CN219958668U - Thermistor pin encapsulation structure - Google Patents
Thermistor pin encapsulation structure Download PDFInfo
- Publication number
- CN219958668U CN219958668U CN202321657773.8U CN202321657773U CN219958668U CN 219958668 U CN219958668 U CN 219958668U CN 202321657773 U CN202321657773 U CN 202321657773U CN 219958668 U CN219958668 U CN 219958668U
- Authority
- CN
- China
- Prior art keywords
- pin
- resistor
- encapsulation
- connector
- thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 13
- 238000005516 engineering process Methods 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012946 outsourcing Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The utility model relates to a thermistor pin encapsulation structure, which belongs to the field of semiconductors and comprises the following components: the resistor comprises a resistor, a connector and encapsulation glue, wherein the resistor is fixedly connected with a PIN, the PIN and a PIN needle of the connector are welded and connected to form a conducting structure, the encapsulation glue is coated outside the conducting structure, and the head of the resistor is exposed outside. Particularly, the material adopts DB-05A (main agent) with the temperature resistance of-50 ℃ to 200 ℃: encapsulation glue of DB-05B (curing agent) (not limited to this type of encapsulation glue) encapsulates resistor pins and solder sitesThe application of the encapsulation technology in the automobile temperature sensor can improve the conduction stability of products, simplify the production technology, shorten the development period of the products and be effectively applicable to the field of temperature sensor sensors in the automobile field 。
Description
Technical Field
The utility model belongs to the field of semiconductors, and particularly relates to a thermistor pin encapsulation structure.
Background
A thermistor is a sensor resistor whose resistance value changes with a change in temperature. Positive temperature coefficient thermistors (PTC thermistors, positive Temperature Coefficient thermistor) and negative temperature coefficient thermistors (NTC thermistors, negative Temperature Coefficientthermistor) are classified according to temperature coefficients. The resistance value of the positive temperature coefficient thermistor increases with the rise of temperature, and the resistance value of the negative temperature coefficient thermistor decreases with the rise of temperature, which belongs to the semiconductor device.
A temperature sensor refers to a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is a core part of the temperature measuring instrument and has various varieties. The measuring method can be divided into two main types, namely contact type and non-contact type, and the measuring method can be divided into two types, namely thermal resistor and thermocouple according to the characteristics of sensor materials and electronic elements.
The existing temperature sensor has the defects that the resistance insulation pressure-resistant mode adopts two encapsulation technologies of pin sleeve heat shrinkage pipe or in-mold injection molding, and the simple pin sleeve heat shrinkage pipe encapsulation technology corresponds to the temperature sensor, has higher defective rate of products with weaker insulation pressure resistance or is complex in-mold injection molding encapsulation technology and is not beneficial to production, and the method comprises the following steps:
1) The simple pin sleeve heat-shrinkable tube packaging technology is easy to have the defects of infirm, broken packaging, short circuit packaging and the like, and risks are all borne by the packaging procedure;
2) The in-mold injection molding encapsulation process needs to newly open an injection mold, the mold processing period is long, and the product development period is too long.
Disclosure of Invention
In view of the above, the present utility model aims to provide a thermistor pin encapsulation structure, which realizes extremely high stability and better insulation and voltage resistance of encapsulation at high temperature or low temperature.
In order to solve the technical problems, the technical scheme of the utility model is that the thermistor PIN encapsulation structure comprises a resistor (1), a connector (2) and encapsulation glue (3), wherein the resistor (1) is fixedly connected with a PIN (11), the PIN (11) and a PIN needle (21) of the connector (2) are welded and connected into a conduction structure (4), the encapsulation glue (3) is coated outside the conduction structure (4), and the head of the resistor (1) is exposed outside.
Preferably, the connector (2) is a plastic part with a PIN needle.
Preferably, the PINs (11) are soldered to PIN PINs (21) of the connector (2).
Preferably, the resistor (1) is a high-precision thermistor.
Compared with the prior art, the utility model provides a thermistor pin encapsulation structure, which has the following beneficial effects:
the connection stability at high temperature or low temperature is extremely high, and double-layer guarantee is provided;
the stability of the encapsulation is enhanced, the encapsulation cannot be broken, and the occurrence of the conditions such as breaking and short circuit is prevented;
the practical encapsulation technology of the utility model is simpler and more convenient, the processing period is shorter, and the method is simpler and more convenient.
Drawings
FIG. 1 is a front view of the present utility model;
fig. 2 is an exploded view of the present utility model.
Wherein, 1-resistance; a 2-connector; 3-an encapsulating adhesive; 11-pins; a 21-PIN needle; 4-conductive structure.
Detailed Description
The following detailed description of the utility model is provided in connection with the accompanying drawings to facilitate understanding and grasping of the technical scheme of the utility model.
In this embodiment, it should be understood that the directions or positional relationships indicated by the terms "middle", "upper", "lower", "top", "right", "left", "upper", "back", "middle", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present utility model, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model.
In this embodiment, if not specifically described, the connection or fixation between the members may be by a bolt, a pin, or a pin, which are commonly used in the prior art, and therefore, will not be described in detail in this embodiment.
Referring to fig. 1-2, the technical effects of the present utility model are mainly as follows: the utility model provides a thermistor PIN encapsulation structure, includes resistance 1, connector 2 and encapsulation glue 3, wherein, resistance 1 fixedly connected with PIN 11, PIN 11 with the PIN needle 21 welded connection of connector 2 becomes conduction structure 4, the outsourcing of conduction structure 4 has encapsulation glue 3, and the head of resistance 1 exposes in the outside, reaches the stability that guarantee resistance and connector are connected and are switched on.
Preferably, the connector 2 is a plastic part with a PIN.
Preferably, the encapsulating adhesive 3 is in a liquid state before encapsulation, and the materials of the liquid are the main agent DB-05A and the curing agent DB-05B, and the temperature is resistant to minus 50 ℃ to 200 ℃. The encapsulation glue 3 is baked at high temperature after encapsulation to strengthen the stability of encapsulation connection.
Preferably, the PINs 11 are soldered to PIN PINs 21 of the connector 2. The encapsulating glue 3, the resistor 1 and the PIN needle 21 of the connector 2 are soldered and conducted with the resistor 1, and then the encapsulating glue 3 is used for encapsulating, so that the stability of connection and conduction of the resistor and the PIN needle of the connector is ensured, and the insulation and voltage-resistant effects are achieved.
Preferably, the resistor 1 is a high-precision thermistor, and the specific model is NTC/thermocouple/PT platinum resistor.
Of course, the above is only a typical example of the utility model, and other embodiments of the utility model are also possible, and all technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of the utility model claimed.
Claims (4)
1. The thermistor PIN encapsulation structure is characterized by comprising a resistor (1), a connector (2) and encapsulation glue (3), wherein the resistor (1) is fixedly connected with a PIN (11), the PIN (11) and a PIN needle (21) of the connector (2) are welded to form a conduction structure (4), and the encapsulation glue (3) is coated outside the conduction structure (4) ， And the head of the resistor (1) is exposed outside.
2. A thermistor PIN package according to claim 1, characterized in that the connector (2) is a plastic part with PIN needles.
3. A thermistor PIN package according to claim 1, characterized in that the PINs (11) are soldered to PIN PINs (21) of the connector (2).
4. A thermistor pin package according to claim 1, characterized in that the resistor (1) is a high-precision thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321657773.8U CN219958668U (en) | 2023-06-28 | 2023-06-28 | Thermistor pin encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321657773.8U CN219958668U (en) | 2023-06-28 | 2023-06-28 | Thermistor pin encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219958668U true CN219958668U (en) | 2023-11-03 |
Family
ID=88542081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321657773.8U Active CN219958668U (en) | 2023-06-28 | 2023-06-28 | Thermistor pin encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219958668U (en) |
-
2023
- 2023-06-28 CN CN202321657773.8U patent/CN219958668U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2019154129A1 (en) | Cilium temperature sensing-based flexible electronic skin and preparation method therefor | |
| CN104854431B (en) | Flow sensor and its manufacture method | |
| CN219958668U (en) | Thermistor pin encapsulation structure | |
| CN211927122U (en) | Temperature and pressure integrated sensor | |
| CN205333218U (en) | Temperature sensor with novel insulating packaging structure | |
| CN106052897A (en) | Temperature sensor and production technology thereof | |
| CN201508251U (en) | NTC temperature sensor manufacturing technique structure | |
| CN107910145A (en) | A kind of embedded varistor and its manufacture craft | |
| CN201522904U (en) | Small glass-encapsulated type negative temperature thermosensitive resistor | |
| CN210953163U (en) | Quick-response temperature sensor | |
| CN111537095B (en) | Temperature sensor and manufacturing method thereof | |
| CN208937209U (en) | A kind of high-temp glue encapsulation thermocouple | |
| CN206056809U (en) | A kind of temperature sensor for new-energy automobile heater | |
| CN219391161U (en) | Anti-extrusion temperature sensor | |
| CN203643046U (en) | Highly sensitive temperature sensor for soya-bean milk machine | |
| CN207395920U (en) | A kind of temperature sensor | |
| CN201741518U (en) | T0-92 and T0-92S encapsulation of NTC thermistor | |
| CN219830136U (en) | Self-locking patch type temperature sensor | |
| CN206905927U (en) | A kind of high-precision integrated form thermosensitive circuit that can be responded rapidly to | |
| CN108789458B (en) | Intelligent mechanical arm | |
| CN215677336U (en) | Single-ended NTC encapsulation temperature sensor that moulds plastics suitable for bullet head shell | |
| CN206330681U (en) | A kind of armoured thermocouple signal output apparatus | |
| CN201210431Y (en) | Welding type negative temperature coefficient thermistor | |
| CN204165668U (en) | A kind of NTC sensor detecting solid surface temperature | |
| CN206132261U (en) | Temperature sensor and bread machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |