CN219893680U - Radiator heat dissipation module of 5G communication equipment - Google Patents
Radiator heat dissipation module of 5G communication equipment Download PDFInfo
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- CN219893680U CN219893680U CN202320210732.8U CN202320210732U CN219893680U CN 219893680 U CN219893680 U CN 219893680U CN 202320210732 U CN202320210732 U CN 202320210732U CN 219893680 U CN219893680 U CN 219893680U
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- heat dissipation
- installation shell
- dissipation module
- shaped pipe
- cooling
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- 238000004891 communication Methods 0.000 title claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 239000007788 liquid Substances 0.000 claims abstract description 38
- 239000004065 semiconductor Substances 0.000 claims abstract description 10
- 238000009434 installation Methods 0.000 claims description 24
- 238000005057 refrigeration Methods 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 6
- 230000002035 prolonged effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation module of a 5G communication equipment radiator, which comprises a top cover, a mounting shell, U-shaped pipes and cooling tanks, wherein a time relay is arranged on one side of the mounting shell at equal intervals through screws, a semiconductor refrigerating sheet is arranged on one end of the mounting shell through the mounting groove, a temperature sensor is arranged on the other end of the mounting shell through the screws, the cooling tanks are arranged in the mounting shell at equal intervals, guide plates are welded on two sides of the inner wall of the cooling tank, the guide plates on two sides are arranged in a staggered mode, a small-sized liquid pump is arranged on one end in the bottom of the cooling tank through a mounting seat, and the U-shaped pipes penetrate through two ends of the bottom of the cooling tank. This novel heat dissipation module improves the heat dissipation rate under the prerequisite that improves 5G rack leakproofness, is fit for extensively using widely.
Description
Technical Field
The utility model relates to the technical field of heat dissipation modules, in particular to a heat dissipation module of a radiator of a 5G communication device.
Background
Generally, 5G communication equipment is composed of main equipment, electric power matched equipment, facilities, iron tower cabinets and the like, and BBUAAU transmission equipment and antennas are main equipment, wherein a radiator radiating module is required to be installed in a sealed cabinet, so that the radiating rate in the 5G communication cabinet is improved, and electronic element aging caused by high temperature is avoided.
Patent No. cn201410678866. X discloses an electronic component for heat dissipation, the heat dissipation module comprises a heat radiator and a plurality of heat pipes which are tightly attached to the electronic component, wherein the heat radiator and the heat pipes are both provided with cooling liquid, the heat dissipation module further comprises a fin group for accommodating the heat pipes, the fin group comprises a plurality of fins and an air deflector rotatably arranged on the fins, the fins are provided with a plurality of ventilation holes at the air deflector, when the cooling liquid absorbs heat generated by the electronic component and enters the fin group through the heat pipes, the air deflector can rotate to enable air flow to pass through the ventilation holes so that the air flow is in full contact with the heat pipes in the fins to accelerate cooling in the heat pipes.
The existing radiator heat dissipation module has the following defects: the heat dissipation rate cannot be increased on the premise of improving the tightness of the 5G cabinet. Therefore, we propose a heat dissipation module of a heat sink for a 5G communication device.
Disclosure of Invention
The utility model mainly aims to provide a heat dissipation module of a radiator of a 5G communication device, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a 5G communication equipment radiator heat dissipation module, includes top cap, installation shell, U-shaped pipe and cooling tank, time relay is installed through the screw equidistance to one side of installation shell, the semiconductor refrigeration piece is installed through the mounting tank to the one end of installation shell, temperature sensor is installed through the screw to the other end of installation shell, the equidistance is provided with the cooling tank in the installation shell, the welding of cooling tank inner wall both sides has the guide plate and the crisscross setting of guide plate of both sides, miniature drawing liquid pump is installed through the mount pad to bottom one end in the cooling tank, the U-shaped pipe has been run through at the bottom both ends of cooling tank.
Further, one end of the U-shaped pipe is higher than the inner bottom of the cooling tank, the liquid pumping end of the small liquid pumping pump is connected with the liquid outlet of the U-shaped pipe, the liquid inlet at the other end of the U-shaped pipe is flush with the inner bottom of the cooling tank, cooling liquid absorbing heat in the U-shaped pipe is pumped into the cooling tank, the flowing time is prolonged under the action of the guide plate, the cooling effect is improved, and the cooled liquid flows into the U-shaped pipe from the liquid inlet at one end of the U-shaped pipe.
Further, the detection end of the temperature sensor is positioned at the bottom of the installation shell, and the refrigeration end of the semiconductor refrigeration piece is positioned in the installation shell.
Furthermore, positioning plates are welded on two sides of the bottom of the installation shell, positioning bolts are installed on the positioning plates through bolt holes, the time relay is utilized to automatically control the small-sized liquid pump, and the small-sized liquid pump is automatically started after the set interval working time is reached.
Further, the top of the installation shell is provided with a top cover through a bolt, and the output end of the time relay is electrically connected with the input end of the miniature liquid pump through a wire.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the radiator heat radiation module of the 5G communication equipment, the radiator heat radiation module is conveniently installed at the top of the 5G communication cabinet by using the positioning bolts on the positioning plate, the U-shaped pipe is positioned in the 5G communication cabinet and positioned at the outer side of the electronic element, the semiconductor refrigerating sheet is started to cool the installation shell, the cooling liquid is stored in the U-shaped pipe, and the cooling liquid in the U-shaped pipe rapidly absorbs heat in the 5G communication cabinet.
2. According to the heat dissipation module of the 5G communication equipment radiator, the time relay is utilized to automatically control the small liquid pump, the small liquid pump is automatically started after the set interval working time is reached, cooling liquid absorbed in the U-shaped pipe is pumped into the cooling groove, the flowing time is prolonged under the action of the guide plate, the cooling effect is improved, the cooled liquid flows into the U-shaped pipe from the liquid inlet at one end of the U-shaped pipe, heat absorption is continued, and therefore the cooling liquid in the U-shaped pipe is recycled and is cooled continuously.
3. According to the heat dissipation module of the 5G communication equipment radiator, the heat dissipation rate is improved on the premise of improving the tightness of a 5G communication cabinet, the temperature value in the 5G communication equipment is conveniently detected by using the temperature sensor, when the value is large, the time relay is adjusted, the interval working time of a small-sized liquid pump is shortened, and the heat dissipation rate is improved.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a heat dissipation module of a heat sink for a 5G communication device according to the present utility model.
Fig. 2 is a schematic diagram of a temperature sensor of a heat dissipation module of a heat sink of a 5G communication device according to the present utility model.
Fig. 3 is a schematic diagram of an internal structure of a mounting case of a heat dissipation module of a heat sink for 5G communication equipment according to the present utility model.
In the figure: 1. a positioning plate; 2. positioning bolts; 3. a time relay; 4. a top cover; 5. a mounting shell; 6. a semiconductor refrigeration sheet; 7. a U-shaped tube; 8. a temperature sensor; 9. a deflector; 10. a small-sized liquid pump; 11. and a cooling tank.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
As shown in fig. 1-3, a heat dissipation module of a radiator of a 5G communication device comprises a top cover 4, a mounting shell 5, a U-shaped pipe 7 and a cooling groove 11, wherein a time relay 3 is installed on one side of the mounting shell 5 at equal intervals through a screw, a semiconductor refrigerating sheet 6 is installed on one end of the mounting shell 5 through the mounting groove, a temperature sensor 8 is installed on the other end of the mounting shell 5 through the screw, the cooling groove 11 is arranged in the mounting shell 5 at equal intervals, guide plates 9 are welded on two sides of the inner wall of the cooling groove 11 and are arranged in a staggered mode, a miniature liquid pump 10 is installed on one end of the bottom in the cooling groove 11 through a mounting seat, and the U-shaped pipe 7 penetrates through two ends of the bottom of the cooling groove 11.
Wherein, the liquid outlet of U-shaped pipe 7 is connected to the liquid drawing end of small-size drawing liquid pump 10 that just is higher than the interior bottom of cooling tank 11 to the one end of U-shaped pipe 7, the inlet of the other end of U-shaped pipe 7 flushes with the interior bottom of cooling tank 11.
In this embodiment, as shown in fig. 1 and 3, the cooling liquid absorbing heat in the U-shaped tube 7 is pumped into the cooling tank 11, and the flowing time is prolonged under the action of the deflector 9, so that the cooling effect is improved, and the cooled liquid flows into the U-shaped tube 7 from the liquid inlet at one end of the U-shaped tube 7.
Wherein, the detection end of temperature sensor 8 is located the bottom of installation shell 5, the refrigeration end of semiconductor refrigeration piece 6 is located installation shell 5.
Wherein, locating plate 1 is welded to the bottom both sides of installation shell 5 and locating bolt 2 is installed through the bolt hole on the locating plate 1.
In this embodiment, as shown in fig. 1, the positioning bolts 2 on the positioning plate 1 are used to facilitate the installation of the radiator module on the top of the 5G communication equipment.
The top of the installation shell 5 is provided with a top cover 4 through bolts, and the output end of the time relay 3 is electrically connected with the input end of the miniature liquid pump 10 through a wire.
In this embodiment, as shown in fig. 1 and 3, the time relay 3 is used to automatically control the small-sized liquid pump 10, and the small-sized liquid pump 10 is automatically started after a set interval of operation time is reached.
It should be noted that, the utility model is a radiator heat dissipation module of a 5G communication equipment, when in operation, the positioning bolt 2 on the positioning plate 1 is used for conveniently installing the radiator heat dissipation module at the top of the 5G communication cabinet, the U-shaped pipe 7 is positioned in the 5G communication cabinet and positioned at the outer side of an electronic element, the semiconductor refrigerating sheet 6 is started to cool the installation shell 5, the cooling liquid is stored in the U-shaped pipe 7, the cooling liquid in the U-shaped pipe 7 rapidly absorbs the heat in the 5G communication cabinet, the time relay 3 is used for automatically controlling the small-sized liquid pump 10, the small-sized liquid pump 10 is automatically started after the set interval working time is reached, the cooling liquid absorbed in the U-shaped pipe 7 is pumped into the cooling groove 11, the flowing time is prolonged under the action of the guide plate 9, the cooling effect is improved, the cooled liquid flows into the U-shaped pipe 7 from the liquid inlet at one end of the U-shaped pipe 7, the cooling effect is further improved, the cooling liquid in the U-shaped pipe 7 is enabled to be circularly used, the cooling is continuously carried out, the cooling is improved, the rate is improved on the premise of improving the tightness of the 5G communication cabinet, the temperature in the 5G communication cabinet is conveniently detected, the temperature in the 5G communication cabinet is conveniently, the small-sized liquid pump 10 is conveniently detected by the temperature sensor 8, the temperature in the working time relay is adjusted, the small-sized liquid pump 10 is used for adjusting the temperature value, and the heat dissipation time interval time is smaller than the value is adjusted.
The foregoing has shown and described the basic principles and features of the utility model and this practice
With the novel advantages. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a 5G communication equipment radiator heat dissipation module, includes top cap (4), installation shell (5), U-shaped pipe (7) and cooling tank (11), its characterized in that: time relay (3) are installed through the screw equidistance to one side of installation shell (5), semiconductor refrigeration piece (6) are installed through the mounting groove to the one end of installation shell (5), temperature sensor (8) are installed through the screw to the other end of installation shell (5), the equidistance is provided with cooling tank (11) in installation shell (5), welding of cooling tank (11) inner wall both sides has guide plate (9) and guide plate (9) of both sides crisscross setting, miniature drawing liquid pump (10) are installed through the mount pad to interior bottom one end of cooling tank (11), U-shaped pipe (7) are run through at the bottom both ends of cooling tank (11).
2. The heat dissipation module of a 5G communication device heat sink of claim 1, wherein: one end of the U-shaped pipe (7) is higher than the inner bottom of the cooling groove (11), the liquid pumping end of the small liquid pumping pump (10) is connected with the liquid outlet of the U-shaped pipe (7), and the liquid inlet at the other end of the U-shaped pipe (7) is flush with the inner bottom of the cooling groove (11).
3. The heat dissipation module of a 5G communication device heat sink of claim 1, wherein: the detection end of the temperature sensor (8) is positioned at the bottom of the installation shell (5), and the refrigeration end of the semiconductor refrigeration piece (6) is positioned in the installation shell (5).
4. The heat dissipation module of a 5G communication device heat sink of claim 1, wherein: positioning plates (1) are welded on two sides of the bottom of the mounting shell (5), and positioning bolts (2) are mounted on the positioning plates (1) through bolt holes.
5. The heat dissipation module of a 5G communication device heat sink of claim 1, wherein: the top of the installation shell (5) is provided with a top cover (4) through a bolt, and the output end of the time relay (3) is electrically connected with the input end of the miniature liquid pump (10) through a wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320210732.8U CN219893680U (en) | 2023-02-14 | 2023-02-14 | Radiator heat dissipation module of 5G communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320210732.8U CN219893680U (en) | 2023-02-14 | 2023-02-14 | Radiator heat dissipation module of 5G communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219893680U true CN219893680U (en) | 2023-10-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320210732.8U Active CN219893680U (en) | 2023-02-14 | 2023-02-14 | Radiator heat dissipation module of 5G communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219893680U (en) |
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2023
- 2023-02-14 CN CN202320210732.8U patent/CN219893680U/en active Active
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