CN219951246U - Plating layer structure of palladium-nickel alloy - Google Patents
Plating layer structure of palladium-nickel alloy Download PDFInfo
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- CN219951246U CN219951246U CN202321559345.1U CN202321559345U CN219951246U CN 219951246 U CN219951246 U CN 219951246U CN 202321559345 U CN202321559345 U CN 202321559345U CN 219951246 U CN219951246 U CN 219951246U
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- 238000007747 plating Methods 0.000 title claims abstract description 140
- 229910000990 Ni alloy Inorganic materials 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910052802 copper Inorganic materials 0.000 claims abstract description 78
- 239000010949 copper Substances 0.000 claims abstract description 78
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 52
- 238000004512 die casting Methods 0.000 claims abstract description 40
- 229910001297 Zn alloy Inorganic materials 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 38
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 26
- 229910001096 P alloy Inorganic materials 0.000 claims abstract description 23
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 22
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims abstract description 22
- 235000011180 diphosphates Nutrition 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- BQVVSSAWECGTRN-UHFFFAOYSA-L copper;dithiocyanate Chemical compound [Cu+2].[S-]C#N.[S-]C#N BQVVSSAWECGTRN-UHFFFAOYSA-L 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 238000012360 testing method Methods 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 150000003839 salts Chemical class 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 238000010998 test method Methods 0.000 abstract description 5
- 239000007921 spray Substances 0.000 abstract description 4
- 238000004070 electrodeposition Methods 0.000 abstract description 3
- 239000003518 caustics Substances 0.000 abstract description 2
- 230000007935 neutral effect Effects 0.000 abstract description 2
- 230000035939 shock Effects 0.000 abstract description 2
- 238000005234 chemical deposition Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 75
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 238000009713 electroplating Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 10
- 238000005406 washing Methods 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 6
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 6
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 4
- PDZKZMQQDCHTNF-UHFFFAOYSA-M copper(1+);thiocyanate Chemical compound [Cu+].[S-]C#N PDZKZMQQDCHTNF-UHFFFAOYSA-M 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 239000012188 paraffin wax Substances 0.000 description 4
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 3
- 229940074439 potassium sodium tartrate Drugs 0.000 description 3
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 3
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 description 3
- 239000011550 stock solution Substances 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 231100000086 high toxicity Toxicity 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a plating layer structure of palladium-nickel alloy plating, which comprises a zinc alloy die casting substrate, and a cyanide-free preplating copper layer, a pyrophosphate copper layer, a copper acid plating layer, a bright nickel plating layer, a nickel-phosphorus alloy plating layer and a palladium-nickel alloy plating layer which are sequentially prepared on the zinc alloy die casting substrate from inside to outside. The utility model discloses a plating layer structure of palladium-nickel alloy, which is characterized in that the binding force of the plating layer is measured by a thermal shock test method according to GB/T5270-2005 'test method for the adhesion strength of a metal coating electro-deposition layer and a chemical deposition layer on a metal substrate', and the binding force meets the standard requirement. According to GB/T10125-2021 salt spray test for artificial atmosphere corrosion test, neutral salt spray test is carried out for 264 hours, no corrosive substances are generated on the surface of a plating part, and the plating structure has good corrosion resistance. The process is environment-friendly and has good market prospect.
Description
Technical Field
The utility model belongs to the field of metal electroplating, and particularly relates to a plating layer structure of palladium-nickel alloy plating.
Background
The palladium-nickel alloy plating layer is prepared by a palladium-nickel alloy electroplating process, wherein the mass fractions of palladium and nickel are respectively 70% and 30%. The palladium-nickel alloy plating layer is white and bright in color, elegant and uniform, good in covering capability, excellent in wear resistance and sweat acid resistance, is generally used for decorative plating layers, and is most suitable for decorations such as electrogalvanized alloy die castings, e.g. jewelry, watches, glasses and the like.
According to the traditional process, the zinc alloy die casting is subjected to cyanide copper plating process to prepare a pre-copper plating layer, and then pyrophosphate copper plating, acid copper plating, bright nickel plating and the like are carried out. Cyanide is one of the extremely toxic compounds, and the use of cyanide has the problems of high pollution and high risk, and the use of cyanide is more and more strictly regulated in China. For this reason, there have been a great deal of development and research on cyanide-free copper plating processes, but there have been many efforts to completely replace cyanide-free copper plating with cyanide-free copper plating [1] 。
The copper plating process of polymeric thiocyanate is a non-cyanide copper plating process which is newly developed, and is characterized in that the copper plating process adopts polymeric cuprous thiocyanate as main salt, and sodium polymeric thiocyanate is used as a complexing agent, and the process performance of the copper plating process is close to that of cyanide copper plating.
Reference is made to: [1] qin Zuzu, li Jiansan, xu Jinlai, national and international advances in cyanide-free copper plating process research [ J ], electroplating and finishing, 2015, 34 (3): 149-152.
Disclosure of Invention
The utility model provides a plating layer structure of palladium-nickel alloy plating, which aims to solve the problem of high pollution caused by preplating copper in a cyanide copper plating process for zinc alloy die castings. In order to achieve the above purpose, the utility model adopts the following technical scheme:
the palladium-nickel alloy plating layer structure comprises a zinc alloy die casting substrate, and a cyanide-free preplating copper layer, a pyrophosphate copper layer, an acid copper layer, a bright nickel layer, a nickel-phosphorus alloy layer and a palladium-nickel alloy layer which are sequentially prepared on the zinc alloy die casting substrate from inside to outside;
the cyanide-free preplating copper layer is prepared by adopting a polymerized thiocyanate copper plating process;
the thickness of the cyanide-free preplating copper layer is 2-5 mu m.
Preferably, the thickness of the pyrophosphate copper plating layer is 5 to 12 μm.
Preferably, the thickness of the acid copper plating layer is 7-17 μm.
Preferably, the thickness of the bright nickel plating layer is 5-12 mu m.
Preferably, the thickness of the nickel-phosphorus alloy coating is 0.5-3.5 mu m.
Preferably, the thickness of the palladium-nickel alloy plating layer is 0.1-0.8 mu m.
The surface of the zinc alloy die casting substrate is provided with more pores, the copper plating speed of the polymeric thiocyanate is lower, and the preplating copper layer prepared by adopting the process can not effectively seal the pores on the surface of the zinc alloy die casting, so that the pores can be completely sealed by carrying out pyrophosphate copper plating. The plating structure can well prevent corrosion of corrosive medium to the direction of the substrate. Plating nickel-phosphorus alloy on the bright nickel plating layer and then plating palladium-nickel alloy can increase the corrosion resistance of the plating layer.
Compared with the prior art, the utility model has the following beneficial effects:
1. the plating structure of the palladium-nickel alloy disclosed by the utility model adopts a polymeric thiocyanate copper plating process to replace high-toxicity cyanide copper plating, so that the problem of high pollution caused by cyanide is solved;
2. the plating layer structure of the palladium-plated nickel alloy prepared by the utility model meets the requirements of GB/T5270-2005 standard of test method comment on adhesion strength of a metal coating electro-deposition and chemical deposition layer on a metal matrix.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and constitute a part of this specification, are incorporated in and constitute a part of this specification and do not limit the utility model in any way, and in which:
fig. 1 is a schematic diagram of the plating structure of examples 1 and 2 of the present utility model.
Description of the embodiments
The present utility model will now be described in detail with reference to the drawings and the specific embodiments thereof, wherein the exemplary embodiments and descriptions of the present utility model are provided for illustration of the utility model and are not intended to be limiting.
And preparing a cyanide-free preplating layer, a pyrophosphate copper plating layer, an acid copper plating layer, a bright nickel plating layer, a nickel-phosphorus alloy plating layer and a palladium-nickel alloy plating layer on the zinc alloy die casting substrate sequentially from inside to outside.
The prior pretreatment process is adopted to remove wax, oil and activate the zinc alloy die casting.
And preparing the cyanide-free preplating copper layer by adopting a polymeric thiocyanate copper plating process after pretreatment of the zinc alloy die casting.
Preferably, the thickness of the cyanide-free preplating copper layer is 2-5 μm.
Preferably, the cyanide-free preplating copper layer is prepared by adopting an HT-810 polymerized thiocyanate copper plating process of Zunyi electroplating materials Co., ltd: 17-23 g/L of polymerized cuprous thiocyanate, 100-160 g/L of polymerized sodium thiocyanate, 8-12 g/L of potassium sodium tartrate, 1-2 mL/L of HT-810 brightening agent, 2-4 mL/L of HT-810 locating agent, 45-55 ℃ of plating bath temperature, 12-13 pH range of plating solution and 0.5-1.0A/dm of cathode current density 2 The cathode moves for 4-6 m/min, and the anode current density is less than or equal to 0.5A/dm 2 Oxygen-free electrolytic copper corners (or copper particles) are used as anodes.
And preparing a pyrophosphate copper plating layer by adopting the current pyrophosphate copper plating process after pre-plating copper of the zinc alloy die casting. Preferably, the thickness of the pyrophosphate copper plating layer is 5 to 12 μm.
And preparing an acid copper plating layer by adopting the current acid copper plating process after the pyrophosphate of the zinc alloy die casting is plated with copper. Preferably, the thickness of the acid copper plating layer is 7-17 μm.
And preparing a bright nickel coating by adopting the current bright nickel plating process after the zinc alloy die casting is coated with acid copper. Preferably, the thickness of the bright nickel plating layer is 5-12 mu m.
And after the zinc alloy die casting is plated with bright nickel, preparing a nickel-phosphorus alloy plating layer by adopting the current nickel-phosphorus alloy plating process.
Preferably, the thickness of the nickel-phosphorus alloy coating is 0.5-3.5 mu m.
Preferably, the nickel-phosphorus alloy plating layer is prepared by adopting an EMFASI 8812 nickel-phosphorus alloy electroplating process in the super-bonding chemical industry: 450-550 mL/L of EMFASI 8812 MU cylinder opener, 280-340 g/L of nickel sulfate, 2.5-2.7 pH range of plating solution, 60-65 ℃ of operation temperature and 3-6A/dm of cathode current density 2 The cathode moves 3-5 m/min.
And after the zinc alloy die casting is plated with the nickel-phosphorus alloy, preparing a palladium-nickel alloy plating layer by adopting the current palladium-nickel alloy electroplating process.
Preferably, the thickness of the palladium-nickel alloy plating layer is 0.1-0.8 mu m.
Preferably, the palladium-nickel alloy plating layer is prepared by adopting a PNP-7030 palladium-nickel alloy electroplating process in super-bonding chemical industry: PNP-7030 cylinder opener is water aqua, stock solution is used without dilution, the mass concentration of palladium in the prepared plating solution is 4-6 g/L, the mass concentration of nickel is 5.5-8.5 g/L, the pH range of the plating solution is 8.5-9.5, the operating temperature is 20-30 ℃, and the cathode current density is 0.5-1.2A/dm 2 The cathode moves 3-5 m/min.
And the zinc alloy die casting is plated with palladium-nickel alloy, washed by water and dried for 15-25 min at 70-80 ℃.
Examples
As shown in fig. 1, a plating structure of palladium-nickel alloy plating comprises a zinc alloy die casting substrate 1, and a cyanide-free preplating copper layer 2, a pyrophosphate copper layer 3, an acid copper layer 4, a bright nickel layer 5, a nickel-phosphorus alloy layer 6 and a palladium-nickel alloy layer 7 which are sequentially prepared on the zinc alloy die casting substrate 1 from inside to outside.
1. Pretreatment:
the zinc alloy die casting substrate 1 is subjected to chemical paraffin removal, water washing, ultrasonic paraffin removal, water washing, chemical degreasing, water washing, ultrasonic degreasing, water washing, acid salt activation and water washing.
2. Cyanide-free preplating copper:
after the zinc alloy die casting is pretreated, a cyanide-free preplating copper layer 2 is prepared by adopting an HT-810 polymeric thiocyanate copper plating process of Zunyi electroplating materials limited company, and the thickness of the copper layer is 3 mu m.
18g/L of polymerized cuprous thiocyanate, 120g/L of polymerized sodium thiocyanate, 10g/L of potassium sodium tartrate, 1.5mL/L of HT-810 brightening agent, 3mL/L of HT-810 locating agent, 53 ℃ of plating bath temperature, 12.8 of plating solution pH and 0.7A/dm of cathode current density 2 The cathode was moved 5m/min and the anode current density was 0.3A/dm 2 An oxygen-free electrolytic copper corner was used as the anode.
3. Pyrophosphate copper plating:
after cyanide-free preplating copper of the zinc alloy die casting, the pyrophosphate copper plating layer 3 is prepared by adopting the current pyrophosphate copper plating process, and the thickness of the plating layer is 8 mu m.
4. Copper plating:
after the pyrophosphate of the zinc alloy die casting is plated with copper, an acid copper plating layer 4 is prepared by adopting the current acid copper plating process, and the thickness of the plating layer is 10 mu m.
5. Plating bright nickel:
after the zinc alloy die casting is coated with acid copper, a bright nickel coating 5 is prepared by adopting the current bright nickel plating process, and the thickness of the coating is 10 mu m.
6. Nickel-phosphorus alloy:
after the zinc alloy die casting is plated with bright nickel, an EMFASI 8812 nickel-phosphorus alloy electroplating process of super-bonding chemical industry is adopted to prepare a nickel-phosphorus alloy plating layer 6, and the thickness of the plating layer is 2 mu m.
EMFASI 8812 MU cylinder opener 430mL/L, nickel sulfate 290g/L, plating solution pH 2.6, operating temperature 62 ℃, cathode current density 3.5A/dm 2 The cathode was moved 4m/min.
7. Plating palladium nickel alloy:
and after the zinc alloy die casting is plated with the nickel-phosphorus alloy, a PNP-7030 palladium-nickel alloy electroplating process in super-bonding chemical industry is adopted to prepare a palladium-nickel alloy coating 7, and the thickness of the coating is 0.5 mu m.
PNP-7030 cylinder opener is water aqua, stock solution is used without dilution, palladium chloride is added in proper amount, the mass concentration of palladium in the prepared plating solution is 4.5g/L, the mass concentration of nickel is 6.5g/L, the pH value of the plating solution is 9, the operating temperature is 23 ℃, and the cathode current density is 0.8A/dm 2 The cathode was moved 4m/min.
8. And (3) drying:
and the zinc alloy die casting is plated with palladium-nickel alloy, washed with water and dried.
Examples
As shown in fig. 1, a plating structure of palladium-nickel alloy plating comprises a zinc alloy die casting substrate 1, and a cyanide-free preplating copper layer 2, a pyrophosphate copper layer 3, an acid copper layer 4, a bright nickel layer 5, a nickel-phosphorus alloy layer 6 and a palladium-nickel alloy layer 7 which are sequentially prepared on the zinc alloy die casting substrate 1 from inside to outside.
1. Pretreatment:
the zinc alloy die casting substrate 1 is subjected to chemical paraffin removal, water washing, ultrasonic paraffin removal, water washing, chemical degreasing, water washing, ultrasonic degreasing, water washing, acid salt activation and water washing.
2. Cyanide-free preplating copper:
after the zinc alloy die casting is pretreated, a non-cyanide copper plating layer 2 is prepared by adopting an HT-810 polymeric thiocyanate copper plating process of Zunyi electroplating materials limited company, and the thickness of the copper plating layer is 5 mu m.
22g/L of polymerized cuprous thiocyanate, 150g/L of polymerized sodium thiocyanate, 10g/L of potassium sodium tartrate, 1.5mL/L of HT-810 brightening agent, 3mL/L of HT-810 locating agent, 52 ℃ of plating bath temperature, 12.8 of plating solution pH and 0.8A/dm of cathode current density 2 The cathode was moved 5m/min and the anode current density was 0.4A/dm 2 Oxygen-free electrolytic copper particles are used as anode.
3. Pyrophosphate copper plating:
after cyanide-free preplating copper of the zinc alloy die casting, the pyrophosphate copper plating layer 3 is prepared by adopting the current pyrophosphate copper plating process, and the thickness of the plating layer is 6 mu m.
4. Copper plating:
after the pyrophosphate of the zinc alloy die casting is plated with copper, an acid copper plating layer 4 is prepared by adopting the current acid copper plating process, and the thickness of the plating layer is 12 mu m.
5. Plating bright nickel:
after the zinc alloy die casting is coated with acid copper, a bright nickel coating 5 is prepared by adopting the current bright nickel plating process, and the thickness of the coating is 8 mu m.
6. Nickel-phosphorus alloy:
after the zinc alloy die casting is plated with bright nickel, an EMFASI 8812 nickel-phosphorus alloy electroplating process of super-bonding chemical industry is adopted to prepare a nickel-phosphorus alloy plating layer 6, and the thickness of the plating layer is 2 mu m.
530mL/L of EMFASI 8812 MU cylinder opener, 330g/L of nickel sulfate, 2.6 pH of plating solution, 62 ℃ of operation temperature and 4A/dm of cathode current density 2 The cathode was moved 4m/min.
7. Plating palladium nickel alloy:
and after the zinc alloy die casting is plated with the nickel-phosphorus alloy, a PNP-7030 palladium-nickel alloy electroplating process in super-bonding chemical industry is adopted to prepare a palladium-nickel alloy coating 7, and the thickness of the coating is 0.5 mu m.
PNP-7030 cylinder opener is water aqua, stock solution is used without dilution, palladium chloride is added in proper amount, the mass concentration of palladium in the prepared plating solution is 5.5g/L, the mass concentration of nickel is 7.5g/L, the pH value of the plating solution is 9, the operating temperature is 28 ℃, and the cathode current density is 1A/dm 2 The cathode was moved 4m/min.
8. And (3) drying:
and the zinc alloy die casting is plated with palladium-nickel alloy, washed with water and dried.
Test example 1:
the palladium-nickel alloy plated articles prepared in this example 1 and example 2 were evaluated by a thermal shock test method according to GB/T5270-2005, test method for adhesion strength of electrodeposited and chemically deposited metal coating layer on Metal substrate. And (3) placing the plating part in a heating furnace, heating to 150 ℃, preserving heat for 30min, taking out, placing into water with room temperature, cooling suddenly, and ensuring that the plating layer does not foam or fall off, wherein the bonding force of the plating layer is good.
Test example 2:
the palladium-nickel alloy plating pieces prepared in the embodiment 1 and the embodiment 2 are subjected to a neutral salt spray test 264h according to the standard of GB/T10125-2021 salt spray test for artificial atmosphere corrosion test, no corrosive substances are generated on the surfaces of the plating pieces, and the prepared plating layers have good corrosion resistance.
The foregoing has outlined the detailed description of the embodiments of the present utility model, and the detailed description of the embodiments and the embodiments of the present utility model has been provided herein by way of illustration of specific examples, which are intended to be merely illustrative of the principles of the embodiments of the present utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.
Claims (6)
1. The utility model provides a plating layer structure of palladium nickel alloy, which is characterized in that: comprises a zinc alloy die casting substrate, and a cyanide-free preplating copper layer, a pyrophosphate copper layer, an acid copper layer, a bright nickel layer, a nickel-phosphorus alloy layer and a palladium-nickel alloy layer which are sequentially prepared on the zinc alloy die casting substrate from inside to outside;
the cyanide-free preplating copper layer is prepared by adopting a polymerized thiocyanate copper plating process;
the thickness of the cyanide-free preplating copper layer is 2-5 mu m.
2. The palladium-plated nickel alloy plating layer structure according to claim 1, wherein: the thickness of the pyrophosphate copper plating layer is 5-12 mu m.
3. The palladium-plated nickel alloy plating layer structure according to claim 1, wherein: the thickness of the acid copper plating layer is 7-17 mu m.
4. The palladium-plated nickel alloy plating layer structure according to claim 1, wherein: the thickness of the bright nickel coating is 5-12 mu m.
5. The palladium-plated nickel alloy plating layer structure according to claim 1, wherein: the thickness of the nickel-phosphorus alloy plating layer is 0.5-3.5 mu m.
6. The palladium-plated nickel alloy plating layer structure according to claim 1, wherein: the thickness of the palladium-nickel alloy plating layer is 0.1-0.8 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321559345.1U CN219951246U (en) | 2023-06-19 | 2023-06-19 | Plating layer structure of palladium-nickel alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321559345.1U CN219951246U (en) | 2023-06-19 | 2023-06-19 | Plating layer structure of palladium-nickel alloy |
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| Publication Number | Publication Date |
|---|---|
| CN219951246U true CN219951246U (en) | 2023-11-03 |
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