CN219920973U - Transmit-receive integrated chip structure and sweeping robot with same - Google Patents
Transmit-receive integrated chip structure and sweeping robot with same Download PDFInfo
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- CN219920973U CN219920973U CN202320481073.1U CN202320481073U CN219920973U CN 219920973 U CN219920973 U CN 219920973U CN 202320481073 U CN202320481073 U CN 202320481073U CN 219920973 U CN219920973 U CN 219920973U
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- 238000010408 sweeping Methods 0.000 title claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims abstract description 3
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 238000000926 separation method Methods 0.000 claims description 14
- 238000005192 partition Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Abstract
The utility model provides a transceiver integrated chip structure, which comprises a main body frame, wherein the main body frame is provided with a front surface and a back surface which are opposite, and a first opening and a second opening which are used for determining a sound wave transmission view field are formed in the main body frame in a penetrating manner; the first MEMS chip and the second MEMS chip are arranged on the front face of the main body frame, the vibrating diaphragm of the first MEMS chip corresponds to the first opening, and the vibrating diaphragm of the second MEMS chip corresponds to the second opening. The sweeping robot comprises a transceiving integrated chip structure, and the transceiving integrated chip structure comprises a chip for transmitting signals and a chip for receiving signals, so that the packaging size is reduced, the consistency of equipment is improved, the transceiving signals adopt a horn type structure, zero blind area detection is realized, and the materials used in the environment are accurately fed back.
Description
Technical Field
One or more embodiments of the present disclosure relate to the field of semiconductor technology, and in particular, to a transceiver chip structure and a sweeping robot having the same.
Background
The floor sweeping robot, also called automatic sweeping machine, intelligent dust collector, robot dust collector, etc., is one kind of intelligent household appliance and can complete floor cleaning automatically inside room with certain artificial intelligence. Generally, the brushing and vacuum modes are adopted, and the ground sundries are firstly absorbed into the garbage storage box of the ground, so that the function of cleaning the ground is completed. Generally, robots that perform cleaning, dust collection, and floor scrubbing work are also collectively referred to as floor cleaning robots.
At present, in the working process of the sweeping robot, the environment information is mostly determined by transmitting ultrasonic signals for scanning, and the disadvantage is that blind areas occur in the process of transmitting the ultrasonic signals, so that information processing is problematic.
Disclosure of Invention
The utility model aims to solve the problems in the background art, and one or more embodiments of the present specification aim to provide a transceiver integrated chip structure and a sweeping robot with the same, which adopt the transceiver integrated chip design to realize zero blind area detection and accurately detect and analyze the materials of the environment.
In view of the above objects, one or more embodiments of the present disclosure provide a transceiver integrated chip structure, including: the main body frame is provided with a front face and a back face which are opposite, and a first opening and a second opening for determining a sound wave transmission view field are formed in the main body frame in a penetrating manner; the first MEMS chip and the second MEMS chip are arranged on the front surface of the main body frame, the vibrating diaphragm of the first MEMS chip corresponds to the first opening, and the vibrating diaphragm of the second MEMS chip corresponds to the second opening; and the separation bulge is arranged on the front surface of the main body frame and is positioned between the first MEMS chip and the second MEMS chip.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the chip for transmitting signals and the chip for receiving signals are adopted, the packaging size is reduced, the consistency of equipment is improved, the transceiver signals adopt a horn type structure, zero blind area detection is realized, and the materials used in the environment are accurately fed back.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the first opening is of a cylindrical structure.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the first opening is in a truncated cone-like structure or a truncated cone-like structure, and the inner diameter of one side of the first opening, which is close to the front surface of the main body frame, is smaller than the inner diameter of one side of the first opening, which is close to the back surface of the main body frame.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the second opening is of a cylindrical structure.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the second opening is in a truncated cone structure or a truncated cone-like structure, and the inner diameter of one side of the second opening, which is close to the front surface of the main body frame, is smaller than the inner diameter of one side of the second opening, which is close to the back surface of the main body frame.
According to the transceiver integrated chip structure of the embodiment of the utility model, the transceiver integrated chip structure further comprises: the first separation frame is arranged on the front surface of the main body frame and sleeved outside the first MEMS chip; and/or a second partition frame, wherein the second partition frame is arranged on the front surface of the main body frame and sleeved outside the second MEMS chip.
The sweeping robot comprises the transceiver integrated chip structure.
The advantageous effects of the present utility model are described in detail below with reference to the embodiments of the present utility model and the accompanying drawings.
Drawings
For a clearer description of one or more embodiments of the present description or of the solutions of the prior art, the drawings that are necessary for the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only one or more embodiments of the present description, from which other drawings can be obtained, without inventive effort, for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a transceiver integrated chip structure according to an embodiment of the present utility model.
Fig. 2 is an exploded view of a transceiver integrated chip structure according to an embodiment of the present utility model.
Fig. 3 is a top view of a transceiver integrated chip structure according to an embodiment of the present utility model.
Fig. 4 is a schematic view of the structure of the partition protrusion of fig. 1.
Fig. 5 is a schematic structural diagram of a transceiver integrated chip structure according to another embodiment of the present utility model.
Fig. 6 is a bottom view of a transceiver integrated chip structure according to an embodiment of the utility model.
Fig. 7 is a cross-sectional view of a first opening along section A-A as set forth in an embodiment of the present utility model.
Fig. 8 is a cross-sectional view of a second opening along section A-A as proposed in an embodiment of the present utility model.
Fig. 9 is a schematic structural diagram of a transceiver integrated chip structure according to another embodiment of the present utility model.
In the reference numerals: 1. a main body frame; 101. a first opening; 102. a second opening; 2. a partition protrusion; 2a, sucking holes; 2b, sound absorbing cotton; 2c, a sound absorbing wall; 3. a first chip; 4. a second chip; 5a, a first partition frame; and 5b, a second partition frame.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made in detail to the following specific examples.
The following describes a transceiver integrated chip structure according to an embodiment of the present utility model with reference to fig. 1 to 8.
Example 1
The transceiver integrated chip structure provided by the embodiment of the utility model comprises a main body frame 1, a first MEMS chip 3, a second MEMS chip 4 and a separation protrusion 2, as shown in figures 1-3.
The main body frame 1 has a front surface and a back surface opposite to each other, and the main body frame 1 is provided with a first opening 101. Alternatively, the first opening 101 is a cylindrical structure, as shown in fig. 7 a. Optionally, the first opening 101 has a truncated cone structure, and an inner diameter of a side of the first opening 101 near the front surface of the main body frame 1 is smaller than an inner diameter of a side near the back surface of the main body frame 1, and an included angle between the bevel edge and the back surface of the bracket main body is 135 degrees or 150 degrees. As shown in fig. 7b and 7 c. Optionally, the first opening 101 has a truncated cone-like structure, and an inner diameter of a side of the first opening 101 near the front surface of the main body frame 1 is smaller than an inner diameter of a side near the back surface of the main body frame 1. The sidewall of the first opening 101 is curved, as shown in fig. 7, and the theoretical formula of the curve is s=s T e mx Where m is a meander constant, the smaller m is the smaller the rate of change of the cross-sectional area of the horn 2, the lower the cut-off frequency fc is, S is the area of the first opening 101 on the side close to the back of the main body frame 1, S T Is the area of one side of the first opening 101 near the front surface of the main body frame 1, and S T Not greater than S as shown in fig. 7 d.
The main body frame 1 is provided with a second opening 103 therethrough. Optionally, the first opening 101 and the second opening 103 are symmetrically arranged. Alternatively, the second opening 103 may be a cylindrical structure, as shown in fig. 8 a. Optionally, the second opening 103 has a truncated cone structure, and an inner diameter of a side of the second opening 103 near the front surface of the main body frame 1 is smaller than an inner diameter of a side near the back surface of the main body frame 1, and an included angle between the oblique side and the back surface of the bracket main body is 135 ° or 150 °, as shown in fig. 8b and 8 c. Optionally, the second opening 103 has a truncated cone-like structure, and an inner diameter of a side of the second opening 103 near the front surface of the main body frame 1 is smaller than an inner diameter of a side near the back surface of the main body frame 1. The sidewall of the second opening 103 is curved, as shown in fig. 7, and the theoretical formula of the curve is s=s T e mx Where m is a meander constant, the smaller m is the smaller the rate of change of the cross-sectional area of the horn 2, the lower the cut-off frequency fc is, S is the area of the second opening 103 on the side close to the back of the body frame 1, S T Is the area of one side of the second opening 103 near the front surface of the main body frame 1, and S T Not greater than S as shown in fig. 8 d.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the first opening 101 and the second opening 103 are adopted to form the horn, so that the horn is used for being matched with the MEMS chip to transmit and receive signals, the packaging size of equipment is reduced, and the consistency is high.
The first MEMS chip 3 is disposed on the main body frame 1, the diaphragm of the first MEMS chip 3 corresponds to the position of the first opening 101, the first MEMS chip 3 cooperates with the first opening 101 for emitting a signal, and the first opening 101 is for defining a field of view of sound waves emitted by the first MEMS chip 3. The second MEMS chip 4 is disposed on the main body frame 1, the diaphragm of the second MEMS chip 4 corresponds to the position of the second opening 103, the second MEMS chip 4 cooperates with the second opening 103 for receiving signals, and the second opening 103 is for defining the field of view of the acoustic wave received by the second MEMS chip 4. Alternatively, the specifications of the first MEMS chip 3 and the second MEMS chip 4 are different, as shown in fig. 6b and 6c, so that the horns formed by the openings can be matched with the corresponding chips, and the chips respectively perform the best performance. Optionally, the positions of the back surfaces of the main body frame 1 where the first opening 3 is located and the positions of the back surfaces of the main body frame 1 where the second opening 4 is located are different in height, as shown in fig. 9, so that the receiving signals and the transmitting signals are not in the same plane, and the cross influence of the signals is prevented.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the zero blind area detection is realized by adopting a chip for transmitting signals and a chip for receiving signals.
And a separation protrusion 2, the separation protrusion 2 being disposed at the front surface of the body frame 1, and the separation protrusion 2 being located between the first MEMS chip 3 and the second MEMS chip 4. Optionally, sound absorbing holes 2a are formed on two sides of the separation protrusion 2 to further absorb sound waves, eliminate stray signals, and prevent air coupling, as shown in fig. 4 a. Optionally, sound absorbing cotton 2b is embedded in two side surfaces of the separation protrusion 2. Alternatively, the sound absorbing walls 2c are provided on both sides of the partition protrusion 2. The two MEMS chips for receiving and transmitting signals are separated by the separation bulge 2, so that air coupling is prevented, cross influence is generated, and detection precision is improved.
Optionally, the MEMS device further comprises a first separation frame 5a, wherein the first separation frame 5a is arranged on the front surface of the main body frame 1 and sleeved outside the first MEMS chip 3. Optionally, the MEMS device further comprises a second partition frame 5b, wherein the second partition frame 5b is arranged on the front surface of the main body frame 1 and sleeved outside the second MEMS chip 4. The first partition frame 5a and the second partition frame 5b provided in this embodiment enhance the effect of separation, and further enhance the detection accuracy.
Example 2
Unlike embodiment 1, according to the transceiver integrated chip structure provided in the embodiment of the present utility model, the first opening 101 is symmetrical along the A-A cross section, and the first opening 101 is trapezoidal along the A-A cross section, as shown in fig. 7B and fig. 7c, the first opening 101 is trapezoidal along the B2-B2 cross section, and the theoretical formula of the curve is the same as that of embodiment 2, as shown in fig. 7 d.
Example 3
Unlike embodiment 1, according to the transceiver integrated chip structure provided in the embodiment of the present utility model, the second opening 103 is symmetrical along the A-A cross section, and the second opening 103 is trapezoidal along the A-A cross section, as shown in fig. 6B and 6c, the second opening 103 is trapezoid-like along the B1-B1 cross section, and the theoretical formula of the curve is the same as that of embodiment 2, as shown in fig. 8 d.
Example 4
The sweeping robot comprises the transceiver integrated chip structure provided by the embodiment of the utility model.
The present disclosure is intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Any omissions, modifications, equivalents, improvements, and the like, which are within the spirit and principles of the one or more embodiments of the disclosure, are therefore intended to be included within the scope of the disclosure.
Claims (7)
1. Receive-transmit integrated chip structure, its characterized in that includes:
the device comprises a main body frame (1), wherein the main body frame (1) is provided with a front surface and a back surface which are opposite, and the main body frame (1) is provided with a first opening (101) and a second opening (102) which are used for determining a sound wave transmission view field in a penetrating way;
the MEMS device comprises a main body frame (1), a first MEMS chip (3) and a second MEMS chip (4), wherein the first MEMS chip (3) and the second MEMS chip (4) are arranged on the front surface of the main body frame (1), the vibrating diaphragm of the first MEMS chip (3) corresponds to a first opening (101), and the vibrating diaphragm of the second MEMS chip (4) corresponds to a second opening (102);
and the separation bulge (2) is arranged on the front surface of the main body frame (1), and the separation bulge (2) is positioned between the first MEMS chip (3) and the second MEMS chip (4).
2. The transceiver integrated chip structure of claim 1, wherein said first opening (101) is a cylindrical structure.
3. The transceiver integrated chip structure according to claim 1, wherein the first opening (101) has a truncated cone structure or a truncated cone-like structure, and an inner diameter of a side of the first opening (101) close to the front surface of the main body frame (1) is smaller than an inner diameter of a side close to the back surface of the main body frame (1).
4. The transceiver integrated chip structure of claim 1, wherein said second opening (102) is a cylindrical structure.
5. The transceiver integrated chip structure according to claim 1, wherein the second opening (102) has a truncated cone structure or a truncated cone-like structure, and an inner diameter of a side of the second opening (102) close to the front surface of the main body frame (1) is smaller than an inner diameter of a side close to the back surface of the main body frame (1).
6. The transceiver integrated chip structure of claim 1, further comprising:
the first partition frame (5 a) is arranged on the front surface of the main body frame (1) and sleeved outside the first MEMS chip (3); and/or
And the second partition frame (5 b) is arranged on the front surface of the main body frame (1), and is sleeved outside the second MEMS chip (4).
7. A sweeping robot comprising the transceiver-integrated chip structure of any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320481073.1U CN219920973U (en) | 2023-03-09 | 2023-03-09 | Transmit-receive integrated chip structure and sweeping robot with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320481073.1U CN219920973U (en) | 2023-03-09 | 2023-03-09 | Transmit-receive integrated chip structure and sweeping robot with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219920973U true CN219920973U (en) | 2023-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320481073.1U Active CN219920973U (en) | 2023-03-09 | 2023-03-09 | Transmit-receive integrated chip structure and sweeping robot with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219920973U (en) |
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- 2023-03-09 CN CN202320481073.1U patent/CN219920973U/en active Active
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