CN219938785U

CN219938785U - Frequency conversion plate heat radiation structure and frequency conversion heat pump

Info

Publication number: CN219938785U
Application number: CN202223428325.9U
Authority: CN
Inventors: 周一帆; 吴海斌; 雷朋飞; 张利; 叶景发; 何卫国; 庄汉岳
Original assignee: Guangdong PHNIX Eco Energy Solution Ltd
Current assignee: Guangdong PHNIX Eco Energy Solution Ltd
Priority date: 2022-12-20
Filing date: 2022-12-20
Publication date: 2023-10-31
Anticipated expiration: 2032-12-20

Abstract

The utility model discloses a variable frequency plate heat radiation structure and a variable frequency heat pump, which comprise a variable frequency plate and a heat radiation plate connected to one side of the variable frequency plate, wherein the heat radiation plate comprises a substrate and a cooling pipe, the cooling pipe comprises a heat exchange part and a connecting part connected with an external refrigerant pipeline, and the substrate is coated outside the heat exchange part in a die-casting manner. The substrate is formed outside the cooling pipe in a die-casting forming mode, so that the substrate and the cooling pipe can be tightly connected, and the heat transfer is prevented from being influenced by gaps between the substrate and the cooling pipe; meanwhile, the problem of splicing and assembling between the substrate and the cooling pipe does not exist after molding, and the surface precision of the substrate is not required strictly, so that the production process is simplified, and the production efficiency is improved.

Description

Frequency conversion plate heat radiation structure and frequency conversion heat pump

Technical Field

The utility model relates to the technical field of heat pumps, in particular to a variable frequency plate heat dissipation structure and a variable frequency heat pump.

Background

The variable frequency heat pump's frequency conversion board working process can give off a large amount of heat, for accelerating the heat dissipation of frequency conversion board, generally installs the fluorine cold heating panel in the dorsal part of frequency conversion board, and the fluorine cold heating panel is directly connected with the fluorine cold system of heat pump system, makes the medium temperature gaseous refrigerant in the fluorine cold system flow through the fluorine cold heating panel in order to accelerate the heat dissipation of fluorine cold heating panel, and then realizes accelerating the heat dissipation of frequency conversion board. The traditional fluorine cooling heat dissipation plate consists of an upper clamping plate, a copper pipe and a lower clamping plate, wherein the copper pipe is clamped and fixed between the upper clamping plate and the lower clamping plate, and then the upper clamping plate and the lower clamping plate are connected and fixed through bolts; and the surface precision of opposite sides of the upper clamping plate and the lower clamping plate needs to be strictly controlled, and bolts need to be relied on for connection during assembly, so that the production efficiency is affected.

Disclosure of Invention

The aim of the embodiment of the utility model is that: the utility model provides a frequency conversion board heat radiation structure and frequency conversion heat pump, it can solve the above-mentioned problem that exists among the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

in one aspect, a heat dissipation structure of a variable frequency plate is provided, the heat dissipation structure comprises the variable frequency plate and a heat dissipation plate connected to one side of the variable frequency plate, the heat dissipation plate comprises a substrate and a cooling pipe, the cooling pipe comprises a heat exchange part and a connecting part connected with an external refrigerant pipeline, and the substrate is die-cast and coated outside the heat exchange part.

Optionally, a convex hull corresponding to the heat exchange part is arranged on one side of the substrate, which is away from the frequency conversion plate.

Optionally, the cooling tube further includes a transfer portion, and the connection portion and the transfer portion are respectively located at two opposite sides of the substrate; the connecting portion comprises a liquid inlet connecting pipe and a liquid return connecting pipe, the heat exchange portion comprises a liquid inlet heat exchange pipe and a liquid return heat exchange pipe, two ends of the liquid inlet heat exchange pipe are respectively connected with the liquid inlet connecting pipe and the transfer portion, and two ends of the liquid return heat exchange pipe are respectively connected with the liquid return connecting pipe and the transfer portion.

Optionally, the heat exchange part includes a plurality of parallel arrangement the feed liquor heat exchange tube, the feed liquor connecting pipe with transfer portion is close to the one end of feed liquor heat exchange tube is connected with first transfer pipe respectively, first transfer pipe have a plurality of with the first branch pipe joint that the feed liquor heat exchange tube corresponds to be connected.

Optionally, the heat exchange portion includes a plurality of parallel arrangement the liquid return heat exchange tube, liquid return connecting tube with transfer portion is close to the one end of liquid return heat exchange tube is connected with the second switching tube respectively, the second switching tube have a plurality of with liquid return heat exchange tube corresponds the second branch coupling that is connected.

Optionally, an internal thread for turbulence is arranged in the cooling pipe.

Optionally, a plurality of locating holes are formed in the base plate, threaded holes corresponding to the locating holes are formed in the variable frequency plate, and locating screws penetrate through the locating holes and are connected with the threaded holes, so that the radiating plate is fixed on the variable frequency plate.

Optionally, a heat-conducting rubber pad is arranged between the frequency conversion plate and the heat dissipation plate.

Optionally, the heat dissipation plate is installed at a position where the IPM module on the frequency conversion plate is located.

On the other hand, a variable frequency heat pump is provided, and the variable frequency heat pump comprises the variable frequency plate heat radiation structure.

The beneficial effects of the utility model are as follows: the utility model provides a frequency conversion plate heat radiation structure and a frequency conversion heat pump, wherein in a heat radiation plate in the heat radiation structure, a substrate is formed outside a cooling pipe in a die-casting forming mode, so that the substrate and the cooling pipe can be tightly connected, and the heat transfer is prevented from being influenced by gaps between the substrate and the cooling pipe; meanwhile, the problem of splicing and assembling between the substrate and the cooling pipe does not exist after molding, and the surface precision of the substrate is not required strictly, so that the production process is simplified, and the production efficiency is improved.

Drawings

The utility model is described in further detail below with reference to the drawings and examples.

Fig. 1 is a schematic structural diagram of one embodiment of a heat dissipation structure of a frequency conversion board according to an embodiment of the present utility model;

FIG. 2 is an exploded view of the structure of FIG. 1;

FIG. 3 is a schematic view of the cooling tube of the structure shown in FIG. 1;

fig. 4 is a schematic structural diagram of another embodiment of a heat dissipating plate according to an embodiment of the present utility model.

In the figure:

1. a frequency conversion plate; 11. an IPM module; 2. a heat dissipation plate; 21. a substrate; 211. convex hulls; 212. positioning holes; 22. a cooling tube; 221. a connection part; 2211. a liquid inlet connecting pipe; 2212. a liquid return connecting pipe; 222. a heat exchange part; 2221. a liquid inlet heat exchange tube; 2222. a liquid return heat exchange tube; 223. a transfer section; 224. a first transfer tube; 225. a second transfer tube; 3. and a heat conducting rubber pad.

Detailed Description

In order to make the technical problems solved by the present utility model, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present utility model are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

As shown in fig. 1-4, the present embodiment provides a heat dissipation structure of a frequency conversion board, which includes a frequency conversion board 1 and a heat dissipation board 2 connected to one side of the frequency conversion board 1, the heat dissipation board 2 includes a substrate 21 and a cooling tube 22, the cooling tube 22 includes a heat exchange portion 222 and a connection portion 221 connected to an external refrigerant pipeline, and the substrate 21 is die-cast and coated outside the heat exchange portion 222.

When the heat radiation plate is applied, the heat radiation plate 2 is fixed on the frequency conversion plate 1, and heat generated in the working process of the frequency conversion plate 1 is transmitted to the substrate 21 of the heat radiation plate 2; the connection part 221 of the cooling pipe 22 is connected to the fluorine cooling system of the heat pump unit, and is generally connected to the rear end of the evaporator, the refrigerant forms a medium-temperature gaseous refrigerant after passing through the evaporator, and when the refrigerant passes through the heat exchange part 222, the refrigerant exchanges heat with the substrate 21 through the pipe wall of the cooling pipe 22, so that the heat dissipation of the substrate 21 is quickened, the substrate 21 is cooled, and further conditions are created for the continuous heat transfer of the inverter board 1 to the substrate 21.

The base plate 21 is die-cast and formed outside the heat exchange portion 222, so that the outer wall of the heat exchange portion 222 can be fully contacted with the base plate 21 without other foreign matters between the outer wall of the heat exchange portion 222 and the base plate 21, specifically, the formed cooling tube 22 is placed in a die-casting cavity of the base plate 21, molten aluminum water is filled into a casting mould under high pressure and high speed, and the molten aluminum water is crystallized and solidified under high pressure to form a casting. The high pressure and high speed are the main characteristics of pressure casting, the pressure is often tens of megapascals, the filling speed (the in-gate speed) is about 16-80 m/s, the time for filling the die cavity with the molten metal is extremely short, and the time is about 0.01-0.2 s. The die casting technology has the advantages of high production efficiency, simple working procedure, higher casting tolerance level, good surface roughness and large mechanical strength, can save a large number of machining working procedures and equipment, saves raw materials and the like, thereby perfectly ensuring the full gapless close contact between the outer wall of the cooling pipe 22 and the aluminum material and ensuring the high efficiency of heat exchange.

In summary, according to the inverter board heat dissipation structure of the present embodiment, the substrate 21 is formed outside the cooling tube 22 by die casting, so that tight connection between the substrate 21 and the cooling tube 22 can be achieved, and the heat transfer is prevented from being affected by the gap between the substrate 21 and the cooling tube 22; meanwhile, the problem of splicing and assembling between the substrate 21 and the cooling pipe 22 does not exist after molding, and the surface precision of the substrate 21 is not required strictly, so that the production process is simplified, and the production efficiency is improved.

Referring to fig. 2, in some embodiments, a convex hull 211 corresponding to the heat exchanging portion 222 is disposed on a side of the substrate 21 facing away from the inverter board 1.

Specifically, the convex hull 211 is arranged to realize cladding and fixing of the heat exchange part 222, and meanwhile, the thickness of the area outside the convex hull 211 on the substrate 21 can be effectively reduced, so that the consumable of the substrate 21 is reduced, and the cost is reduced; meanwhile, the convex hull 211 can increase the surface area of the substrate 21 to a certain extent, and improve the heat dissipation efficiency.

In other embodiments, the side of the substrate 21 facing away from the inverter board 1 is a flat surface.

Further, the cooling tube 22 further includes a middle portion 223, and the connection portion 221 and the middle portion 223 are respectively located at two opposite sides of the substrate 21; the connecting portion 221 includes a liquid inlet connecting pipe 2211 and a liquid return connecting pipe 2212, the heat exchange portion 222 includes a liquid inlet heat exchange pipe 2221 and a liquid return heat exchange pipe 2222, two ends of the liquid inlet heat exchange pipe 2221 are respectively connected with the liquid inlet connecting pipe 2211 and the transfer portion 223, and two ends of the liquid return heat exchange pipe 2222 are respectively connected with the liquid return connecting pipe 2212 and the transfer portion 223.

That is, the liquid inlet connection pipe 2211 and the liquid return connection pipe 2212 of the heat dissipation plate 2 are positioned at the same side of the heat dissipation plate, and when the liquid inlet connection pipe and the liquid return connection pipe are connected with an external refrigerant pipeline, the connection pipe at one side can be realized, so that the arrangement and connection operation of the pipeline can be facilitated. In particular, during operation, the refrigerant flows in from the liquid inlet connection pipe 2211, flows through the liquid inlet heat exchange pipe 2221, the intermediate transfer portion 223 and the liquid return heat exchange pipe 2222 in sequence, and then flows out from the liquid return connection pipe 2212.

In some embodiments, referring to fig. 2-3, the heat exchange portion 221 includes a plurality of liquid inlet heat exchange tubes 2221 arranged in parallel, one end of the liquid inlet connection tube 2211 and one end of the intermediate portion 223, which is close to the liquid inlet heat exchange tubes 2221, are respectively connected with a first adapter tube 224, and the first adapter tube 224 has a plurality of first branch tube connectors correspondingly connected with the liquid inlet heat exchange tubes 2221.

Specifically, the first transfer tubes 224 have the functions of flow dividing and converging, and after the refrigerant enters from the liquid inlet heat exchange tube 2221, the refrigerant flows through the flow dividing function of the first transfer tube 224 to each liquid inlet heat exchange tube 2221, and when the refrigerant in each liquid inlet heat exchange tube 2221 flows to the next first transfer tube 224, the refrigerant merges and flows into the transfer portion 223. The plurality of liquid inlet heat exchange tubes 2221 are arranged in the base plate 21 based on the flow dividing and converging functions of the first transfer tube 224, and the total area of all liquid inlet heat exchange tubes 2221 in contact with the base plate 21 can be increased by dividing the liquid inlet heat exchange tubes 2221 under the condition that the total refrigerant flow is kept unchanged, so that the effect of improving the heat exchange efficiency of the liquid inlet heat exchange tubes 2221 and the base plate 21 is achieved.

As another embodiment, referring to fig. 4, the heat exchange portion 221 includes a plurality of liquid-return heat exchange tubes 2222 arranged in parallel, one end of the liquid-return connection tube 2212 and one end of the intermediate portion 223, which is close to the liquid-return heat exchange tubes 2222, are respectively connected with a second switching tube 225, and the second switching tube 225 is provided with a plurality of second branch tube connectors correspondingly connected with the liquid-return heat exchange tubes 2222.

Similarly, the second transfer pipe 225 has the functions of flow dividing and converging, and after the refrigerant enters from the transfer portion 223, the refrigerant flows through the flow dividing function of the second transfer pipe 225 to each liquid-return heat exchange pipe 2222 on average, and when the refrigerant in each liquid-return heat exchange pipe 2222 flows to the next second transfer pipe 225, the refrigerant merges and flows to the liquid-return connection pipe 2212. The plurality of liquid return heat exchange tubes 2222 are arranged in the substrate 21 based on the flow dividing and converging functions of the second transfer tube 225, and the total area of all the liquid return heat exchange tubes 2222 in contact with the substrate 21 can be increased by dividing the liquid return heat exchange tubes 2222 under the condition that the total refrigerant flow is kept unchanged, so that the effect of improving the heat exchange efficiency of the liquid return heat exchange tubes 2222 and the substrate 21 is achieved.

In specific application, in one heat dissipation plate 2, a single liquid inlet heat exchange tube 2221+ single liquid return heat exchange tube 2222 may be provided, or multiple liquid inlet heat exchange tubes 2221+ single liquid return heat exchange tube 2222 may be provided, or single liquid inlet heat exchange tube 2221+ multiple liquid return heat exchange tubes 2222 may be provided, or multiple liquid inlet heat exchange tubes 2221+ multiple liquid return heat exchange tubes 2222 may be provided. The person skilled in the art can freely choose the setting according to the actual requirements.

Further, the cooling pipe 22 is internally provided with internal threads for turbulence.

Specifically, by adding the female screw to the cooling tube 22, the refrigerant flowing inside can be disturbed, the mixing degree of the refrigerant can be improved, and the refrigerant in the cooling tube 22 can uniformly exchange heat with the substrate 21.

In order to realize the installation of the heat dissipation plate 2, the substrate 21 is provided with a plurality of positioning holes 212, the frequency conversion plate 1 is provided with threaded holes corresponding to the positioning holes 212, and positioning screws penetrate through the positioning holes 212 and are connected with the threaded holes, so that the heat dissipation plate 2 is fixed on the frequency conversion plate 1.

Adopt the screw to connect, its connection is simple, and the reliability is good, makes things convenient for the dismouting simultaneously. Further, a sinking groove is formed in the side, facing away from the frequency conversion board 1, of the base plate 21, corresponding to the positioning hole 212, and a nut of the screw is embedded into the sinking groove, so that the nut is prevented from protruding out of the surface of the base plate 21.

In some embodiments, a heat-conducting rubber pad 3 is arranged between the frequency conversion plate 1 and the heat dissipation plate 2.

Specifically, because machining precision limits, the surface of the frequency conversion plate 1 and the surface of the heat dissipation plate 2 are difficult to ensure complete contact, so the scheme is provided with the heat conduction rubber cushion 3 between the frequency conversion plate 1 and the heat dissipation plate 2, and two sides of the heat conduction rubber cushion 3 can be in close contact with the frequency conversion plate 1 and the heat dissipation plate 2, so that a good heat conduction structure is realized. Meanwhile, the heat-conducting rubber pad 3 has elasticity and can buffer vibration transmission between the variable frequency plate 1 and the heat dissipation plate 2. The thermal conductive rubber pad 3 is preferably thermal conductive silica gel.

Referring to fig. 1, the heat dissipating plate 2 is mounted on the inverter board 1 at a position where the IPM module 11 is located.

Specifically, in the inverter board 1, the IPM module 11 is a main heat generating unit, and the IPM module 11 to which the heat dissipating plate 2 is attached is located, so that heat transfer from the IPM module 11 to the heat dissipating plate 2 can be achieved with the shortest heat transfer path, and an optimal heat dissipating effect can be ensured.

In the same way, the variable frequency heat pump has the advantages of good heat dissipation performance, simplified production process, improved production efficiency and the like.

In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are merely for convenience of description and to simplify the operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.

In the description herein, reference to the term "one embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.

The technical principle of the present utility model is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the utility model and should not be taken in any way as limiting the scope of the utility model. Other embodiments of the utility model will be apparent to those skilled in the art from consideration of this specification without undue burden.

Claims

1. The utility model provides a frequency conversion board heat radiation structure, its characterized in that, including frequency conversion board (1) and connect in heating panel (2) of frequency conversion board (1) one side, heating panel (2) include base plate (21) and cooling tube (22), cooling tube (22) include heat exchange portion (222) and with external refrigerant pipeline connection's connecting portion (221), base plate (21) die-casting cladding in outside heat exchange portion (222).

2. The inverter board heat dissipation structure according to claim 1, wherein a convex hull (211) corresponding to the heat exchanging portion (222) is provided on a side of the substrate (21) facing away from the inverter board (1).

3. The inverter board heat dissipation structure as claimed in claim 1, wherein the cooling pipe (22) further comprises a transit portion (223), the connection portion (221) and the transit portion (223) being located at two opposite sides of the substrate (21), respectively; connecting portion (221) are including feed liquor connecting pipe (2211) and return liquid connecting pipe (2212), heat transfer portion (222) are including feed liquor heat transfer pipe (2221) and return liquid heat transfer pipe (2222), feed liquor connecting pipe (2211) and transfer portion (223) are connected respectively to the both ends of feed liquor heat transfer pipe (2221), return liquid connecting pipe (2212) and transfer portion (223) are connected respectively to the both ends of return liquid heat transfer pipe (2222).

4. A frequency conversion board heat dissipation structure according to claim 3, wherein the heat exchange portion (222) comprises a plurality of liquid inlet heat exchange tubes (2221) arranged in parallel, one ends of the liquid inlet connection tubes (2211) and the transfer portion (223) close to the liquid inlet heat exchange tubes (2221) are respectively connected with a first transfer tube (224), and the first transfer tube (224) is provided with a plurality of first branch tube connectors correspondingly connected with the liquid inlet heat exchange tubes (2221).

5. A frequency conversion board heat dissipation structure according to claim 3, wherein the heat exchange portion (222) comprises a plurality of liquid return heat exchange tubes (2222) arranged in parallel, one ends of the liquid return connection tubes (2212) and the transfer portion (223) close to the liquid return heat exchange tubes (2222) are respectively connected with a second transfer tube (225), and the second transfer tube (225) is provided with a plurality of second branch tube connectors correspondingly connected with the liquid return heat exchange tubes (2222).

6. A frequency conversion plate heat radiation structure according to claim 3, characterized in that the cooling tube (22) is provided with internal threads for turbulence.

7. The heat dissipation structure of a frequency conversion plate according to claim 1, wherein the base plate (21) is provided with a plurality of positioning holes (212), the frequency conversion plate (1) is provided with threaded holes corresponding to the positioning holes (212), and positioning screws penetrate through the positioning holes (212) and are connected with the threaded holes, so that the heat dissipation plate (2) is fixed on the frequency conversion plate (1).

8. The frequency conversion plate heat radiation structure according to claim 7, wherein a heat conducting rubber pad (3) is arranged between the frequency conversion plate (1) and the heat radiation plate (2).

9. The inverter board heat dissipation structure as claimed in claim 8, wherein the heat dissipation board (2) is mounted at a position where the IPM module (11) on the inverter board (1) is located.

10. A variable frequency heat pump, characterized by comprising the variable frequency plate heat radiation structure of any one of claims 1-9.