CN221297096U - Plating layer structure of zinc alloy die casting plated pearl copper - Google Patents
Plating layer structure of zinc alloy die casting plated pearl copper Download PDFInfo
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- CN221297096U CN221297096U CN202322731889.8U CN202322731889U CN221297096U CN 221297096 U CN221297096 U CN 221297096U CN 202322731889 U CN202322731889 U CN 202322731889U CN 221297096 U CN221297096 U CN 221297096U
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- copper plating
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 150
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 150
- 239000010949 copper Substances 0.000 title claims abstract description 150
- 238000007747 plating Methods 0.000 title claims abstract description 126
- 229910001297 Zn alloy Inorganic materials 0.000 title claims abstract description 46
- 238000004512 die casting Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 42
- 238000000576 coating method Methods 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims abstract description 26
- 235000011180 diphosphates Nutrition 0.000 claims abstract description 26
- 239000002253 acid Substances 0.000 claims abstract description 25
- 239000003973 paint Substances 0.000 claims abstract description 24
- 239000011159 matrix material Substances 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims description 38
- BQVVSSAWECGTRN-UHFFFAOYSA-L copper;dithiocyanate Chemical compound [Cu+2].[S-]C#N.[S-]C#N BQVVSSAWECGTRN-UHFFFAOYSA-L 0.000 claims description 8
- 239000010410 layer Substances 0.000 abstract description 80
- 239000000758 substrate Substances 0.000 abstract description 13
- 238000012360 testing method Methods 0.000 abstract description 13
- 230000007797 corrosion Effects 0.000 abstract description 11
- 238000005260 corrosion Methods 0.000 abstract description 11
- 150000003839 salts Chemical class 0.000 abstract description 9
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 239000007921 spray Substances 0.000 abstract description 6
- 239000011247 coating layer Substances 0.000 abstract description 4
- 230000007935 neutral effect Effects 0.000 abstract description 3
- 239000003518 caustics Substances 0.000 abstract description 2
- 238000005234 chemical deposition Methods 0.000 abstract description 2
- 230000035939 shock Effects 0.000 abstract description 2
- 238000010998 test method Methods 0.000 abstract description 2
- 239000011241 protective layer Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000011049 pearl Substances 0.000 description 49
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000005406 washing Methods 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 8
- PDZKZMQQDCHTNF-UHFFFAOYSA-M copper(1+);thiocyanate Chemical compound [Cu+].[S-]C#N PDZKZMQQDCHTNF-UHFFFAOYSA-M 0.000 description 4
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 4
- 239000012188 paraffin wax Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 239000012752 auxiliary agent Substances 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- 239000008139 complexing agent Substances 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910021389 graphene Inorganic materials 0.000 description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 3
- -1 hydroxyl graphene Chemical compound 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 3
- 229940074439 potassium sodium tartrate Drugs 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 3
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BAERPNBPLZWCES-UHFFFAOYSA-N (2-hydroxy-1-phosphonoethyl)phosphonic acid Chemical compound OCC(P(O)(O)=O)P(O)(O)=O BAERPNBPLZWCES-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- LBJNMUFDOHXDFG-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu].[Cu] LBJNMUFDOHXDFG-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a plating layer structure of a zinc alloy die casting pearl copper plating layer, which comprises a zinc alloy matrix, and a cyanide-free preplating copper layer, a pyrophosphate copper layer, an acid copper layer, a pearl copper layer and an electrophoretic paint layer which are sequentially prepared on the zinc alloy matrix from inside to outside. The coating structure prepared by the utility model tests the binding force of the coating by a thermal shock method according to GB/T5270-2005 'test method for electrodepositing a metal coating layer on a metal substrate and adhesive strength of a chemical deposition layer', the binding force meets the standard requirement, a neutral salt spray test 432h is carried out according to GB/T10125-2021 'test salt spray test for artificial atmosphere corrosion', and no corrosive substances are generated on the surface of the protective layer. The utility model has the advantages that: the prepared protective layer is beautiful and elegant and has high corrosion resistance.
Description
Technical Field
The utility model relates to the field of metal electroplating and coating, in particular to a plating structure of a zinc alloy die casting plated with pearl copper.
Background
According to the traditional electroplating method, a cyanide copper plating process is generally adopted to prepare a preplating layer on the surface of a zinc alloy die casting, so that the bonding force between the plating layer and a substrate can be ensured. However, the use of cyanide has been under increasingly stringent control in China.
For many years, home and abroad specialists and scholars are always searching for a proper cyanide-free copper plating process to replace cyanide copper plating, and although some effects are achieved, the cyanide-free copper plating process is deficient and deficient, and a lot of work is needed to be done for truly and completely replacing cyanide copper plating. A large part of the existing cyanide-free copper plating process is poor in binding force between a plating layer and a substrate, and is far inferior to cyanide copper plating. To obtain a coating with good binding force, at least two key factors are required to be satisfied: firstly, preventing the replacement reaction of the metal ions in the plating solution and the matrix metal; secondly, the plating solution has good activating capability on the matrix metal, and can reduce the oxide film on the surface of the matrix. The cyanide-free alkaline copper plating process at the present stage mainly adopts cyanide-free alkaline copper plating, and most of the cyanide-free alkaline copper plating process adopts a strong complexing agent to enable bivalent copper ions to generate complexing ions with the bivalent copper ions, so that the deposition potential of copper is improved. Typical complexing agents are HEDP (hydroxyethylidene diphosphonic acid), pyrophosphate, citrate, EDTA (ethylenediamine tetraacetic acid) and the like [1-2].
The copper plating process of the polymeric thiocyanate is a newly developed cyanide-free copper plating process, takes sodium polymeric thiocyanate as a complexing agent, takes the polymeric cuprous thiocyanate as a main salt, and has the characteristics which are obviously different from that of the past bivalent copper cyanide-free copper plating.
The pearl copper plating has a beautiful and soft appearance, but its application is limited due to its low corrosion resistance. Along with the improvement of the material and cultural life level, the development and the adoption of diversified decorative coating structures are attracting more and more attention. The electrophoretic paint coating is bright, and the colorless electrophoretic paint is used for coating the pearl copper coating, so that the soft and beautiful appearance of the pearl copper can be maintained, and the corrosion resistance of the coating can be obviously improved.
Reference is made to: [1] qin Zuzu, li Jiansan, xu Jinlai, national and international cyanide-free copper plating process research progress [ J ], electroplating and finishing, 2015, 34 (3): 149-152. [2] Ma Tao, li Yungang, yang Guiyu, etc., state of the art cyanide-free copper plating process for steel substrates [ J ], casting technique, 2016, 37 (12): 2579-2582.
Disclosure of Invention
The utility model aims to provide a plating structure of plating pearl copper on a zinc alloy die casting, which aims to solve the pollution problem of cyanide preplating copper adopted by the existing zinc alloy die casting and the problem of low corrosion resistance of the pearl copper plating.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
The plating layer structure of the pearl copper plating of the zinc alloy die casting comprises a zinc alloy matrix, and a cyanide-free preplating copper layer, a pyrophosphate copper layer, an acid copper layer, a pearl copper layer and an electrophoretic paint coating which are sequentially prepared on the zinc alloy matrix from inside to outside;
The cyanide-free preplating copper plating layer is prepared by adopting a polymerized thiocyanate copper plating process, and the thickness of the copper plating layer is 1-5 mu m;
The thickness of the electrophoretic paint coating is 9-15 mu m.
Preferably, the thickness of the pyrophosphate copper plating layer is 5 to 10 μm.
Preferably, the thickness of the acid copper plating layer is 11-18 μm.
Preferably, the thickness of the pearl copper plating layer is 1-3 mu m.
Compared with the prior art, the utility model has the advantages that:
1. The utility model adopts the process of copper plating with polymeric thiocyanate to prepare the pre-copper plating layer, thereby solving the problem of high pollution caused by cyanide pre-copper plating in the prior art;
2. The utility model prepares the electrophoretic paint coating on the pearl copper coating, thereby effectively improving the corrosion resistance of the coating.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and constitute a part of this specification, are incorporated in and constitute a part of this specification and do not limit the utility model in any way, and in which:
Fig. 1 is a schematic diagram of the plating structure of examples 1 and 2 of the present utility model.
Description of the embodiments
The present utility model will now be described in detail with reference to the drawings and the specific embodiments thereof, which are illustrative embodiments and illustrations of the utility model, but are not to be construed as limiting the utility model.
A plating layer structure of a zinc alloy die casting pearl copper plating comprises a zinc alloy matrix, and a cyanide-free preplating copper layer, a pyrophosphate copper layer, an acid copper layer, a pearl copper layer and an electrophoretic paint coating which are sequentially prepared on the zinc alloy matrix from inside to outside.
The existing pretreatment process is adopted to carry out oil removal, wax removal and activation treatment on the zinc alloy matrix.
And preparing the cyanide-free preplating copper layer by adopting a polymerized thiocyanate copper plating process after pretreatment of the zinc alloy die casting.
Preferably, the thickness of the cyanide-free preplating copper layer is 1-5 μm.
Preferably, the cyanide-free preplating copper layer is prepared by adopting an HT-810 polymerized thiocyanate copper plating process of Zunyi electroplating materials Co., ltd:
17-23 g/L of polymerized cuprous thiocyanate, 100-160 g/L of polymerized sodium thiocyanate, 8-12 g/L of potassium sodium tartrate, 1-2 mL/L of HT-810 brightening agent, 2-4 mL/L of HT-810 plating solution, 45-55 ℃ of plating bath temperature, 12-13 of plating bath pH range, 0.5-1.0A/dm 2 of cathode current density, 4-6 m/min of cathode movement, less than or equal to 0.5A/dm 2 of anode current density, and oxygen-free electrolytic copper corners (or copper particles) are used as anodes.
After cyanide-free preplating copper of the zinc alloy die casting, preparing a pyrophosphate copper plating layer by adopting the current pyrophosphate copper plating process.
Preferably, the thickness of the pyrophosphate copper plating layer is 5 to 10 μm.
And preparing an acid copper plating layer by adopting the current acid copper plating process after the pyrophosphate of the zinc alloy die casting is plated with copper.
Preferably, the thickness of the acid copper plating layer is 11-18 μm.
After acid copper plating of the zinc alloy die casting, the prior pearl copper plating process is adopted to prepare a pearl copper plating layer.
Preferably, the thickness of the pearl copper plating layer is 1-3 mu m.
Preferably, the pearl copper plating layer is prepared by adopting a PC-18 pearl copper electroplating process in super-bonding chemical industry:
160-200 g/L of copper sulfate, 90-120 g/L of sulfuric acid, 50-150 mg/L of chloride ions, 7-15 mL/L of PC-18 pearl copper sand forming agent, 3-8 mL/L of PC-18 pearl copper auxiliary agent, 35-45 ℃ of plating bath temperature, 2-4A/dm 2 of cathode current density and 2-5 m/min of cathode movement.
And (3) plating pearl copper on the zinc alloy die casting, and preparing an electrophoretic paint coating by adopting the current electrophoretic coating process.
Preferably, the thickness of the electrophoretic paint coating is 9-15 mu m.
Preferably, the electrophoretic paint coating is prepared by AKINI 120,120 electrophoretic process developed by super-nation chemical industry:
AKINI 120 electrophoretic paint 300-350 g/L, hydroxyl graphene filler 20-60 g/L, bath solution pH range 4-5, operating temperature 25-30 ℃ and bath voltage 30-50V.
The prepared electrophoretic paint coating is baked for 30-60 min at 140 ℃.
Examples
As shown in fig. 1, the plating structure of the zinc alloy die casting pearl copper plating comprises a zinc alloy substrate 1, and a cyanide-free preplating copper layer 2, a pyrophosphate copper layer 3, an acid copper plating layer 4, a pearl copper plating layer 5 and an electrophoretic paint coating layer 6 which are sequentially prepared on the zinc alloy substrate 1 from inside to outside.
The thickness of the cyanide-free preplating copper layer 2 is 2 mu m, and the cyanide-free preplating copper layer is prepared by adopting an HT-810 polymerized thiocyanate copper plating process of Zunyi electroplating materials Co., ltd.):
20g/L of polymerized cuprous thiocyanate, 140g/L of polymerized sodium thiocyanate, 10g/L of potassium sodium tartrate, 1.5mL/L of HT-810 brightening agent, 3mL/L of HT-810 positioning agent, 52 ℃ of plating bath temperature, 12.3 pH of plating solution, 0.8A/dm 2 of cathode current density, 5m/min of cathode movement and 0.4A/dm 2 of anode current density, and an anaerobic electrolytic copper corner is used as an anode.
The thickness of the pyrophosphate copper plating layer 3 is 8 mu m, and the pyrophosphate copper plating layer is prepared by the current pyrophosphate copper plating process.
The thickness of the acid copper plating layer 4 is 12 mu m, and the acid copper plating layer is prepared by adopting the current acid copper plating process.
The thickness of the pearl copper plating layer 5 is 2 mu m, and the pearl copper plating layer is prepared by adopting a PC-18 pearl copper electroplating process in super-bonding chemical industry:
170g/L of copper sulfate, 90g/L of sulfuric acid, 70mg/L of chloride ions, 9mL/L of PC-18 pearl copper sand forming agent, 5mL/L of PC-18 pearl copper auxiliary agent, the plating bath temperature is 37 ℃, and the cathode current density is 2.5A/dm 2.
The thickness of the electrophoretic paint coating 6 is 12 mu m, and the electrophoretic paint coating is prepared by adopting AKINI 120,120 electrophoretic technology in super-bonding chemical industry:
AKINI 120 electrophoretic paint 310g/L, hydroxyl graphene filler 40g/L, bath solution pH 4.2, operating temperature 25 ℃ and bath voltage 40V.
The embodiment is divided into the following steps in specific operation:
1. Pretreatment: the zinc alloy die casting substrate 1 is subjected to chemical paraffin removal, water washing, ultrasonic paraffin removal, water washing, chemical degreasing, water washing, acid salt activation and water washing.
2. Pre-plating copper: and preparing the cyanide-free preplating copper layer 2 on the pretreated zinc alloy die casting substrate 1 by adopting a polymeric thiocyanate copper plating process.
3. Pyrophosphate copper plating: the pyrophosphate copper plating layer 3 is prepared on the zinc alloy die casting subjected to cyanide-free preplating according to the current process.
4. Copper plating: the acid copper plating layer 4 is prepared on the zinc alloy die casting subjected to pyrophosphate copper plating according to the current process.
5. Plating pearl copper: and preparing a pearl copper plating layer 5 on the zinc alloy die casting subjected to acid copper plating by adopting a PC-18 pearl copper electroplating process.
6. And (3) electrophoretic coating: the electrophoretic paint coating 6 is prepared by the steps of removing the film by sulfuric acid with the mass fraction of 10 percent, washing by water, electrophoretic coating, washing by water and drying at 140 ℃ for 40 minutes on the zinc alloy die casting plated with the pearl copper.
Examples
As shown in fig. 1, the plating structure of the zinc alloy die casting pearl copper plating comprises a zinc alloy substrate 1, and a cyanide-free preplating copper layer 2, a pyrophosphate copper layer 3, an acid copper plating layer 4, a pearl copper plating layer 5 and an electrophoretic paint coating layer 6 which are sequentially prepared on the zinc alloy substrate 1 from inside to outside.
The thickness of the preplating layer 2 is 2 mu m, and the preplating layer is prepared by adopting an HT-810 polymerized thiocyanate copper plating process of Zunyi electroplating materials limited company:
22g/L of polymerized cuprous thiocyanate, 150g/L of polymerized sodium thiocyanate, 10g/L of potassium sodium tartrate, 1.5mL/L of HT-810 brightening agent, 3mL/L of HT-810 positioning agent, 55 ℃ of plating bath temperature, 12 pH of plating solution, 0.8A/dm 2 of cathode current density, 5m/min of cathode movement and 0.3A/dm 2 of anode current density, and oxygen-free electrolytic copper particles are used as anodes.
The thickness of the pyrophosphate copper plating layer 3 is 6 mu m, and the pyrophosphate copper plating layer is prepared by the current pyrophosphate copper plating process.
The thickness of the acid copper plating layer 4 is 13 mu m, and the acid copper plating layer is prepared by adopting the current acid copper plating process.
The thickness of the pearl copper plating layer 5 is 3 mu m, and the pearl copper plating layer is prepared by adopting a PC-18 pearl copper electroplating process in super-bonding chemical industry:
190g/L of copper sulfate, 110g/L of sulfuric acid, 100mg/L of chloride ions, 13mL/L of PC-18 pearl copper sand forming agent, 6mL/L of PC-18 pearl copper auxiliary agent, 42 ℃ of plating bath temperature and 3.5A/dm 2 of cathode current density.
The thickness of the electrophoretic paint coating 6 is 14 mu m, and the electrophoretic paint coating is prepared by adopting AKINI 120,120 electrophoretic technology in super-bonding chemical industry:
AKINI 120 electrophoretic paint 340g/L, hydroxyl graphene filler 30g/L, bath solution pH 4.8, operating temperature 30 ℃ and bath voltage 40V.
The embodiment is divided into the following steps in specific operation:
1. Pretreatment: the zinc alloy die casting substrate 1 is subjected to chemical paraffin removal, water washing, ultrasonic paraffin removal, water washing, chemical degreasing, water washing, acid salt activation and water washing.
2. Pre-plating copper: and preparing the cyanide-free preplating copper layer 2 on the pretreated zinc alloy die casting substrate 1 by adopting a polymeric thiocyanate copper plating process.
3. Pyrophosphate copper plating: the pyrophosphate copper plating layer 3 is prepared on the zinc alloy die casting subjected to copper preplating according to the current process.
4. Copper plating: the acid copper plating layer 4 is prepared on the zinc alloy die casting subjected to pyrophosphate copper plating according to the current process.
5. Plating pearl copper: and preparing a pearl copper plating layer 5 on the zinc alloy die casting subjected to acid copper plating by adopting a PC-18 pearl copper electroplating process.
6. And (3) electrophoretic coating: the electrophoretic paint coating 6 is prepared by the steps of removing the film by sulfuric acid with the mass fraction of 10 percent, washing by water, electrophoretic coating, washing by water and drying at 140 ℃ for 40 minutes on the zinc alloy die casting plated with the pearl copper.
Test example 1:
the pearl copper plated sample pieces prepared in the embodiment 1 and the embodiment 2 are tested for binding force of a plating layer by a thermal shock method according to GB/T5270-2005 test method for adhesion strength of a metal coating layer and a chemical deposition layer on a metal substrate, the prepared pearl copper plated sample pieces are heated to 150 ℃ in a heating furnace for 30min, taken out and immediately cooled in cold water at room temperature, and the plating layer is free from foaming and falling, and the binding force meets the standard requirements.
Test example 2:
The pearl copper plated sample pieces prepared in the embodiment 1 and the embodiment 2 are subjected to a neutral salt spray test 432h according to GB/T10125-2021 salt spray test for artificial atmosphere corrosion test, and no corrosive substances are generated on the surface of the plating layer. Experiments show that the pearl copper plating layer structure prepared by the utility model has good corrosion resistance.
Comparative example 1:
the preparation process of examples 1 and 2 is that a cyanide-free preplating copper layer, a pyrophosphate copper layer, an acid copper layer and a pearl copper layer are sequentially prepared on a zinc alloy die casting from inside to outside, then a 20g/L chromic acid solution is used for passivation treatment to generate a passivation film, the prepared sample piece is subjected to a neutral salt spray test for 12 hours according to GB/T10125-2021 salt spray test of an artificial atmosphere corrosion test, and more brown copper oxide corrosions are generated on the surface of the coating. Tests have shown that the corrosion resistance of the copper-plated layer structure of pearls prepared by the conventional passivation process is much lower than that of the present utility model.
The foregoing has outlined the detailed description of the embodiments of the present utility model, and the detailed description of the embodiments and the embodiments of the present utility model has been provided herein by way of illustration of specific examples, which are intended to be merely illustrative of the principles of the embodiments of the present utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.
Claims (4)
1. A plating layer structure of zinc alloy die casting plated pearl copper is characterized in that: comprises a zinc alloy matrix, and a cyanide-free preplating copper layer, a pyrophosphate copper layer, an acid copper layer, a pearl copper layer and an electrophoretic paint layer which are sequentially prepared on the zinc alloy matrix from inside to outside;
The cyanide-free preplating copper plating layer is prepared by adopting a polymerized thiocyanate copper plating process, and the thickness of the copper plating layer is 1-5 mu m;
The thickness of the electrophoretic paint coating is 9-15 mu m.
2. The plating structure of the zinc alloy die casting plated with the pearl copper according to claim 1, wherein: the thickness of the pyrophosphate copper plating layer is 5-10 mu m.
3. The plating structure of the zinc alloy die casting plated with the pearl copper according to claim 1, wherein: the thickness of the acid copper plating layer is 11-18 mu m.
4. The plating structure of the zinc alloy die casting plated with the pearl copper according to claim 1, wherein: the thickness of the pearl copper plating layer is 1-3 mu m.
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