CN219930335U - Air pressure adjusting device, reaction chamber tail row pipeline and semiconductor processing equipment - Google Patents
Air pressure adjusting device, reaction chamber tail row pipeline and semiconductor processing equipment Download PDFInfo
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- CN219930335U CN219930335U CN202321290488.7U CN202321290488U CN219930335U CN 219930335 U CN219930335 U CN 219930335U CN 202321290488 U CN202321290488 U CN 202321290488U CN 219930335 U CN219930335 U CN 219930335U
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- air pressure
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 90
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000012545 processing Methods 0.000 title claims abstract description 9
- 230000001105 regulatory effect Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 25
- 238000004891 communication Methods 0.000 claims description 12
- 238000011144 upstream manufacturing Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 abstract description 8
- 239000007789 gas Substances 0.000 description 38
- 238000005336 cracking Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides an air pressure adjusting device, a reaction chamber tail exhaust pipeline and semiconductor processing equipment. The tail exhaust pipeline is connected with the reaction chamber and the tail gas treatment device, the tail exhaust pipeline comprises a first on-off valve communicated with the reaction chamber, and the air pressure regulating device comprises: the bypass pipeline is connected in parallel with two ends of the first on-off valve, the bypass pipeline is at least provided with a one-way valve, and the flow direction of the one-way valve is from the reaction chamber to the tail gas treatment device. According to the utility model, the bypass pipeline is arranged to be communicated with the two ends of the first on-off valve, so that the pressure difference between the tail exhaust pipeline and the reaction chamber is approximately equal to the opening pressure of the one-way valve, and the opening pressure of the one-way valve is generally smaller, so that larger airflow fluctuation can not be generated when the first on-off valve is started, further, the substrate pollution in the reaction chamber can not be caused, and devices on the tail exhaust pipeline can be protected. In addition, the one-way valve can also prevent the tail gas of the tail gas exhaust pipeline from flowing back to the reaction chamber.
Description
Technical Field
The utility model relates to the technical field of semiconductor equipment, in particular to an air pressure adjusting device, a reaction chamber tail row pipeline and semiconductor processing equipment.
Background
The chemical vapor deposition process refers to a process of transferring a reaction gas into a reaction chamber, reacting the reaction gas in the reaction chamber by heating or the like, and depositing the reaction gas on a substrate to form an epitaxial film.
When the chemical vapor deposition process is performed, the exhaust gas generated by the chemical reaction is continuously discharged into the exhaust gas treatment device through the tail gas discharge pipeline connected with the exhaust port of the reaction chamber.
In the case of cavity opening actions such as conveying, maintenance, inspection and the like, the tail pipe needs to be closed first before cavity opening, so that the tail pipe is kept in a low-pressure state, and after cavity opening, the pressure of the reaction chamber rises, and at the moment, a significant pressure difference is formed between the reaction chamber and the tail pipe. Therefore, when the tail exhaust pipeline is opened after the cavity is closed, the obvious pressure difference exists between the reaction chamber and the tail exhaust pipeline, and the obvious pressure difference can cause the air flow in the reaction chamber to generate rapid disturbance, so that the particles on the inner wall of the reaction chamber are influenced by the air flow disturbance to drop on the substrate or the base, the substrate is polluted, and the yield of process products is influenced; this significant pressure differential can also cause oscillation of devices (e.g., pumps, filters) on the tail drain, shortening the life of the devices.
Disclosure of Invention
The utility model aims to provide an air pressure adjusting device, a reaction chamber tail exhaust pipeline and semiconductor processing equipment, so as to solve the problem that obvious pressure difference exists between the reaction chamber and the tail exhaust pipeline.
In order to achieve the above object, the present utility model is realized by the following technical scheme:
a air pressure adjusting device for reaction chamber tail calandria way, reaction chamber and tail gas treatment device are connected to tail calandria way, tail calandria way is including the intercommunication reaction chamber's first on-off valve, air pressure adjusting device includes:
the bypass pipeline is connected in parallel with two ends of the first on-off valve, the bypass pipeline is at least provided with a one-way valve, and the flow direction of the one-way valve is from the reaction chamber to the tail gas treatment device.
Optionally, the air pressure adjusting device further includes: the second break-make valve is arranged on the bypass pipeline;
and the controller is configured with a first control instruction, and the first control instruction is configured to send a communication instruction to the second on-off valve before sending a closing instruction to the first on-off valve.
Optionally, the tail drain pipeline comprises a negative pressure device arranged at the downstream of the first on-off valve, the bypass pipeline comprises a second end arranged at the downstream of the first on-off valve, and the second end is arranged at the upstream of the negative pressure device;
the controller is configured with a second control command configured to keep the second on-off valve in communication before sending a closing command to the negative pressure device.
Optionally, the controller is configured with a third control instruction, and the third control instruction is configured to send a communication instruction to the first on-off valve and then send a closing instruction to the second on-off valve after sending a starting instruction to the negative pressure device.
Optionally, the tail drain pipeline includes a filter disposed downstream of the first on-off valve, and the bypass pipeline includes a second end disposed downstream of the first on-off valve, and the second end is disposed upstream of the filter.
Optionally, the opening pressure value of the one-way valve is not lower than 5kPa and not higher than 10kPa.
Optionally, a second on-off valve is further arranged on the bypass pipe;
in a first time period after the process is finished, the second on-off valve is in an open state, and the first on-off valve is in a disconnected state;
in a second time period after the first time period, the second on-off valve and the first on-off valve are in an off state;
in a third time period before the process starts, the second on-off valve is in an open state, and the first on-off valve is in an off state;
in a fourth time period before the process starts, the first on-off valve is in an open state, the second on-off valve is in an off state, and the fourth time period is after the third time period.
Optionally, the second on-off valve is a pneumatic on-off valve or an electric on-off valve; the first on-off valve is a pneumatic on-off valve or an electric on-off valve.
A reaction chamber tail line configured with an air pressure regulating device as described above.
The semiconductor processing equipment comprises a reaction chamber, a tail gas treatment device and a tail gas exhaust pipeline for connecting the reaction chamber and the tail gas treatment device, wherein the tail gas exhaust pipeline adopts the reaction chamber tail gas exhaust pipeline.
Compared with the prior art, the utility model has the following advantages:
according to the utility model, the bypass pipeline is arranged to be communicated with the two ends of the first on-off valve, so that the pressure difference between the tail exhaust pipeline and the reaction chamber is approximately equal to the opening pressure of the one-way valve, and the opening pressure of the one-way valve is generally smaller, so that larger airflow fluctuation can not be generated when the first on-off valve is started, further, the substrate pollution in the reaction chamber can not be caused, and devices on the tail exhaust pipeline can be protected. In addition, the one-way valve can also prevent the tail gas of the tail gas exhaust pipeline from flowing back to the reaction chamber.
Drawings
For a clearer description of the technical solutions of the present utility model, the drawings that are needed in the description will be briefly introduced below, it being obvious that the drawings in the following description are one embodiment of the present utility model, and that, without inventive effort, other drawings can be obtained by those skilled in the art from these drawings:
FIG. 1 is a block diagram of a prior art tail pipe according to one embodiment of the present utility model;
fig. 2 is a block diagram of a tail pipe with an air pressure adjusting device according to an embodiment of the present utility model.
Detailed Description
The following provides a further detailed description of the proposed solution of the utility model with reference to the accompanying drawings and detailed description. The advantages and features of the present utility model will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the utility model.
Fig. 1 is a schematic diagram of a tail gas exhaust pipeline X connecting a reaction chamber 1 and a tail gas treatment device 2, where the reaction chamber 1 may be any chamber of a semiconductor processing apparatus that needs to perform tail gas emission, such as a chemical vapor deposition apparatus. As shown in fig. 1, the tail pipe line X includes a first on-off valve 3 connected to the reaction chamber 1, and in order to realize automatic on-off of the tail pipe line X, the first on-off valve 3 may be a pneumatic on-off valve or an electric on-off valve.
Before the reaction chamber 1 is closed and the process starts, the negative pressure device 4 is started and then the first on-off valve 3 is started so as to carry out exhaust treatment on the reaction chamber 1 through the negative pressure device 4 (namely an exhaust pump) on the tail exhaust pipeline X, in the process, the first on-off valve 3 is kept in an open state, the reaction chamber 1 is continuously exhausted through the negative pressure device 4, and the exhaust gas exhausted through the negative pressure device 4 is purified through the tail gas treatment device 2 and finally exhausted into the air.
After the process is finished, the first on-off valve 3 is usually closed, and then the negative pressure device 4 is closed, so that the section from the first on-off valve 3 to the negative pressure device 4 in the tail pipe line X is in a low pressure state (the pressure is lower than the pressure in the reaction chamber 1 before the cavity is opened), and after the cavity is opened, the pressure of the reaction chamber 1 rises to the atmospheric pressure, and therefore, a larger pressure difference is formed between the tail pipe line X and the reaction chamber 1. Then, after the cavity is closed, when the first on-off valve 3 is opened, the larger pressure difference causes the air flow in the reaction chamber 1 to generate rapid disturbance, so that the particles on the inner wall of the reaction chamber 1 are influenced by the air flow disturbance and drop on the substrate or the base, thereby causing substrate pollution and influencing the yield of process products; meanwhile, the pressure difference can also cause the devices (such as the negative pressure device 4 and the filter 5) on the tail exhaust pipeline X to vibrate, so that the service life of the devices is shortened.
In this embodiment, since the air pressure value of the tail pipe X does not exceed the air pressure value of the reaction chamber 1, the pressure difference between the tail pipe X and the reaction chamber 1 refers to the difference between the air pressure inside the reaction chamber 1 and the air pressure in the section from the first on-off valve 3 of the tail pipe X to the negative pressure device 4.
Based on this, the present utility model provides an air pressure adjusting device for a reaction chamber tail drain pipe, as shown in fig. 2, comprising: the bypass pipeline Y is connected in parallel with the two ends of the first on-off valve 3, and is at least provided with a one-way valve 6, and the flow direction of the one-way valve 6 is from the reaction chamber 1 to the tail gas treatment device 2. It should be noted that, the upstream end of the bypass line Y is connected to the upstream pipe of the first on-off valve 3 of the tail line X, and is not directly connected to the reaction chamber 1, so as to keep the flow direction of the gas flow in the reaction chamber 1 unchanged, and no disturbance is generated to the gas flow field in the chamber due to the switching of the tail line X and the bypass line Y.
Through setting up this bypass line Y, the both ends of intercommunication first on-off valve 3 for the pressure differential between tail row pipeline X and the reaction chamber 1 is not greater than the cracking pressure of check valve 6, and the cracking pressure of check valve 6 is usually less, therefore can not have great pressure differential at the both ends of first on-off valve 3, so can not produce great air current fluctuation when first on-off valve 3 starts, and then can not cause the substrate pollution in the reaction chamber 1 and can protect the device on the tail row pipeline X. In addition, the one-way valve 6 can also prevent the tail gas of the tail gas discharge pipeline X from flowing back to the reaction chamber 1.
Further, the tail exhaust pipeline X includes a filter 5 disposed downstream of the first on-off valve 3, and the filter 5 is used for filtering the exhaust gas of the reaction chamber 1 to filter out particulate matters in the exhaust gas. The bypass line Y comprises a second end downstream of the first on-off valve 1, which is upstream of the filter 5. By this means, the bypass line Y is provided before the filter 5, through which bypass line Y the gas flow of the reaction chamber 1 is prevented from entering the filter 5 from the rear end of the filter 5, causing particles on the filter 5 to escape the filter 5 and return to its upstream conduit.
It will be appreciated that the check valve 6 has a cracking pressure, and that when the differential pressure across the check valve 6 in the forward direction does not exceed the cracking pressure, the check valve 6 is in a closed state, and when the differential pressure across the check valve 6 in the forward direction exceeds the cracking pressure, the check valve 6 will be positively conducted. In this embodiment, the opening pressure value of the check valve 6 is not lower than 5kPa and not higher than 10kPa. Therefore, when the pressure difference between the tail pipeline X and the reaction chamber 1 is larger than the opening pressure of the one-way valve 6, the one-way valve 6 is positively conducted, and the bypass pipeline Y carries out air pressure adjustment on the tail pipeline X, so that the pressure difference between the tail pipeline X and the reaction chamber 1 is not larger than the opening pressure of the one-way valve 6.
Further, in order to avoid the problem that the service life of the check valve 6 is reduced and the reliability is deteriorated due to the fact that the check valve 6 is in the on state for a long time, the air pressure adjusting device further comprises: the second on-off valve 7 is arranged on the bypass pipeline Y, and the on-off of the bypass pipeline Y is controlled by controlling the on-off of the second on-off valve 7. The second on-off valve 7 may be a pneumatic on-off valve or an electric on-off valve in order to realize automatic on-off of the bypass line Y.
In a first period after the process is finished, the second on-off valve 7 is in an open state, and the first on-off valve 3 is in an off state. Specifically, in the period from the end of the process to the opening of the cavity, the first on-off valve 3 is in an off state, and the pressure in the reaction chamber 1 is continuously increased, so that the second on-off valve 7 is set in an on state, and the bypass pipeline Y is in an on state, and then the pressure difference between the tail pipeline X and the reaction chamber 1 is not greater than the opening pressure of the one-way valve, so that the pressure difference between the tail pipeline X and the reaction chamber 1 is reduced.
In a second time period after the first time period, the second on-off valve 7 and the first on-off valve 3 are in an off state; specifically, the second on-off valve 3 is disconnected in the period from the opening of the cavity to the closing of the cavity, so that the check valve 6 can be prevented from being in a conducting state for a long time.
In a third time period before the process starts, the second on-off valve 7 is in an open state, and the first on-off valve 3 is in a disconnected state; specifically, after the cavity is closed and before the negative pressure device 4 is opened to vacuumize the reaction chamber 1, if the first on-off valve 3 and the second on-off valve 7 are in an off state, because the reaction chamber 1 is at atmospheric pressure, if the negative pressure device 4 is directly opened first to exhaust, obvious pressure difference is formed between the tail exhaust pipeline X and the reaction chamber 1; if the first on-off valve 3 is opened first, the gas in the tail gas exhaust pipeline X flows back and diffuses into the reaction chamber 1 due to no continuous pressure difference between the tail gas exhaust pipeline X and the reaction chamber 1. Therefore, the second on-off valve 7 is switched to be in an open state, the bypass pipeline Y is conducted, the negative pressure device 4 is opened to vacuumize, and then the pressure difference between the tail exhaust pipeline X and the reaction chamber 1 is kept equal to the opening pressure of the one-way valve, so that the pressure difference between the tail exhaust pipeline X and the reaction chamber 1 is reduced, and the gas in the tail exhaust pipeline X can be prevented from flowing back and diffusing into the reaction chamber 1.
In a fourth period of time before the start of the process, the first on-off valve 3 is in an open state and the second on-off valve 7 is in an off state, said fourth period of time being after said third period of time. Specifically, after the negative pressure device 4 is opened, the first on-off valve 3 may be switched to an open state, and then the second on-off valve 7 may be switched to an off state to close the bypass line Y. Since the pressure difference between the reaction chamber 1 and the tail gas discharge pipe X is kept at the opening pressure of the check valve 6 in the third period, the pressure difference is small, and therefore, when the first on-off valve 3 is switched to the open state, the pressure difference between the upstream and downstream of the first on-off valve 3 is substantially equal to the opening pressure of the check valve 6, that is, the pressure difference between the upstream and downstream of the first on-off valve 3 is small but continuously exists, the pressure difference does not disturb the gas flow of the reaction chamber 1, and the condition that the gas in the tail gas discharge pipe X flows back and diffuses into the reaction chamber 1 is avoided. In addition, after the first on-off valve 3 is opened, the second on-off valve 7 is closed, so that the check valve 6 is prevented from being opened for a long time, and the service life of the check valve 6 is prolonged.
In other embodiments, the air pressure regulating device may further comprise a controller to enable automatic control of air pressure regulation.
The controller is configured with a first control command configured to send a communication command to the second on-off valve 7 before sending a closing command to the first on-off valve 3. Therefore, after the technological process is finished and before the tail exhaust pipeline X is closed, the controller firstly sends a communication instruction to the second on-off valve 7 to control the second on-off valve 7 to be opened, so that the bypass pipeline Y is in a conducting state, and then sends a closing instruction to the first on-off valve 3 to control the first on-off valve 3 to be switched into a disconnecting state, at the moment, the pressure difference between the tail exhaust pipeline X and the reaction chamber 1 is approximately equal to the opening pressure of the one-way valve 6, and therefore the pressure difference between the reaction chamber 1 and the tail exhaust pipeline X is reduced.
Further, the tail exhaust pipeline X comprises a negative pressure device 4 arranged at the downstream of the first on-off valve 3, the bypass pipeline Y comprises a second end arranged at the downstream of the first on-off valve 7, and the second end is arranged at the upstream of the negative pressure device 4, so that the bypass pipeline Y is arranged in front of the negative pressure device 4, and the air flow of the reaction chamber 1 can be prevented from being input into the negative pressure device 4 from the rear end of the negative pressure device 4 through the bypass pipeline Y, and the negative pressure device 4 is caused to vibrate. The controller is configured with a second control command configured to keep the second on-off valve 7 in communication before sending a closing command to the negative pressure device 4. Thereby, the second on-off valve 7 is kept in communication, i.e. the bypass line Y is kept in a conducting state, before the negative pressure device 4 is closed, so that a small pressure difference between the tail drain line X and the reaction chamber 1 can be maintained.
Further, the controller is configured with a third control instruction configured to send a communication instruction to the first on-off valve 3 and then send a closing instruction to the second on-off valve 7 after sending a start instruction to the negative pressure device 4. Thus, after controlling the negative pressure device 4 to open, the controller sends a communication command to the first on-off valve 3 to switch the first on-off valve 3 to an open state, thereby opening the tail drain pipeline X, and sends a closing command to the second on-off valve 7 to switch the second on-off valve 7 to an off state, thereby closing the bypass pipeline Y. When the negative pressure device 4 is opened, the second on-off valve 7 is in an open state, so that the pressure difference between the reaction chamber 1 and the tail exhaust pipeline X is slightly larger than the opening pressure of the one-way valve 6, and the pressure difference is small, therefore, when the first on-off valve 3 is switched to the open state, the pressure difference does not disturb the air flow of the reaction chamber 1, and the condition that the air in the tail exhaust pipeline X flows back and diffuses into the reaction chamber 1 does not occur. After the tail exhaust pipeline X is opened, the bypass pipeline Y is closed, so that the check valve 6 can be prevented from being in a conducting state for a long time, and the service life of the check valve 6 is prolonged.
Based on the same conception, the utility model also provides a reaction chamber tail drain pipeline which is provided with the air pressure regulating device.
The utility model also provides semiconductor processing equipment, which comprises a reaction chamber, a tail gas treatment device and a tail gas pipeline connecting the reaction chamber and the tail gas treatment device, wherein the tail gas pipeline adopts the reaction chamber tail gas pipeline.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present utility model has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the utility model. Many modifications and substitutions of the present utility model will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the utility model should be limited only by the attached claims.
Claims (10)
1. A air pressure adjusting device for reaction chamber tail calandria way, reaction chamber and tail gas treatment device are connected to tail calandria way, tail calandria way is including the intercommunication reaction chamber's first on-off valve, its characterized in that, air pressure adjusting device includes:
the bypass pipeline is connected in parallel with two ends of the first on-off valve, the bypass pipeline is at least provided with a one-way valve, and the flow direction of the one-way valve is from the reaction chamber to the tail gas treatment device.
2. The air pressure regulating device of claim 1, further comprising: the second break-make valve is arranged on the bypass pipeline;
and the controller is configured with a first control instruction, and the first control instruction is configured to send a communication instruction to the second on-off valve before sending a closing instruction to the first on-off valve.
3. The air pressure regulating device of claim 2, wherein the tail pipe line comprises a negative pressure device downstream of the first on-off valve, and the bypass line comprises a second end downstream of the first on-off valve, the second end being upstream of the negative pressure device;
the controller is configured with a second control command configured to keep the second on-off valve in communication before sending a closing command to the negative pressure device.
4. The air pressure regulating device of claim 3, wherein the controller is configured with a third control command configured to send a communication command to the first on-off valve and then to send a closing command to the second on-off valve after sending a start command to the negative pressure device.
5. The air pressure regulator of claim 1, wherein the tail pipe line includes a filter disposed downstream of the first on-off valve, and the bypass line includes a second end disposed downstream of the first on-off valve, the second end being disposed upstream of the filter.
6. The air pressure regulating device of claim 1, wherein the opening pressure value of the check valve is not lower than 5kPa and not higher than 10kPa.
7. The air pressure regulating device as claimed in claim 1, wherein the bypass line is further provided with a second on-off valve;
in a first time period after the process is finished, the second on-off valve is in an open state, and the first on-off valve is in a disconnected state;
in a second time period after the first time period, the second on-off valve and the first on-off valve are in an off state;
in a third time period before the process starts, the second on-off valve is in an open state, and the first on-off valve is in an off state;
in a fourth time period before the process starts, the first on-off valve is in an open state, the second on-off valve is in an off state, and the fourth time period is after the third time period.
8. The air pressure regulating device according to claim 2 or 7, wherein the second on-off valve is a pneumatic on-off valve or an electric on-off valve; the first on-off valve is a pneumatic on-off valve or an electric on-off valve.
9. A reaction chamber tail pipe provided with an air pressure regulating device according to any one of claims 1 to 8.
10. A semiconductor processing apparatus comprising a reaction chamber, an exhaust gas treatment device, and an exhaust line connecting the reaction chamber and the exhaust gas treatment device, wherein the exhaust line employs the reaction chamber exhaust line of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321290488.7U CN219930335U (en) | 2023-05-24 | 2023-05-24 | Air pressure adjusting device, reaction chamber tail row pipeline and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321290488.7U CN219930335U (en) | 2023-05-24 | 2023-05-24 | Air pressure adjusting device, reaction chamber tail row pipeline and semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219930335U true CN219930335U (en) | 2023-10-31 |
Family
ID=88490687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321290488.7U Active CN219930335U (en) | 2023-05-24 | 2023-05-24 | Air pressure adjusting device, reaction chamber tail row pipeline and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219930335U (en) |
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2023
- 2023-05-24 CN CN202321290488.7U patent/CN219930335U/en active Active
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