CN219516122U - Transmit-receive integrated chip structure and sweeping robot with same - Google Patents
Transmit-receive integrated chip structure and sweeping robot with same Download PDFInfo
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- CN219516122U CN219516122U CN202320481100.5U CN202320481100U CN219516122U CN 219516122 U CN219516122 U CN 219516122U CN 202320481100 U CN202320481100 U CN 202320481100U CN 219516122 U CN219516122 U CN 219516122U
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Abstract
The utility model provides a transceiver integrated chip structure, which comprises a main body support, wherein the main body support is provided with a front surface and a back surface which are opposite, and a first opening and a second opening which are used for determining a sound wave transmission view field are formed in the main body support in a penetrating manner; the first MEMS chip and the second MEMS chip are arranged on the front surface of the main body support, the vibrating diaphragm of the first MEMS chip corresponds to the first opening, and the vibrating diaphragm of the second MEMS chip corresponds to the second opening. The sweeping robot comprises a transceiving integrated chip structure, and the transceiving integrated chip structure comprises a chip for transmitting signals and a chip for receiving signals, so that the packaging size is reduced, the consistency of equipment is improved, the transceiving signals adopt a horn type structure, zero blind area detection is realized, and the materials used in the environment are accurately fed back.
Description
Technical Field
One or more embodiments of the present disclosure relate to the field of semiconductor technologies, and in particular, to a transceiver integrated chip structure and a sweeping robot with the same.
Background
The floor sweeping robot, also called automatic sweeping machine, intelligent dust collector, robot dust collector, etc., is one kind of intelligent household appliance and can complete floor cleaning automatically inside room with certain artificial intelligence. Generally, the brushing and vacuum modes are adopted, and the ground sundries are firstly absorbed into the garbage storage box of the ground, so that the function of cleaning the ground is completed. Generally, robots that perform cleaning, dust collection, and floor scrubbing work are also collectively referred to as floor cleaning robots.
At present, in the working process of the sweeping robot, the environment information is mostly determined by transmitting ultrasonic signals for scanning, and the disadvantage is that blind areas occur in the process of transmitting the ultrasonic signals, so that information processing is problematic.
Disclosure of Invention
The utility model aims to solve the problems in the background art, and one or more embodiments of the present specification aim to provide a transceiver integrated chip structure and a sweeping robot with the same, which adopt the transceiver integrated chip design to realize zero blind area detection and accurately detect and analyze the material of the environment.
In view of the above, one or more embodiments of the present disclosure provide a transceiver-integrated chip structure, including a main body support, where the main body support has a front surface and a back surface opposite to each other, and the main body support is provided with a first opening and a second opening for determining a sound wave transmission field of view therethrough; the first MEMS chip and the second MEMS chip are arranged on the front surface of the main body support, the vibrating diaphragm of the first MEMS chip corresponds to the first opening, and the vibrating diaphragm of the second MEMS chip corresponds to the second opening.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the chip for transmitting signals and the chip for receiving signals are adopted, the packaging size is reduced, the consistency of equipment is improved, the transceiver signals adopt a horn type structure, zero blind area detection is realized, and the materials used in the environment are accurately fed back.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the first opening is of a cylindrical structure.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the first opening is one of a truncated cone-shaped structure and a truncated cone-like structure, and the inner diameter of one side of the first opening, which is close to the front surface of the main body support, is smaller than the inner diameter of one side of the first opening, which is close to the back surface of the main body support.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the second opening is of a cylindrical structure.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the second opening is in a truncated cone structure or a truncated cone-like structure, and the inner diameter of one side of the second opening, which is close to the front surface of the main body support, is smaller than the inner diameter of one side of the second opening, which is close to the back surface of the main body support.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the main body support is provided with the separation groove in a penetrating manner and is positioned between the first MEMS chip and the second MEMS chip, and the inside of the separation groove is provided with the first filler.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the main body support is provided with the separation opening in a penetrating manner and is positioned between the first MEMS chip and the second MEMS chip, and the inside of the separation opening is provided with the second filler.
The sweeping robot comprises the transceiver integrated chip structure.
The advantageous effects of the present utility model are described in detail below with reference to the embodiments of the present utility model and the accompanying drawings.
Drawings
For a clearer description of one or more embodiments of the present description or of the solutions of the prior art, the drawings that are necessary for the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only one or more embodiments of the present description, from which other drawings can be obtained, without inventive effort, for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a transceiver integrated chip structure according to an embodiment of the present utility model.
Fig. 2 is an exploded view of a transceiver integrated chip structure according to an embodiment of the present utility model.
Fig. 3 is a top view of a transceiver integrated chip structure according to an embodiment of the present utility model.
Fig. 4 is a bottom view of a transceiver integrated chip structure according to an embodiment of the utility model.
Fig. 5 is a cross-sectional view of the first opening of fig. 1 taken along the A-A plane.
Fig. 6 is a cross-sectional view of the second opening of fig. 1 taken along the A-A plane.
Fig. 7 is a schematic structural diagram of a transceiver integrated chip structure according to another embodiment of the present utility model.
Fig. 8 is a schematic structural view of the preferred embodiment in fig. 7.
Fig. 9 is a cross-sectional view of the transceiver integrated chip structure of fig. 8 along the X-X plane.
In the reference numerals: 1. a main body structure; 101. a first opening; 102a, separating grooves; 102b, a separation opening; 103. a second opening; 2a, a first filler; 2b, a second filler; 3. a first chip; 4. and a second chip.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made in detail to the following specific examples.
The transceiver-integrated chip structure in the embodiment of the present utility model is described below with reference to fig. 1 to 9.
Example 1
The transceiver integrated chip structure provided by the embodiment of the utility model comprises a main body bracket 1, a first MEMS chip 3 and a second MEMS chip 4, as shown in figures 1-4.
The main body bracket 1 has a front surface and a back surface opposite to each other, and the main body bracket 1 is provided with a first opening 101. Alternatively, the first opening 101 is a cylindrical structure, as shown in fig. 5 a. Optionally, the first opening 101 has a truncated cone structure, and an inner diameter of a side of the first opening 101 near the front surface of the main body bracket 1 is smaller than an inner diameter of a side near the back surface of the main body bracket 1, and an included angle between the bevel edge and the back surface of the bracket main body is 135 degrees or 150 degrees. As shown in fig. 5b and 5 c. Optionally, the first opening 101 has a truncated cone-like structure, and an inner diameter of a side of the first opening 101 near the front surface of the main body support 1 is smaller than an inner diameter of a side near the back surface of the main body support 1. The sidewall of the first opening 101 is curved, as shown in fig. 7, and the theoretical formula of the curve is s=s T e mx Wherein m is a meander constant, the smaller m is, the smaller the cross-sectional area of the horn 2 is, the lower the cut-off frequency fc is, S is the area of the first opening 101 on one side close to the back surface of the main body support 1, S T Is the area of one side of the first opening 101 near the front surface of the main body bracket 1, and S T Not greater than S as shown in fig. 5 d.
The main body bracket 1 is provided with a second opening 103. Optionally, the first opening 101 and the second opening 103 are symmetrically arranged. Alternatively, the second opening 103 may be a cylindrical structure, as shown in fig. 6 a. Optionally, the second opening 103 has a truncated cone structure, and an inner diameter of a side of the second opening 103 near the front surface of the main body support 1 is smaller than an inner diameter of a side near the back surface of the main body support 1, and an included angle between the bevel edge and the back surface of the main body of the support is 135 ° or 150 °, as shown in fig. 6b and fig. 6 c. Optionally, the second opening 103 has a truncated cone-like structure, and an inner diameter of a side of the second opening 103 near the front surface of the main body support 1 is smaller than an inner diameter of a side near the back surface of the main body support 1. The sidewall of the second opening 103 is curved, as shown in fig. 7, and the theoretical formula of the curve is s=s T e mx Where m is a meander constant, the smaller m is the smaller the rate of change of the cross-sectional area of the horn 2, the lower the cut-off frequency fc is, S is the area of the second opening 103 on the side close to the back of the body support 1, S T Is the area of one side of the second opening 103 close to the front surface of the main body bracket 1, and S T Not greater than S as shown in fig. 5 d.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the first opening 101 and the second opening 103 are adopted to form the horn, so that the horn is used for being matched with the MEMS chip to transmit and receive signals, the packaging size of equipment is reduced, and the consistency is high.
The first MEMS chip 3 is disposed on the main body support 1, the diaphragm of the first MEMS chip 3 corresponds to the position of the first opening 101, the first MEMS chip 3 cooperates with the first opening 101 for emitting a signal, and the first opening 101 is used for defining the field of view of the acoustic wave emitted by the first MEMS chip 3.
The second MEMS chip 4 is disposed on the main body support 1, the diaphragm of the second MEMS chip 4 corresponds to the position of the second opening 103, the second MEMS chip 4 cooperates with the second opening 103 for receiving signals, and the second opening 103 is for defining the field of view of the acoustic wave received by the second MEMS chip 4.
According to the transceiver integrated chip structure provided by the embodiment of the utility model, the zero blind area detection is realized by adopting a chip for transmitting signals and a chip for receiving signals.
Preferably, according to the transceiver integrated chip structure of the embodiment of the present utility model, the main body support 1 is provided with a separation groove 102a in a penetrating manner, the separation groove 102a is located between the first MEMS chip 3 and the second MEMS chip 4, and a first filler 2a is disposed inside the separation groove 102a and is used for separating the first MEMS chip 3 and the second MEMS chip 4, as shown in fig. 8 and fig. 9 a. Optionally, the main body support 1 is provided with a separation opening 102b in a penetrating manner, the separation opening 102b is located between the first MEMS chip 3 and the second MEMS chip 4, and a first filler 2b is disposed inside the separation opening 102b and is used for separating the first MEMS chip 3 and the second MEMS chip 4, as shown in fig. 8 and 9 b. Optionally, the first filler 2a and the second filler 2b are silica gel fillers, and are used for separating the first MEMS chip 3 and the second MEMS chip 4, so as to prevent adverse effects caused by vibration crossing.
Example 2
Unlike embodiment 1, according to the transceiver-integrated chip structure provided by the embodiment of the utility model, the first opening 101 is symmetrical along the A-A cross section, the first opening 101 is trapezoid along the A-A cross section, as shown in fig. 5B and 5c, the first opening 101 is trapezoid-like along the B2-B2 cross section, and the theoretical formula of the curve is the same as that of embodiment 2, as shown in fig. 5 d.
Example 3
Unlike embodiment 1, according to the transceiver-integrated chip structure provided by the embodiment of the utility model, the second opening 103 is symmetrical along the A-A cross section, and the second opening 103 is trapezoid along the A-A cross section, as shown in fig. 6B and fig. 6c, the second opening 103 is trapezoid-like along the B1-B1 cross section, and the theoretical formula of the curve is the same as that of embodiment 2, as shown in fig. 6 d.
Example 4
The sweeping robot comprises the transceiver integrated chip structure provided by the embodiment of the utility model.
The present disclosure is intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Any omissions, modifications, equivalents, improvements, and the like, which are within the spirit and principles of the one or more embodiments of the disclosure, are therefore intended to be included within the scope of the disclosure.
Claims (8)
1. A transceiver integrated chip structure, comprising:
the device comprises a main body support (1), wherein the main body support (1) is provided with a front surface and a back surface which are opposite, and the main body support (1) is provided with a first opening (101) and a second opening (103) which are used for determining the transmission view field of sound waves in a penetrating way;
the MEMS device comprises a main body support (1), a first MEMS chip (3) and a second MEMS chip (4), wherein the first MEMS chip (3) and the second MEMS chip (4) are arranged on the front surface of the main body support (1), the vibrating diaphragm of the first MEMS chip (3) corresponds to a first opening (101), and the vibrating diaphragm of the second MEMS chip (4) corresponds to a second opening (103).
2. The transceiver integrated chip structure of claim 1, wherein said first opening (101) is a cylindrical structure.
3. The transceiver integrated chip structure according to claim 1, wherein the first opening (101) is a truncated cone structure or a truncated cone-like structure, and an inner diameter of a side of the first opening (101) close to the front side of the main body support (1) is smaller than an inner diameter of a side close to the back side of the main body support (1).
4. The transceiver integrated chip structure according to claim 1, characterized in that the second opening (103) is a cylindrical structure.
5. The transceiver integrated chip structure according to claim 1, wherein the second opening (103) has a truncated cone structure or a truncated cone-like structure, and an inner diameter of a side of the second opening (103) close to the front surface of the main body support (1) is smaller than an inner diameter of a side close to the back surface of the main body support (1).
6. The transceiver integrated chip structure according to claim 1, wherein the main body support (1) is provided with a separation groove (102 a) in a penetrating manner, and is located between the first MEMS chip (3) and the second MEMS chip (4), and a first filler (2 a) is arranged inside the separation groove (102 a).
7. The integrated transceiver chip structure of claim 6, wherein the main body support (1) is provided with a separation opening (102 b) in a penetrating manner, and is located between the first MEMS chip (3) and the second MEMS chip (4), and a second filler (2 b) is arranged inside the separation opening (102 b).
8. A sweeping robot comprising the transceiver-integrated chip structure of any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320481100.5U CN219516122U (en) | 2023-03-09 | 2023-03-09 | Transmit-receive integrated chip structure and sweeping robot with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320481100.5U CN219516122U (en) | 2023-03-09 | 2023-03-09 | Transmit-receive integrated chip structure and sweeping robot with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219516122U true CN219516122U (en) | 2023-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320481100.5U Active CN219516122U (en) | 2023-03-09 | 2023-03-09 | Transmit-receive integrated chip structure and sweeping robot with same |
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| Country | Link |
|---|---|
| CN (1) | CN219516122U (en) |
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- 2023-03-09 CN CN202320481100.5U patent/CN219516122U/en active Active
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