CN219958978U - Heat radiation structure and power module - Google Patents
Heat radiation structure and power module Download PDFInfo
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- CN219958978U CN219958978U CN202221977727.1U CN202221977727U CN219958978U CN 219958978 U CN219958978 U CN 219958978U CN 202221977727 U CN202221977727 U CN 202221977727U CN 219958978 U CN219958978 U CN 219958978U
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- liquid
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- fin located
- heat dissipating
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- 230000005855 radiation Effects 0.000 title description 3
- 239000007788 liquid Substances 0.000 claims abstract description 95
- 239000000110 cooling liquid Substances 0.000 claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 239000002826 coolant Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat dissipation structure and a power module, wherein the heat dissipation structure comprises: the cooling device comprises a substrate, an enclosing wall fixed on the surface of the substrate and forming an accommodating space together with the substrate, and a plurality of fins fixed on the surface of the substrate and positioned in the accommodating space, wherein each fin is arranged at intervals, the cross section of each fin is elliptical, the enclosing wall is provided with two liquid channel sides parallel to the flowing direction of cooling liquid, the two liquid channel sides are oppositely arranged, and when the length of the liquid channel sides is greater than a preset value, the flowing direction of the cooling liquid is parallel to the long axis of the ellipse; when the length of the liquid passage side is less than or equal to a predetermined value, the flow direction of the cooling liquid is perpendicular to the major axis of the ellipse. Because the cross section of fin is oval, can utilize oval long axis face increase and coolant liquid's contact surface, can improve the density of fin in oval minor axis direction, compare circular form fin under the same area, can effectively improve heat transfer area and heat transfer effect, can satisfy the inside chip heat dissipation demand of module under limited volume.
Description
Technical Field
The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation structure and a power module.
Background
When the power module works, the internal chip can generate a large amount of heat, and if the heat is not timely emitted, the temperature of the internal chip of the module exceeds the allowable maximum temperature, the performance of the chip can be seriously influenced, so that the performance and the reliability of the whole module are adversely affected, and the power module needs to adopt a corresponding heat dissipation structure to conduct heat dissipation treatment of the module.
In the related art, a pin fin heat dissipation structure is generally adopted for liquid cooling heat dissipation of a module, but the design of the pin fin heat dissipation structure has a certain limitation on heat dissipation of a high-frequency high-power module, and the pin fin heat dissipation structure cannot meet the heat dissipation requirement of a chip inside the module under a limited volume, so that the heat dissipation effect of the pin fin heat dissipation structure is poor, and the temperature of the chip inside the module is easy to rise.
Disclosure of Invention
The utility model aims to solve the technical problem that the pin fin heat dissipation structure in the related art cannot meet the heat dissipation requirement of a chip in a module under the limited volume.
In order to solve the above technical problems, a first aspect of the present utility model provides a heat dissipation structure, including: the cooling device comprises a base plate, an enclosing wall fixed on the surface of the base plate and forming an accommodating space together with the base plate, and a plurality of fins fixed on the surface of the base plate and positioned in the accommodating space, wherein the fins are arranged at intervals, the cross section of each fin is elliptical, the enclosing wall is provided with two liquid channel sides parallel to the flowing direction of cooling liquid, the two liquid channel sides are oppositely arranged, and when the length of the liquid channel sides is greater than a preset value, the flowing direction of the cooling liquid is parallel to the long axis of the ellipse; when the length of the liquid passage side is less than or equal to a predetermined value, the flow direction of the cooling liquid is perpendicular to the major axis of the ellipse.
Preferably, the value range of the preset value is 100mm-140mm.
Preferably, the ratio of the minor axis to the major axis of the ellipse ranges from: the minor axis/major axis is less than or equal to 0.25 and less than or equal to 0.75.
Preferably, the surrounding wall is provided with a liquid inlet side and a liquid outlet side which are oppositely arranged, the cooling liquid flows from the liquid inlet side to the liquid outlet side, and the liquid inlet side, the liquid channel side, the liquid outlet side and the liquid channel side are sequentially connected.
Preferably, the fins are arranged in an array in the accommodating space, the length extending direction of each row of fins is parallel to the liquid inlet side, and the length extending direction of each column of fins is parallel to the liquid channel side.
Preferably, the fins in adjacent rows are arranged in a staggered manner, the fins in adjacent columns are arranged in a staggered manner, the number of the fins in the adjacent rows is the same, and the number of the fins in the adjacent columns is the same.
Preferably, one row of the adjacent rows further away from the liquid inlet side comprises a half fin positioned at the head end and the tail end and a full fin positioned between the head end and the tail end, the half fin positioned at the head end and the half fin positioned at the tail end jointly form the full fin, and the half fin positioned at the head end and the half fin positioned at the tail end are respectively fixed at the two liquid channel sides.
Preferably, one of the adjacent columns further away from the liquid channel side comprises a half fin positioned at the head end and the tail end and a full fin positioned between the head end and the tail end, the half fin positioned at the head end and the half fin positioned at the tail end jointly form the full fin, and the half fin positioned at the head end and the half fin positioned at the tail end are respectively fixed on the liquid inlet side and the liquid outlet side.
Preferably, the height of the fins ranges from 2mm to 10mm.
A second aspect of the utility model provides a power module comprising a heat dissipating structure as defined in any one of the preceding claims.
Compared with the prior art, the heat dissipation structure and the power module have the beneficial effects that: because the cross section of the fin is elliptical, the contact surface with the cooling liquid can be increased by utilizing the long axial surface of the ellipse, the density of the fin can be improved in the direction of the short axis of the ellipse, and compared with a circular fin with the same area, the heat exchange area and the heat exchange effect can be effectively improved; when the length of the liquid channel side is larger than a preset value, the liquid channel on the substrate is a long liquid channel, the flow direction of the cooling liquid is parallel to the long axis of the ellipse, so that the flow resistance of the cooling liquid can be reduced, the flow speed of the cooling liquid can be ensured under the condition of the long liquid channel, and further, the cooling liquid and the fins can perform effective heat exchange; when the length of the liquid channel side is smaller than or equal to a preset value, the liquid channel on the substrate is a short liquid channel, so that the cooling liquid can be effectively contacted with the oval long axial surface, and the cooling liquid is effectively subjected to heat exchange at a certain resistance to reduce the speed of the cooling liquid, thereby meeting the heat dissipation requirement of the chip inside the module under the limited volume and improving the heat dissipation effect of the heat dissipation structure.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a heat dissipating structure according to an embodiment of the present utility model;
FIG. 2 is a schematic view showing a heat dissipation structure according to an embodiment of the present utility model, wherein a flow direction of a cooling liquid is perpendicular to a major axis of an ellipse;
fig. 3 is a schematic view showing a heat dissipation structure according to an embodiment of the present utility model, in which a flow direction of a cooling liquid is parallel to a major axis of an ellipse.
In the drawings, each reference numeral denotes: 1. a substrate; 2. an enclosing wall; 21. a liquid channel side; 22. a liquid inlet side; 23. a liquid outlet side; 3. a fin; 31. a half fin; 32. full fins.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Examples:
referring to fig. 1, 2 and 3 (the arrow direction in fig. 2 and 3 is indicated as the flowing direction of the cooling liquid), the embodiment of the utility model provides a power module, which comprises a module body and a heat dissipation structure fixed on the lower surface of the module body, wherein the heat dissipation structure comprises a base plate 1, a surrounding wall 2 and fins 3, the surrounding wall 2 is fixed on the plate surface of the base plate 1 and forms an accommodating space together with the base plate 1, a plurality of fins 3 are fixed on the plate surface of the base plate 1 and are positioned in the accommodating space, the fins 3 are arranged at intervals, the cross section of each fin 3 is elliptical, the surrounding wall 2 is provided with two liquid channel sides 21 parallel to the flowing direction of the cooling liquid, the two liquid channel sides 21 are oppositely arranged, and when the length of the liquid channel sides 21 is greater than a preset value, the flowing direction of the cooling liquid is parallel to the long axis of the ellipse; when the length of the liquid passage side 21 is less than or equal to a predetermined value, the flow direction of the cooling liquid is perpendicular to the major axis of the ellipse.
Because the cross section of the fin 3 is elliptical, the contact surface with the cooling liquid can be increased by utilizing the long axial surface of the ellipse, the density of the fin 3 can be improved in the direction of the short axis of the ellipse, and compared with a circular fin 3 with the same area, the heat exchange area and the heat exchange effect can be effectively improved; when the length of the liquid channel side 21 is larger than the preset value, the liquid channel on the substrate 1 is a long liquid channel, the flow direction of the cooling liquid is parallel to the long axis of the ellipse, so that the flow resistance of the cooling liquid can be reduced, the flow speed of the cooling liquid can be ensured under the condition of the long liquid channel, and further, the cooling liquid and the fins 3 can be effectively subjected to heat exchange; when the length of the liquid channel side 21 is smaller than or equal to a preset value, the liquid channel on the substrate 1 is a short liquid channel, so that the cooling liquid can be effectively contacted with the oval long axial surface, and the cooling liquid is effectively subjected to heat exchange at a certain resistance to reduce the speed of the cooling liquid, thereby meeting the heat dissipation requirement of chips in the module under the limited volume and improving the heat dissipation effect of the heat dissipation structure.
Further, the predetermined value may be 100mm-140mm, specifically 100mm, 105mm, 110mm, 120mm, 130mm, 140mm, etc., preferably 120mm, i.e., the length of the liquid channel side 21 is preferably 120mm, and when the length of the liquid channel side 21 is greater than 120mm, the flow direction of the cooling liquid is parallel to the major axis of the ellipse; when the length of the liquid channel side 21 is less than or equal to 120mm, the flowing direction of the cooling liquid is perpendicular to the long axis of the ellipse, which is beneficial to maximally improving the heat dissipation effect of the heat dissipation structure. It should be understood that when the length of the liquid passage side 21 is greater than 120mm, the flow direction of the setting coolant is parallel to the major axis of the ellipse, and the heat radiation effect thereof is better than the flow direction of the setting coolant perpendicular to the major axis of the ellipse.
In one embodiment, the ratio of the minor axis to the major axis of the ellipse ranges from: the ratio of the short axis to the long axis is less than or equal to 0.25 and less than or equal to 0.75, namely the ratio of the short axis to the long axis can be specifically 0.25, 0.4, 0.65, 0.70, 0.75 and the like, and the flow pressure drop and the flow resistance of the cooling liquid are smaller within the ratio range, so that the heat dissipation effect of the fin 3 is improved.
As shown, in one embodiment, the surrounding wall 2 has a liquid inlet side 22 and a liquid outlet side 23 which are disposed opposite to each other, and the cooling liquid flows from the liquid inlet side 22 to the liquid outlet side 23, and the liquid inlet side 22, the liquid channel side 21, the liquid outlet side 23, and the liquid channel side 21 are disposed in this order. Specifically, the surrounding wall 2 may be a rectangular frame, and four sides of the surrounding wall 2 are respectively a liquid inlet side 22, a liquid channel side 21, a liquid outlet side 23 and a liquid channel side 21; the fins 3 are arranged in an array in the accommodating space, the length extending direction of each row of fins 3 is parallel to the liquid inlet side 22, and the length extending direction of each column of fins 3 is parallel to the liquid channel side 21. According to actual needs, fins 3 with any number of rows and any number of columns, such as nineteen rows and twenty-three columns, can be arranged in the accommodating space. Moreover, the surrounding wall 2 can block the impact of the cooling liquid on the peripheral seal ring, thereby preventing displacement of the peripheral seal ring.
Further, as shown in the figure, the fins 3 in adjacent rows are arranged in a staggered manner, the fins 3 in adjacent columns are arranged in a staggered manner, the number of the fins 3 in the adjacent rows is the same, and the number of the fins 3 in the adjacent columns is the same. Specifically, for convenience of description, one of the adjacent rows closer to the liquid inlet side 22 is set as a first row, one of the adjacent columns closer to the liquid channel side 21 is set as a first column, one of the adjacent columns further from the liquid channel side 21 is set as a second column, the fins 3 of the first row are located between the adjacent fins 3 of the second row, and the fins 3 of the first column are located between the adjacent fins 3 of the second column. Furthermore, the fins 3 of the first row are preferably arranged in the middle of the adjacent fins 3 of the second row, and the fins 3 of the first column are preferably arranged in the middle of the adjacent fins 3 of the second column, in such an arrangement that the flow of the cooling liquid is effectively uniformly distributed. In other embodiments, the staggered offset distance of the fins 3 can be adjusted according to actual conditions to adapt to the liquid flow distribution of other special cooling liquids; the density among the fins 3 can be adjusted according to the situation, the distance between the fins 3 corresponding to the chip position can be encrypted according to the actual requirement, and the fins 3 are arranged more sparsely in other non-chip areas, so that the cost can be properly reduced on the premise of ensuring heat dissipation.
As shown in the figure, preferably, one row farther from the liquid inlet side 22 in the adjacent rows includes a half fin 31 located at the head end and the tail end and a full fin 32 located between the head end and the tail end, the half fin 31 located at the head end and the half fin 31 located at the tail end together form the full fin 32, and the half fin 31 located at the head end and the half fin 31 located at the tail end are respectively fixed at the two liquid channel sides 21; one of the adjacent columns further from the liquid channel side 21 comprises a half fin 31 positioned at the head end and the tail end and a full fin 32 positioned between the head end and the tail end, the half fin 31 positioned at the head end and the half fin 31 positioned at the tail end jointly form the full fin 32, and the half fin 31 positioned at the head end and the half fin 31 positioned at the tail end are respectively fixed on the liquid inlet side 22 and the liquid outlet side 23. It will be appreciated that the half fins 31 provided on the liquid inlet side 22, the liquid outlet side 23 and the two liquid passage sides 21 can effectively control the direction in which the cooling liquid flows, ensuring that the cooling liquid flows to the inside of the fins 3 to improve the effectiveness of heat exchange.
In one embodiment, the height of the fins 3 ranges from 2mm to 10mm, the height of the fins 3 can be specifically 2mm, 3mm, 5mm, 7mm, 9mm, 10mm, and the like, preferably 7mm, and one end of the fins 3 far away from the base plate 1 is flush with one end of the surrounding wall 2 far away from the base plate 1, which is favorable for flowing cooling liquid on the base plate 1, and meanwhile, is favorable for integrally forming a heat dissipation structure.
Firstly, determining the area and the appearance size of a base plate 1, the area of a radiating area of a fin 3, the length-to-length axis ratio of an elliptical fin 3, the appearance size and the height of the elliptical fin 3 according to requirements, and setting the aspect of the length axis of the elliptical fin 3 according to the flowing direction and the requirements of cooling liquid; the spacing of the fins 3 is set according to the minimum spacing of the process, the elliptical fins 3 are reasonably distributed in the maximum density, the heat dissipation structure is produced by adopting high heat conduction copper materials and corresponding process means, and after the heat dissipation structure is formed, the heat dissipation structure, the module body and the cooling liquid equipment are assembled. Through the fashioned heat radiation structure of this design, under the same base plate 1 area and fin 3 interval, oval form fin 3 of equal area can arrange quantity and can increase about 15% than circular form fin 3 to the ability of fin 3 heat transfer has been greatly promoted.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. A heat dissipation structure, comprising: the cooling device comprises a base plate, an enclosing wall fixed on the surface of the base plate and forming an accommodating space together with the base plate, and a plurality of fins fixed on the surface of the base plate and positioned in the accommodating space, wherein the fins are arranged at intervals, the cross section of each fin is elliptical, the enclosing wall is provided with two liquid channel sides parallel to the flowing direction of cooling liquid, the two liquid channel sides are oppositely arranged, and when the length of the liquid channel sides is greater than a preset value, the flowing direction of the cooling liquid is parallel to the long axis of the ellipse; when the length of the liquid passage side is less than or equal to a predetermined value, the flow direction of the cooling liquid is perpendicular to the major axis of the ellipse.
2. The heat dissipating structure of claim 1, wherein the predetermined value ranges from 100mm to 140mm.
3. The heat dissipating structure of claim 1, wherein the ratio of the minor axis to the major axis of the ellipse ranges from: the minor axis/major axis is less than or equal to 0.25 and less than or equal to 0.75.
4. The heat dissipating structure of claim 1, wherein the surrounding wall has a liquid inlet side and a liquid outlet side which are disposed opposite to each other, the cooling liquid flows from the liquid inlet side to the liquid outlet side, and the liquid inlet side, the liquid outlet side, and the liquid outlet side are disposed in series.
5. The heat dissipating structure of claim 4, wherein each of said fins is arranged in an array in said receiving space, and wherein a length extension direction of each row of fins is parallel to said liquid inlet side, and a length extension direction of each column of fins is parallel to said liquid channel side.
6. The heat dissipating structure of claim 5, wherein each of said fins in adjacent rows are offset from each other, each of said fins in adjacent columns are offset from each other, and the number of said fins in adjacent rows is the same and the number of said fins in adjacent columns is the same.
7. The heat dissipating structure of claim 6, wherein one of the adjacent rows further from the liquid inlet side comprises a half fin located at both ends of the head and the tail and a full fin located between both ends of the head and the tail, the half fin located at the head and the half fin located at the tail together forming the full fin, and the half fin located at the head and the half fin located at the tail are fixed at both of the liquid channel sides, respectively.
8. The heat dissipating structure of claim 6, wherein one of the adjacent rows further from the liquid channel side comprises a half fin located at both ends of the head and the tail and a full fin located between both ends of the head and the tail, the half fin located at the head and the half fin located at the tail together constitute one of the full fins, and the half fin located at the head and the half fin located at the tail are fixed to the liquid inlet side and the liquid outlet side, respectively.
9. The heat dissipating structure of claim 1, wherein the fins have a height ranging from 2mm to 10mm.
10. A power module comprising a heat dissipating structure as claimed in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221977727.1U CN219958978U (en) | 2022-07-27 | 2022-07-27 | Heat radiation structure and power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221977727.1U CN219958978U (en) | 2022-07-27 | 2022-07-27 | Heat radiation structure and power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219958978U true CN219958978U (en) | 2023-11-03 |
Family
ID=88539897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221977727.1U Active CN219958978U (en) | 2022-07-27 | 2022-07-27 | Heat radiation structure and power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219958978U (en) |
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2022
- 2022-07-27 CN CN202221977727.1U patent/CN219958978U/en active Active
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