CN219876226U - High-precision multi-layer circuit board with heat dissipation effect - Google Patents
High-precision multi-layer circuit board with heat dissipation effect Download PDFInfo
- Publication number
- CN219876226U CN219876226U CN202222932036.6U CN202222932036U CN219876226U CN 219876226 U CN219876226 U CN 219876226U CN 202222932036 U CN202222932036 U CN 202222932036U CN 219876226 U CN219876226 U CN 219876226U
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- China
- Prior art keywords
- circuit board
- rear plate
- plate
- mounting bracket
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 230000000694 effects Effects 0.000 title claims abstract description 18
- 238000009423 ventilation Methods 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims description 29
- 230000006978 adaptation Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000000428 dust Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, in particular to a high-precision multilayer circuit board with a heat dissipation effect. Including the base plate, the mounting bracket is all installed at base plate top both ends, be connected with the circuit board body between the mounting bracket, be connected with the front bezel between the mounting bracket, and a plurality of ventilation hole has all been seted up on front bezel and the mounting bracket, still be connected with the back plate between the mounting bracket, and back plate and front bezel are installed respectively on the front and back both ends top outer wall of base plate, be connected with radiator unit between the both sides inner wall of mounting bracket, radiator unit includes driving motor, driving motor installs on the outer wall of one of them mounting bracket, driving motor's output is connected with the drive shaft, rotate on the inner wall of another one mounting bracket and be connected with the universal driving shaft. The utility model can make the air at the circuit board form convection so as to accelerate the heat dissipation of the circuit board, thereby facilitating the subsequent normal use of the circuit board.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-precision multilayer circuit board with a heat dissipation effect.
Background
The high-precision multilayer circuit board is an electronic device. At present, in the use of high-accuracy multilayer circuit board, because install and be provided with a plurality of component on the circuit board, and the circuit board is when using and need the circular telegram operation, along with the increase of live time, the temperature on the circuit board also can take place the condition that rises thereupon, when the temperature is too high, then can influence the normal use of circuit board, and be provided with relevant heat radiation structure on the current circuit board again, long-time high temperature just realizes the heat dissipation through the strength of natural wind, the radiating effect is not good to just be unfavorable for the follow-up normal use of circuit board yet.
Therefore, it is necessary to provide a new high-precision multilayer circuit board with heat dissipation effect to solve the above technical problems.
Disclosure of Invention
In order to solve the technical problems, the utility model provides the high-precision multilayer circuit board with the heat dissipation effect, which can enable air at the circuit board to form convection so as to accelerate heat dissipation of the circuit board, thereby facilitating subsequent normal use of the circuit board.
The utility model provides a high-precision multilayer circuit board with a heat dissipation effect, which comprises a substrate, wherein mounting frames are arranged at two ends of the top of the substrate, slots are formed in one sides of the mounting frames, which are opposite to each other, a circuit board body is connected between the slots, and the high-precision multilayer circuit board further comprises:
the front plate is connected between the mounting frames, and a plurality of ventilation holes are formed in the front plate and the mounting frames;
the rear plate is also connected between the mounting frames, and the rear plate and the front plate are respectively arranged on the top outer walls of the front end and the rear end of the base plate;
the heat dissipation assembly is connected between the inner walls of the two sides of the mounting frame and comprises a driving motor, the driving motor is mounted on the outer wall of one of the mounting frames, the output end of the driving motor penetrates through the mounting frame and is connected with a driving shaft, the other mounting frame is rotatably connected with a linkage shaft on the inner wall of the mounting frame, and a plurality of fan blades are mounted on the outer annular surface of one end, opposite to the linkage shaft, of the driving shaft at equal intervals along the circumferential direction;
the cleaning assembly is connected with the heat dissipation assembly, and the cleaning assembly is connected with the rear plate.
Preferably, the driving gears are arranged on the outer annular surfaces of the opposite ends of the driving shaft and the linkage shaft, the mounting frames are also rotationally connected with the reciprocating screw rods, the outer annular surfaces of the two ends of the reciprocating screw rods are respectively provided with the driven gears, and the driven gears are respectively meshed with the two driving gears.
Preferably, the cleaning assembly comprises a linkage block, the linkage block is in threaded connection with an outer ring surface of the reciprocating screw, the linkage block is in sliding connection with an inner side wall of the rear plate, two connection blocks in mirror image distribution are installed on one side of the linkage block, two first movable grooves in mirror image distribution are formed in the inner side wall of the rear plate, a first movable block matched with the first movable groove is installed on one side of the connection block, facing the rear plate, of the connection block, and the first movable block is in sliding connection with the inner part of the first movable groove.
Preferably, the rear plate is located the position between two first movable grooves and has been seted up the through-hole, the link is installed towards one side in the rear plate to the linkage piece, the link runs through in the rear plate through the through-hole, just link and rear plate sliding connection, the second movable groove has been seted up on the upper end lateral wall of rear plate, the second movable block with second movable groove looks adaptation is installed towards one side in the rear plate to the upper end of link, just second movable block sliding connection is in the inside in second movable groove.
Preferably, the top of link is connected with the clearance board, just the clearance board is located the top of circuit board body to parallel with it, a plurality of brush is installed to the bottom of clearance board, just the brush contacts with the top outer wall of circuit board body.
Preferably, the slot is downwards communicated with the limiting sliding groove, limiting sliding plates matched with the limiting sliding groove are arranged at the bottoms of the two ends of the circuit board body, the limiting sliding plates are embedded in the limiting sliding groove, and a plurality of fixing bolts are connected between the limiting sliding plates and the mounting frame in a threaded mode.
Compared with the related art, the high-precision multilayer circuit board with the heat dissipation effect has the following beneficial effects:
(1) According to the high-precision multilayer circuit board with the heat dissipation effect, through the heat dissipation assembly, air at the circuit board can form convection, so that heat dissipation of the circuit board is accelerated, and the circuit board can be conveniently used normally in the follow-up process;
(2) The high-precision multilayer circuit board with the heat dissipation effect provided by the utility model has the advantages that the cleaning assembly connected with the heat dissipation assembly can be used for driving the cleaning assembly to clean the surface of the circuit board body while the heat dissipation assembly is used for dissipating heat of the circuit board body, so that the influence on the use of elements on the circuit board body caused by dust accumulation is prevented;
(3) According to the high-precision multilayer circuit board with the heat radiation effect, the heat radiation assembly is used for radiating the circuit board body, and meanwhile, the cleaning assembly can be synchronously driven to clean the dust on the surface of the circuit board body, so that the heat radiation and the cleaning can be simultaneously carried out, the consumption of electric energy is reduced, and the use cost is saved
(4) According to the high-precision multilayer circuit board with the heat dissipation effect, when the linkage block axially moves, the first moving block can slide in the first moving groove correspondingly, so that the stability of the linkage block in the moving process is guaranteed, when the linkage block moves, the connecting frame moves along with the linkage block, and the second moving block synchronously slides in the second moving groove, so that the stability of the linkage block in the moving process can be further guaranteed.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a preferred embodiment of a high-precision multi-layer circuit board with heat dissipation effect according to the present utility model;
FIG. 2 is a schematic view of a part of the structure of the present utility model;
FIG. 3 is a schematic view of the isometric structure of FIG. 2 illustrating the present utility model;
FIG. 4 is a schematic view of the connection between the driving gear and the driven gear according to the present utility model;
FIG. 5 is a schematic view of the structure of the joint of the linkage blocks of the present utility model;
fig. 6 is a schematic structural diagram of a circuit board body according to the present utility model.
Reference numerals in the drawings: 1. a substrate; 2. a mounting frame; 3. a vent hole; 4. a slot; 5. limiting sliding grooves; 6. a front plate; 7. a rear plate; 8. a first moving groove; 9. a through hole; 10. a second moving groove; 11. a driving motor; 12. a drive shaft; 13. a drive gear; 14. a fan blade; 15. a driven gear; 16. a reciprocating screw; 17. a linkage shaft; 18. a linkage block; 19. a connecting block; 20. a first moving block; 21. a connecting frame; 22. a second moving block; 23. a cleaning plate; 24. a brush; 25. a circuit board body; 26. a limit sliding plate; 27. and (5) fixing bolts.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Specific implementations of the utility model are described in detail below in connection with specific embodiments.
Referring to fig. 1 to 6, the high-precision multi-layer circuit board with heat dissipation effect provided by the embodiment of the utility model includes a substrate 1, mounting frames 2 are mounted at two ends of the top of the substrate 1, slots 4 are formed on opposite sides between the mounting frames 2, and a circuit board body 25 is connected between the slots 4, and the circuit board further includes:
the front plate 6 is connected between the mounting frames 2, and a plurality of ventilation holes 3 are formed in the front plate 6 and the mounting frames 2;
the rear plate 7 is also connected between the mounting frames 2, and the rear plate 7 and the front plate 6 are respectively arranged on the top outer walls of the front end and the rear end of the base plate 1;
the heat dissipation assembly is connected between the inner walls of the two sides of the mounting frames 2 and comprises a driving motor 11, the driving motor 11 is mounted on the outer wall of one of the mounting frames 2, the output end of the driving motor 11 penetrates through the mounting frames 2 and is connected with a driving shaft 12, the inner wall of the other mounting frame 2 is rotationally connected with a linkage shaft 17, and a plurality of fan blades 14 are mounted on the outer annular surface of one opposite end between the linkage shaft 17 and the driving shaft 12 at equal intervals along the circumferential direction;
the cleaning component is connected with the heat dissipation component, and the cleaning component is connected with the rear plate 7.
It should be noted that: according to the utility model, through the heat dissipation assembly, air at the circuit board can form convection, so that heat dissipation of the circuit board is accelerated, and the circuit board can be conveniently used normally in the follow-up process;
also to be described is: the cleaning assembly connected with the heat dissipation assembly can drive the cleaning assembly to clean the surface of the circuit board body 25 while the heat dissipation assembly dissipates heat to prevent dust accumulation and influence the use of elements on the circuit board body 25.
In the embodiment of the present utility model, referring to fig. 4, driving gears 13 are respectively mounted on outer annular surfaces of opposite ends of the driving shaft 12 and the linkage shaft 17, a reciprocating screw 16 is further rotatably connected between the mounting frames 2, driven gears 15 are respectively mounted on outer annular surfaces of both ends of the reciprocating screw 16, and the driven gears 15 are respectively engaged with the two driving gears 13.
It should be noted that: when the circuit board body 25 dissipates heat, the driving motor 11 can drive the driving shaft 12 to rotate, the fan blades 14 arranged on the outer ring surface of the driving shaft 12 can be synchronously driven to rotate while the driving shaft 12 rotates, surrounding air is formed into air flow, and the driving gear 13 is further arranged on the driving shaft 12, the reciprocating screw 16 is rotationally connected between the mounting frames 2, the driven gears 15 which are in meshed connection with the driving gear 13 are arranged on the outer ring surfaces at two ends of the reciprocating screw 16, when the driving gear 13 rotates along with the rotation of the driving shaft 12, one driven gear 15 can be driven to rotate under the meshed connection, the other driven gear 15 can be driven to rotate along with the reciprocating screw 16 while the driven gear 15 rotates, and the driving gear 13 is also arranged on the linkage shaft 17 and is in meshed connection with the driven gear 15, when the driven gear 15 rotates along with the rotation of the reciprocating screw 16, the driven gear 13 can be driven to rotate under the meshed connection, the two fan blades 14 arranged on the linkage shaft 17 can be driven to rotate along with the rotation of the linkage shaft 17, and the two fan blades 14 can be correspondingly arranged on the mounting frames 2, and the two fan blades can be correspondingly rotated, and the air flow can be accelerated, and the heat can be dissipated to the corresponding body 25 is formed.
In the embodiment of the present utility model, referring to fig. 2 and 5, the cleaning assembly includes a linkage block 18, the linkage block 18 is screwed on an outer ring surface of the reciprocating screw 16, the linkage block 18 is slidably connected on an inner side wall of the rear plate 7, two connection blocks 19 distributed in mirror image are installed on a side of the linkage block 18 facing the rear plate 7, two first movement grooves 8 distributed in mirror image are opened on an inner side wall of the rear plate 7, a first movement block 20 adapted to the first movement groove 8 is installed on a side of the connection block 19 facing the rear plate 7, and the first movement block 20 is slidably connected inside the first movement groove 8.
It should be noted that: when the reciprocating screw 16 rotates, the linkage block 18 is in threaded connection with the outer ring surface of the reciprocating screw 16, so when the reciprocating screw 16 rotates, the linkage block 18 moves correspondingly axially on the outer ring surface of the reciprocating screw 16 along with the rotation of the threads, the first moving block 20 is installed on the connecting block 19 due to the fact that the connecting block 19 is installed on the linkage block 18, the first moving groove 8 is formed in the inner side wall of the rear plate 7, the first moving block 20 is matched with the first moving groove 8 and is in sliding connection with the first moving groove 8, and when the linkage block 18 moves axially, the first moving block 20 slides correspondingly inside the first moving groove 8, so that the stability of the linkage block 18 in the moving process is guaranteed.
In the embodiment of the present utility model, referring to fig. 3 and 5, a through hole 9 is formed in the rear plate 7 at a position between the two first moving slots 8, a connecting frame 21 is mounted on a side of the linkage block 18 facing the rear plate 7, the connecting frame 21 penetrates the rear plate 7 through the through hole 9, the connecting frame 21 is slidably connected with the rear plate 7, a second moving slot 10 is formed on an outer side wall of an upper end portion of the rear plate 7, a second moving block 22 adapted to the second moving slot 10 is mounted on a side of an upper end portion of the connecting frame 21 facing the rear plate 7, and the second moving block 22 is slidably connected inside the second moving slot 10.
It should be noted that: since the linkage block 18 is further provided with the connecting frame 21, and the connecting frame 21 penetrates through the rear plate 7 and is slidably connected to the rear plate 7, the outer side wall of the upper end portion of the rear plate 7 is provided with the second moving groove 10, the upper end portion of the connecting frame 21 is provided with the second moving block 22 adapted to the second moving groove 10 towards one side of the rear plate 7, when the linkage block 18 moves, the connecting frame 21 moves along with the second moving block, and the synchronous second moving block 22 slides in the second moving groove 10, so that the stability of the linkage block 18 during movement is further ensured.
In the embodiment of the present utility model, referring to fig. 1 and 5, a cleaning plate 23 is connected to the top of the connecting frame 21, the cleaning plate 23 is located above and parallel to the circuit board body 25, a plurality of brushes 24 are installed at the bottom of the cleaning plate 23, and the brushes 24 are in contact with the top outer wall of the circuit board body 25.
It should be noted that: because the cleaning plate 23 is arranged at the top of the connecting frame 21, the plurality of brushes 24 are arranged at the bottom of the cleaning plate 23, and the brushes 24 are in contact with the outer surface of the top of the circuit board body 25, when the connecting frame 21 moves, the cleaning plate 23 correspondingly moves above the circuit board body 25, so that the brushes 24 are driven to sweep from the surface of the circuit board body 25, dust on the surface of the circuit board body 25 is cleaned, and the situation that the influence on elements is caused by excessive dust accumulation is avoided;
also to be described is: according to the utility model, the heat dissipation assembly is used for dissipating heat of the circuit board body 25, and meanwhile, the cleaning assembly can be synchronously driven to clean dust on the surface of the circuit board body 25, so that heat dissipation and cleaning can be simultaneously carried out, thereby reducing the consumption of electric energy and saving the use cost.
In the embodiment of the present utility model, referring to fig. 1 and 6, the slot 4 is provided with a limiting chute 5 in a downward communication manner, the bottoms of two ends of the circuit board body 25 are respectively provided with a limiting slide plate 26 adapted to the limiting chute 5, the limiting slide plates 26 are embedded in the limiting chute 5, and a plurality of fixing bolts 27 are connected between the limiting slide plates 26 and the mounting frame 2 in a threaded manner.
It should be noted that: when installing circuit board body 25, can make the both ends of circuit board body 25 align with slot 4, make spacing slide 26 and spacing spout 5 align in step, insert circuit board body 25 in the inside of slot 4, the inside of spacing spout 5 is slided to spacing slide 26 in step, realize dual connection, and on the basis of this connection, through the fixing bolt 27 that sets up, can make circuit board body 25 install more firmly between two mounting brackets 2 to can not take place the condition that drops easily when using, and then in order to follow-up use.
The working principle of the high-precision multilayer circuit board with the heat dissipation effect provided by the utility model is as follows: when the circuit board body 25 is installed, the two ends of the circuit board body 25 are aligned with the slots 4, the limiting slide plate 26 and the limiting slide groove 5 are aligned synchronously, the circuit board body 25 is inserted into the slots 4, the synchronous limiting slide plate 26 slides into the limiting slide groove 5 to realize double connection, and on the basis of the connection, the circuit board body 25 can be more firmly installed between the two installation racks 2 through the fixing bolts 27, so that the situation of falling off cannot easily occur during use, and the follow-up use is facilitated;
when the temperature on the circuit board body 25 is too high and heat dissipation is needed, the driving motor 11 can drive the driving shaft 12 to rotate, the fan blades 14 arranged on the outer ring surface of the driving shaft 12 can be synchronously driven to rotate while the driving shaft 12 rotates, surrounding air is formed into air flow, and because the driving shaft 12 is also provided with the driving gear 13, the mounting frames 2 are rotationally connected with the reciprocating screw 16, the outer ring surfaces at the two ends of the reciprocating screw 16 are respectively provided with the driven gears 15 which are in meshed connection with the driving gear 13, when the driving gear 13 rotates along with the rotation of the driving shaft 12, one driven gear 15 can be driven to rotate under the meshed connection, and the reciprocating screw 16 simultaneously rotates along with the driven gear 15, the other driven gear 15 also drives to rotate, and because the linkage shaft 17 is arranged on the inner side wall of the other mounting frame 2, and the linkage shaft 17 is also provided with the driving gear 13 and is in meshed connection with the driven gear 15, when the driven gear 15 rotates along with the rotation of the reciprocating screw 16, the driven gears 13 can be driven to rotate under the meshed connection, and the linkage shaft 17 can rotate along with the rotation of the corresponding fan blades 14, and the two fan blades 14 can be correspondingly arranged on the linkage shaft 2, and the two fan blades can be driven to rotate along with the linkage shaft rotation, and the rotation of the linkage frame 2 can be accelerated;
because the linkage block 18 is connected to the outer ring surface of the reciprocating screw 16 in a threaded manner, the linkage block 18 is provided with the connecting frame 21, the linkage block 18 and the connecting frame 21 are both connected to the rear plate 7 in a sliding manner, the top of the connecting frame 21 is provided with the cleaning plate 23, the bottom of the cleaning plate 23 is provided with the plurality of brushes 24, the brushes 24 are in contact with the outer surface of the top of the circuit board body 25, when the reciprocating screw 16 rotates, the linkage block 18 can correspondingly axially move on the outer ring surface of the reciprocating screw 16 and synchronously drive the connecting frame 21 to move, and when the connecting frame 21 moves, the cleaning plate 23 can correspondingly move above the circuit board body 25, so that the brushes 24 are driven to sweep the surface of the circuit board body 25, and dust on the surface of the circuit board body 25 is cleaned, so that the situation that the influence on elements caused by excessive dust accumulation is avoided.
The circuits and control involved in the present utility model are all of the prior art, and are not described in detail herein.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (3)
1. High-precision multilayer circuit board with radiating effect, a serial communication port, including base plate (1), mounting bracket (2) are all installed at base plate (1) top both ends, slot (4) have all been seted up to one side in opposite directions between mounting bracket (2), just be connected with circuit board body (25) between slot (4), still include:
the front plate (6), be connected with front plate (6) between mounting bracket (2), and a plurality of ventilation holes (3) have all been seted up on front plate (6) and mounting bracket (2);
the rear plate (7) is also connected between the mounting frames (2), and the rear plate (7) and the front plate (6) are respectively arranged on the top outer walls of the front end and the rear end of the base plate (1);
the cooling device comprises a cooling assembly, wherein the cooling assembly is connected between the inner walls of the two sides of a mounting frame (2), the cooling assembly comprises a driving motor (11), the driving motor (11) is mounted on the outer wall of one of the mounting frames (2), the output end of the driving motor (11) penetrates through the mounting frame (2) and is connected with a driving shaft (12), the other inner wall of the mounting frame (2) is rotationally connected with a linkage shaft (17), and a plurality of fan blades (14) are mounted on the outer annular surface of one end, opposite to the other end, of the linkage shaft (17) and the driving shaft (12) at equal intervals along the circumferential direction;
the cleaning component is connected with the radiating component and is connected with the rear plate (7);
a driving gear (13) is arranged on the outer annular surface at one end, opposite to the driving shaft (12), of the coupling shaft (17), a reciprocating screw (16) is further rotationally connected between the mounting frames (2), driven gears (15) are arranged on the outer annular surfaces at two ends of the reciprocating screw (16), and the driven gears (15) are respectively meshed and connected with the two driving gears (13);
the cleaning assembly comprises a linkage block (18), the linkage block (18) is in threaded connection with the outer ring surface of the reciprocating screw rod (16), the linkage block (18) is in sliding connection with the inner side wall of the rear plate (7), two connecting blocks (19) in mirror image distribution are arranged on one side, facing the rear plate (7), of the linkage block (18), two first moving grooves (8) in mirror image distribution are formed in the inner side wall of the rear plate (7), a first moving block (20) matched with the first moving grooves (8) is arranged on one side, facing the rear plate (7), of the connecting blocks (19), and the first moving block (20) is in sliding connection with the inner part of the first moving grooves (8);
the rear plate (7) is located the position between two first movable grooves (8) and has been seted up through hole (9), link (18) are installed link (21) towards one side in rear plate (7), link (21) run through in rear plate (7) through hole (9), just link (21) and rear plate (7) sliding connection, second movable groove (10) have been seted up on the upper end lateral wall of rear plate (7), link (21) upper end face in one side of rear plate (7) install second movable block (22) with second movable groove (10) looks adaptation, just second movable block (22) sliding connection is in the inside of second movable groove (10).
2. The high-precision multi-layer circuit board with the heat dissipation effect according to claim 1, wherein a cleaning plate (23) is connected to the top of the connecting frame (21), the cleaning plate (23) is located above and parallel to the circuit board body (25), a plurality of brushes (24) are installed at the bottom of the cleaning plate (23), and the brushes (24) are in contact with the top outer wall of the circuit board body (25).
3. The high-precision multilayer circuit board with the heat dissipation effect according to claim 1, wherein the slot (4) is downwards communicated with a limiting chute (5), limiting sliding plates (26) matched with the limiting chute (5) are respectively installed at the bottoms of two ends of the circuit board body (25), the limiting sliding plates (26) are embedded in the limiting chute (5), and a plurality of fixing bolts (27) are connected between the limiting sliding plates (26) and the mounting frame (2) in a threaded mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222932036.6U CN219876226U (en) | 2022-11-04 | 2022-11-04 | High-precision multi-layer circuit board with heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222932036.6U CN219876226U (en) | 2022-11-04 | 2022-11-04 | High-precision multi-layer circuit board with heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876226U true CN219876226U (en) | 2023-10-20 |
Family
ID=88330769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222932036.6U Active CN219876226U (en) | 2022-11-04 | 2022-11-04 | High-precision multi-layer circuit board with heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876226U (en) |
-
2022
- 2022-11-04 CN CN202222932036.6U patent/CN219876226U/en active Active
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