CN111834781A - Conductive terminal and positive and negative plug USB socket - Google Patents
Conductive terminal and positive and negative plug USB socket Download PDFInfo
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- CN111834781A CN111834781A CN202010599148.7A CN202010599148A CN111834781A CN 111834781 A CN111834781 A CN 111834781A CN 202010599148 A CN202010599148 A CN 202010599148A CN 111834781 A CN111834781 A CN 111834781A
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- conductive terminal
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- electroplated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Abstract
The invention relates to a conductive terminal, wherein a plating layer is formed on the outer side of the conductive terminal in an electroplating way, and the plating layer comprises a copper plating layer electroplated on the outer surface of the conductive terminal, a nickel-tungsten plating layer electroplated on the outer surface of the copper plating layer, a first combined plating layer electroplated on the outer surface of the nickel-tungsten plating layer, a palladium-nickel plating layer electroplated outside the first combined plating layer, a second combined plating layer electroplated on the outer surface of the palladium-nickel plating layer and a platinum plating layer electroplated on the outer surface of the second combined plating layer. The conductive terminal has the advantages of good corrosion resistance, plugging resistance and low cost.
Description
Technical Field
The invention relates to the field of electroplating of a positive and negative plug USB socket, in particular to a conductive terminal and the positive and negative plug USB socket.
Background
Since the release of Type C connector standard in 2014, related products have been widely used in various electronic industries to replace the conventional Mini USB interface. In different application fields, the functional requirements on the connector are different, and in the field of notebook computers, the connector can be generally transmitted only by conventional high-frequency data; in the field of mobile phone devices, requirements of water resistance, large current transmission and wear resistance (high plugging times) are provided, and the mobile phone device needs to be applied to different severe environments, such as human body sweat environment and the like. Mobile phone manufacturers have made strict functional requirements on the conductive terminals of the connector, and in order to solve the problem of corrosion resistance of the conductive terminals under the condition of large current transmission and in the environment of human sweat, plating layers of electroplated rhodium ruthenium metal are provided in the electroplating process, and the rhodium metal has the characteristics of corrosion resistance and extremely high hardness, but has the problem of extremely high cost.
Disclosure of Invention
Based on the above, the invention provides the conductive terminal and the positive and negative plug USB socket, which can reduce the manufacturing cost under the performances of corrosion resistance and wear resistance of the conductive terminal in a severe environment.
In order to solve the technical problem, the application provides a conductive terminal, a plating layer is formed on the outer side of the conductive terminal in an electroplating mode, and the plating layer comprises a copper plating layer electroplated on the outer surface of the conductive terminal, a nickel-tungsten plating layer electroplated on the outer surface of the copper plating layer, a first combined plating layer electroplated on the outer surface of the nickel-tungsten plating layer, a palladium-nickel plating layer electroplated outside the first combined plating layer, a second combined plating layer electroplated on the outer surface of the palladium-nickel plating layer and a platinum plating layer electroplated on the outer surface of the second combined plating layer.
Preferably, the platinum plating layer is a platinum ruthenium alloy plating layer.
Preferably, the thickness of the platinum ruthenium alloy plating layer is 0.5-1 μm.
Preferably, the first and second combined plating layers are both gold plating layers, the thickness of the first combined plating layer is 0.1-1 μm, and the thickness of the second combined plating layer is 0.5-1 μm.
Preferably, the thickness of the copper plating layer is 1 to 3 μm.
Preferably, the thickness of the nickel tungsten plating layer is 1-5 μm.
Preferably, the palladium-nickel plating layer has a thickness of 0.5 to 2 μm.
Preferably, the conductive terminal is a copper substrate, and the copper substrate is subjected to degreasing and activation polishing treatment before electroplating.
In order to solve the technical problem, the application further provides a positive and negative plug-in USB socket, which comprises a shielding middle plate, first and second conductive terminal groups located on the upper and lower sides of the shielding middle plate, and an insulating body combining the shielding middle plate, the first and second conductive terminal groups into a whole, wherein the first and second conductive terminals comprise plating layers of the conductive terminals.
Preferably, the first and second conductive terminal sets respectively include a pair of ground terminals located at the outermost side, two pairs of high-frequency signal terminals located inside the pair of ground terminals, a pair of power terminals located inside the two pairs of high-frequency signal terminals, and a plurality of normal signal terminals located inside the pair of power terminals, and the power terminals and the ground terminals of the first and second conductive terminals at least include the platinum-ruthenium plating layer.
According to the conductive terminal and the positive and negative plug USB socket using the conductive terminal, platinum and ruthenium are electroplated on the outermost layer of the conductive terminal, so that the problems of weak corrosion resistance and poor plugging resistance of a transmission gold-plating scheme are solved, and the technical problem that a newly-appeared rhodium-ruthenium-plated scheme is high in manufacturing cost is solved.
Drawings
FIG. 1 is a schematic diagram of a conductive terminal plating structure according to an embodiment;
FIG. 2 is a schematic diagram of a plating layer of a second conductive terminal according to an embodiment;
fig. 3 is a schematic structural diagram of a plating layer of three conductive terminals according to an embodiment.
The meaning of the reference symbols in the drawings is:
copper plating-11, 21, 31; nickel plating-12, 22; first bond coat-13, 24, 33; palladium nickel plating-14, 25, 34; second bond coat-15, 26, 35; platinum plating-16, 27, 36; nickel tungsten plating-32.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
This application conductive terminal adopts the copper base material punching press to form, is rectangular form structure for Type C Type USB socket is with transmission data, communication signal and electric energy.
The Type C Type USB socket generally comprises a shielding middle plate, a first conductive terminal group, a second conductive terminal group and an insulating body, wherein the first conductive terminal group and the second conductive terminal group are positioned on the upper side and the lower side of the shielding middle plate, and the insulating body combines the shielding middle plate, the first conductive terminal group and the second conductive terminal group into a whole. The first and second conductive terminal groups respectively comprise a pair of ground terminals located at the outermost side, two pairs of high-frequency signal terminals located at the inner sides of the pair of ground terminals, a pair of power supply terminals located at the inner sides of the two pairs of high-frequency signal terminals, and a plurality of conventional signal terminals located at the inner sides of the pair of power supply terminals. The first and second conductive terminal groups are not in electrical contact with the shielding middle plate.
The outer surfaces of the first and second conductive terminal sets need to be plated with a plurality of plating layers to increase the wear resistance and corrosion resistance of the conductive terminal surfaces.
Example one
Referring to fig. 1, the conductive terminal plating layer of the present application includes a copper plating layer 11 plated on an outer surface of a copper substrate 17 of the conductive terminal, a nickel plating layer 12 plated on an outer surface of the copper plating layer 11, a first bonding plating layer 13 plated on an outer surface of the nickel plating layer 12, a palladium-nickel plating layer 14 plated on an outer surface of the first bonding plating layer 13, a second bonding plating layer 15 plated on an outer surface of the palladium-nickel plating layer 14, and a platinum plating layer 16 plated on an outer surface of the second bonding plating layer 15.
Before electroplating, the copper base material 17 of the conductive terminal needs to be subjected to degreasing and activating polishing treatment to remove an oxide film on the surface of the copper base material 17, and meanwhile, the surface of the copper base material 17 is more flat through the polishing treatment to form a smooth and flat surface 18.
The copper plating layer 11 is formed on the surface 18 of the copper base material 17 in an electroplating mode, so that the surface of the copper base material 17 is smoother, has better compactness and is beneficial to the smoothness and compactness of a subsequent plating layer, and the thickness of the copper plating layer 11 is 1-3 mu m.
The nickel plating layer 12 is formed on the outer surface of the copper plating layer 11 in an electroplating way, and the thickness of the nickel plating layer 12 is between 1 and 5 mu m. The nickel plating 12 may further level the outer surface of the copper substrate 17 and promote corrosion resistance.
The first bonding plating layer 13 is formed on the outer surface of the nickel plating layer 12 in an electroplating way, the first bonding plating layer 13 is a gold plating layer, and the thickness of the first bonding plating layer is 0.1-1 μm. The thickness of the palladium-nickel plating layer 14 on the outer side of the first bonding plating layer 13 is 0.5-2 μm, and the palladium-nickel plating layer 14 is used for improving the corrosion resistance of the conductive terminal. The first bonding plating layer 13 is a gold plating layer mainly for improving the bonding between the nickel plating layer 12 and the palladium-nickel plating layer 14.
The second combined plating layer 15 is formed on the outer surface of the palladium-nickel plating layer 14 in an electroplating mode, and the second combined plating layer is a gold plating layer with the thickness of 0.5-1 mu m. The outer surface of the second combined plating layer 15 is electroplated with a platinum plating layer 16 with a thickness of 0.5-1 μm, and the platinum plating layer 16 is preferably made of platinum ruthenium alloy to enhance the corrosion resistance of the outer surface of the conductive terminal. The second bond plating layer 15 is primarily used to enhance the bond between the palladium nickel plating layer 14 and the platinum plating layer 16.
Example two
Referring to fig. 2, the conductive terminal plating layer of the present application includes a copper plating layer 21 plated on an outer surface of a copper substrate 17 of the conductive terminal, a nickel plating layer 22 plated on an outer surface of the copper plating layer 21, a nickel-tungsten plating layer 23 plated on an outer surface of the nickel plating layer 22, a first bonding plating layer 24 plated on an outer surface of the nickel-tungsten plating layer 23, a palladium-nickel plating layer 25 plated on an outer surface of the first bonding plating layer 24, a second bonding plating layer 26 plated on an outer surface of the palladium-nickel plating layer 25, and a platinum plating layer 27 plated on an outer surface of the second bonding plating layer 26.
Before electroplating, the copper base material 17 of the conductive terminal needs to be subjected to degreasing and activating polishing treatment to remove an oxide film on the surface of the copper base material 17, and meanwhile, the surface of the copper base material 17 is more flat through the polishing treatment to form a smooth and flat surface 18.
The copper plating layer 21 is formed on the surface 18 of the copper base material 17 in an electroplating mode, so that the surface of the copper base material 17 is smoother, has better compactness and is beneficial to the smoothness and compactness of a subsequent plating layer, and the thickness of the copper plating layer 21 is 1-3 mu m.
The outer surface of the copper plating layer 21 is electroplated with a nickel plating layer 22, and the thickness of the nickel plating layer 22 is between 1 and 5 μm. The nickel plating 22 may further level the outer surface of the copper substrate 17 and promote corrosion resistance.
The nickel tungsten plating layer 23 is formed on the outer surface of the nickel plating layer 22 in an electroplating manner, the thickness of the nickel tungsten plating layer 23 is between 0.75 and 3 micrometers, and the nickel tungsten plating layer 23 can further fill and level the outer surface of the copper base material 17 and improve the corrosion resistance.
A first bonding plating layer 24 is formed on the outer surface of the nickel-tungsten plating layer 23 in an electroplating way, the first bonding plating layer is a gold plating layer, and the thickness of the first bonding plating layer is 0.1-1 μm. The thickness of the palladium-nickel plating layer 25 on the outer side of the first bonding plating layer 24 is 0.5-2 μm, and the palladium-nickel plating layer 25 is used for improving the corrosion resistance of the conductive terminal. The first bonding plating layer 24 is a gold plating layer, which is mainly used to improve the bonding between the nickel-tungsten plating layer 23 and the palladium-nickel plating layer 25.
The second combined plating layer 26 is formed on the outer surface of the palladium-nickel plating layer 25 in an electroplating manner, and the second combined plating layer 26 is a gold plating layer with the thickness of 0.5-1 μm. The outer surface of the second bonding plating layer 26 is electroplated with a platinum plating layer 27 with a thickness of 0.5-1 μm, and the platinum plating layer 15 is preferably made of platinum ruthenium alloy to enhance the corrosion resistance of the outer surface of the conductive terminal. The second bond plating layer 26 is primarily used to enhance the bond between the palladium nickel plating layer 25 and the platinum plating layer 27.
EXAMPLE III
Referring to fig. 3, the conductive terminal plating layer of the present application includes a copper plating layer 31 plated on an outer surface of a copper substrate 17 of the conductive terminal, a nickel-tungsten plating layer 32 plated on an outer surface of the copper plating layer 31, a first bonding plating layer 33 plated on an outer surface of the nickel-tungsten plating layer 32, a palladium-nickel plating layer 34 plated on an outer surface of the first bonding plating layer 33, a second bonding plating layer 35 plated on an outer surface of the palladium-nickel plating layer 34, and a platinum plating layer 36 plated on an outer surface of the second bonding plating layer 35.
Before electroplating, the copper base material 17 of the conductive terminal needs to be subjected to degreasing and activating polishing treatment to remove an oxide film on the surface of the copper base material 17, and meanwhile, the surface of the copper base material 17 is more flat through the polishing treatment to form a smooth and flat surface 18.
The copper plating layer 31 is formed on the surface 18 of the copper base material 17 in an electroplating mode, so that the surface of the copper base material 17 is smoother, has better compactness and is beneficial to the smoothness and compactness of a subsequent plating layer, and the thickness of the copper plating layer 31 is 1-3 mu m.
The nickel-tungsten plating layer 32 is formed on the outer surface of the copper plating layer 31 in an electroplating mode, and the thickness of the nickel-tungsten plating layer 32 is 0.75-3 mu m. The nickel tungsten coating 32 may further fill the outer surface of the copper substrate 17 and promote corrosion resistance.
The first bonding plating layer 33 is formed on the outer surface of the nickel-tungsten plating layer 32 in an electroplating manner, the first bonding plating layer 33 is a gold plating layer, and the thickness of the first bonding plating layer is 0.1-1 μm. The thickness of the palladium-nickel plating layer 34 on the outer side of the first bonding plating layer 33 is 0.5-2 μm, and the palladium-nickel plating layer 34 is used for improving the corrosion resistance of the conductive terminal. The first bonding plating layer 33 is a gold plating layer, which is mainly used to improve the bonding between the nickel-tungsten plating layer 32 and the palladium-nickel plating layer 34.
The second combined plating layer 35 is formed on the outer surface of the palladium-nickel plating layer 34 in an electroplating mode, and the second combined plating layer is a gold plating layer with the thickness of 0.5-1 μm. The outer surface of the second bonding plating layer 35 is electroplated with a platinum plating layer 36 with a thickness of 0.5-1 μm, and the platinum plating layer 36 is preferably made of platinum ruthenium alloy to enhance the corrosion resistance of the outer surface of the conductive terminal. The second bond plating layer 35 is primarily used to enhance the bond between the palladium nickel plating layer 34 and the platinum plating layer 36.
Example four
The electroplating process of the first to third embodiments of the present application is as follows:
s10, removing oil, and removing oil stains on the surface of the copper base material 17;
s20, activating and polishing to remove the oxide film on the surface of the copper base material 17 and to make the surface of the copper base material 17 smoother;
and S30, electroplating, wherein the electroplating is sequentially carried out according to the plating structures of the first embodiment to the third embodiment.
In this step, the electroplating process includes electroplating copper plating, electroplating nickel or nickel alloy plating (in the second embodiment, two times of electroplating), gold plating, palladium nickel plating, gold plating, and platinum ruthenium plating.
The nickel or nickel alloy plating layer has the capabilities of resisting oxidation and high-temperature discoloration, and the capability of the product for resisting high-temperature oxidation corrosion is effectively improved. The gold plating layer has good adherence performance, the bonding strength of each plating layer and the gold plating layer is good, and the plating layer outside the gold plating layer can be effectively prevented from peeling off and falling off under the action of rapid heating, rapid cooling or impact external force. The palladium-nickel plating layer has the advantages of smooth and fine crystallization, few gaps, strong element stability and strong corrosion resistance due to potential difference of the alloy, and can effectively resist corrosion of chloride ions, thereby playing a protective role in addition.
In the grounding terminal, the power terminal, the high-frequency signal terminal and the conventional signal terminal of the first and second conductive terminals of the positive and negative plug USB socket, which are used for transmitting large current, the power terminal and the grounding terminal are mainly used, and can be selectively electroplated during electroplating to reduce the manufacturing cost. Therefore, during electroplating, the power supply terminal and the grounding terminal are suitable for the technical scheme of electroplating platinum and ruthenium, and the signal terminal can be only plated with gold conventionally.
In experimental verification, the sample 1 is gold-plated, the sample 2 is rhodium-plated ruthenium, the sample 3 is platinum-plated ruthenium, and the plating layer has the same thickness, under the same electrolytic environment, the corrosion resistance of the traditional gold-plated conductive terminal of the sample 1 is only 30 seconds, the corrosion resistance of the rhodium-plated ruthenium of the sample 2 can reach 15 minutes, and the corrosion resistance of the sample 3 of the embodiment can reach 5 minutes. On the other hand, if the cost of sample 1 is set to 1, the cost of sample 2 is 8, and the cost of sample 3 is 4.7. The cost of sample 2 is mainly due to the expensive price of rhodium metal, resulting in a high cost.
In conclusion, on the basis of the performance requirements of customers, the 5-minute corrosion resistance basically meets the performance requirements of most customers, and the rhodium-ruthenium plating scheme with the highest cost has very superior corrosion resistance but very high cost; the platinum-ruthenium solution of sample 3 greatly reduces the manufacturing cost of the product while satisfying the customer requirements, and is an optimal solution compared with sample 1 and sample 2. And the platinum-ruthenium alloy is very hard and has very excellent plugging resistance.
According to the conductive terminal and the positive and negative plug USB socket using the conductive terminal, platinum and ruthenium are electroplated on the outermost layer of the conductive terminal, so that the problems of weak corrosion resistance and poor plugging resistance of a transmission gold-plating scheme are solved, and the technical problem that a newly-appeared rhodium-ruthenium-plated scheme is high in manufacturing cost is solved.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A conductive terminal is provided, the outer side of the conductive terminal is electroplated with a plating layer, and the plating layer comprises a copper plating layer electroplated on the outer surface of the conductive terminal, a nickel-tungsten plating layer electroplated on the outer surface of the copper plating layer, a first combination plating layer electroplated on the outer surface of the nickel-tungsten plating layer, a palladium-nickel plating layer electroplated outside the first combination plating layer, a second combination plating layer electroplated on the outer surface of the palladium-nickel plating layer and a platinum plating layer electroplated on the outer surface of the second combination plating layer.
2. The conductive terminal of claim 1, wherein the platinum plating is a platinum ruthenium alloy plating.
3. The conductive terminal of claim 2, wherein the platinum ruthenium alloy plating layer has a thickness of 0.5 to 1 μm.
4. An electrically conductive terminal as claimed in claim 3, wherein the first and second bond plating layers are gold plating layers, the first bond plating layer has a thickness of 0.1 to 1 μm, and the second bond plating layer has a thickness of 0.5 to 1 μm.
5. An electrically conductive terminal as claimed in claim 4, wherein the copper plating is 1 to 3 μm thick.
6. An electrically conductive terminal as claimed in claim 4, wherein the nickel tungsten plating has a thickness of 0.75 to 3 μm.
7. The conductive terminal of claim 4, wherein the palladium-nickel plating layer has a thickness of 0.5-2 μm.
8. The conductive terminal of claim 1, wherein the conductive terminal is a copper substrate that has been degreased and activated before electroplating.
9. A positive-negative-insertion USB socket, comprising a shielding middle plate, a first and a second conductive terminal sets located at the upper and lower sides of the shielding middle plate, and an insulating body combining the shielding middle plate, the first and the second conductive terminal sets into a whole, wherein the first and the second conductive terminals comprise a plating layer of the conductive terminal according to any one of claims 1 to 8.
10. The reversible USB socket of claim 9, wherein the first and second conductive terminal sets respectively include a pair of ground terminals located at the outermost side, two pairs of high frequency signal terminals located inside the pair of ground terminals, a pair of power terminals located inside the two pairs of high frequency signal terminals, and a plurality of regular signal terminals located inside the pair of power terminals, and the power terminals and the ground terminals of the first and second conductive terminals at least include the platinum-ruthenium plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010599148.7A CN111834781A (en) | 2020-06-28 | 2020-06-28 | Conductive terminal and positive and negative plug USB socket |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010599148.7A CN111834781A (en) | 2020-06-28 | 2020-06-28 | Conductive terminal and positive and negative plug USB socket |
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| Publication Number | Publication Date |
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| CN111834781A true CN111834781A (en) | 2020-10-27 |
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| CN202010599148.7A Pending CN111834781A (en) | 2020-06-28 | 2020-06-28 | Conductive terminal and positive and negative plug USB socket |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112962123A (en) * | 2021-02-01 | 2021-06-15 | 东莞天正新材料有限公司 | Coating of mobile phone charging interface and preparation method thereof |
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2020
- 2020-06-28 CN CN202010599148.7A patent/CN111834781A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112962123A (en) * | 2021-02-01 | 2021-06-15 | 东莞天正新材料有限公司 | Coating of mobile phone charging interface and preparation method thereof |
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