CN210668752U - Conductive terminal, electric connector and terminal equipment - Google Patents

Abstract

The application provides a conductive terminal, electric connector and terminal equipment, conductive terminal includes the contact site, the contact site includes basement, nickel coating, rhodium cladding material and palladium cladding material, basement, nickel coating, rhodium cladding material and palladium cladding material set gradually from inside to outside. In the application, the nickel plating layer has good acid resistance, the rhodium plating layer can prevent the external corrosion to the substrate, and the palladium plating layer has good electric corrosion resistance, so that various performances and durability of the conductive terminal are ensured; in addition, the rhodium plating layer is arranged on the inner layer, so that the requirements of strength, wear resistance and the like are not required, the thickness can be properly reduced, the content of rhodium is reduced, the thickness of the rhodium plating layer is reduced, the rhodium electroplating process can be simplified, and the manufacturing cost is favorably reduced.

Description

Conductive terminal, electric connector and terminal equipment

Technical Field

The present application relates to the field of electronic devices, and in particular, to a conductive terminal, an electrical connector, and a terminal device.

Background

Currently, the outer surface of the contact part of the conductive terminal is usually electroplated with a rhodium ruthenium plating layer, and the rhodium ruthenium plating layer has strong corrosion resistance and high strength, and is beneficial to improving the mechanical property and the chemical property of the conductive terminal. However, the rhodium ruthenium plating layer is expensive, and the rhodium ruthenium plating layer is located at the outermost side of the contact portion, so that the thickness of the rhodium ruthenium plating layer needs to be designed to be large in order to meet the requirements of wear resistance, strength and the like, which leads to increase in the cost of the rhodium material and the plating cost.

SUMMERY OF THE UTILITY MODEL

The application provides a low-cost conductive terminal, an electric connector and terminal equipment.

The application provides a conductive terminal, including the contact site, the contact site includes basement, nickel coating, rhodium cladding material and palladium cladding material, basement, nickel coating, rhodium cladding material and palladium cladding material set gradually from inside to outside.

Further, the rhodium plating layer is a rhodium alloy layer, and the palladium plating layer is a palladium alloy layer.

Further, the thickness of the rhodium plating layer is not less than 5u ″, and/or the thickness of the palladium plating layer is not less than 50u ″.

Further, the contact portion includes a first transition layer between the nickel plating layer and the rhodium plating layer.

Furthermore, the contact part comprises a second transition layer, the second transition layer is positioned between the rhodium plating layer and the palladium plating layer, and the thicknesses of the first transition layer and the second transition layer are not less than 1u ″.

Further, the contact part comprises a gold plating layer covered on the outer side of the palladium plating layer, and the thickness of the gold plating layer is not less than 5u ″.

Further, the contact portion further includes a copper plating layer between the substrate and the nickel plating layer.

Furthermore, the thickness of the copper plating layer is 40-120 u ', and the thickness of the nickel plating layer is not less than 80 u'.

In another aspect, the present application further provides an electrical connector including the conductive terminal as described above.

In yet another aspect, the present application also provides a terminal device comprising the electrical connector as described above.

In the application, the nickel plating layer has good acid resistance, the rhodium plating layer can prevent the external corrosion to the substrate, and the palladium plating layer has good electric corrosion resistance, so that various performances and durability of the conductive terminal are ensured; in addition, the rhodium plating layer is arranged on the inner layer, so that the requirements of strength, wear resistance and the like are not required, the thickness can be properly reduced, the content of rhodium is reduced, the thickness of the rhodium plating layer is reduced, the rhodium electroplating process can be simplified, and the manufacturing cost is favorably reduced.

Drawings

Fig. 1 is a schematic view of one embodiment of an electrical connector of the present application.

Fig. 2 is a schematic cross-sectional view of a contact portion of a conductive terminal of the electrical connector shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of a second embodiment of a contact portion of a conductive terminal of the present application.

Fig. 4 is a schematic cross-sectional view of a third embodiment of a contact portion of a conductive terminal of the present application.

Fig. 5 is a schematic cross-sectional view of a fourth embodiment of a contact portion of a conductive terminal of the present application.

FIG. 6 is a bottom view of one embodiment of a terminal device of the present application.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of "first," "second," and similar terms in the description and in the claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "a number" means two or more. Unless otherwise indicated, "front", "rear", "lower" and/or "upper" and the like are for convenience of description and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

Referring to fig. 1 to 6, the present application provides a conductive terminal, an electrical connector and a terminal device, where the conductive terminal includes a contact portion, the contact portion includes a substrate, a nickel plating layer, a rhodium plating layer and a palladium plating layer, and the substrate, the nickel plating layer, the rhodium plating layer and the palladium plating layer are sequentially disposed from inside to outside.

Referring to fig. 1, an electrical connector 1000, which is an I/O (input/output) connector, is provided. Referring to fig. 6, in the present embodiment, the electrical connector is a Type-C female terminal connector, and includes a conductive terminal 100, an insulating body 200 and a metal shell 300, wherein the conductive terminal 100 is mounted on the insulating body 200, and the metal shell 300 covers the insulating body 200 and the conductive terminal 100 for shielding electromagnetic interference outside the conductive terminal 100. In other embodiments, the metal housing may not be provided, for example, the housing of the terminal device may be used to implement the shielding function.

With reference to fig. 1, the conductive terminal 100 includes a contact portion 1, a fixing portion and a soldering portion 2, wherein the fixing portion connects the contact portion 1 and the soldering portion 3. The contact portion 1 is used for contacting with a terminal of a mating connector to form an electrical connection, the fixing portion is used for fixing to the insulating body 200, and the soldering portion 3 is used for soldering with a circuit board. The contact portion 1 of the conductive terminal 100 is disposed on the tongue plate 20 of the insulating body 200, and the soldering portion 2 protrudes from the insulating body 200.

Referring to fig. 2, the contact portion 1 includes a substrate 10, a nickel plating layer 11, a rhodium plating layer 12, and a palladium plating layer 13, and the substrate 10 of the contact portion is the same as the substrate of the fixing portion and the soldering portion, and is made of copper or a copper alloy. The substrate 10, the nickel plating layer 11, the rhodium plating layer 12 and the palladium plating layer 13 are sequentially arranged from inside to outside.

Optionally, the material of the nickel plating layer 11 is nickel or a nickel alloy, the nickel alloy is, for example, a nickel-tungsten alloy or a nickel-phosphorus alloy, and a nickel-tungsten alloy is selected in this embodiment; the rhodium plating layer 12 is made of rhodium or rhodium alloy, in this embodiment, rhodium ruthenium alloy is selected; the palladium plating layer 13 is made of palladium or a palladium alloy, and the palladium alloy is selected in this embodiment.

The nickel plating layer 11 has good acid resistance, the rhodium plating layer 12 can prevent the external corrosion to the substrate 10, and the palladium plating layer 13 has good electric corrosion resistance and wear resistance, and can realize the performance equivalent to the plating layer structure of the existing conductive terminal. In addition, the palladium plating layer 13 has good process stability, and can realize precise selective plating. The rhodium plating layer is arranged in the inner layer and has no requirements on strength, wear resistance and the like while the performance and the durability of the conductive terminal are ensured, so that the thickness can be properly reduced, and the content of a rhodium material is reduced. On the other hand, the rhodium plating layer is thinner, so that the concentration requirement and the requirement on the plating current of the rhodium ruthenium plating solution are reduced, the phenomenon that the rhodium ruthenium plating solution is easy to age and lose efficacy due to overlarge concentration is avoided, and the cost of the conductive terminal is further reduced.

Preferably, the thickness of the nickel plating layer 11 is not less than 80u ″ ("u" is english system unit, commonly used in electroplating industry, 1u ≈ 40um), the thickness of the rhodium plating layer 12 is not less than 5u ″, and the thickness of the palladium plating layer 13 is not less than 50u ″. The thickness of the existing rhodium ruthenium plating layer on the outer surface of the contact part of the conductive terminal is about 20u ″, namely, the thickness of the rhodium plating layer of the present application can be reduced to 1/4 of the thickness of the existing rhodium ruthenium plating layer, so that the material cost and the electroplating cost are greatly reduced.

The contact portion 1 further includes a copper plating layer 15, the copper plating layer 15 is located between the substrate 10 and the nickel plating layer 11, and optionally, the material of the copper plating layer 15 is copper or a copper alloy, and copper is selected in this embodiment. The copper plating layer 15 is plated on the outer side of the substrate 10, which is beneficial to improving the flatness of the substrate surface and reducing the internal stress of the subsequent plating layer caused by uneven distribution.

Referring to fig. 3, the second embodiment is different from the first embodiment in that the contact portion includes a first transition layer 16, the first transition layer 16 is disposed between the nickel plating layer 11 and the rhodium plating layer 12, the material of the first transition layer 16 may be copper or gold, and in this embodiment, gold is used. The first transition layer 16 serves to bond the nickel plating layer 11 and the rhodium plating layer 12, reducing internal stress therein. Optionally, the thickness of the first transition layer 16 is not less than 1u ", and the thickness of the present embodiment is 2 u".

Referring to fig. 4, the third embodiment is different from the second embodiment in that the contact portion includes a second transition layer 17, the second transition layer 17 is disposed between the rhodium plating layer 12 and the palladium plating layer 13, and the second transition layer 17 is used for bonding the rhodium plating layer 12 and the palladium plating layer 13 to reduce internal stress therein. Optionally, the thickness of the second transition layer 17 is not less than 1u ", and the thickness of the present embodiment is 2 u".

Note that when the adhesion between the rhodium plating layer 12 and the other plating layers is sufficiently large, the transition layer may not be provided.

Referring to fig. 5, the fourth embodiment is different from the second embodiment in that the contact portion 1 further includes a gold plating layer 14, the gold plating layer 14 covers the palladium plating layer 13, and the gold plating layer 14 is made of gold or a gold alloy. Preferably, the thickness of the gold plating layer 14 is not less than 5u ″, and the gold plating layer has good stability and corrosion resistance, thereby effectively protecting the substrate.

It should be noted that, for each of the above plating layers, the larger the thickness of the plating layer is, the better the parameters of the conductive terminal, such as mechanical properties, electrical properties, chemical properties, etc., but at the same time, rhodium, palladium, and gold in each plating layer are all expensive metals, so that it is necessary to balance the manufacturing cost and performance of the conductive terminal in actual production.

On the other hand, the application also provides a terminal device, such as a mobile phone, a tablet computer, a notebook computer, a desktop computer, a smart watch, a virtual reality device, and the like. Referring to fig. 6, in this embodiment, the terminal device is a mobile phone, which includes the electrical connector of any one of the embodiments, and certainly, the mobile phone further includes a housing 2000, a display screen, a motherboard, a battery, and other structures, the welding portion 2 of the electrical connector is electrically connected to the motherboard, and the contact portion 1 is used for connecting a data line for charging or data transmission. The cost of the electric connector is reduced, the cost of the whole terminal device is reduced, and meanwhile, the performance and the service life of the product are not influenced by the reduction of the cost.

Although the present application has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the application, and all changes, substitutions and alterations that fall within the spirit and scope of the application are to be understood as being covered by the following claims.

Claims (10)

1. The conductive terminal is characterized by comprising a contact part (1), wherein the contact part comprises a substrate (10), a nickel plating layer (11), a rhodium plating layer (12) and a palladium plating layer (13), and the substrate (10), the nickel plating layer (11), the rhodium plating layer (12) and the palladium plating layer (13) are sequentially arranged from inside to outside.

2. An electrically conductive terminal as claimed in claim 1, wherein the rhodium plating (12) is a rhodium alloy layer and the palladium plating (13) is a palladium alloy layer.

3. An electrically conductive terminal as claimed in claim 2, wherein the thickness of the rhodium plating (12) is not less than 5u "and/or the thickness of the palladium plating (13) is not less than 50 u".

4. The electrically conductive terminal according to claim 1, characterized in that the contact portion (1) comprises a first transition layer (16), the first transition layer (16) being located between the nickel plating (11) and the rhodium plating (12).

5. The conductive terminal according to claim 4, wherein the contact portion (1) comprises a second transition layer (17), the second transition layer (17) being located between the rhodium plating layer (12) and the palladium plating layer (13), the thickness of the first transition layer (16) and the second transition layer (17) being not less than 1u ".

6. An electrically conductive terminal as claimed in claim 1, wherein the contact portion (1) comprises a gold plating (14) overlying the palladium plating (13) on the outside, the gold plating (14) having a thickness of no less than 5u ".

7. The conductive terminal according to any one of claims 1 to 6, characterized in that the contact portion (1) further comprises a copper plating (15), the copper plating (15) being located between the substrate (10) and the nickel plating (11).

8. The conductive terminal according to claim 7, wherein the thickness of the copper plating layer (15) is 40-120 u ", and the thickness of the nickel plating layer (11) is not less than 80 u".

9. An electrical connector comprising an electrically conductive terminal as claimed in any one of claims 1 to 8.

10. A terminal device, characterized in that it comprises an electrical connector according to claim 9.

Images