CN219874138U - Conductive terminal and wearable equipment - Google Patents
Conductive terminal and wearable equipment Download PDFInfo
- Publication number
- CN219874138U CN219874138U CN202320604338.2U CN202320604338U CN219874138U CN 219874138 U CN219874138 U CN 219874138U CN 202320604338 U CN202320604338 U CN 202320604338U CN 219874138 U CN219874138 U CN 219874138U
- Authority
- CN
- China
- Prior art keywords
- layer
- corrosion
- conductive terminal
- resistant
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010410 layer Substances 0.000 claims abstract description 276
- 238000007747 plating Methods 0.000 claims abstract description 142
- 238000005260 corrosion Methods 0.000 claims abstract description 131
- 230000007797 corrosion Effects 0.000 claims abstract description 131
- 239000000758 substrate Substances 0.000 claims abstract description 71
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910001252 Pd alloy Inorganic materials 0.000 claims abstract description 38
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 29
- 239000011247 coating layer Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims description 69
- 239000011248 coating agent Substances 0.000 claims description 65
- 230000007704 transition Effects 0.000 claims description 29
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 22
- 229910052697 platinum Inorganic materials 0.000 claims description 11
- 229910001020 Au alloy Inorganic materials 0.000 claims description 6
- 239000003353 gold alloy Substances 0.000 claims description 6
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 claims description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910000531 Co alloy Inorganic materials 0.000 claims description 3
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 239000000956 alloy Substances 0.000 abstract description 5
- 238000002425 crystallisation Methods 0.000 abstract description 5
- 230000008025 crystallization Effects 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 229910052759 nickel Inorganic materials 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000566 Platinum-iridium alloy Inorganic materials 0.000 description 2
- 229910000929 Ru alloy Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- CFQCIHVMOFOCGH-UHFFFAOYSA-N platinum ruthenium Chemical compound [Ru].[Pt] CFQCIHVMOFOCGH-UHFFFAOYSA-N 0.000 description 2
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical class [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 2
- 230000003405 preventing effect Effects 0.000 description 2
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 208000026935 allergic disease Diseases 0.000 description 1
- 230000007815 allergy Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PCLURTMBFDTLSK-UHFFFAOYSA-N nickel platinum Chemical compound [Ni].[Pt] PCLURTMBFDTLSK-UHFFFAOYSA-N 0.000 description 1
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The disclosure relates to a conductive terminal and wearable equipment, relates to electronic equipment technical field, and the conductive terminal includes: a terminal body; the substrate layer covers the surface of the terminal body and comprises a palladium plating layer and/or a palladium alloy plating layer; at least one corrosion-resistant coating layer covering the substrate layer. According to the conductive terminal, the palladium plating layer and/or the palladium alloy plating layer are arranged on the terminal body to serve as the substrate layer, the palladium material and the palladium alloy material have good corrosion resistance, and the palladium plating layer and/or the palladium alloy plating layer is high in crystallization density and good in flatness, so that the corrosion-resistant plating layer arranged on the substrate layer is low in porosity, the compactness of the corrosion-resistant plating layer is improved, the terminal body is prevented from being corroded by the environment, the corrosion-resistant effect of the conductive terminal is improved, the requirement of the market on the conductive terminal is met, and the market competitiveness of a product is improved.
Description
Technical Field
The disclosure relates to the technical field of electronic equipment, in particular to a conductive terminal and wearable equipment.
Background
The connector terminal has a function of charging an electronic device or transmitting a data signal, and there is a risk of corrosion of the connector terminal when the connector terminal is in a severe environment such as a humid environment, an acidic environment, or an alkaline environment.
In the related art, the connector terminals are prevented from being corroded by plating the surfaces of the connector terminals with rhodium ruthenium plating or platinum plating, but the corrosion preventing effect of the rhodium ruthenium plating or the platinum plating is poor. The formation of a nickel-containing plating layer on the surface of a connector terminal also makes it possible to prevent corrosion, but nickel is a sensitized metal, and the market is very strict in terms of nickel release, so that development of a nickel-free plating layer having a low cost and a high corrosion preventing effect is urgent.
Disclosure of Invention
To overcome the problems in the related art, the present disclosure provides a conductive terminal and a wearable device.
A first aspect of the present disclosure proposes a conductive terminal comprising:
a terminal body;
a substrate layer covering the surface of the terminal body, the substrate layer including a palladium plating layer and/or a palladium alloy plating layer;
at least one corrosion-resistant coating layer covering the substrate layer.
Optionally, the palladium alloy plating layer comprises a gold palladium alloy plating layer and/or a silver palladium alloy plating layer.
Optionally, the substrate layer has a thickness of 5 microinches to 20 microinches.
Optionally, the at least one corrosion-resistant coating comprises a first corrosion-resistant coating and a second corrosion-resistant coating that are stacked, the first corrosion-resistant coating comprising a platinum coating and the second corrosion-resistant coating comprising a platinum alloy coating.
Optionally, the first corrosion-resistant coating has a thickness of 5 microinches to 20 microinches; and/or the number of the groups of groups,
the second corrosion-resistant coating has a thickness of 5 micro-inches to 20 micro-inches.
Optionally, the conductive terminal further includes:
and a transition layer arranged between the at least one corrosion-resistant coating and the substrate layer and/or between adjacent corrosion-resistant coatings.
Optionally, the transition layer comprises a gold layer and/or a gold alloy layer.
Optionally, the gold alloy layer comprises a gold cobalt alloy layer and/or a gold silver alloy layer.
Optionally, the terminal body is a copper alloy terminal or a stainless steel terminal.
A second aspect of the present disclosure proposes a wearable device comprising a conductive terminal according to the first aspect of the present disclosure.
The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: according to the utility model, the palladium plating layer and/or the palladium alloy plating layer are arranged on the terminal body as the substrate layer, the palladium material and the palladium alloy material have good corrosion resistance, and the palladium plating layer and/or the palladium alloy plating layer has high crystallization density and good flatness, so that the corrosion-resistant plating layer arranged on the substrate layer has low porosity, the compactness of the corrosion-resistant plating layer is further improved, the terminal body is prevented from being corroded by the environment, the corrosion-resistant effect of the conductive terminal is improved, the requirements of the market on the conductive terminal are met, and the market competitiveness of the product is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
Fig. 1 is a schematic diagram of a conductive terminal shown according to an exemplary embodiment.
Fig. 2 is a schematic diagram of a conductive terminal shown according to an exemplary embodiment.
Fig. 3 is a schematic diagram of a conductive terminal shown according to an exemplary embodiment.
Fig. 4 is a schematic diagram of a conductive terminal shown according to an exemplary embodiment.
Fig. 5 is a schematic diagram of a conductive terminal shown according to an exemplary embodiment.
Fig. 6 is a schematic diagram of a conductive terminal shown according to an exemplary embodiment.
Fig. 7 is a schematic diagram of a conductive terminal shown according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the utility model. Rather, they are merely examples of apparatus and methods consistent with aspects of the utility model as detailed in the accompanying claims.
In the related art, the connector terminal is prevented from being corroded by plating the surface of the connector terminal with a rhodium ruthenium plating layer or a platinum plating layer, but the density of the rhodium ruthenium plating layer or the platinum plating layer is low, resulting in a high porosity of the corrosion-preventing plating layer thereon, and poor corrosion-preventing effect. The formation of a nickel-containing plating layer on the surface of the connector terminal also produces a good corrosion-preventing effect, but nickel is the most common sensitization metal, and the market is very demanding for the release of nickel, so it is urgent to develop a nickel-free plating layer with low cost and high corrosion-preventing effect.
To solve the above technical problems, the present disclosure provides a conductive terminal, which includes a terminal body, a substrate layer and at least one corrosion-resistant plating layer, the substrate layer covers a surface of the terminal body, the substrate layer includes a palladium plating layer and/or a palladium alloy plating layer, and the corrosion-resistant plating layer covers the substrate layer. According to the conductive terminal, the palladium plating layer and/or the palladium alloy plating layer are arranged on the terminal body of the conductive terminal to serve as the substrate layer, the palladium material and the palladium alloy material have good corrosion resistance, and the palladium plating layer and/or the palladium alloy plating layer are high in crystallization density and good in flatness, so that the corrosion-resistant plating layer arranged on the substrate layer is low in porosity, the compactness of the corrosion-resistant plating layer is improved, the terminal body is prevented from being corroded by the environment, the corrosion-resistant effect of the conductive terminal is improved, the requirements of markets on the conductive terminal are met, and the market competitiveness of products is improved.
The following detailed description of the technical solutions of the present disclosure is given with reference to the accompanying drawings, and the features in the following examples and embodiments may be combined with each other without conflict.
According to an exemplary embodiment of the present disclosure, a conductive terminal is provided, and the conductive terminal of the present embodiment is applied to an electronic device, for example, an electronic device that is easy to contact a corrosive environment, such as a mobile phone, a tablet computer, or a wearable electronic device, where the wearable electronic device may be a smart watch, a smart bracelet, or a smart earphone. When the connector terminal of the embodiment is applied to the wearable electronic device, the connector terminal may be an earphone charging seat of an intelligent earphone, a charging terminal of an intelligent watch, a pogo pin (spring pin) on an intelligent bracelet, a charging spring piece, a charging solid pin, and the like.
As shown in fig. 1, the conductive terminal of the present embodiment includes a terminal body 1, a substrate layer 2, and at least one corrosion-resistant plating layer 3, wherein the terminal body 1 has a function of charging an electronic device or transmitting a data signal, and the terminal body 1 may be a copper alloy terminal or a stainless steel terminal. The substrate layer 2 covers the surface of the terminal body 1 and is used for protecting the terminal body 1, the terminal body 1 is prevented from being worn in the application process, the terminal body 1 data transmission or conduction function is favorably maintained, the substrate layer 2 comprises a palladium coating and/or a palladium alloy coating, the palladium coating and/or the palladium alloy coating has good corrosion resistance, the palladium coating and/or the palladium alloy coating is high in crystallization density, palladium flatness is good, the corrosion-resistant coating arranged on the substrate layer is low in porosity, the compactness of the corrosion-resistant coating is further improved, the terminal body is prevented from being corroded by the environment, the corrosion-resistant effect of the conductive terminal is improved, the requirements of the market on the conductive terminal are met, meanwhile, palladium materials and/or palladium alloy materials in the substrate layer 2 are low in price relative to rhodium ruthenium coating or platinum coating materials, the production cost of the conductive terminal is reduced, and the market competitiveness of products is improved.
The substrate layer 2 comprises a palladium plating and/or a palladium alloy plating. The number of layers of the substrate layer 2 is not limited in this embodiment, for example, as shown in fig. 1, the substrate layer 2 may be a single-layer structure, and the substrate layer 2 includes a palladium plating layer or a palladium alloy plating layer, and the palladium alloy plating layer includes a gold palladium alloy plating layer and/or a silver palladium alloy plating layer. Alternatively, the substrate layer 2 may be a double-layer or multi-layer structure, and as shown in fig. 2, the substrate layer 2 may include a first layer 21 and a second layer 22 that are stacked on the surface of the terminal body 1, the first layer 21 being a palladium plating layer, and the second layer 22 being a palladium alloy plating layer. The palladium plating layer is a pure palladium plating layer, and the palladium alloy plating layer comprises a gold palladium alloy plating layer or a silver palladium alloy plating layer. The substrate layer 2 containing palladium material is used for replacing rhodium ruthenium plating, platinum plating or nickel plating, so that the cost price of the conductive terminal is reduced, meanwhile, the conductive terminal does not contain nickel components, the conductive terminal can not release nickel in the use process so as to cause allergy to users, and the requirements of the market on the conductive terminal are met.
In this embodiment, the thickness of the substrate layer 2 is 5 micro inches to 20 micro inches. When the substrate layer 2 is a double-layer or multi-layer structure, the thickness of each layer of the substrate layer 2 may be equal, for example, the substrate layer 2 includes a first layer 21 and a second layer 22 stacked on the surface of the conductive terminal, the first layer 21 is a palladium plating layer, the second layer 22 is a palladium alloy plating layer, and the thickness of the first layer 21 and the thickness of the second layer 22 are both 10 micro inches. Or, the thickness of each layer structure of the substrate layer 2 may be unequal, for example, the thickness of the first layer 21 of the substrate layer 2 may be greater than the thickness of the second layer 22, the thickness of the first layer 21 is 15 micro inches, and the thickness of the second layer 22 is 5 micro inches, so that the corrosion resistance of the conductive terminal can be improved on the premise of not increasing the total thickness of the substrate layer 2, the thickness of the second layer 22 in the substrate layer 2 is reduced, that is, the thickness of the palladium alloy plating layer of the substrate layer 2 is reduced, the cost of the conductive terminal can be further reduced, and the cost performance of the conductive terminal is improved.
As shown in fig. 1 and 2, at least one corrosion-resistant plating layer 3 of the present embodiment includes a first corrosion-resistant plating layer 31 and a second corrosion-resistant plating layer 32 that are stacked. And a first corrosion-resistant coating 31 and a second corrosion-resistant coating 32 are laminated on the substrate layer 2, and are used for protecting the substrate layer 2 and improving the corrosion resistance of the conductive terminal. In some examples, the first corrosion-resistant coating 31 comprises a platinum coating and the second corrosion-resistant coating 32 comprises a platinum alloy coating. In other examples, the first corrosion-resistant coating 31 comprises a platinum alloy coating and the second corrosion-resistant coating 32 comprises a platinum coating.
The first corrosion-resistant coating 31 is disposed on a side of the substrate layer 2 away from the terminal body 1, that is, the first corrosion-resistant coating 31 is disposed above the substrate layer 2, and the first corrosion-resistant coating 31 is used for blocking corrosion of the substrate layer 2 by external environment, so as to further protect the terminal body 1. Meanwhile, the first corrosion-resistant plating layer 31 can also avoid the problem that the surface of the conductive terminal is yellow due to the ion electrolysis in the environment when the terminal body 1 is in a severe environment (such as a humid environment, an acidic environment or an alkaline environment) and the environment is contacted.
In some examples, as shown in fig. 1 and 2, the conductive terminal may include only one first corrosion-resistant plating layer 31. In other examples, the conductive terminal may include multiple layers of the first corrosion-resistant plating layer 31, where the first corrosion-resistant plating layer 31 is a platinum plating layer, and other plating layers are disposed between adjacent first corrosion-resistant plating layers 31. The other coating may be a transition layer 4. As shown in fig. 3, the conductive terminal includes two first corrosion-resistant plating layers 31, and the two first corrosion-resistant plating layers 31 are bonded together by the transition layer 4.
As shown in fig. 1 and 2, the second corrosion-resistant plating layer 32 is disposed on a side of the first corrosion-resistant plating layer 31 away from the substrate layer 2, that is, the second corrosion-resistant plating layer 32 is disposed above the first corrosion-resistant plating layer 31, and the second corrosion-resistant plating layer 32 includes a platinum alloy plating layer, which may include at least one of a platinum ruthenium alloy plating layer, a platinum iridium alloy plating layer, a platinum rhodium alloy plating layer, or a platinum nickel alloy plating layer. The second corrosion-resistant plating layer 32 is used for blocking the corrosion of the external environment to the first corrosion-resistant plating layer 31, and further protecting the terminal body 1. Meanwhile, the second corrosion-resistant coating 32 is higher in hardness and good in wear resistance, the second corrosion-resistant coating 32 can also prevent the conductive terminal from being damaged by friction in the use process, the data transmission or conductive function of the terminal body 1 can be maintained, and the service life of the conductive terminal can be prolonged.
In some examples, as shown in fig. 1, 2, the conductive terminal may include only one layer of the second corrosion-resistant plating 32. In other examples, the conductive terminal may include multiple layers of the second corrosion-resistant plating 32, adjacent two layers of the second corrosion-resistant plating 32 may be directly bonded together, or other plating may be disposed between adjacent two layers of the second corrosion-resistant plating 32. The other coating may be a transition layer 4. For example, as shown in fig. 4, the second corrosion-resistant plating layer 32 is located to include a platinum-ruthenium alloy plating layer and a platinum-iridium alloy plating layer that are sequentially stacked and disposed above the first corrosion-resistant plating layer 31.
In this embodiment, the thickness of the first corrosion-resistant coating 31 is 5 micro inches to 20 micro inches. The second corrosion-resistant coating 32 has a thickness of 5 microinches to 20 microinches.
In some examples, the thickness of the first corrosion-resistant coating 31 and the thickness of the second corrosion-resistant coating 32 are equal. For example, the thickness of the first corrosion-resistant coating 31 and the thickness of the second corrosion-resistant coating 32 are each 20 micro inches. When the conductive terminal includes a plurality of first corrosion-resistant plating layers 31, the thickness of each first corrosion-resistant plating layer 31 may be the same or may be different, for example, each first corrosion-resistant plating layer 31 may have a thickness of 10 micro inches. When the conductive terminal includes multiple layers of the second corrosion-resistant plating layers 32, the thickness of each layer of the second corrosion-resistant plating layers 32 may be the same or different, for example, the conductive terminal includes two layers of the second corrosion-resistant plating layers 32, and each layer of the second corrosion-resistant plating layers 32 has a thickness of 10 microinches, so that the corrosion resistance of the conductive terminal can be improved without increasing the total thickness of the second corrosion-resistant plating layers 32.
The first corrosion-resistant coating 31 may be provided directly on the substrate layer 2, or another coating may be provided between the first corrosion-resistant coating 31 and the substrate layer 2. The other coating may be a transition layer 4.
The second corrosion-resistant coating 32 may be provided directly on the substrate layer 2, or another coating may be provided between the second corrosion-resistant coating 32 and the first corrosion-resistant coating 31. Where the second corrosion-resistant coating 32 includes a multi-layer structure, other coatings may be disposed between adjacent two of the second corrosion-resistant coating 32. The other coating may be a transition layer 4.
When the substrate layer 2 has a double-layer or multi-layer structure, other plating layers may be disposed between two adjacent layers of the substrate layer 2. The other coating may be a transition layer 4.
According to an exemplary embodiment of the present disclosure, the conductive terminal of the present embodiment includes a terminal body 1, a substrate layer 2, and at least one corrosion-resistant plating layer 3 (refer to fig. 1), the terminal body 1 may be a copper alloy terminal or a stainless steel terminal, and the substrate layer 2 includes a palladium plating layer and/or a palladium alloy plating layer. The conductive terminal of the present embodiment further comprises a transition layer 4, the transition layer 4 being arranged between at least one corrosion-resistant coating 3 and the substrate layer 2 and/or between adjacent corrosion-resistant coatings 3. The transition layer 4 comprises a gold layer and/or a gold alloy layer, wherein the gold alloy layer comprises a gold cobalt alloy layer and/or a gold silver alloy layer.
In one example, as shown in fig. 5, a transition layer 4 is disposed between the first corrosion-resistant plating layer 31 and the substrate layer 2, the transition layer 4 having a thickness of 1 micro-inch to 10 micro-inches, and the transition layer 4 being used to enhance the bonding force between the corrosion-resistant plating layer 3 and the substrate layer 2.
As shown in fig. 5, the conductive terminal comprises two substrate layers 2, and when the bonding force of the two substrate layers 2 is weak, a transition layer 4 is arranged between the two substrate layers 2, and the thickness of the transition layer 4 is 1 micro-inch to 10 micro-inches, so that the bonding force of adjacent layers in the substrate layers 2 is enhanced. It will be appreciated that the transition layer 4 may not be provided between adjacent layers in the substrate layer 2 when the bonding force of adjacent layers in the substrate layer 2 is strong.
In an example, as shown in fig. 6, a transition layer 4 is provided between the first corrosion-resistant plating layer 31 and the second corrosion-resistant plating layer 32, and the transition layer 4 serves to enhance the bonding force between the first corrosion-resistant plating layer 31 and the second corrosion-resistant plating layer 32. The conductive terminal comprises two layers of second corrosion-resistant plating layers 32, and when the bonding force between the second corrosion-resistant plating layers 32 is weak, a transition layer 4 can be arranged between the second corrosion-resistant plating layers 32, and the thickness of the transition layer 4 is 1 micro-inch to 10 micro-inches for enhancing the bonding force between the second corrosion-resistant plating layers 32. It is understood that the transition layer 4 may not be provided between the second corrosion-resistant plating layers 32 when the bonding force between the second corrosion-resistant plating layers 32 is strong.
In one example, as shown in fig. 7, a transition layer 4 is disposed between the first corrosion-resistant plating layer 31 and the substrate layer 2, and a transition layer 4 is disposed between the first corrosion-resistant plating layer 31 and the second corrosion-resistant plating layer 32. The conductive terminal comprises two substrate layers 2, a transition layer 4 is arranged between the two substrate layers 2, two first corrosion-resistant plating layers 31 are arranged on the substrate layers 2, the transition layer 4 is arranged between the two first corrosion-resistant plating layers 33, two second corrosion-resistant plating layers 32 are arranged on the first corrosion-resistant plating layers 31, and the transition layer 4 is arranged between the two second corrosion-resistant plating layers 32.
According to an exemplary embodiment, a wearable device is provided, the wearable device comprising the conductive terminal of any of the embodiments described above. The wearable electronic device of the embodiment includes a smart watch, a smart bracelet, a smart earphone, or the like. The substrate layer of the conductive terminal of the wearable electronic device of the embodiment comprises a palladium plating layer and/or a palladium alloy plating layer, the palladium material and the palladium alloy material have good corrosion resistance, and the palladium plating layer and/or the palladium alloy plating layer are high in crystallization density and good in flatness, so that the corrosion-resistant plating layer arranged on the substrate layer is low in porosity, the compactness of the corrosion-resistant plating layer is improved, the terminal body is prevented from being corroded by the environment, the corrosion-resistant effect of the conductive terminal is improved, the requirements of the market on the conductive terminal are met, and the market competitiveness of a product is improved.
Other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.
It is to be understood that the utility model is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.
Claims (10)
1. A conductive terminal, comprising:
a terminal body;
a substrate layer covering the surface of the terminal body, the substrate layer including a palladium plating layer and/or a palladium alloy plating layer;
at least one corrosion-resistant coating layer covering the substrate layer.
2. The conductive terminal of claim 1, wherein the palladium alloy plating layer comprises a gold palladium alloy plating layer and/or a silver palladium alloy plating layer.
3. The conductive terminal of claim 1, wherein the substrate layer has a thickness of 5 microinches to 20 microinches.
4. The conductive terminal of claim 1, wherein the at least one corrosion-resistant coating comprises a first corrosion-resistant coating and a second corrosion-resistant coating in a stacked arrangement, the first corrosion-resistant coating comprising a platinum coating and the second corrosion-resistant coating comprising a platinum alloy coating.
5. The conductive terminal of claim 4, wherein the first corrosion-resistant plating has a thickness of 5 microinches to 20 microinches; and/or the number of the groups of groups,
the second corrosion-resistant coating has a thickness of 5 micro-inches to 20 micro-inches.
6. The conductive terminal according to any one of claims 1 to 5, further comprising:
and a transition layer arranged between the at least one corrosion-resistant coating and the substrate layer and/or between adjacent corrosion-resistant coatings.
7. The conductive terminal of claim 6, wherein the transition layer comprises a gold layer and/or a gold alloy layer.
8. The conductive terminal of claim 7, wherein the gold alloy layer comprises a gold-cobalt alloy layer and/or a gold-silver alloy layer.
9. The conductive terminal of claim 1, wherein the terminal body is a copper alloy terminal or a stainless steel terminal.
10. A wearable device, characterized in that it comprises a conductive terminal according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320604338.2U CN219874138U (en) | 2023-03-24 | 2023-03-24 | Conductive terminal and wearable equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320604338.2U CN219874138U (en) | 2023-03-24 | 2023-03-24 | Conductive terminal and wearable equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219874138U true CN219874138U (en) | 2023-10-20 |
Family
ID=88320013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320604338.2U Active CN219874138U (en) | 2023-03-24 | 2023-03-24 | Conductive terminal and wearable equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219874138U (en) |
-
2023
- 2023-03-24 CN CN202320604338.2U patent/CN219874138U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208501124U (en) | A kind of anticorrosion electroplated layer with silver alloy layers | |
| CN207918991U (en) | A kind of resistance to plug galvanization coating, terminal and the electrical interface at nickel alloy base bottom | |
| CN109004405A (en) | Inserting terminal, grafting pin processing technology and electronic equipment | |
| CN219874138U (en) | Conductive terminal and wearable equipment | |
| CN209607940U (en) | A kind of erosion-resisting electroplated layer, terminal and electrical interface | |
| CN210886265U (en) | Electroplating coating for interface terminal of handheld electronic equipment | |
| CN213124789U (en) | Electric connector with coating structure and electronic product | |
| CN212659703U (en) | Conductive terminal, corrosion-resistant layer thereof and electric connector | |
| CN219040795U (en) | Connector terminal and wearable electronic equipment | |
| CN110581344B (en) | Mobile terminal shell, mobile terminal and preparation method of shell | |
| CN210668752U (en) | Conductive terminal, electric connector and terminal equipment | |
| CN208939195U (en) | A kind of bonder terminal, connector and terminal device | |
| CN211980946U (en) | Electric connector and electronic equipment | |
| CN217823338U (en) | Electric connector, connecting assembly and terminal equipment | |
| US20190378632A1 (en) | Plated product and method of manufacturing the same | |
| CN211700652U (en) | Electric connector and electronic equipment | |
| CN214754279U (en) | Electric connector, terminal and electric connector assembly | |
| CN216563626U (en) | Conductive terminal, electric connector and terminal equipment | |
| CN111834781A (en) | Conductive terminal and positive and negative plug USB socket | |
| CN216145790U (en) | Plug-resistant anti-hand-sweat coating, terminal and electronic equipment | |
| CN217607067U (en) | Nickel-free platinum-ruthenium-plated hand sweat-resistant combined coating, connecting terminal and electronic equipment | |
| CN214754278U (en) | Electric connector, terminal and electric connector assembly | |
| CN220767204U (en) | Plating layer for terminal, electronic interface and electronic device | |
| CN211088549U (en) | Connector and electronic equipment | |
| CN216427448U (en) | Plug-resistant anti-hand-sweat coating, terminal and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |