CN219322866U - Liquid cooling heat radiator - Google Patents
Liquid cooling heat radiator Download PDFInfo
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- CN219322866U CN219322866U CN202223607495.3U CN202223607495U CN219322866U CN 219322866 U CN219322866 U CN 219322866U CN 202223607495 U CN202223607495 U CN 202223607495U CN 219322866 U CN219322866 U CN 219322866U
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Abstract
The utility model relates to a liquid cooling heat dissipation device, which comprises a shell and a heat dissipation piece, wherein a first flow channel area, a second flow channel area, a gap and a first flow guide cavity are communicated in the shell; the first diversion cavity extends from the liquid inlet towards the first flow channel area, and the sectional area of the first diversion cavity is gradually increased; the first flow channel region and/or the second flow channel region is/are also provided with at least one high heat dissipation region, and the plurality of columnar heat dissipation element arrays are arranged on the high heat dissipation region. The utility model has the advantages that: the columnar heat dissipation elements can better dissipate heat generated by the high-power-consumption chip. After flowing in from the first flow guide cavity, the cooling liquid can flow through the high heat dissipation area more uniformly and is in contact with each columnar heat dissipation part more uniformly, so that the cooling liquid is guaranteed to take away the heat of each part of the high heat dissipation area and the heat of each columnar heat dissipation part more uniformly, and the heat dissipation effect of the liquid cooling heat dissipation device is enhanced.
Description
Technical Field
The utility model relates to the technical field of vehicle-mounted equipment, in particular to a liquid cooling heat dissipation device.
Background
With the development of intelligent driving of automobiles, more and more perception sensors are installed on automobiles, the requirements on functions of domain controllers for controlling the sensors are higher and higher, chips arranged on the domain controllers are more and more, and the power consumption of the chips is larger and more, so that more and more heat is generated by the domain controllers. In addition, among the chips on the domain controller, some chips have higher power consumption, more heat is generated, and some chips have lower power consumption, less heat is generated, so that the temperatures of the various parts in the domain controller are different, and the temperature of the area where the high-power-consumption chip in the domain controller is located is higher. At present, a common method for radiating heat of the domain controller is to arrange an air cooling heat radiating structure or a liquid cooling heat radiating structure on the domain controller. However, in the liquid cooling heat dissipation device in the prior art, the cooling liquid simply flows in and out, and the optimal design is not performed aiming at the temperature difference of each part in the domain controller, so that the heat dissipation effect is poor.
Disclosure of Invention
In view of the above, the present utility model provides a liquid cooling heat dissipation device, which sets a high heat dissipation area for a region where a high power chip in a domain controller is located, and enables a cooling liquid to flow through the high heat dissipation area more uniformly, so as to enhance a heat dissipation effect.
In order to solve the problems, the utility model provides the following technical scheme:
a liquid-cooled heat sink for a domain controller, comprising: the heat dissipation device comprises a shell and a heat dissipation piece, wherein a first flow passage area and a second flow passage area which are communicated are arranged in the shell, a partition plate is arranged in the shell, the partition plate extends from a first end of the shell towards a second end of the shell, a gap is reserved between the partition plate and the second end of the shell, and the first flow passage area and the second flow passage area are communicated through the gap; the shell further comprises a liquid inlet, a liquid outlet and a first diversion cavity communicated with the liquid inlet, the first diversion cavity extends from the liquid inlet towards the first flow channel area, and the sectional area of the first diversion cavity is gradually increased; the heat dissipation piece is arranged in the first flow channel area and the second flow channel area, at least one high heat dissipation area is further arranged on the first flow channel area and/or the second flow channel area, the heat dissipation piece comprises a plurality of columnar heat dissipation pieces, and the columnar heat dissipation pieces are arranged in the high heat dissipation areas and are arranged in an array.
In one embodiment, the columnar heat sink is cylindrical in shape.
So set up, compare in other columnar heat dissipation piece, cylindric columnar heat dissipation piece's heat radiating area is bigger, and radiating efficiency is higher, can dispel the heat of high heat dissipation area better.
In one embodiment, each high heat dissipation area is provided with a plurality of columnar heat dissipation elements, the columnar heat dissipation elements form a plurality of rows of columnar heat dissipation element groups arranged at intervals, and the columnar heat dissipation elements in the columnar heat dissipation element groups in adjacent rows are arranged in a staggered manner.
By the arrangement, the cooling liquid can be in a turbulent state, so that the cooling liquid can better disperse heat, and the heat dissipation effect is enhanced.
In one embodiment, the columnar heat dissipation piece is cylindrical in shape, has a diameter D and satisfies the condition that D is less than or equal to 5.5mm and less than or equal to 6.5mm; the spacing between the columnar heat dissipation piece groups in adjacent rows is H 1 And satisfies H with a diameter of 10mm or less 1 ≤15mm。
The arrangement is beneficial to reducing the flow resistance of the cooling liquid, so that the cooling liquid can flow through quickly to take away heat quickly, and the heat dissipation effect is enhanced.
In one embodiment, the distance between the centers of two adjacent columnar heat dissipation elements in each columnar heat dissipation element group is H 2 And satisfy H of 7mm or less 2 ≤10mm。
The arrangement is beneficial to the uniform flow of the cooling liquid and the heat exchange of the cooling liquid among different columnar heat dissipation piece groups.
In one embodiment, the heat dissipation elements further include plate-shaped heat dissipation elements, the plate-shaped heat dissipation elements are arranged on the outer sides of the high heat dissipation areas, and adjacent plate-shaped heat dissipation elements are arranged in a staggered manner or the end portions of the adjacent plate-shaped heat dissipation elements are arranged in a flush manner.
The liquid cooling heat dissipation device is beneficial to enhancing the heat dissipation effect of the liquid cooling heat dissipation device.
In one embodiment, the liquid cooling heat dissipation device includes a flow channel bottom wall and a flow channel side wall, the flow channel bottom wall, the flow channel side wall and the partition board enclose the first flow channel area, the gap and the second flow channel area together, and the bottom wall of the first flow guiding cavity is lower than the flow channel bottom wall.
By the arrangement, the cooling liquid can flow into the first flow channel area from the lower part of the first flow channel area, so that the cooling liquid is beneficial to being dispersed gradually, and therefore the cooling liquid flows to the positions of the first flow channel area more uniformly, and the cooling liquid is distributed more uniformly in the first flow channel area. The cooling liquid in the first flow channel region flows to the second flow channel region through the gaps, so that the cooling liquid is uniformly distributed in the first flow channel region, the gaps and the second flow channel region, the cooling liquid is ensured to uniformly flow through the high heat dissipation region and to uniformly contact with each columnar heat dissipation piece, and the cooling liquid is ensured to uniformly take away the heat at each position of the high heat dissipation region and the heat on each columnar heat dissipation piece.
In one embodiment, the upper edge of the liquid inlet is lower than the bottom wall of the flow channel, the first diversion cavity extends from the liquid inlet to the bottom wall of the flow channel obliquely upwards, and the width of the bottom wall of the first diversion cavity gradually increases along with the first diversion cavity extending from the liquid inlet obliquely upwards.
The arrangement is beneficial to the cooling liquid to be dispersed gradually after flowing into the first flow guide cavity, so that the cooling liquid is distributed more uniformly in the first flow channel area.
In one embodiment, the housing further has a second flow guiding cavity in communication with the liquid outlet, the second flow guiding cavity extends from the liquid outlet toward the second flow channel region, and a cross-sectional area of the second flow guiding cavity gradually increases.
So set up, the coolant liquid of being convenient for flows from the liquid outlet.
In one embodiment, the liquid inlet and the liquid outlet are both disposed at the first end.
The liquid cooling heat dissipation device is beneficial to reducing the size of the liquid cooling heat dissipation device.
The utility model has at least the following beneficial effects:
according to the liquid cooling heat dissipation device provided by the utility model, the high heat dissipation area is arranged in the area where the high power consumption chip is located, and the plurality of columnar heat dissipation pieces are arranged in the high heat dissipation area in an array mode, so that heat generated by the high power consumption chip is better dissipated. The first diversion cavity extends from the liquid inlet towards the first flow channel area, and the sectional area of the first diversion cavity is gradually increased. After flowing in from the first flow guide cavity, the cooling liquid can be uniformly distributed in the liquid cooling heat dissipation device, so that the cooling liquid flows through the high heat dissipation area uniformly and contacts with each columnar heat dissipation piece uniformly, the cooling liquid is guaranteed to take away the heat of each part of the high heat dissipation area and the heat of each columnar heat dissipation piece uniformly, and the heat dissipation effect of the liquid cooling heat dissipation device is enhanced.
Drawings
In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings that are required to be used in the description of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is an isometric view of a liquid-cooled heat sink according to an embodiment of the present utility model;
FIG. 2 is an enlarged schematic view of FIG. 1 at A;
FIG. 3 is a top view of the liquid-cooled heat sink shown in FIG. 1;
FIG. 4 is an isometric view of a liquid-cooled heat sink according to another embodiment of the utility model;
FIG. 5 is a top view of the liquid-cooled heat sink shown in FIG. 4;
FIG. 6 is an isometric view of a liquid-cooled heat sink according to yet another embodiment of the present utility model;
fig. 7 is a top view of the liquid-cooled heat sink shown in fig. 6.
Reference numerals:
10. a housing; 11. a flow-through section; 111. a first flow channel region; 112. a second flow path region; 113. a gap; 114. a flow channel bottom wall; 115. a flow channel side wall; 12. a partition plate; 13. a first end; 14. a second end; 15. a liquid inlet; 16. a first flow directing chamber; 161. a bottom wall; 162. a first sidewall; 163. a third sidewall; 17. a liquid outlet; 18. the second diversion cavity; 20. a heat sink; 21. a columnar heat dissipation member; 22. plate-like heat sink.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used in the description of the present application for purposes of illustration only and do not represent the only embodiment.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be a direct contact of the first feature with the second feature, or an indirect contact of the first feature with the second feature via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.
Unless defined otherwise, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. The term "and/or" as used in the specification of this application includes any and all combinations of one or more of the associated listed items.
With the development of intelligent driving of automobiles, more and more perception sensors are installed on automobiles, the requirements on functions of domain controllers for controlling the sensors are higher and higher, chips arranged on the domain controllers are more and more, and the power consumption of the chips is larger and more, so that more and more heat is generated by the domain controllers. In addition, among the chips on the domain controller, some chips have higher power consumption, more heat is generated, and some chips have lower power consumption, less heat is generated, so that the temperatures of the various parts in the domain controller are different, and the temperature of the area where the high-power-consumption chip in the domain controller is located is higher. At present, a common method for radiating heat of the domain controller is to arrange an air cooling heat radiating structure or a liquid cooling heat radiating structure on the domain controller. However, in the liquid cooling heat dissipation device in the prior art, the cooling liquid simply flows in and out, and the optimal design is not performed aiming at the temperature difference of each part in the domain controller, so that the heat dissipation effect is poor.
In order to solve the above-mentioned problems, referring to fig. 1 to 7, the present utility model provides a liquid cooling heat dissipation device, which can be used for dissipating heat of a domain controller. The heat of the domain controller is diffused to the liquid cooling heat radiating device, and the cooling liquid flowing through the liquid cooling heat radiating device takes away the heat, so that the domain controller is radiated. The liquid cooling heat dissipation device is provided with a high heat dissipation area aiming at the area where the high power consumption chip in the area controller is located, and cooling liquid can flow through the high heat dissipation area more uniformly, so that the heat dissipation effect is enhanced.
Referring to fig. 1, the liquid cooling heat dissipation device provided by the utility model comprises a housing 10, wherein the housing 10 is provided with a circulation part 11, a first flow passage area 111 and a second flow passage area 112 which are communicated are arranged in the circulation part 11, the housing 10 comprises a liquid inlet 15, a liquid outlet 17 and a first diversion cavity 16, and cooling liquid flows into the liquid cooling heat dissipation device through the liquid inlet 15, so that the liquid outlet 17 is discharged from the liquid cooling heat dissipation device. The first diversion cavity 16 is communicated with the liquid inlet 15, the first diversion cavity 16 extends from the liquid inlet 15 towards the first flow passage area 111, and the sectional area of the first diversion cavity 16 is gradually increased. After the cooling liquid flows into the liquid cooling heat dissipation device from the liquid inlet 15, the cooling liquid flows towards the first flow channel region 111 along the extending direction of the first flow guiding cavity 16, and the cooling liquid is dispersed gradually due to the gradually increased sectional area of the first flow guiding cavity 16, so that the cooling liquid flows into the first flow channel region 111 and is distributed in the first flow channel region 111 more uniformly. The second flow path region 112 communicates with the first flow path region 111, and the cooling fluid in the first flow path region 111 can flow to the second flow path region 112, thereby distributing the cooling fluid more uniformly in the first flow path region 111 and the second flow path region 112.
Referring to fig. 1, the housing 10 has a first end 13 and a second end 14, a partition 12 is disposed within the housing 10, the partition 12 extends from the first end 13 of the housing 10 toward the second end 14 of the housing 10, a gap 113 is provided between the partition 12 and the second end 14, and the first flow path region 111 communicates with the second flow path region 112 through the gap 113. The cooling liquid in the first flow path region 111 flows into the second flow path region 112 through the gap 113. Thus, the coolant can be distributed more uniformly in the first flow passage region 111, the gap 113, and the second flow passage region 112. In other words, the coolant can be distributed more uniformly in the liquid-cooled heat sink.
Referring to fig. 1, the liquid cooling heat dissipation device further includes a heat dissipation member 20, where the heat dissipation member 20 can increase the heat dissipation area of the liquid cooling heat dissipation device, can increase the contact area between the liquid cooling heat dissipation device and the cooling liquid, and can improve the heat dissipation efficiency of the liquid cooling heat dissipation device. The heat dissipation element 20 is disposed in the first flow channel region 111 and the second flow channel region 112, so as to contact with the cooling liquid in the first flow channel region 111 and the second flow channel region 112, thereby allowing the cooling liquid to take away more heat and improving the heat dissipation efficiency of the liquid cooling heat dissipation device.
Referring to fig. 1, in order to better dissipate heat generated by the high-power chip, the liquid cooling heat dissipation device is provided with at least one high heat dissipation area, and the position of the high heat dissipation area corresponds to the position of the high-power chip. The high heat dissipation area may be located in the first channel area 111, or may be located in the second channel area 112, or may be located in both the first channel area 111 and the second channel area 112. The location of the high heat dissipation area corresponds to the location of the high power chip. Thus, heat generated by the high power chip can be spread to the high heat dissipation area. The heat dissipation element 20 includes a plurality of columnar heat dissipation elements 21, the columnar heat dissipation elements 21 are disposed in the high heat dissipation area, the number of the columnar heat dissipation elements 21 is plural, and the plurality of columnar heat dissipation elements 21 are disposed in the high heat dissipation area. Therefore, the heat of the high-heat-dissipation area is diffused to the columnar heat dissipation piece 21, the heat dissipation area of the columnar heat dissipation piece 21 is large, and the cooling liquid is convenient for absorbing the heat, so that the heat diffused to the high-heat-dissipation area by the high-power-consumption chip is better dissipated.
After flowing in from the first diversion cavity 16, the cooling liquid can be distributed in the liquid cooling heat dissipation device more uniformly, so that the cooling liquid flows through the high heat dissipation area more uniformly and contacts with each columnar heat dissipation piece 21 more uniformly, and further, the cooling liquid is guaranteed to take away the heat of each part of the high heat dissipation area and the heat of each columnar heat dissipation piece 21 more uniformly, and therefore the heat dissipation effect of the liquid cooling heat dissipation device is enhanced.
In the actual design and manufacturing process, the specific position of the high heat dissipation area on the liquid cooling heat dissipation device is determined according to the position of the high power consumption chip of the domain controller.
Preferably, referring to FIG. 1, in some embodiments, the first flow path region 111, the gap 113, and the second flow path region 112 are generally "U" shaped after communication.
Preferably, referring to fig. 1, in some embodiments, the columnar heat sink 21 is cylindrical in shape. Compared with the columnar heat dissipation piece 21 with other shapes, the columnar heat dissipation piece 21 has larger heat dissipation area and higher heat dissipation efficiency, and can better dissipate the heat of the high heat dissipation area.
Preferably, referring to fig. 1, in some embodiments, a plurality of columnar heat dissipation elements 21 are disposed on each high heat dissipation area, the columnar heat dissipation elements 21 form a plurality of rows of columnar heat dissipation element groups, the columnar heat dissipation elements 21 in the same columnar heat dissipation element group are located on the same straight line, the plurality of rows of columnar heat dissipation element groups are arranged at intervals, and the columnar heat dissipation elements 21 in two adjacent rows of columnar heat dissipation element groups are staggered. The cooling liquid can flow through the high heat dissipation area to be in a turbulent state, and the cooling liquid can better dissipate heat, so that the heat dissipation effect is enhanced.
Further, referring to FIGS. 1 and 3, in some embodiments, the columnar heat sinks 21 within the columnar heat sink group are columnar, and the diameter D of the columnar heat sinks 21 satisfies 5.5 mm.ltoreq.D.ltoreq.6.5 mm; the spacing H1 between the cylindrical columnar heat dissipation element groups in the adjacent rows is more than or equal to 10mm and less than or equal to 15mm. This is advantageous in reducing the flow resistance of the cooling liquid, and in allowing the cooling liquid to flow through and rapidly taking away heat, thereby enhancing the heat dissipation effect.
Further, referring to FIGS. 1 and 3, in some embodiments, the spacing H2 between the centers of two adjacent cylindrical columnar heat sinks 21 within each columnar heat sink group satisfies 7 mm.ltoreq.H2.ltoreq.10mm. This facilitates the uniform flow of the cooling liquid and the heat exchange of the cooling liquid between the different columnar heat dissipation members 21.
Referring to fig. 4 to 7, in some embodiments, to further enhance the heat dissipation effect of the liquid cooling heat dissipation device, the heat dissipation element 20 further includes a plate-shaped heat dissipation element 22, and the plate-shaped heat dissipation element 22 is disposed outside the high heat dissipation area.
Preferably, referring to fig. 4 and 5, in some embodiments, adjacent plate-like heat dissipating members 22 are staggered, which facilitates the flow of cooling liquid into the space between different plate-like heat dissipating members 22, resulting in a uniform flow of cooling liquid, and an increase in heat dissipation efficiency of the liquid-cooled heat dissipating apparatus.
Of course, referring to fig. 6 and 7, in some embodiments, in order to increase the space utilization of the liquid cooling heat dissipating device, more plate-shaped heat dissipating members 22 are disposed, and the end portions of adjacent plate-shaped heat dissipating members 22 may be disposed flush.
Referring to fig. 1, in some embodiments, the flow portion 11 includes a flow channel bottom wall 114 and a flow channel side wall 115, the flow channel bottom wall 114 is located at the bottom of the flow portion 11, the flow channel side wall 115 is connected to the flow channel bottom wall 114 and forms an included angle with the flow channel bottom wall 114, and the flow channel bottom wall 114, the flow channel side wall 115 and the partition 12 together define a first flow channel region 111, a gap 113 and a second flow channel region 112.
It will be appreciated that in some embodiments, a groove may be formed in the housing 10, where the first channel region 111, the second channel region 112 and the gap 113 are part of the groove, and the first channel region 111 and the second channel region 112 are communicated through the gap 113, the bottom wall of the groove is a bottom wall 114 of the channel, part of the wall of the groove is a side face of the partition 12, and the rest of the wall of the groove is a side wall 115 of the channel. In other embodiments, a protrusion may be disposed on the housing 10, the protrusion is disposed on the housing 10, the protrusion and the partition 12 together enclose a sinking cavity, the first flow channel region 111, the second flow channel region 112 and the gap 113 are all part of the sinking cavity, the first flow channel region 111 and the second flow channel region 112 are communicated through the gap 113, the bottom wall of the sinking cavity is a flow channel bottom wall 114, and the flow channel side wall 115 is located on the side surface of the protrusion.
Further, referring to fig. 1 and 3, in some embodiments, the flow portion 11 includes a flow channel bottom wall 114, and a bottom wall 161 of the first flow guiding chamber 16 is lower than the flow channel bottom wall 114. Thus, the cooling liquid can flow into the first flow channel region 111 from below the first flow channel region 111, which is beneficial to the gradual dispersion of the cooling liquid, so that the cooling liquid flows to all positions of the first flow channel region 111 more uniformly, and the cooling liquid is distributed more uniformly in the first flow channel region 111. The cooling liquid in the first flow channel region 111 flows to the second flow channel region 112 through the gaps 113, which ensures that the cooling liquid is more uniformly distributed in the first flow channel region 111, the gaps 113 and the second flow channel region 112, thereby ensuring that the cooling liquid flows through the high heat dissipation area more uniformly and contacts each columnar heat dissipation element 21 more uniformly, and further ensuring that the cooling liquid takes away the heat at each position of the high heat dissipation area and the heat on each columnar heat dissipation element 21 more uniformly
Further, referring to fig. 1 and 3, in some embodiments, the upper edge of the inlet 15 is lower than the flow channel bottom wall 114, and the first diversion chamber 16 extends obliquely upward from the inlet 15 to the flow channel bottom wall 114. Thereby, the cooling liquid may flow into the first flow passage area 111 from below the first flow passage area 111.
Referring to fig. 1-3, in some embodiments, the chamber wall of the first diversion chamber 16 includes a bottom wall 161, and the bottom wall 161 extends obliquely upward and in the same direction as the first diversion chamber 16. As the first guide chamber 16 extends obliquely upward from the liquid inlet 15 toward the flow passage bottom wall 114, the width of the bottom wall 161 gradually increases. This facilitates a gradual spreading of the cooling fluid, thereby allowing a more uniform flow of the cooling fluid throughout the first flow path region 111, and a more uniform distribution of the cooling fluid within the first flow path region 111.
Preferably, referring to fig. 1-3, in some embodiments, bottom wall 161 is generally trapezoidal.
Further, referring to fig. 1-3, in some embodiments, the chamber walls of the first flow directing chamber 16 further include a second sidewall (not shown) that is coplanar with the flow channel sidewall 115. The second side wall is disposed opposite to the bottom wall 161, and since the bottom wall 161 extends obliquely upward, the bottom wall 161 can intersect the second side wall while being disposed opposite to the second side wall. The first sidewall 162, the second sidewall, and the third sidewall 163 are sequentially connected, and the third sidewall 163 is disposed opposite to the first sidewall 162. In other words, the third sidewall 163 and the first sidewall 162 are located at two sides of the second sidewall; meanwhile, the first side wall 162, the bottom wall 161 and the third side wall 163 are also connected in sequence, and the third side wall 163 and the first side wall 162 are also located at two sides of the bottom wall 161. The liquid inlet 15 is arranged on the second side wall. The third sidewall 163 may be the same or similar in shape to the first sidewall 162.
Referring to fig. 1 and 3, in some embodiments, to facilitate the flow of the cooling liquid from the liquid outlet 17, the housing 10 further has a second flow guiding cavity 18, the second flow guiding cavity 18 is in communication with the liquid outlet 17, the second flow guiding cavity 18 extends from the liquid outlet 17 toward the second flow channel region 112, and a cross-sectional area of the second flow guiding cavity 18 gradually increases. Thus, the cooling liquid flows to the liquid outlet 17 through the second flow guiding cavity 18, and then flows out from the liquid outlet 17.
Referring to fig. 1 and 3, in some embodiments, the walls of the second flow directing chamber 18 may be the same or similar to the walls of the first flow directing chamber 16.
Referring to fig. 1, in some embodiments, the liquid inlet 15 and the liquid outlet 17 are both disposed at the first end 13. Compared with the liquid inlet 15 and the liquid outlet 17 which are respectively positioned at the first end 13 and the second end 14, the liquid inlet 15 and the liquid outlet 17 are both arranged at the first end 13, so that the size of the liquid cooling heat radiator can be reduced.
Preferably, referring to fig. 1, in some embodiments, the liquid inlet 15 is located corresponding to the first flow channel region 111, and the liquid outlet 17 is located corresponding to the second flow channel region 112. The cooling liquid flows from the liquid inlet 15 into the first flow channel region 111, then flows through the gap 113 to the second flow channel region 112, and then flows out of the liquid cooling heat sink from the liquid outlet 17.
It is worth mentioning that the liquid cooling heat abstractor that provides in this application can utilize whole car cooling system to realize power cycle and cooling of coolant liquid. The specific mode can be briefly described as that the liquid cooling heat radiating device is communicated with a whole car cooling system of an automobile, and the cooling liquid is condensed water. The whole vehicle cooling system comprises a compressor, a condenser, a thermal expansion valve, an evaporator, a water tank and a water pump, wherein the thermal expansion valve and the evaporator are connected into a whole. The water tank sets up first water inlet and first outlet, and the water pump sets up second water inlet and second outlet. The first water inlet is connected with the condenser, and condensed water in the condenser enters the water tank through the first water inlet; the first water outlet is connected with the second water inlet, the second water outlet is connected with the liquid inlet 15, and when the water pump works, condensed water in the water tank flows into the liquid inlet 15 through the water pump and then flows to the liquid outlet 17 through the first flow channel region 111, the gap 113 and the second flow channel region 112 in sequence. The liquid outlet 17 is connected with a thermal expansion valve which is connected with an evaporator, so that condensed water after heat absorption in the liquid cooling heat dissipation device enters the thermal expansion valve through the liquid outlet 17, the thermal expansion valve makes the condensed water into low-temperature low-pressure vaporous refrigerant, and the vaporous refrigerant is sprayed into the evaporator, and is gasified into steam after heat absorption in the evaporator. The compressor is connected to the evaporator to draw vapor from the evaporator and raise the pressure and temperature of the vapor and send the vapor to the condenser. The condenser liquefies the vapor into condensed water. Therefore, the circulating flow of the condensed water is realized, and the condensed water after absorbing heat is cooled down and cooled so as to be convenient for recycling. Wherein, the compressor is driven by the engine, and the water pump is driven by the motor.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of the present application is to be determined by the following claims.
Claims (10)
1. A liquid-cooled heat sink for a domain controller, comprising:
a shell (10), a first flow channel region (111) and a second flow channel region (112) which are communicated are arranged in the shell (10), a partition plate (12) is arranged in the shell (10), the partition plate (12) extends from a first end (13) of the shell (10) towards a second end (14) of the shell (10) and a gap (113) is formed between the partition plate and the second end (14) of the shell (10), and the first flow channel region (111) and the second flow channel region (112) are communicated through the gap (113); the shell (10) further comprises a liquid inlet (15), a liquid outlet (17) and a first diversion cavity (16) communicated with the liquid inlet (15), the first diversion cavity (16) extends from the liquid inlet (15) towards the first flow channel region (111), and the cross section area of the first diversion cavity (16) is gradually increased; and
the heat dissipation piece (20) is arranged in the first flow channel area (111) and the second flow channel area (112), at least one high heat dissipation area is further arranged on the first flow channel area (111) and the second flow channel area (112), the heat dissipation piece (20) comprises a plurality of columnar heat dissipation pieces (21), and the columnar heat dissipation pieces (21) are arranged in the high heat dissipation area and are arranged in an array.
2. The liquid-cooled heat sink according to claim 1, wherein the columnar heat sink (21) is cylindrical in shape.
3. The liquid cooling heat dissipating device according to claim 1, wherein a plurality of the columnar heat dissipating members (21) are disposed on each high heat dissipating area, the columnar heat dissipating members (21) form a plurality of rows of columnar heat dissipating member groups disposed at intervals, and the columnar heat dissipating members (21) in the columnar heat dissipating member groups of adjacent rows are staggered.
4. A liquid-cooled heat sink according to claim 3, characterized in that the columnar heat sink (21) is cylindrical in shape and has a diameter D, and satisfies 5.5 mm-D-6.5 mm;
the spacing between the columnar heat dissipation piece groups in adjacent rows is H 1 And satisfies H with a diameter of 10mm or less 1 ≤15mm。
5. The liquid cooling heat sink according to claim 4, wherein the distance between the centers of two adjacent columnar heat sinks (21) in each columnar heat sink group is H 2 And satisfy H of 7mm or less 2 ≤10mm。
6. The liquid cooling heat sink according to any one of claims 1 to 5, wherein the heat sink (20) further comprises a plate-like heat sink (22), the plate-like heat sink (22) being disposed outside the high heat dissipation area, adjacent plate-like heat sinks (22) being staggered or end portions of adjacent plate-like heat sinks (22) being flush.
7. The liquid cooling heat sink according to claim 1, wherein the liquid cooling heat sink comprises a flow channel bottom wall (114) and a flow channel side wall (115), the flow channel bottom wall (114), the flow channel side wall (115) and the partition plate (12) enclose the first flow channel region (111), the gap (113) and the second flow channel region (112) together, and a bottom wall (161) of the first flow guiding cavity (16) is lower than the flow channel bottom wall (114).
8. The liquid cooling heat sink according to claim 7, wherein the upper edge of the liquid inlet (15) is lower than the flow passage bottom wall (114), the first diversion chamber (16) extends obliquely upward from the liquid inlet (15) to the flow passage bottom wall (114), and the width of the bottom wall (161) of the first diversion chamber (16) gradually increases as the first diversion chamber (16) extends obliquely upward from the liquid inlet (15).
9. The liquid-cooled heat sink according to claim 1, wherein the housing (10) further has a second flow guiding chamber (18) communicating with the liquid outlet (17), the second flow guiding chamber (18) extending from the liquid outlet (17) toward the second flow channel region (112), and a cross-sectional area of the second flow guiding chamber (18) gradually increasing.
10. The liquid cooling heat sink according to claim 9, wherein the liquid inlet (15) and the liquid outlet (17) are both disposed at the first end (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223607495.3U CN219322866U (en) | 2022-12-30 | 2022-12-30 | Liquid cooling heat radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223607495.3U CN219322866U (en) | 2022-12-30 | 2022-12-30 | Liquid cooling heat radiator |
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| CN219322866U true CN219322866U (en) | 2023-07-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117881170A (en) * | 2024-03-13 | 2024-04-12 | 东莞市隆慧电子科技有限公司 | Water-cooling radiator of frequency converter |
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- 2022-12-30 CN CN202223607495.3U patent/CN219322866U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117881170A (en) * | 2024-03-13 | 2024-04-12 | 东莞市隆慧电子科技有限公司 | Water-cooling radiator of frequency converter |
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