CN219937025U

CN219937025U - Wafer back defect detection device

Info

Publication number: CN219937025U
Application number: CN202321047818.XU
Authority: CN
Inventors: 陈海龙
Original assignee: Xinmao Jiaxing Semiconductor Technology Co ltd
Current assignee: Xinmao Jiaxing Semiconductor Technology Co ltd
Priority date: 2023-05-05
Filing date: 2023-05-05
Publication date: 2023-10-31
Anticipated expiration: 2033-05-05

Abstract

The utility model discloses a wafer back defect detection device which comprises a bottom plate, wherein the middle part of the upper surface of the bottom plate is rotationally connected with a stand column through a bearing, the top end of the stand column is provided with a U-shaped frame, two vertical sections of the U-shaped frame are rotationally connected with a transverse connecting shaft through a bearing, a supporting seat is fixedly connected onto the connecting shaft, the top end of the supporting seat is fixedly connected with an adsorption plate contacted with the middle part of the back of a wafer through a supporting rod, and the surface of the adsorption plate is provided with a plurality of first suction openings which are uniformly and orderly distributed. This wafer back defect detection device through the cooperation between arc and the adsorption plate, can realize the comprehensive detection to the wafer back, does not have the dead angle, and then has further improved product quality, has avoided current device direct adsorption wafer back to cause the condition that waits that the inspection area was sheltered from to take place, and easy operation.

Description

Wafer back defect detection device

Technical Field

The utility model belongs to the technical field of semiconductor integrated circuit manufacturing, and particularly relates to a wafer back defect detection device.

Background

In integrated circuit fabrication, inspection of wafers is common and important. The possible problems in the integrated circuit manufacturing process can be found in time through the inspection of the wafer, so that the problems can be solved as soon as possible, and the influence of the lack and leakage in the integrated circuit manufacturing process on the integrated circuit product can be prevented as much as possible; in addition, the defect product can be prevented from flowing into the market through the inspection of the wafer, and the product quality is ensured.

In the prior art, during the fabrication of semiconductor devices, the wafers need to be inspected for appearance defects, which can affect the quality of the semiconductor devices. Wherein, the appearance defects comprise breakage, crack, scratch, attachment or pollution, and the conventional inspection equipment is provided with macroscopic inspection and microscopic inspection functions of the front surface of the wafer. With the improvement of integrated circuit integration and the reduction of line width, the back surface condition of the wafer has a great influence on the yield, and the customer also puts forward the requirement of wafer back surface quality inspection, so that the quality of the wafer and the reliability of the corresponding integrated circuit manufacturing process are more clearly and accurately judged, and therefore, the wafer back surface inspection device must be established.

When detecting the wafer, need use anchor clamps or adsorption equipment to fix the wafer, but fix the wafer through anchor clamps and adsorption equipment, can cause the shielding to the surface contact position of wafer for can not detect the shielding part in the testing process, can not guarantee the comprehensive detection to the wafer, thereby can not effectively guarantee product quality.

Disclosure of Invention

The utility model aims to provide a wafer back defect detection device for solving the technical problems in the background technology.

In order to achieve the above purpose, the specific technical scheme of the utility model is as follows: the utility model provides a wafer back defect detection device, includes the bottom plate, the upper surface middle part of bottom plate is connected with the stand through the bearing rotation, the top of stand is provided with U type frame, rotate through the bearing between the two vertical sections of U type frame and be connected with the connecting axle of horizontal, fixedly connected with supporting seat on the connecting axle, the top of supporting seat passes through bracing piece fixedly connected with and the adsorption plate of wafer back middle part contact, the surface of adsorption plate is provided with a plurality of evenly orderly distributed's first suction inlet, be provided with first adsorption mechanism in the middle of supporting seat and the adsorption plate bottom, be provided with the first actuating mechanism that is used for driving stand horizontal direction rotation on the bottom plate, be provided with the second actuating mechanism that is used for driving supporting seat up-and-down direction rotation on the U type frame, upper surface one side of bottom plate is provided with the riser, be provided with the baffle that can reciprocate between the bottom of baffle and the upper surface of bottom plate through the cylinder connection, the back of baffle installs the third motor, the back of the shaft portion of baffle is connected with a plurality of evenly orderly distribution's first suction inlet, be provided with the first actuating mechanism that is used for driving the stand horizontal direction rotation, the second actuating mechanism is located on the arc, the arc is located on the arc is contacted with the top of the wafer.

Preferably, the arc is annular structure, just one side of arc is provided with the breach, the inside wall of arc is provided with three and is the extension piece that circumference array distributes, the upper surface of extension piece is provided with the second suction inlet with wafer back edge contact.

Preferably, the first adsorption mechanism comprises a vacuum pump arranged in the inner cavity of the supporting seat, the vacuum pump is connected with a shunt pipe through an air pipe, suction cups which are distributed in one-to-one correspondence with the first suction ports are connected to the shunt pipe, and the structure of the second adsorption mechanism is the same as that of the first adsorption mechanism.

Preferably, the first driving mechanism comprises a second motor fixedly connected with the upper surface of the bottom plate, a pinion is connected with a shaft part of the second motor, a large gear is sleeved on the upright post, the large gear is rotationally connected with the pinion, and the large gear is meshed with the pinion.

Preferably, the second driving mechanism comprises a first motor arranged on the side wall of the U-shaped frame, and a shaft part of the first motor is connected with the connecting shaft.

Preferably, two sliding grooves which are vertically distributed are formed in the surface of the vertical plate, and two sliding blocks which are in sliding connection with the sliding grooves are arranged at the bottom of the back of the baffle plate.

The wafer back defect detection device has the following advantages:

1. this wafer back defect detection device for the arc is in the periphery of U type frame through the setting of annular structure arc for the arc is in the periphery of U type frame, when need not use the arc to adsorb the wafer, and use the adsorption plate to adsorb the wafer, make the arc be in the below, can not cause the interference to the activity of U type frame, when needs make the arc adsorb the edge of wafer back, make the arc shift up, thereby contact with the wafer back on the adsorption plate, thereby make the wafer be fixed in on the arc, thereby make the middle part of wafer back expose, thereby make under the cooperation between adsorption plate and the arc, can realize the comprehensive detection to the wafer back, there is not the dead angle, and then further improved product quality, avoided current device direct adsorption wafer back to cause the condition that waits that the inspection area is sheltered from to take place, and easy operation.

2. This wafer back defect detection device through starting first motor for the connecting axle rotates, thereby makes the supporting seat rotate as the centre of a circle with the axle center of connecting axle, thereby realizes the regulation to the wafer fillet degree, and the maximum inclination at steerable wafer back makes visual observation more clear.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of a baffle plate according to the present utility model;

FIG. 3 is an exploded view of the suction plate and the support base of the present utility model;

FIG. 4 is a schematic structural view of a first adsorption mechanism according to the present utility model;

the figure indicates: 1. a bottom plate; 2. a column; 3. a U-shaped frame; 4. a support base; 5. an adsorption plate; 6. a first motor; 7. a second motor; 8. a large gear; 9. a pinion gear; 10. an arc-shaped plate; 11. a vertical plate; 12. a chute; 13. a slide block; 14. a cylinder; 15. a baffle; 16. a third motor; 17. an extension block; 18. a first suction opening; 19. a second suction port; 20. a support rod; 21. a vacuum pump; 22. an air pipe; 23. a shunt; 24. and a sucking disc.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in numerous different ways without departing from the spirit or scope of the embodiments of the present utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

In the description of the embodiments of the present utility model, it should be understood that the terms "length," "vertical," "horizontal," "top," "bottom," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience in describing the embodiments of the present utility model and to simplify the description, rather than to indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.

The following disclosure provides many different implementations, or examples, for implementing different configurations of embodiments of the utility model. In order to simplify the disclosure of embodiments of the present utility model, components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit embodiments of the present utility model. Furthermore, embodiments of the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

For a better understanding of the objects, structures and functions of the present utility model, a wafer backside defect inspection apparatus according to the present utility model will be described in further detail with reference to the accompanying drawings.

As shown in figures 1-4, the wafer back defect detection device comprises a bottom plate 1, wherein the middle part of the upper surface of the bottom plate 1 is rotationally connected with a stand column 2 through a bearing, the top end of the stand column 2 is provided with a U-shaped frame 3, two vertical sections of the U-shaped frame 3 are rotationally connected with a transverse connecting shaft through a bearing, a supporting seat 4 is fixedly connected on the connecting shaft, the top end of the supporting seat 4 is fixedly connected with an adsorption plate 5 contacted with the middle part of the wafer back through a supporting rod 20, the surface of the adsorption plate 5 is provided with a plurality of uniformly and orderly distributed first suction ports 18, a first adsorption mechanism is arranged between the supporting seat 4 and the bottom of the adsorption plate 5, the bottom plate 1 is provided with a first driving mechanism for driving the stand column 2 to rotate in the horizontal direction, the first driving mechanism comprises a second motor 7 fixedly connected with the upper surface of the bottom plate 1, the shaft part of the second motor 7 is connected with a pinion 9, the upright post 2 is sleeved with a large gear 8, the large gear 8 is rotationally connected with the pinion 9, the large gear 8 is meshed with the pinion 9, the pinion 9 drives the large gear 8 to rotate by starting the second motor 7, the upright post 2 rotates by taking the shaft center as the circle center, the adsorption plate 5 realizes the rotation in the horizontal direction, the U-shaped frame 3 is provided with a second driving mechanism for driving the supporting seat 4 to rotate in the up-down direction, the second driving mechanism comprises a first motor 6 arranged on the side wall of the U-shaped frame 3, the shaft part of the first motor 6 is connected with a connecting shaft, the connecting shaft is rotated by starting the first motor 6, the supporting seat 4 is rotated by taking the shaft center of the connecting shaft as the circle center, the wafer fillet degree is adjusted, the maximum inclination angle of the back surface of a wafer can be controlled, so that the visual observation is clearer.

A vertical plate 11 is arranged on one side of the upper surface of the bottom plate 1, a baffle plate 15 capable of moving up and down is arranged on one side of the vertical plate 11, two sliding grooves 12 which are vertically distributed are arranged on the surface of the vertical plate 11, two sliding blocks 13 which are in sliding connection with the sliding grooves 12 are arranged at the bottom of the back of the baffle plate 15, good limiting effect is achieved on the baffle plate 15 through the cooperation between the sliding blocks 13 and the sliding grooves 12, the stability of the baffle plate 15 in moving up and down is improved, the bottom of the baffle plate 15 is connected with the upper surface of the bottom plate 1 through an air cylinder 14, a third motor 16 is arranged at the back of the baffle plate 15, an arc-shaped plate 10 is connected with a shaft part of the third motor 16, the arc-shaped plate 10 is sleeved on the outer side of the U-shaped frame 3, the arc-shaped plate 10 is of an annular structure, one side of the arc-shaped plate 10 is provided with a notch, three extending blocks 17 which are distributed in a circumferential array are arranged on the inner side wall of the arc-shaped plate 10, the upper surface of the extension block 17 is provided with a second suction port 19 which is in contact with the edge of the back surface of the wafer, through the arrangement of the arc plate 10 with an annular structure, the arc plate 10 is positioned at the periphery of the U-shaped frame 3, when the arc plate 10 is not required to be used for adsorbing the wafer and the adsorption plate 5 is used for adsorbing the wafer, the arc plate 10 is positioned below and does not interfere with the movement of the U-shaped frame 3, when the arc plate 10 is required to adsorb the edge of the back surface of the wafer, the arc plate 10 is upwards moved to be in contact with the back surface of the wafer on the adsorption plate 5, the wafer is fixed on the arc plate 10, the middle part of the back surface of the wafer is exposed, the comprehensive detection of the back surface of the wafer can be realized under the cooperation between the adsorption plate 5 and the arc plate 10, the condition that the back surface of the wafer is blocked by the prior device is avoided, be provided with the second adsorption equipment who adsorbs the contact with wafer back edge on the arc 10, first adsorption equipment is including installing in the vacuum pump 21 of supporting seat 4 inner chamber, vacuum pump 21 is connected with shunt tubes 23 through trachea 22, be connected with on the shunt tubes 23 with first suction inlet 18 one-to-one distribution's sucking disc 24, and the structure of second adsorption equipment is the same with first adsorption equipment's structure, through starting vacuum pump 21, can make sucking disc 24 produce suction to adsorb fixedly to the wafer through first suction inlet 18 and second suction inlet 19.

The working principle is as follows: when the wafer back detection device is used, the middle part of the back of a wafer is contacted with the upper surface of the adsorption plate 5, the angle of the wafer is adjusted through the cooperation between the first motor 7 and the second motor 6, the front and back parts of the wafer which are not shielded are detected, the wafer is in a horizontal state after detection is completed, then the air cylinder 14 is started, the arc plate 10 is upwards moved, the upper surface of the extension block 17 on the arc plate 10 is contacted with the edge of the back of the wafer, the wafer is adsorbed and fixed through the sucker 24, at the moment, the air cylinder 14 can be started, the arc plate 10 is continuously upwards moved, the wafer is separated from the adsorption plate 5, then the third motor 16 is started, the arc plate 10 rotates by taking the axle center of the axle part of the third motor 16 as the center of the circle, the wafer fillet degree is adjusted, the middle part of the back of the wafer is exposed, the middle part of the back of the wafer can be detected, the wafer is comprehensively detected, no dead angle exists, the product quality is further improved, and the operation is simple.

It will be understood that the utility model has been described in terms of several embodiments, and that various changes and equivalents may be made to these features and embodiments by those skilled in the art without departing from the spirit and scope of the utility model. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. The utility model provides a wafer back defect detection device which characterized in that: including bottom plate (1), the upper surface middle part of bottom plate (1) is connected with stand (2) through the bearing rotation, the top of stand (2) is provided with U type frame (3), be connected with the connecting axle of horizontal through the bearing rotation between the two vertical sections of U type frame (3), fixedly connected with supporting seat (4) on the connecting axle, the top of supporting seat (4) is through bracing piece (20) fixedly connected with adsorption plate (5) with wafer back middle part contact, the surface of adsorption plate (5) is provided with a plurality of first suction openings (18) of evenly orderly distribution, be provided with first adsorption mechanism in the middle of supporting seat (4) and adsorption plate (5) bottom, be provided with the first actuating mechanism that is used for driving stand (2) horizontal direction rotation on bottom plate (1), be provided with the second actuating mechanism that is used for driving supporting seat (4) direction rotation from top to bottom on U type frame (3), the upper surface one side of bottom plate (1) is provided with riser (11), the surface one side of riser (11) can be provided with on the motor (15) and be provided with on the bottom plate (15) and be connected with three baffle (16) on the bottom plate (16) is installed on the bottom plate (16), the arc-shaped plate (10) is sleeved on the outer side of the U-shaped frame (3), and a second adsorption mechanism in adsorption contact with the edge of the back of the wafer is arranged on the arc-shaped plate (10).

2. The wafer backside defect inspection apparatus of claim 1, wherein: the arc-shaped plate (10) is of an annular structure, a notch is formed in one side of the arc-shaped plate (10), three extending blocks (17) distributed in a circumferential array are arranged on the inner side wall of the arc-shaped plate (10), and a second suction port (19) in contact with the edge of the back face of the wafer is formed in the upper surface of each extending block (17).

3. The wafer backside defect inspection apparatus of claim 1, wherein: the first adsorption mechanism comprises a vacuum pump (21) arranged in the inner cavity of the supporting seat (4), the vacuum pump (21) is connected with a shunt tube (23) through an air tube (22), suction cups (24) which are distributed in one-to-one correspondence with the first suction openings (18) are connected to the shunt tube (23), and the structure of the second adsorption mechanism is the same as that of the first adsorption mechanism.

4. The wafer backside defect inspection apparatus of claim 1, wherein: the first driving mechanism comprises a second motor (7) fixedly connected with the upper surface of the bottom plate (1), a pinion (9) is connected with a shaft part of the second motor (7), a large gear (8) is sleeved on the upright post (2), the large gear (8) is rotationally connected with the pinion (9), and the large gear (8) is meshed with the pinion (9).

5. The wafer backside defect inspection apparatus of claim 1, wherein: the second driving mechanism comprises a first motor (6) arranged on the side wall of the U-shaped frame (3), and the shaft part of the first motor (6) is connected with the connecting shaft.

6. The wafer backside defect inspection apparatus of claim 1, wherein: two sliding grooves (12) which are vertically distributed are formed in the surface of the vertical plate (11), and two sliding blocks (13) which are in sliding connection with the sliding grooves (12) are arranged at the bottom of the back of the baffle plate (15).