substrate 101 of the light emitting chip 104 and the second transparent substrate 101 of the light emitting chip package structure, respectively, so as to improve the light extraction efficiency of light. In general, the distribution of the concave patterns 105 and/or the convex patterns 103 on the respective disposition surfaces is uniform, and the concave patterns 105 and/or the convex patterns 103 may be each in a regular or irregular arrangement, for example, may be in an array-type regular arrangement. The dimensions of the concave pattern 105 and the convex pattern 103 may be the same or different according to actual requirements.

As an example, see a partially enlarged schematic view of a cross section of the light emitting chip package structure shown in fig. 2. In this example, the light emitting chip 104 may be a Micro LED chip, and the light emitting side of the light emitting chip 104 and the light transmitting substrate 101 are respectively formed with an inverted triangle shape and a triangle shape, wherein the triangle shape on the light transmitting substrate 101 is the bump pattern 103, the bottom width L1 may be set to 2-3.5um, for example, 2.5um, 3um, and the like, and the height L2 may be 1.5-3um, for example, 2um, 2.5um, and the like. In some examples, the cross-sectional shape of the protrusion pattern 103 may also be trapezoidal, and then its top width may be 1.5-2.5um, e.g., 1.7um, 2um, etc. On the light emitting side of the light emitting chip 104, a concave platform is formed between the inverted triangles, where the length L3 of the concave platform may be set to 1.5-3.5um, for example, 2um, 2.5um, 3um, the base width L4 of the inverted triangle area may be 1.5-3.5um, for example, 2um, 2.5um, 3um, and the height L5 may be 1.5-3um, for example, 2um, 2.5um, etc. In some examples, the inverted triangle-shaped region may also be inverted trapezoid-shaped. It should be noted that, the protrusions and recesses in the present utility model refer to their corresponding surfaces, and are not affected by the placement direction, for example, the concave platform on the light emitting chip 104 in fig. 2 is configured towards the transparent substrate 101, and in the placement reference direction shown in fig. 2, the shape of the concave platform is a convex platform structure, but the concave platform is concave compared to the surface of the light emitting chip 104 itself.

Illustratively, the transparent substrate 101 may be made of sapphire or other transparent substrate materials. The bonding layer 102 thereon may be an adhesive paste to fix the light emitting chips 104 transferred onto the light transmissive substrate 101 by adhesion. As shown in fig. 2, the thickness of the bonding layer 102 may be greater than the sum of the heights (l1+l5) of the concave pattern 105 and the convex pattern 103. This allows a certain spacing between the concave pattern 105 and the convex pattern 103, which can ensure that light exiting through the first roughened surface can be better affected again by the second roughened surface. In some embodiments, the first roughened surface and the second roughened surface have a spacing of 1-2um. The distance between the first roughened surface and the second roughened surface may be controlled based on the set thickness of the bonding layer 102, and it should be understood that concave or convex structures are formed on the first roughened surface and the second roughened surface, and the distance between the first roughened surface and the second roughened surface should be understood as the closest distance between the first roughened surface and the second roughened surface.

Referring to fig. 3, a structure of a light emitting chip 104 is illustrated. The light emitting chip 104 of the present embodiment includes a first semiconductor layer 1042, an active layer 1043, a second semiconductor layer 1044, a transparent conductive layer 1045, a passivation layer 1046 covering the surface, and an electrode 1047 connected to the semiconductor layer. The first semiconductor layer 1042, the active layer 1043, the second semiconductor layer 1044 and the transparent conductive layer 1045 are stacked in this order, and the second semiconductor layer 1044 and the active layer 1043 are etched to form a mesa to expose the first semiconductor layer 1042 below. The passivation layer 1046 is disposed on the surface of the stacked structure, and is formed with a mesa corresponding to the first semiconductor layer 1042 and an electrode 1047 through hole of the transparent conductive layer 1045, and the two electrodes 1047 of the light emitting chip 104 are electrically connected to the first semiconductor layer 1042 and the second semiconductor layer 1044 respectively through the electrode 1047 through hole. When the light emitting chip 104 is fabricated, a complementary pattern corresponding to the first roughened surface may be formed on the growth substrate 1041, and when the first semiconductor layer 1042 grows on the growth substrate 1041, a side thereof adjacent to the growth substrate 1041 forms the first roughened surface. The light emitting chip 104 may be peeled off from the growth substrate 1041 before transferring the light emitting chip 104 to the bonding layer 102.

For example, the light emitting chip package structure of the present embodiment may include two or more light emitting chips 104 of different light emitting colors. For example, referring to fig. 4, the light emitting chip package structure further includes a trace layer 106, where the trace layer 106 is connected to the electrode 1047 of each light emitting chip 104, and the light emitting chip package structure may be electrically connected to an external driving circuit through a pad area in the trace layer 106, so as to perform driving control on the packaged light emitting chips 104 therein. The interval distance between the light emitting chips 104 is set according to the actual situation, and in practical application, in order to reduce the size of Pixels and improve PPI (pixel Per Inch) of the display product, the interval between the light emitting chips 104 can be reduced as much as possible. In practice, the light emitting chips 104 of different colors may be manufactured separately and transferred to the transparent substrate 101 after being manufactured by a method including, but not limited to, mass transfer. As an example, the light emitting chips 104 in a single light emitting chip package structure may include a red light emitting chip 104, a green light emitting chip 104, and a blue light emitting chip 104, and the light emitting chip package structure including the light emitting chips 104 of the three primary colors of optics may display as at least one independent pixel unit, and of course, the selection of the light emitting color of the light emitting chip 104 of the present embodiment is not limited thereto.

To drive these light emitting chips 104 in the light emitting chip package structure, the trace layer 106 includes a first pad region 1061 connected to a first pole of the light emitting chip 104, and a second pad region 1062 connected to a second pole of the light emitting chip 104. The first electrode of the light emitting chip 104 is one of a positive electrode and a negative electrode, the second electrode is the other of the positive electrode and the negative electrode, and the total number of the first pad area 1061 and the second pad area 1062 may be the same as the number of the electrodes 1047 of the light emitting chip 104, or may be designed in a common positive electrode or a common negative electrode. The first pad area 1061 and the second pad area 1062 in the present utility model are areas where the light emitting chip package structure is electrically connected to the outside, that is, at least exposed portions thereof are used to connect with other conductors, in practical application, the routing layer 106 may further include connection paths 1063 connecting the first pad area 1061 and the second pad area 1062 with the corresponding electrode 1047, and these connection paths 1063 are also patterned conductive lines, and the connection paths 1063 may be packaged inside without being exposed to the outside. Illustratively, the material of the trace layer 106 may be selected from conductive metals including, but not limited to, at least one of Cr, ni, al, ti, au, pt, W, pb, rh, sn, cu, ag, and the like. The first pad area 1061, the second pad area 1062, and the connection path 1063 may be made of the same or different materials, and may be formed simultaneously or separately in the process of manufacturing, which is not limited in this embodiment.

In some embodiments, the number of first pad areas 1061 is the same as the number of first poles, and each of the first pad areas 1061 is independent from each other and connected in one-to-one correspondence with the first poles; the number of the second pad areas 1062 is one, and each second electrode is simultaneously connected to the second pad area 1062, so that each light emitting chip 104 can be independently lighted and controlled to brightness, thereby meeting the control requirement of pixel display, reducing the number of the pad areas as much as possible, and being beneficial to downsizing and bonding simplification. For example, in the example of fig. 5, three light emitting chips 104 are disposed in the light emitting chip package structure, each light emitting chip 104 has a first pole and a second pole, three first pad areas 1061 are disposed on the trace layer 106, one of the first pad areas 1061 is connected to the first pole of the light emitting chip 104, and the second pad area 1062 is connected to the second pole of each light emitting chip 104. In the above example, the first electrode may be a positive electrode or a negative electrode, and the first electrode may be a positive electrode and form a common negative electrode. In the above example, each pad area is disposed at a corner of the light emitting chip package structure and is connected to the electrode 1047 of the light emitting chip 104 through the connection path 1063 in the routing layer 106, and in other examples, the first pad area 1061 and the second pad area 1062 may be disposed at other positions, and the specific pattern of the routing layer 106 may be set according to the actual situation, which is not limited in the present utility model.

Referring to fig. 4 again, in the present embodiment, the side of the light emitting chip 104 close to the bonding layer 102 is the light emitting side of the light emitting chip 104, and the electrode 1047 of the light emitting chip 104 is located at the side far from the bonding layer 102. In order to better connect the electrode 1047 of the light emitting chip 104 with the trace layer 106, a planarization layer 107 for laying the trace layer 106 may be disposed around the light emitting chip 104. The flat layer 107 is used to fill the area between the light emitting chips 104 and raise the plane around the light emitting chips 104, which makes the setting position of the routing layer 106 have smaller height difference from the electrode 1047 of the light emitting chips 104, and the routing layer 106 has smaller gradient change around the electrode 1047 of the light emitting chips 104, so as to be beneficial to metal climbing. In practical applications, in order to achieve a better arrangement effect of the routing layer 106, the thickness of the planarization layer 107 is generally similar to or identical to the height of the light emitting chip 104, and for example, the difference between the thickness of the planarization layer 107 and the height of the light emitting chip 104 may be controlled within 1um, and in other examples, 2um and 3um may be selected, which may be specifically set according to practical process requirements.

It should be noted that the light emitting chip 104 of the present utility model includes a Micro LED chip, and in other examples, may also include a Mini LED (Mini Light Emitting Diode, sub-millimeter light emitting diode) chip or other type of LED (Light Emitting Diode ) chip.

In some embodiments, the first roughened surface includes a recessed pattern 105 and the second roughened surface includes a raised pattern 103. That is, the first light-transmitting substrate 101 and the second light-transmitting substrate 101 in the light-emitting chip package structure of the present embodiment are both formed with a convex structure. The shapes of the concave pattern 105 and the convex pattern 103 may be the same or different, and in some embodiments, the concave pattern 105 and/or the convex pattern 103 may be a cone, a portion of a sphere, or other regular or irregular convex structure. The concave pattern 105 and/or the convex pattern 103 may have a shape of a sharp peak, or may have a certain land area formed on the top, for example, a truncated cone shape.

As shown in fig. 4, in this embodiment, a black glue layer is further disposed on the second roughened surface of the light emitting chip package structure, and a light emitting hole is formed in a position of the black glue layer opposite to the light emitting chip 104. The raised pattern 103 formed on the second roughened surface has a larger surface area, and the bonding strength of the black layer on the second roughened surface is also better. In some embodiments, the black matrix layer blocks the influence of the light emitting chips 104 of other colors beside, enhancing contrast.

The light emitting chip package structure may further include a package layer 108, wherein the package layer 108 covers a side of the light emitting chip package structure where the trace layer 106 is disposed for packaging, and the package layer 108 includes pad through holes (not shown in the drawing), and the first pad region 1061 and the second pad region 1062 of the trace layer 106 are exposed from the pad through holes. The encapsulation layer 108 may be a material such as an encapsulation adhesive, and covers the light emitting chip 104 to form an encapsulation protection. In some implementations, the encapsulation layer 108 may encapsulate the light emitting chip 104, the trace layer 106, the planarization layer 107, and other structures as a whole, and the side areas of these structures may be covered as well. The encapsulation layer 108 may be made of transparent or black glue, which can block light from propagating in an unwanted direction, for example, block lateral light, so as to avoid light emission between adjacent light emitting chip encapsulation structures.

The embodiment also provides a light emitting device, which includes the light emitting chip package structure and a circuit substrate, wherein the light emitting chip package structure is disposed on the circuit substrate, and a conductive line on the circuit substrate is electrically connected with the light emitting chip 104 in the light emitting chip package structure. The light emitting chip package structure of the above example enables the light emitting device of the present embodiment to have better brightness in some implementation processes, and wherein the light emitting angle of each light emitting chip package structure is larger, and the light emitting effect is good. Illustratively, a driving circuit is disposed on the circuit substrate, and bonding is performed with the first pad region 1061 and the second pad region 1062 in the light emitting chip package structure by bonding such as soldering, so that the light emitting chip 104 in the light emitting chip package structure can be driven and controlled. The light emitting chips 104 of three or four colors may be provided in the light emitting chip package structures, each of which can be displayed as one pixel. The light emitting device includes, but is not limited to, a display panel capable of displaying, or an electronic device having a display function such as an intelligent terminal, a wristwatch, a computer, or a display mounted with the display panel, or may be a light source device not having a display function.

It should be noted that, unless otherwise specified, the "first", "second", and the like in the present utility model are merely for clearly distinguishing similar objects from each other, and do not represent merits or other limitations thereof. It is to be understood that the utility model is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.

Claims (10)

1. A light emitting chip package structure, comprising:

the light emitting device comprises a plurality of light emitting chips arranged at intervals, wherein a first roughened surface is formed on the light emitting side of the light emitting chips, and the first roughened surface comprises a plurality of concave patterns;

a light-transmitting substrate, wherein a second roughened surface is formed on the light-transmitting substrate, and the second roughened surface comprises a plurality of raised patterns;

and the bonding layer is arranged between the light-emitting chip and the light-transmitting substrate to fix the light-emitting chip and the light-transmitting substrate, and the light-emitting side of the light-emitting chip is arranged opposite to the second roughened surface of the light-transmitting substrate.

2. The light-emitting chip package structure according to claim 1, wherein an inner wall of the concave pattern is inclined, and an inner diameter of the concave pattern increases from a side away from the light-transmitting substrate to a side close to the light-transmitting substrate.

3. The light emitting chip package structure of claim 2, wherein the space shape of the concave pattern is at least one of a portion of a sphere, a mesa, and a taper.

4. The light emitting chip package structure of claim 1, wherein sidewalls of the protrusion patterns are inclined, and an outer diameter of the protrusion patterns increases from a side away from the light transmissive substrate to a side close to the light transmissive substrate.

5. The light emitting chip package structure of claim 4, wherein the protrusion pattern is at least one of a portion of a sphere, a mesa, and a pyramid.

6. The light emitting chip package structure of claim 1, wherein a distance between the first roughened surface and the second roughened surface is 1-2um.

7. The light emitting chip package structure of claim 1, wherein the light emitting chip package structure comprises at least three light emitting chips of red, green, and blue different light emitting colors, the light emitting chip package structure further comprises a routing layer, the routing layer comprises a first pad area connected with a first pole of the light emitting chip, and a second pad area connected with a second pole of the light emitting chip, and the first pad area and the second pad area are pad areas electrically connected to the outside of the light emitting chip package structure.

8. The light emitting chip package structure of claim 7, wherein the second roughened surface is further provided with a black glue layer, and the black glue layer is provided with a light emitting hole at a position opposite to the light emitting chip.

9. The light emitting chip package structure of any one of claims 1-8, wherein the light emitting chip comprises a Micro LED chip.

10. A light emitting device, comprising the light emitting chip package structure of any one of claims 1-9 and a circuit substrate, wherein the light emitting chip package structure is disposed on the circuit substrate, and a conductive line on the circuit substrate is electrically connected to the light emitting chip in the light emitting chip package structure.