CN219586209U - Plating layer structure of zinc alloy die casting gold-plated palladium alloy - Google Patents
Plating layer structure of zinc alloy die casting gold-plated palladium alloy Download PDFInfo
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- CN219586209U CN219586209U CN202320317736.6U CN202320317736U CN219586209U CN 219586209 U CN219586209 U CN 219586209U CN 202320317736 U CN202320317736 U CN 202320317736U CN 219586209 U CN219586209 U CN 219586209U
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Abstract
The utility model discloses a plating layer structure of a gold-plated palladium alloy of a zinc alloy die casting, which comprises a zinc alloy matrix, and an acidic zinc-nickel alloy plating layer, a citrate nickel plating layer, a pyrophosphate copper plating layer, an acid copper plating layer, a bright nickel plating layer, a nickel-phosphorus alloy plating layer and a gold-palladium alloy plating layer which are sequentially prepared on the zinc alloy matrix from inside to outside. The plating layer structure of the gold-plated palladium alloy disclosed by the utility model is environment-friendly in preparation process, and has the advantages that the binding force of the plating layer is measured by a thermal shock test method according to GB/T5270-2005 'test method for the adhesion strength of a metal covering layer electro-deposition layer and a chemical deposition layer on a metal substrate', the binding force meets the standard requirement, the neutral salt spray test is carried out for 360 hours according to GB/T10125-2021 'salt spray test for artificial atmosphere corrosion test', no corrosive substances are generated on the surface of a plated part, and the plated part has good corrosion resistance.
Description
Technical Field
The utility model belongs to the field of metal electroplating, and particularly relates to a plating structure of a gold-plated palladium alloy of a zinc alloy die casting.
Background
The gold-palladium alloy coating has excellent corrosion resistance, is durable without color change, is generally suitable for functional coatings of high-end electronic products, and has not been developed and utilized in the field of decorative electroplating.
The surface of the zinc alloy die casting cannot be directly plated with pyrophosphate copper, otherwise, loose replacement copper layers are formed, and the binding force of the plating layer is seriously reduced. According to the traditional process, the zinc alloy die casting is subjected to cyanide copper plating process to prepare a pre-copper plating layer, and then pyrophosphate copper plating, acid copper plating, bright nickel plating and the like are carried out. Cyanide is one of the extremely toxic compounds, and the use of cyanide has the problems of high pollution and high risk, and the use of cyanide is more and more strictly regulated in China. Therefore, efforts to develop a replacement for the cyanide copper plating process have been made.
Disclosure of Invention
The utility model provides a plating structure of gold-plated palladium alloy of a zinc alloy die casting, which aims to solve the problems of high pollution and high risk of preplating copper by adopting a cyanide copper plating process. In order to achieve the above purpose, the utility model adopts the following technical scheme:
the plating layer structure of the gold-plated palladium alloy of the zinc alloy die casting comprises a zinc alloy matrix, and an acidic zinc-nickel alloy plating layer, a citrate nickel plating layer, a pyrophosphate copper plating layer, a copper acid plating layer, a bright nickel plating layer, a nickel-phosphorus alloy plating layer and a gold-palladium alloy plating layer which are sequentially prepared on the zinc alloy matrix from inside to outside;
the thickness of the gold-palladium alloy coating is 0.05-0.8 mu m.
Preferably, the thickness of the acid zinc-nickel alloy plating layer is 4-8 mu m.
Preferably, the thickness of the citrate nickel plating layer is 1-3 μm.
Preferably, the thickness of the pyrophosphate copper plating layer is 3 to 6 μm.
Preferably, the thickness of the acid copper plating layer is 7-11 μm.
Preferably, the thickness of the bright nickel plating layer is 6-10 mu m.
Preferably, the thickness of the nickel-phosphorus alloy coating is 0.5-2 μm.
The acid zinc-nickel alloy plating on the zinc alloy die casting substrate can effectively close the pores on the substrate surface, and can obviously improve the brightness of the surface of a plated part, in addition, the plating solution immersed in the pores on the zinc alloy substrate surface has weak corrosiveness to the substrate and the plating layer, and can not cause poor binding force and foaming of the plating layer. The citrate nickel plating layer prepared on the acidic zinc-nickel alloy plating layer has good binding force. The pyrophosphate copper plating can also form better binding force on the citrate nickel plating layer. Plating acid copper on the pyrophosphate copper plating layer can significantly increase the brightness of the plating layer. The bright nickel coating is prepared on the acid copper coating, the potential of the electrode of the nickel coating is negative, and the nickel coating belongs to an anode coating for the copper coating, so that corrosion of a corrosive medium to the direction of a substrate can be well prevented. The nickel-phosphorus alloy plating on the bright nickel plating layer can further improve the corrosion resistance of the plating layer.
Compared with the prior art, the utility model has the following beneficial effects:
1. the plating structure of the gold-plated palladium alloy of the zinc alloy die casting disclosed by the utility model adopts acid zinc-nickel alloy plating and citrate nickel plating to replace high-toxicity cyanide copper plating, and provides an effective technical scheme for eliminating the cyanide copper plating process;
2. the gold-palladium alloy coating prepared by the method has good anti-discoloration capability.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and constitute a part of this specification, are incorporated in and constitute a part of this specification and do not limit the utility model in any way, and in which:
fig. 1 is a schematic diagram of the plating structure of examples 1 and 2 of the present utility model.
Description of the embodiments
The present utility model will now be described in detail with reference to the drawings and the specific embodiments thereof, wherein the exemplary embodiments and descriptions of the present utility model are provided for illustration of the utility model and are not intended to be limiting.
Acid zinc-nickel alloy plating, citrate nickel plating, pyrophosphate copper plating, acid copper plating, bright nickel plating, nickel-phosphorus alloy plating and gold-palladium alloy plating are sequentially prepared on the zinc alloy die casting substrate from inside to outside.
The prior pretreatment process is adopted to remove wax, oil and activate the workpiece.
After the workpiece is pretreated, the acid zinc-nickel alloy plating layer is prepared by adopting the current acid zinc-nickel alloy electroplating process, and the thickness of the prepared plating layer is preferably 4-8 mu m.
After the workpiece is plated with the acid zinc-nickel alloy, the citrate nickel plating layer is prepared by adopting the current citrate nickel plating process, and the thickness of the prepared plating layer is preferably 1-3 mu m.
Preferably, the citrate nickel plating process comprises the following steps: 180-250 g/L of nickel sulfate hexahydrate, 10-12 g/L of sodium chloride, 30-35 g/L of boric acid, 30-40 g/L of magnesium sulfate, pH value of 7.0-7.2, plating bath temperature of 50-60 ℃ and cathode current density of 1-1.5A/dm 2 The cathode moves for 4-6 m/min.
After the workpiece citrate is plated with nickel, the pyrophosphate copper plating layer is prepared by adopting the current pyrophosphate copper plating process, and the thickness of the prepared plating layer is preferably 3-6 mu m.
After the work piece pyrophosphate copper plating, the acid copper plating layer is prepared by adopting the current acid copper plating process, and the thickness of the prepared plating layer is preferably 7-11 mu m.
After the work piece is coated with acid copper, the current bright nickel plating process is adopted to prepare a bright nickel plating layer, and the thickness of the prepared plating layer is preferably 6-10 mu m.
After the work piece is plated with bright nickel, the nickel-phosphorus alloy plating layer is prepared by adopting the current nickel-phosphorus alloy plating process, and the thickness of the prepared plating layer is preferably 0.5-2 mu m.
After the workpiece is plated with nickel-phosphorus alloy, the current gold-plating palladium alloy process is adopted to prepare a gold-palladium alloy plating layer, and the thickness of the prepared plating layer is preferably 0.05-0.8 mu m.
Preferably, the gold-palladium alloy coating is prepared by adopting a BALILOY 8500 cyanide-free gold-plating palladium alloy process of Guangzhou super-nation chemical industry Co., ltd, and the plating solution comprises the components and the operating conditionsThe method comprises the following steps: BALILOY 8500 MUP cylinder opener stock solution is used, gold salt complexing agent is 0.5g/L, pH range is 9.0-9.5, operating temperature is 38-42 ℃, and cathode current density is 1A/dm 2 The cathode moves for 3 to 5m/min, the gold content is controlled to be 0.4 to 0.6g/L, and the palladium content is controlled to be 0.3 to 0.5g/L in the maintenance of the plating solution.
Examples
As shown in fig. 1, a plating structure of a gold-plated palladium alloy of a zinc alloy die casting comprises a zinc alloy substrate 1, and an acidic zinc-nickel alloy plating layer 2, a citrate nickel plating layer 3, a pyrophosphate copper plating layer 4, a copper acid plating layer 5, a bright nickel plating layer 6, a nickel-phosphorus alloy plating layer 7 and a gold-palladium alloy plating layer 8 which are sequentially prepared on the zinc alloy substrate 1 from inside to outside.
The thickness of the acid zinc-nickel alloy plating layer 2 is 6 mu m, and the acid zinc-nickel alloy plating layer is prepared by adopting the current acid zinc-nickel alloy plating process.
The thickness of the citrate nickel plating layer 3 is 2 mu m, and the citrate nickel plating layer is prepared by the existing citrate nickel plating process:
200g/L of nickel sulfate hexahydrate, 10g/L of sodium chloride, 30g/L of boric acid, 30g/L of magnesium sulfate, pH value of 7.0, temperature of 50 ℃ and cathode current density of 1.2A/dm 2 The cathode was moved 5m/min.
The thickness of the pyrophosphate copper plating layer 4 is 5 μm, and the pyrophosphate copper plating layer is prepared by the current pyrophosphate copper plating process.
The thickness of the acid copper plating layer 5 is 9 mu m, and the acid copper plating layer is prepared by adopting the current acid copper plating process.
The thickness of the bright nickel coating 6 is 8 mu m, and the bright nickel coating is prepared by the current bright nickel coating process.
The thickness of the nickel-phosphorus plating layer 7 is 1 mu m, and the nickel-phosphorus plating layer is prepared by adopting the existing nickel-phosphorus alloy plating process.
The thickness of the gold-palladium alloy coating 8 is 0.3 mu m, and the gold-palladium alloy coating is prepared by adopting a BALILOY 8500 cyanide-free gold-palladium alloy process in the super-bonding chemical industry:
BALILOY 8500 MUP cylinder opener stock solution is used, gold salt complexing agent is 0.5g/L, pH value is 9.2, operating temperature is 40deg.C, and cathode current density is 1A/dm 2 The cathode moves for 4m/min, the gold content is controlled to be 0.5g/L, and the palladium content is controlled to be 0.4g/L in the maintenance of the plating solution.
The embodiment is divided into the following steps in specific operation:
1. pretreatment: the work piece substrate 1 is subjected to the steps of 'chemical dewaxing, water washing, ultrasonic dewaxing, water washing, chemical degreasing, water washing, acid salt activation and water washing'.
2. Plating acid zinc-nickel alloy: and preparing an acidic zinc-nickel alloy coating 2 after the pretreatment of the workpiece.
3. Citrate nickel plating: the workpiece is coated with acid zinc-nickel alloy and then is subjected to sulfuric acid film removal with the mass fraction of 5%, water washing, citrate nickel plating and water washing to prepare the citrate nickel plating layer 3.
4. Pyrophosphate copper plating: the pyrophosphate copper plating layer 4 is prepared after the citrate of the workpiece is plated with nickel.
5. Copper plating: the work piece is copper coated with pyrophosphate to prepare an acid copper coating 5.
6. Plating bright nickel: the work piece is coated with acid copper to prepare a bright nickel coating 6.
7. Nickel-phosphorus alloy: and preparing a nickel-phosphorus alloy coating 7 after plating the work piece with bright nickel.
8. Gold plating palladium alloy: after the workpiece is plated with nickel-phosphorus alloy, a gold-palladium alloy coating 8 is prepared according to the Balloy 8500 cyanide-free gold-plating palladium alloy process.
9. And (3) drying: and (5) washing the workpiece with water, and drying.
Examples
As shown in fig. 1, a plating structure of a gold-plated palladium alloy of a zinc alloy die casting comprises a zinc alloy substrate 1, and an acidic zinc-nickel alloy plating layer 2, a citrate nickel plating layer 3, a pyrophosphate copper plating layer 4, a copper acid plating layer 5, a bright nickel plating layer 6, a nickel-phosphorus alloy plating layer 7 and a gold-palladium alloy plating layer 8 which are sequentially prepared on the zinc alloy substrate 1 from inside to outside.
The thickness of the acid zinc-nickel alloy plating layer 2 is 4 mu m, and the acid zinc-nickel alloy plating layer is prepared by adopting the current acid zinc-nickel alloy plating process.
The thickness of the citrate nickel plating layer 3 is 3 mu m, and the citrate nickel plating layer is prepared by the existing citrate nickel plating process:
220g/L nickel sulfate hexahydrate, 12g/L sodium chloride, 32g/L boric acid, 35g/L magnesium sulfate, pH value of 7.0, temperature of 55 ℃ and cathode current density of 1.2A/dm 2 Cathode movement 5m/min。
The thickness of the pyrophosphate copper plating layer 4 is 3 μm, and the pyrophosphate copper plating layer is prepared by the current pyrophosphate copper plating process.
The thickness of the acid copper plating layer 5 is 11 mu m, and the acid copper plating layer is prepared by the existing acid copper plating process.
The thickness of the bright nickel coating 6 is 6 mu m, and the bright nickel coating is prepared by the current bright nickel coating process.
The thickness of the nickel-phosphorus plating layer 7 is 1.5 mu m, and the nickel-phosphorus plating layer is prepared by adopting the existing nickel-phosphorus alloy plating process.
The thickness of the gold-palladium alloy coating 8 is 0.4 mu m, and the gold-palladium alloy coating is prepared by adopting a BALILOY 8500 cyanide-free gold-palladium alloy process in the super-bonding chemical industry:
BALILOY 8500 MUP cylinder opener stock solution is used, gold salt complexing agent is 0.5g/L, pH value is 9.4, operating temperature is 40deg.C, and cathode current density is 1A/dm 2 The cathode moves for 4m/min, the gold content is controlled to be 0.55g/L, and the palladium content is controlled to be 0.45g/L in the maintenance of the plating solution. .
The embodiment is divided into the following steps in specific operation:
1. pretreatment: the work piece substrate 1 is subjected to the steps of 'chemical dewaxing, water washing, ultrasonic dewaxing, water washing, chemical degreasing, water washing, acid salt activation and water washing'.
2. Plating acid zinc-nickel alloy: and preparing an acidic zinc-nickel alloy coating 2 after the pretreatment of the workpiece.
3. Citrate nickel plating: the workpiece is coated with acid zinc-nickel alloy and then is subjected to sulfuric acid film removal with the mass fraction of 5%, water washing, citrate nickel plating and water washing to prepare the citrate nickel plating layer 3.
4. Pyrophosphate copper plating: the pyrophosphate copper plating layer 4 is prepared after the citrate of the workpiece is plated with nickel.
5. Copper plating: the work piece is copper coated with pyrophosphate to prepare an acid copper coating 5.
6. Plating bright nickel: the work piece is coated with acid copper to prepare a bright nickel coating 6.
7. Nickel-phosphorus alloy: and preparing a nickel-phosphorus alloy coating 7 after plating the work piece with bright nickel.
8. Gold plating palladium alloy: after the workpiece is plated with nickel-phosphorus alloy, a gold-palladium alloy coating 8 is prepared according to the Balloy 8500 cyanide-free gold-plating palladium alloy process.
9. And (3) drying: and (5) washing the workpiece with water, and drying.
Test example 1
The gold-palladium alloy plating articles prepared in this example 1 and example 2 were evaluated in terms of thermal shock test method according to GB/T5270-2005, test method for adhesion strength of electrodeposited and chemically deposited metal coating layer on Metal substrate. And (3) placing the workpiece in a heating furnace, heating to 150 ℃, preserving heat for 30min, taking out, placing in water at room temperature, cooling suddenly, and ensuring that the coating does not foam or fall off and has good binding force.
Test example 2
The gold-palladium alloy plating pieces prepared in the embodiment 1 and the embodiment 2 are subjected to a neutral salt spray test for 360 hours according to the standard of GB/T10125-2021 salt spray test for artificial atmosphere corrosion test, and no corrosive substances are generated on the surfaces of the plating pieces.
Test example 3
The gold-palladium alloy plating pieces prepared in this example 1 and example 2 were hung in an outdoor environment for 2 years, and no observable change occurred on the surface of the plating piece.
Comparative example 1
An acid zinc-nickel alloy plating layer, a citrate nickel plating layer, a pyrophosphate copper plating layer, an acid copper plating layer and a bright nickel plating layer are prepared on a zinc alloy die casting according to the scheme of the embodiment 1, and then a gold plating layer is prepared according to the BaLILOY 300 FC 3N acid gold plating process of the super-bonding chemical industry, wherein the thickness of the gold plating layer is 0.4 mu m. The prepared gold-plated piece is hung in an outdoor environment for 2 years, and the surface of the plated piece is darkened in color.
The foregoing has described in detail the technical solutions provided by the embodiments of the present utility model, and specific examples have been applied to illustrate the principles and implementations of the embodiments of the present utility model, where the above description of the embodiments is only suitable for helping to understand the principles of the embodiments of the present utility model; meanwhile, according to the embodiments and principles of the present utility model, some changes may be made in the specific embodiments and application scope by those skilled in the art, but they should fall within the scope of the claims.
Claims (7)
1. A plating layer structure of a gold-plated palladium alloy of a zinc alloy die casting is characterized in that: comprises a zinc alloy matrix, and an acidic zinc-nickel alloy plating layer, a citrate nickel plating layer, a pyrophosphate copper plating layer, an acid copper plating layer, a bright nickel plating layer, a nickel-phosphorus alloy plating layer and a gold-palladium alloy plating layer which are sequentially prepared on the zinc alloy matrix from inside to outside;
the thickness of the gold-palladium alloy coating is 0.05-0.8 mu m.
2. The plating structure of the gold-plated palladium alloy of the zinc alloy die casting according to claim 1, wherein: the thickness of the acid zinc-nickel alloy plating layer is 4-8 mu m.
3. The plating structure of the gold-plated palladium alloy of the zinc alloy die casting according to claim 1, wherein: the thickness of the citrate nickel plating layer is 1-3 mu m.
4. The plating structure of the gold-plated palladium alloy of the zinc alloy die casting according to claim 1, wherein: the thickness of the pyrophosphate copper plating layer is 3-6 mu m.
5. The plating structure of the gold-plated palladium alloy of the zinc alloy die casting according to claim 1, wherein: the thickness of the acid copper plating layer is 7-11 mu m.
6. The plating structure of the gold-plated palladium alloy of the zinc alloy die casting according to claim 1, wherein: the thickness of the bright nickel coating is 6-10 mu m.
7. The plating structure of the gold-plated palladium alloy of the zinc alloy die casting according to claim 1, wherein: the thickness of the nickel-phosphorus alloy coating is 0.5-2 mu m.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202320317736.6U CN219586209U (en) | 2023-02-27 | 2023-02-27 | Plating layer structure of zinc alloy die casting gold-plated palladium alloy |
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| CN202320317736.6U CN219586209U (en) | 2023-02-27 | 2023-02-27 | Plating layer structure of zinc alloy die casting gold-plated palladium alloy |
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