CN212103010U - Coating structure of gold-plated nickel alloy of zinc alloy die casting - Google Patents
Coating structure of gold-plated nickel alloy of zinc alloy die casting Download PDFInfo
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- CN212103010U CN212103010U CN202020369398.7U CN202020369398U CN212103010U CN 212103010 U CN212103010 U CN 212103010U CN 202020369398 U CN202020369398 U CN 202020369398U CN 212103010 U CN212103010 U CN 212103010U
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Abstract
The utility model discloses a zinc alloy die casting gilding nickel alloy's cladding material structure, including the zinc alloy base member and alkaline zinc-nickel alloy cladding material, chemical nickel coating, pyrophosphate copper plate, acid copper cladding material, bright nickel cladding material, nickel phosphorus alloy cladding material, gold nickel alloy cladding material that from inside to outside prepare in proper order on the zinc alloy base member. The utility model discloses a gold nickel alloy cladding material structure, preparation technology environmental protection carries out neutral salt fog test 168 hours according to GB/T10125 + 2012 "artificial atmosphere corrosion test salt fog test", and the piece surface that plates does not have the corrosive substance and generates, has good corrosion resistance.
Description
Technical Field
The utility model belongs to the metal plating field, concretely relates to zinc alloy die casting gilding nickel alloy's cladding material structure.
Background
The acid gold-nickel alloy plating speed is high, the plating layer is bright, the color is bright, the wear resistance and the ductility are excellent, the cost is low, and the method is suitable for preparing a thicker gold-nickel alloy plating layer.
The traditional process for electroplating acidic gold-nickel alloy on zinc alloy die castings generally uses cyanide copper plating as a pre-plating layer, and because cyanide is extremely toxic, the traditional process does not meet the industrial policy made by the national development and reform committee in the catalogue of industrial structure adjustment guidance (2011).
The zinc alloy die casting surface has more pores, and the coating prepared by the traditional process cannot effectively eliminate the pores on the surface of the matrix of the plated part, so that the corrosion resistance of the coating is poor.
SUMMERY OF THE UTILITY MODEL
In order to solve zinc alloy die casting preparation gold nickel alloy cladding material and use the cyanide copper facing technology problem of high toxicity, the utility model provides a zinc alloy die casting gold nickel alloy's cladding material structure. In order to achieve the purpose, the utility model adopts the following technical scheme:
a plating layer structure of gold-plated nickel alloy of a zinc alloy die casting comprises a zinc alloy substrate, and an alkaline zinc-nickel alloy plating layer, a chemical nickel plating layer, a pyrophosphate copper plating layer, an acid copper plating layer, a bright nickel plating layer, a nickel-phosphorus alloy plating layer and an acid gold-nickel alloy plating layer which are sequentially prepared on the zinc alloy substrate from inside to outside.
Preferably, the thickness of the alkaline zinc-nickel alloy coating is 5-15 μm.
Preferably, the chemical nickel plating layer is a low-phosphorus chemical nickel plating layer, and the thickness of the plating layer is 1-5 μm.
Preferably, the pyrophosphate copper plating layer has a thickness of 5 to 10 μm.
Preferably, the thickness of the acid copper plating layer is 5-20 μm.
Preferably, the thickness of the bright nickel coating is 5-15 μm.
Preferably, the thickness of the nickel-phosphorus alloy coating is 0.5-2.5 μm.
Preferably, the thickness of the acid gold-nickel alloy plating layer is 0.2-2 μm.
The alkaline zinc-nickel alloy plating solution has high dispersion capacity and deep plating capacity, the plating layer has high corrosion resistance, and the alkaline zinc-nickel alloy plating on the zinc alloy die casting can effectively seal the pores on the surface of the zinc alloy die casting and improve the corrosion resistance. Chemical nickel plating can be carried out on the zinc-nickel alloy plating layer, pyrophosphate copper plating can be carried out on the chemical nickel plating layer, and the binding force is good, so the alkaline zinc-nickel alloy plating and the chemical nickel plating can replace the traditional cyanide copper plating.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses a plating layer structure of gold-plated nickel alloy of zinc alloy die castings, which adopts alkaline zinc-nickel alloy plating to prepare a bottom plating layer, can effectively seal the pores on the surface layer of the zinc alloy die castings and improve the corrosion resistance of the plating layer;
2. the electroplating alkaline zinc-nickel alloy and the chemical nickel plating layer are adopted to replace a cyanide copper plating layer, so that the limitation of using highly toxic cyanide in the existing preparation process and the potential safety hazard caused by the use of the highly toxic cyanide are eliminated.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, do not constitute a limitation of the invention, and in which:
FIG. 1 is a schematic diagram of the structure of the plating layer in examples 1 and 2 of the present invention.
Detailed Description
The invention will be described in detail with reference to the drawings and specific embodiments, wherein the exemplary embodiments and descriptions are provided to explain the invention, but not to limit the invention.
Example 1:
as shown in figure 1, the plating structure of the gold-nickel alloy plating of the zinc alloy die casting comprises a zinc alloy substrate 1, and an alkaline zinc-nickel alloy plating layer 2, an electroless nickel plating layer 3, a pyrophosphate copper plating layer 4, an acid copper plating layer 5, a bright nickel plating layer 6, a nickel-phosphorus alloy plating layer 7 and a gold-nickel alloy plating layer 8 which are sequentially prepared on the zinc alloy substrate 1 from inside to outside.
The thickness of the zinc-nickel alloy coating 2 is 8-10 mu m, and the zinc-nickel alloy coating is prepared by adopting a Detron 1215 alkaline zinc-nickel alloy electroplating process of the ultra-high chemical industry. The plating solution comprises the following components and operating conditions: 5.5-8.5 g/L Zn, 1.0-1.8 g/L Ni (provided by 13-22 mL/L DetroNZIN 1215 Ni replenisher), 120-135 g/L NaOH, 90-110 mL/L DETRNZIN 1215 Base adjuvant, 1.0-5.0 mL/L DETRNZIN 1215 Brightener main polish, 0.1-0.8 mL/L DETRONZIN 1215Purifier R decontaminant, 21-28 deg.C bath temperature, and 1.0-3.0A/dm of cathode current density2The cathode moves 4-6 m/min.
The chemical nickel-plating layer 3 is a low-phosphorus chemical nickel-plating layer with the thickness of 2-3 mu m and is prepared by adopting GG-178 alkaline chemical nickel-plating process of ultra-bonding chemical industry. The plating solution components and the operation conditions are as follows: 25-50 mL/L of GG-178A additive, 25-40 mL/L of GG-178B reducing agent, 30-60 mL/L of GG-178C stabilizer, 25-38 ℃ of operation temperature, 8.5-9.5 of pH value and 8-15 min of time.
The pyrophosphate copper plating layer 4 is 8-10 microns thick and is prepared by adopting the existing pyrophosphate copper plating process.
The thickness of the acid copper plating layer 5 is 16-18 mu m, and the acid copper plating layer is prepared by adopting the existing acid copper plating process.
The thickness of the bright nickel plating layer 6 is 8-10 mu m, and the bright nickel plating layer is prepared by adopting the existing bright nickel plating process.
The thickness of the nickel-phosphorus alloy coating 7 is 1.5-1.8 mu m, and the nickel-phosphorus alloy coating is prepared by adopting an EMFASI 8812 nickel-phosphorus alloy electroplating process in the ultra-high chemical industry. The plating solution components and the operation conditions are as follows: 450-550 mL/L of EMFASI 8812 MU jar opener, 280-340 g/L of nickel sulfate, pH range of 2.5-2.7, operation temperature of 60-65 ℃, and cathode current density of 3-6A/dm2The cathode moves 3-5 m/min, and the electroplating time is 6-8 min.
The thickness of the gold-nickel alloy plating layer 8 is 0.6-0.8 mu m, and the gold-nickel alloy plating layer is prepared by an ANG-114 acidic gold-nickel alloy electroplating process in the ultra-high chemical industry. The plating solution components and the operation conditions are as follows: 600mL/L of ANG-114M cylinder opening agent, 3-5 g/L of gold ions, 3-5 g/L of nickel ions, 4.0-4.5 of pH, 35-50 ℃ of operation temperature and 2A/dm of cathode current density2Cathode movement of 4-6 m/min, electroplating time of 5-up to10min。
The operation of the embodiment is divided into the following steps:
1. pretreatment: the zinc alloy die casting 1 is subjected to the steps of "chemical wax removal → water washing → ultrasonic wax removal → water washing → chemical degreasing → water washing → acid salt activation → water washing".
2. Electroplating zinc-nickel alloy: the zinc alloy die casting 1 after pretreatment is prepared into a zinc-nickel alloy coating 2 by adopting a Detronzin 1215 alkaline zinc-nickel alloy electroplating process.
3. Chemical nickel plating: and preparing a chemical nickel-plating layer 3 on the zinc-nickel alloy plating layer 2 by adopting a GG-178 alkaline chemical nickel-plating process.
4. Pyrophosphate copper plating: the pyrophosphate copper plating layer 4 is prepared on the chemical nickel plating layer 3 by adopting the existing pyrocopper plating process.
5. Acid copper plating: and preparing an acid copper plating layer 5 on the pyrophosphate copper plating layer 4 by adopting the existing acid copper plating process.
6. Plating bright nickel: and preparing a bright nickel plating layer 6 on the acid copper plating layer 5 by adopting the existing bright nickel plating process.
7. Plating nickel-phosphorus alloy: and preparing a nickel-phosphorus alloy plating layer 7 on the bright nickel plating layer 6 by adopting an EMFASI 8812 nickel-phosphorus alloy electroplating process.
8. Gold-plated nickel alloy: and preparing a gold-nickel alloy plating layer 8 on the nickel-phosphorus alloy plating layer 7 by adopting an ANG-114 acid gold-nickel alloy electroplating process.
Example 2:
as shown in figure 1, the plating structure of the gold-nickel alloy plating of the zinc alloy die casting comprises a zinc alloy substrate 1, and an alkaline zinc-nickel alloy plating layer 2, an electroless nickel plating layer 3, a pyrophosphate copper plating layer 4, an acid copper plating layer 5, a bright nickel plating layer 6, a nickel-phosphorus alloy plating layer 7 and a gold-nickel alloy plating layer 8 which are sequentially prepared on the zinc alloy substrate 1 from inside to outside.
The thickness of the zinc-nickel alloy coating 2 is 10-12 mu m, and the zinc-nickel alloy coating is prepared by adopting a DETRONZIN 510 alkaline zinc-nickel alloy electroplating process in the ultra-high chemical industry. The plating solution comprises the following components and operating conditions: 6-9 g/L zinc, 1.3-1.9 g/L nickel (provided by DetroNZIN 515 nickel replenisher 17-23 mL/L), 100-130 g/L sodium hydroxide, 100-130 mL/L DetroNZIN 510 adjuvant, DetroNZI6.0-10 mL/L of N511 cylinder opening agent, 6.0-10 mL/L of DETRONZIN 512 brightener, 21-28 ℃ of plating bath temperature and 0.5-3.0A/dm of cathode current density2The cathode is moved 4-6 m/min.
The chemical nickel-plating layer 3 is a low-phosphorus chemical nickel-plating layer, has the thickness of 2-3 mu m, and is prepared by adopting GG-182 alkaline chemical nickel-plating process of ultra-bonding chemical industry. The plating solution components and the operation conditions are as follows: 40-60 mL/L of GG-182A additive, 30-50 mL/L of GG-182B reducing agent, 30-50 mL/L of GG-182C stabilizer, 30-50 ℃ of operation temperature, 8.5-9.5 of pH range and 8-15 min of time.
The pyrophosphate copper plating layer 4 is 6-8 microns thick and is prepared by adopting the existing pyrophosphate copper plating process.
The thickness of the acid copper plating layer 5 is 13-16 mu m, and the acid copper plating layer is prepared by adopting the existing acid copper plating process.
The thickness of the bright nickel plating layer 6 is 7-9 mu m, and the bright nickel plating layer is prepared by adopting the existing bright nickel plating process.
The thickness of the nickel-phosphorus alloy coating 7 is 1.4-1.7 mu m, and the nickel-phosphorus alloy coating is prepared by adopting an EMFASI 8812 nickel-phosphorus alloy electroplating process in the ultra-high chemical industry. The plating solution components and the operation conditions are as follows: 450-550 mL/L of EMFASI 8812 MU jar opener, 280-340 g/L of nickel sulfate, pH range of 2.5-2.7, operation temperature of 60-65 ℃, and cathode current density of 3-6A/dm2The cathode moves 3-5 m/min, and the electroplating time is 5.5-7 min.
The thickness of the gold-nickel alloy plating layer 8 is 0.8-1.0 mu m, and the gold-nickel alloy plating layer is prepared by an ANG-114 acidic gold-nickel alloy electroplating process in the ultra-high chemical industry. The plating solution components and the operation conditions are as follows: 600mL/L of ANG-114M cylinder opening agent, 3-5 g/L of gold ions, 3-5 g/L of nickel ions, 4.0-4.5 of pH, 35-50 ℃ of operation temperature and 2A/dm of cathode current density2The cathode moves for 4-6 m/min, and the electroplating time is 5-10 min.
The operation of the embodiment is divided into the following steps:
1. pretreatment: the zinc alloy die casting 1 is subjected to the steps of "chemical wax removal → water washing → ultrasonic wax removal → water washing → chemical degreasing → water washing → acid salt activation → water washing".
2. Electroplating zinc-nickel alloy: the zinc alloy part 1 after pretreatment is prepared into a zinc-nickel alloy coating 2 by adopting a Detronzin 510 alkaline zinc-nickel alloy electroplating process.
3. Chemical nickel plating: and preparing a chemical nickel-plating layer 3 on the zinc-nickel alloy plating layer 2 by adopting a GG-182 alkaline chemical nickel-plating process.
4. Pyrophosphate copper plating: pyrophosphate copper plating 4 is prepared on the chemical nickel plating layer 3 by adopting the existing pyrocopper plating process.
5. Acid copper plating: and preparing an acid copper plating layer 5 on the pyrophosphate copper plating layer 4 by adopting the existing acid copper plating process.
6. Plating bright nickel: and preparing a bright nickel plating layer 6 on the acid copper plating layer 5 by adopting the existing bright nickel plating process.
7. Plating nickel-phosphorus alloy: and preparing a nickel-phosphorus alloy plating layer 7 on the bright nickel plating layer 6 by adopting an EMFASI 8812 nickel-phosphorus alloy electroplating process.
8. Gold-plated nickel alloy: and preparing a gold-nickel alloy plating layer 8 on the nickel-phosphorus alloy plating layer 7 by adopting an ANG-114 acid gold-nickel alloy electroplating process.
The electroplated parts prepared in the embodiments 1 and 2 are subjected to a neutral salt spray test 168h according to GB/T10125-2012 salt spray test for artificial atmosphere corrosion test, and no corrosive substances are generated on the surfaces of the electroplated parts.
The plated articles prepared in examples 1 and 2 were tested for plating adhesion by thermal shock test according to JB 2111-. And (3) heating the plated part to 190 ℃ in a heating furnace, taking out the plated part, and placing the plated part into water at room temperature for sudden cooling, wherein the plated layer does not generate bubbles and fall off, and the plated layer has good bonding force.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the above embodiments are only applicable to help understand the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the description should not be construed as a limitation to the present invention.
Claims (8)
1. Zinc alloy die casting gilt nickel alloy's cladding material structure, its characterized in that: the zinc alloy plating layer is characterized by comprising a zinc alloy matrix, and an alkaline zinc-nickel alloy plating layer, a chemical nickel plating layer, a pyrophosphate copper plating layer, an acid copper plating layer, a bright nickel plating layer, a nickel-phosphorus alloy plating layer and an acid gold-nickel alloy plating layer which are sequentially prepared on the zinc alloy matrix from inside to outside.
2. The plating structure of gold-plated nickel alloy for zinc alloy die castings according to claim 1, characterized in that: the thickness of the alkaline zinc-nickel alloy coating is 5-15 mu m.
3. The plating structure of gold-plated nickel alloy for zinc alloy die castings according to claim 1, characterized in that: the chemical nickel plating layer is a low-phosphorus chemical nickel plating layer, and the thickness of the plating layer is 1-5 mu m.
4. The plating structure of gold-plated nickel alloy for zinc alloy die castings according to claim 1, characterized in that: the pyrophosphate copper plating layer is 5-10 μm thick.
5. The plating structure of gold-plated nickel alloy for zinc alloy die castings according to claim 1, characterized in that: the thickness of the acid copper plating layer is 5-20 mu m.
6. The plating structure of gold-plated nickel alloy for zinc alloy die castings according to claim 1, characterized in that: the thickness of the bright nickel coating is 5-15 mu m.
7. The plating structure of gold-plated nickel alloy for zinc alloy die castings according to claim 1, characterized in that: the thickness of the nickel-phosphorus alloy coating is 0.5-2.5 mu m.
8. The plating structure of gold-plated nickel alloy for zinc alloy die castings according to claim 1, characterized in that: the thickness of the acid gold-nickel alloy coating is 0.2-2 mu m.
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| CN118563395A (en) * | 2024-07-30 | 2024-08-30 | 环讯精密制品(南通)有限公司 | Anti-splashing zinc alloy precision die casting electroplating device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118563395A (en) * | 2024-07-30 | 2024-08-30 | 环讯精密制品(南通)有限公司 | Anti-splashing zinc alloy precision die casting electroplating device and method |
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