CN219924956U - Preformed soldering lug of composite structure - Google Patents
Preformed soldering lug of composite structure Download PDFInfo
- Publication number
- CN219924956U CN219924956U CN202223604858.8U CN202223604858U CN219924956U CN 219924956 U CN219924956 U CN 219924956U CN 202223604858 U CN202223604858 U CN 202223604858U CN 219924956 U CN219924956 U CN 219924956U
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- CN
- China
- Prior art keywords
- metal coating
- substrate
- composite structure
- metal
- soldering lug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002131 composite material Substances 0.000 title claims abstract description 25
- 238000005476 soldering Methods 0.000 title abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 64
- 239000002184 metal Substances 0.000 claims abstract description 64
- 239000011248 coating agent Substances 0.000 claims abstract description 41
- 238000000576 coating method Methods 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000002923 metal particle Substances 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000006259 organic additive Substances 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052720 vanadium Inorganic materials 0.000 description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model provides a preformed soldering lug of a composite structure. The preformed soldering lug of the composite structure comprises a substrate, a first metal coating, a second metal coating and a material belt for improving cutting stability, wherein the first metal coating is arranged on the upper surface of the substrate, the second metal coating is arranged on one side, far away from the substrate, of the first metal coating, the material belt is arranged on one side, far away from the first metal coating, of the second metal coating, and the preformed soldering lug of the composite structure can improve the rigidity, the hardness and the conductivity of the substrate through the arrangement of the first metal coating and the second metal coating, and meanwhile, the production yield of the preformed soldering lug of the composite structure can be improved through the arrangement of the material belt.
Description
Technical Field
The utility model relates to the technical field of soldering lugs, in particular to a preformed soldering lug with a composite structure.
Background
With the rapid development of electric power, high-speed rail, electric car, etc., the demand for high-power semiconductor devices is rapidly increasing.
The high-power semiconductor device has high power density, large heating value and high working temperature, and the reliability of the device manufactured by the traditional packaging mode can be obviously reduced.
In the high-power device package, the front electrode of the chip is connected with the substrate or the lead frame through metal lead bonding in a bonding mode, so that overcurrent is realized.
In the past, bond alloy wires have the advantages of high conductivity, corrosion resistance, good toughness and the like, are widely applied to integrated circuit packaging, but under the dual pressures of rising material price and falling electronic product price, the bond alloy wires are intangibly pushing industry professionals and units to continuously seek new cheap replacement materials, and become a market development rule. At present, materials such as aluminum wires, copper wires and the like are appeared. Aluminum wire bonding is low in cost, and is widely applied to high-power device packaging at present, but the reliability of the device is poor due to poor balling, poor stretching and heat resistance and the like. Meanwhile, the electrothermal performance of the copper wire is superior to that of the gold wire, and meanwhile, as the tensile, shearing strength and ductility of the copper wire are superior to those of the gold wire, the copper wire with smaller diameter can be adopted to replace the gold wire. Data analysis shows that the shearing force of the copper wire bonding ball is 15-25% higher than that of the gold wire, the tensile force is 10-20% higher than that of the gold wire, and the wire arc bending resistance is better during plastic package encapsulation. Therefore, the popularization of the copper wire bonding technology in the high-power device has important significance.
However, the copper wire has high hardness, which means that larger ultrasonic power and pressure intensity are needed during bonding, a series of problems such as substrate fracture, silicon pit, cold joint and the like are easily caused, and damage and destruction to a chip can bring hidden danger to product quality and reliability.
There is therefore an urgent need to redesign a new composite structure preform lug to address the above-mentioned problems.
Disclosure of Invention
The utility model provides a preformed soldering lug with a composite structure, so as to solve the technical problems in the prior art.
The utility model provides a preformed soldering lug with a composite structure, which comprises a substrate, a first metal coating, a second metal coating and a material belt, wherein the material belt is used for improving cutting stability, the first metal coating is arranged on the upper surface of the substrate, the second metal coating is arranged on one side of the first metal coating away from the substrate, and the material belt is arranged on one side of the second metal coating away from the first metal coating.
Optionally, the substrate is made of pure copper or iron-nickel alloy.
Optionally, the thickness of the substrate is 30-300 μm.
Optionally, the material of the first metal plating layer is any one or more of nickel, copper, gold, silver, palladium, titanium and vanadium.
Optionally, the thickness of the first metal plating layer is 1-20 μm.
Optionally, the material of the second metal plating layer is any one or more of nickel, copper, gold, silver, palladium, titanium and vanadium.
Optionally, the material belt comprises a plurality of metal particles and an organic auxiliary agent, the metal particles are arranged on one side of the second metal coating far away from the first metal coating, and the metal particles are filled with the organic auxiliary agent.
The beneficial effects of the utility model are as follows:
the preformed soldering lug of the composite structure comprises a substrate, a first metal coating, a second metal coating and a material belt for improving cutting stability, wherein the first metal coating is arranged on the upper surface of the substrate, the second metal coating is arranged on one side, far away from the substrate, of the first metal coating, the material belt is arranged on one side, far away from the first metal coating, of the second metal coating, and the preformed soldering lug of the composite structure can improve the rigidity, the hardness and the conductivity of the substrate through the arrangement of the first metal coating and the second metal coating, and meanwhile, the production yield of the preformed soldering lug of the composite structure can be improved through the arrangement of the material belt.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic side elevational view of a preform tab of a composite structure provided by the present utility model.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, the preformed soldering lug of the composite structure of the present utility model includes a substrate 100, a first metal plating layer 200, a second metal plating layer 300 and a material tape for improving cutting stability,
the first metal plating layer 200 is mounted on the upper surface of the substrate 100, the second metal plating layer 300 is mounted on a side of the first metal plating layer 200 away from the substrate 100, and the material tape is disposed on a side of the second metal plating layer 300 away from the first metal plating layer 200;
the substrate 100 plays a role in fixedly supporting the preformed soldering lug of the whole composite structure, and meanwhile, the first metal plating layer 200 or the second metal plating layer 300 is deposited on the substrate 100 in a manner of electroplating, magnetron sputtering, vapor deposition, chemical vapor deposition and the like, and the arrangement of the material belt can improve the reliability of the module;
further, 5um nickel and 1um silver may be electroplated on a 50um copper substrate, followed by prefabrication of solder on the substrate, followed by laser cutting.
In this embodiment, the substrate 100 is made of pure copper or iron-nickel alloy.
In this embodiment, the thickness of the substrate 100 is 30-300 μm.
In this embodiment, the material of the first metal plating layer 200 is any one or more of nickel, copper, gold, silver, palladium, titanium, and vanadium.
Meanwhile, the second metal plating layer 300 is made of any one or more of nickel, copper, gold, silver, palladium, titanium and vanadium.
The first metal plating layer 200 and the second metal plating layer 300 may be the same or different.
In this embodiment, the thickness of the first metal plating layer 200 is 1-20 μm.
In this embodiment, the material belt includes a plurality of metal particles 310 and an organic additive, the plurality of metal particles 310 are disposed on a side of the second metal plating layer 300 away from the first metal plating layer 200, and the metal particles 310 are filled with the organic additive.
The metal particles 310 and the organic auxiliary agent can facilitate the subsequent cutting of the soldering lug, so that the safety of the preformed soldering lug with the integral composite structure can be ensured to a certain extent.
The preformed soldering lug of the composite structure comprises a substrate 100, a first metal coating 200, a second metal coating 300 and a material belt for improving cutting stability, wherein the first metal coating 200 is arranged on the upper surface of the substrate 100, the second metal coating 300 is arranged on one side of the first metal coating 200 away from the substrate 100, and the material belt is arranged on one side of the second metal coating 300 away from the first metal coating 100, wherein the preformed soldering lug of the composite structure can improve the rigidity, the hardness and the conductivity of the substrate 100 through the arrangement of the first metal coating 200 and the second metal coating 300, and meanwhile, the production yield of the preformed soldering lug of the composite structure can be improved through the arrangement of the material belt.
The foregoing description is only of embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present utility model or directly or indirectly applied to other related technical fields are included in the scope of the present utility model.
Claims (5)
1. A preformed solder tab of composite construction comprising
A substrate;
a first metal plating layer mounted on the upper surface of the substrate;
a second metal plating layer mounted on a side of the first metal plating layer remote from the substrate;
and the material belt is used for improving cutting stability and is arranged on one side of the second metal coating far away from the first metal coating.
2. The composite structure preformed solder tab of claim 1 wherein the substrate is made of pure copper or iron-nickel alloy.
3. The preformed solder tab of composite structure of claim 1 wherein the substrate has a thickness of 30-300 μm.
4. The preformed solder tab of composite structure of claim 1, wherein the first metal coating has a thickness of 1-20 μm.
5. The composite structure preformed solder tab of claim 1, wherein the ribbon comprises a plurality of metal particles and an organic additive, wherein a plurality of the metal particles are disposed on a side of the second metal coating remote from the first metal coating, and wherein the metal particles are filled with the organic additive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223604858.8U CN219924956U (en) | 2022-12-27 | 2022-12-27 | Preformed soldering lug of composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223604858.8U CN219924956U (en) | 2022-12-27 | 2022-12-27 | Preformed soldering lug of composite structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219924956U true CN219924956U (en) | 2023-10-31 |
Family
ID=88498573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223604858.8U Active CN219924956U (en) | 2022-12-27 | 2022-12-27 | Preformed soldering lug of composite structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219924956U (en) |
-
2022
- 2022-12-27 CN CN202223604858.8U patent/CN219924956U/en active Active
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