CN219875987U

CN219875987U - MIC seal assembly structure and electronic equipment

Info

Publication number: CN219875987U
Application number: CN202321024150.7U
Authority: CN
Inventors: 陈家冰; 刘紫云; 钟招伟
Original assignee: Shenzhen Fenda Technology Co Ltd
Current assignee: Shenzhen Fenda Technology Co Ltd
Priority date: 2023-04-28
Filing date: 2023-04-28
Publication date: 2023-10-20
Anticipated expiration: 2033-04-28

Abstract

The utility model discloses an MIC sealing assembly structure and electronic equipment, wherein the MIC sealing assembly structure comprises an MIC module, a shell and a pressing assembly, the MIC module comprises a PCB and a plurality of MICs, a plurality of MIC holes are formed in the PCB, and sealing rings fixed on the back surface of the PCB are arranged on the periphery of each MIC hole; the inner side wall of the shell is provided with a bearing part for bearing the PCB and a limiting part for limiting the PCB so that each pickup hole is communicated with each MIC in a one-to-one correspondence manner; the lamination assembly is used for laminating and locking the PCB and the shell, so that each sealing ring is extruded between the shell and the PCB, when the MIC module is combined with the shell, deviation of the MIC hole and the pickup hole on the shell can be effectively avoided, the pickup hole on the shell is effectively prevented from being blocked by the sealing ring attached to the MIC module, meanwhile, assembly is convenient, and production efficiency is improved.

Description

MIC seal assembly structure and electronic equipment

Technical Field

The utility model relates to the technical field of intelligent electronic products with MICs, in particular to a MIC sealing assembly structure and electronic equipment.

Background

With rapid development of technology, intelligent electronic devices such as sound equipment, mobile phones, tablet computers and the like usually have audio functions of voice recognition and man-machine conversation. In order to ensure the voice recognition quality of the electronic device, a good sealing effect on a Microphone (MIC) of the electronic device needs to be ensured. The MIC of some electronic devices needs to be fixed inside a shell of the electronic device, of course, a pickup hole is formed in a side wall of the shell, an MIC hole corresponding to the pickup hole is formed in a PCB (main board of the MIC), the MIC is fixed on the front face (back to one face of the pickup hole) of the PCB and electrically connected with the PCB, and the MIC is connected with the PCB to form an MIC module. In the prior art, when the MIC module is assembled with the housing, a sealing ring is generally attached to the back surface of the PCB and the sealing ring is enclosed around the periphery of the MIC hole, a silica gel sleeve for protecting the MIC is attached to the front surface of the PCB, and then the MIC module is fixed on the inner side wall of the housing by a plastic bracket and a screw, so that a sound pick-up hole on the housing is correspondingly communicated with the MIC hole and the sealing of the MIC is realized by the sealing ring and the silica gel sleeve, namely, the sealing ring and the silica gel sleeve are used for enabling the sound pick-up of the MIC to be only from the sound pick-up Kong Shequ so as to improve the voice recognition capability.

However, before the screw locks the MIC module with the housing, the MIC module floats on the housing to cause the MIC hole to be offset easily from the pickup hole on the housing, and if the MIC hole is offset from the MIC hole, the sealing ring may cause the pickup hole to be blocked to affect the pickup effect.

Disclosure of Invention

The utility model aims to at least solve one of the technical problems in the prior art, and provides an MIC sealing assembly structure and electronic equipment, which can facilitate the assembly between an MIC module and a shell, and can effectively avoid the deviation of an MIC hole and a pickup hole on the shell when the MIC module is assembled and connected with the shell, thereby effectively avoiding the blocking of the pickup hole on the shell by a sealing ring attached to the MIC module.

The utility model adopts the following technical scheme:

a MIC seal assembly structure comprising:

the MIC module comprises a PCB and a plurality of MICs, each MIC is fixed on the front surface of the PCB and is electrically connected with the PCB, a plurality of MIC holes are formed in the PCB, each MIC hole is communicated with each MIC, and a sealing ring fixed on the back surface of the PCB is arranged on the periphery of each MIC hole;

the shell is provided with a plurality of pickup holes penetrating through the inner side wall and the outer side wall of the shell, the inner side wall of the shell is provided with a bearing part and a limiting part, the bearing part is used for bearing the PCB, and the limiting part is used for limiting the PCB so that each pickup hole is communicated with each MIC hole in a one-to-one correspondence manner;

and the pressing assembly is used for pressing and locking the PCB and the shell so that each sealing ring is extruded between the shell and the PCB.

Further, the pressing assembly comprises a fixing support and a plurality of locking pieces, and the locking pieces are used for being sequentially connected to the fixing support, the PCB and the shell in a penetrating mode to press and lock the PCB and the shell.

Further, the bearing part is also used for bearing the fixed support.

Further, the supporting portion includes a plurality of first ribs disposed along a height direction of the housing and located below the sound pick-up hole.

Further, a step is arranged on the top end face of the first rib, the upper end face of the step is used for supporting the PCB, and the lower end face of the step is used for supporting the fixing support.

Further, a plurality of pickup holes form pickup hole group, spacing portion includes two respectively be located the relative both sides of pickup hole group and all follow the second rib that the direction of height of casing set up.

Further, the fixed support is a hardware support.

Further, a silica gel sleeve for protecting the MIC is also fixed on the front surface of the PCB.

The utility model also provides electronic equipment comprising the MIC sealing assembly structure.

Compared with the prior art, the MIC sealing assembly structure and the electronic equipment have the beneficial effects that:

1. when the MIC module is connected and assembled with the shell, the MIC module is supported by the supporting part on the inner side wall of the shell, the MIC module is limited by the limiting part on the inner side wall of the shell, all pickup holes on the shell are communicated with all MIC holes on the PCB in a one-to-one correspondence manner, and finally the PCB is pressed and locked with the shell through the pressing assembly, so that all sealing rings are pressed between the shell and the PCB, and the opposite end surfaces of all the sealing rings are respectively tightly attached to the inner side wall of the shell and the PCB.

2. When the MIC sealing assembly structure is used, the MIC module is positioned through the bearing part and the limiting part, so that the MIC module and the shell are pressed and locked by the pressing assembly conveniently, the MIC module and the shell are assembled conveniently, and the production efficiency is improved.

3. Due to the fact that the MIC sealing assembly structure is used in the electronic equipment, deviation of the MIC hole and the pickup hole on the shell can be effectively avoided when the MIC module of the electronic equipment is assembled and connected with the shell of the electronic equipment, and therefore the fact that the pickup hole on the shell is blocked by a sealing ring attached to the MIC module is effectively avoided, and the pickup effect of the electronic equipment is improved.

Drawings

FIG. 1 is a schematic cross-sectional view of a MIC seal assembly according to an embodiment of the present utility model;

FIG. 2 is an enlarged schematic view of the structure shown at A in FIG. 1;

FIG. 3 is a schematic view of a structure of a housing according to an embodiment of the present utility model;

FIG. 4 is an enlarged schematic view of the structure shown at B in FIG. 3;

fig. 5 is a schematic structural view of a MIC seal assembly structure according to an embodiment of the present utility model.

10, a shell; 101. a sound pick-up hole; 102. a first rib; 1021. a step; 103. second ribs; 20. a PCB board; 201. MIC wells; 21. MIC; 30. a fixed bracket; 31. a seal ring; 32. a silica gel sleeve; 33. a dust screen; 40. a net cover.

Detailed Description

The present utility model will be described with priority in the following description with reference to the drawings and the specific embodiments, and it should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "horizontal," "vertical," "top," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly, indirectly, through intermediaries, or in communication with each other. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1-5, a MIC seal assembly structure is shown in a preferred embodiment of the present utility model, which is used in electronic devices such as a mobile phone, a sound device, a tablet computer, a portable intelligent terminal, and a smart bracelet.

In this embodiment, the MIC seal assembly structure includes a MIC module, a case 10, and a press-fit assembly; the MIC module includes a PCB 20 and a plurality of MIC21, where the MIC21 of the embodiment is provided with two but not limited to two, each MIC21 is fixed on the front surface of the PCB 20 and electrically connected with the PCB 20, and the PCB 20 is provided with a plurality of MIC holes (sound transmission holes) 201, so that the number of MIC holes 201 of the embodiment corresponds to the number of MIC21, and of course, each MIC hole 201 is communicated with each MIC21, and the periphery of each MIC hole 201 is provided with a sealing ring 31 fixed on the back surface of the PCB 20. The casing 10 is provided with a plurality of pick-up holes 101 penetrating through the inner and outer side walls thereof, and in order to correspond to the number of MICs 21, the pick-up holes 101 of the embodiment are also provided with two, the inner side wall of the casing 10 is provided with a supporting part and a limiting part, the supporting part is used for supporting the PCB 20, and the limiting part is used for limiting the PCB 20 so that each pick-up hole 101 is communicated with each MIC hole 201 in a one-to-one correspondence. The pressing assembly is used for pressing and locking the PCB 20 and the housing 10, so that each sealing ring 31 is pressed between the housing 10 and the PCB 20. It can be seen that, when the MIC module is assembled with the casing 10, the MIC module is supported by the supporting portion on the inner side wall of the casing 10, the MIC module is limited by the limiting portion on the inner side wall of the casing 10, so that each pick-up hole 101 on the casing 10 is correspondingly communicated with each MIC hole 201 on the PCB board 20, and finally the PCB board 20 and the casing 10 are pressed and locked by the pressing assembly, so that each sealing ring 31 is pressed between the casing 10 and the PCB board 20, and opposite end surfaces of each sealing ring 31 are respectively tightly attached to the inner side wall of the casing 10 and the PCB board 20 to play a role in preventing air leakage, and therefore, the MIC21 sealing assembly structure of the embodiment can effectively avoid the MIC hole 201 from deviating from the pick-up hole 101 on the casing 10 when the MIC module is assembled with the casing 10, and effectively avoid the sealing ring 31 attached to the MIC module from blocking the pick-up hole 101 on the casing 10.

It is worth noting that, when the MIC21 seal assembly structure of this embodiment is used, because the MIC module is positioned through the bearing portion and the limiting portion, the pressing assembly is used for pressing and locking the MIC module and the shell 10, thereby achieving the effects of being convenient for assembling between the MIC module and the shell 10 and improving the production efficiency.

In this embodiment, the pressing assembly includes a fixing bracket 30 and a plurality of locking members, and the locking members of this embodiment include two locking members, which are screws, and each locking member is used to sequentially pass through the fixing bracket 30, the PCB 20 and the housing 10 to press and lock the PCB 20 and the housing 10. In order to avoid the fixing support 30 from crushing MIC21 elements on the PCB 20, a silicone sleeve 32 for protecting MIC21 is fixed on the front surface of the PCB 20, and of course, the number of the silicone sleeves 32 corresponds to the number of MIC21, and when the MIC module and the housing 10 are in a press-locking state, two opposite end surfaces of each silicone sleeve 32 are respectively and tightly attached to the front surface of the PCB 20 and the surface of the fixing support 30 facing the PCB 20. In addition, the silicone cover 32 also plays a role in sealing the MIC21, that is, by combining the sealing ring 31 and the silicone cover 32, pickup of the MIC21 can be only picked up from the pickup hole 101, so that the voice recognition capability of the MIC21 is improved.

In this embodiment, the fixing support 30 is a hardware support, so that the pressing force of the fixing support 30 to the PCB 20 can be improved, thereby further improving the sealing performance of each sealing ring 31.

In this embodiment, the supporting portion is further used for supporting the fixing support 30, so that the fixing support 30 and the housing 10 can be conveniently connected and fixed by the locking member, and the fixing support 30 can be conveniently locked on the housing 10, thereby achieving the effect of saving labor. Specifically, the supporting portion includes a plurality of first ribs 102 disposed along the height direction of the housing 10 and located below the pick-up hole 101, and the first ribs 102 of the present embodiment are not limited thereto. Of course, in other embodiments, the first ribs 102 may also be disposed along a horizontal direction, which is not limited herein; the top end face of the first rib 102 is provided with a step 1021, the upper end face of the step 1021 is used for supporting the PCB 20, and the lower end face of the step 1021 is used for supporting the fixing support 30, so that the purpose of supporting the PCB 20 and the fixing support 30 can be achieved through the supporting portion.

In this embodiment, two pick-up holes 101 are formed into a pick-up hole 101 group, and the limiting portion includes two second ribs 103 respectively located at two opposite sides of the pick-up hole 101 group and all set along the height direction of the housing 10, that is, the two second ribs 103 limit the left and right degrees of freedom of the PCB 20 in the horizontal direction, and combine the functions of the two first ribs 102 to support the PCB 20, so as to achieve the effect of positioning the MIC module, so that each MIC hole 201 on the PCB 20 is in one-to-one correspondence with each pick-up hole 101 on the housing 10, thereby avoiding each sealing ring 31 on the back of the PCB 20 from blocking each pick-up hole 101.

In this embodiment, each sealing ring 31 is embedded with a dust-proof net 33, and the dust-proof net 33 is embedded at one end of the sealing ring 31 close to the PCB 20, for preventing foreign matters and dust from entering the MIC21 element, so as to ensure that the sound quality of the MIC21 is not affected. Further, a mesh cover 40 for protecting the housing 10 is provided on the outer wall of the housing 10.

The utility model also provides an electronic device comprising the MIC21 sealing assembly structure, and the electronic device in the embodiment is an intelligent sound but is not limited to the intelligent sound. Because the electronic equipment uses the MIC21 sealing assembly structure, the MIC module of the electronic equipment and the shell 10 of the electronic equipment can effectively avoid the deviation of the MIC hole 201 and the pickup hole 101 on the shell 10 when being assembled and connected, thereby effectively avoiding the sealing ring 31 attached to the MIC module from blocking the pickup hole 101 on the shell 10 and improving the pickup effect of the electronic equipment.

The above embodiments are only preferred embodiments of the present utility model, and the scope of the present utility model is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present utility model are intended to be within the scope of the present utility model as claimed.

Claims

1. A MIC seal assembly structure, characterized by comprising:

2. The MIC seal assembly structure according to claim 1, wherein the press-fit assembly includes a fixing bracket and a plurality of locking members, the plurality of locking members being for press-fitting and locking the PCB with the housing by sequentially penetrating through the fixing bracket, the PCB and the housing.

3. The MIC seal assembly structure according to claim 2, wherein the bearing portion is further for bearing the fixing bracket.

4. The MIC seal assembly structure according to claim 3, wherein the bearing portion includes a plurality of first ribs disposed in a height direction of the housing and located below the sound pick-up hole.

5. The MIC seal assembly structure according to claim 4, wherein a step is provided on a top end surface of the first rib, an upper end surface of the step is used for supporting the PCB, and a lower end surface of the step is used for supporting the fixing bracket.

6. The MIC seal assembly structure according to claim 1, wherein a plurality of the sound pickup holes are formed as a sound pickup hole group, and the limiting portion includes two second ribs which are respectively located at opposite sides of the sound pickup hole group and are each provided along a height direction of the housing.

7. The MIC seal assembly structure according to claim 2, wherein the fixing bracket is a hardware bracket.

8. The MIC seal assembly structure according to claim 1, wherein a silicone sleeve for protecting the MIC is further fixed on the front surface of the PCB.

9. An electronic device comprising the MIC seal assembly structure according to any one of claims 1 to 8.