CN217334454U - Conductive terminal - Google Patents
Conductive terminal Download PDFInfo
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- CN217334454U CN217334454U CN202220098546.5U CN202220098546U CN217334454U CN 217334454 U CN217334454 U CN 217334454U CN 202220098546 U CN202220098546 U CN 202220098546U CN 217334454 U CN217334454 U CN 217334454U
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Abstract
The utility model relates to a conductive terminal is applicable to electric connector. The conductive terminal has a butt-joint section for electrically abutting against the conductive terminal of the other electric connector. The butt-joint section comprises a base material and a multi-layer electroplated layer arranged on the base material. The multilayer plating layer includes: a copper layer, a nickel or nickel alloy layer, a silver, palladium or nickel alloy layer, a platinum alloy layer, and a platinum layer or another platinum alloy layer. The copper layer is disposed on the surface of the substrate. The nickel or nickel alloy layer is disposed above the copper layer. The silver, palladium alloy or nickel alloy layer is disposed over the nickel or nickel alloy layer. The platinum alloy layer is disposed on one of the opposing two stacked sides of the silver, palladium alloy, or nickel alloy layer. A platinum layer or another platinum alloy layer is disposed on the other of the two opposing stacked sides of the silver, palladium alloy or nickel alloy layer.
Description
Technical Field
The utility model relates to a conductive terminal.
Background
In the prior art, the electrical connector has to meet the general performance requirements, and particularly important requirements are that the electrical connector has to achieve good contact, reliable operation and convenient maintenance, and whether the reliable operation directly affects the normal operation of a circuit, which relates to the safety of the whole electronic device applying the electrical connector.
Generally, electronic devices such as mobile phones are often charged because of their long usage time and high power consumption. The contact area of the terminal is often plugged or rubbed, so that the contact area of the terminal is more easily corroded due to the fact that the contact area of the terminal is wetted by hand sweat of a human body or water vapor in the air, and the corrosion of a terminal copper material is accelerated due to frequent plugging or rubbing, so that the service life of the electronic equipment is influenced. It follows that it is particularly important to design an electrical connector that improves the corrosion resistance of the terminals.
Disclosure of Invention
The utility model provides a conductive terminal, it has conductive property, corrosion resistance and wear resistance with many plating layer structures concurrently.
The utility model discloses a conductive terminal is applicable to the electric connector. The conductive terminal has a butt-joint section for electrically abutting against the conductive terminal of the other electric connector. The butt-joint section comprises a base material and a multi-layer electroplated layer arranged on the base material. The multilayer plating layer includes: a copper layer, a nickel or nickel alloy layer, a silver, palladium or nickel alloy layer, a platinum alloy layer, and a platinum layer or another platinum alloy layer. The copper layer is disposed on the surface of the substrate. The nickel or nickel alloy layer is disposed above the copper layer. The silver, palladium alloy or nickel alloy layer is disposed over the nickel or nickel alloy layer. The platinum alloy layer is disposed on one of the opposing two stacked sides of the silver, palladium alloy, or nickel alloy layer. A platinum layer or another platinum alloy layer is disposed on the other of the two opposing stacked sides of the silver, palladium alloy or nickel alloy layer.
Preferably, the multilayer electroplated layer further comprises a multilayer gold layer sandwiched between any two adjacent layers of nickel or a nickel alloy layer, silver, a palladium alloy or a nickel alloy layer, a platinum layer or another platinum alloy layer.
Preferably, the multilayer electroplating layer further comprises a gold layer, which is the outermost layer of the multilayer electroplating layer far away from the substrate to become the appearance layer of the conductive terminal.
Preferably, the layer of gold has a thickness of 1 inch to 40 inches.
Preferably, the platinum alloy layer and the other platinum alloy layer are platinum-ruthenium alloy layers respectively, wherein the ruthenium content is 1% -3%.
Preferably, the platinum alloy layer and the other platinum alloy layer are platinum-rhodium alloy layers respectively, wherein the rhodium content is 3% -5%.
Preferably, the platinum alloy layer and the other platinum alloy layer are platinum-palladium alloy layers respectively, wherein the palladium content is 15% -20%.
Preferably, the Vickers hardness of the platinum alloy layer and the other platinum alloy layer is HV 500-HV 650.
Preferably, the Vickers hardness of the platinum layer is HV 400-HV 550.
Preferably, the thickness of the copper layer is 10 inches to 80 inches, the thickness of the nickel or nickel alloy layer is 1 inch to 600 inches, the thickness of the silver, palladium alloy or nickel alloy layer is 1 inch to 100 inches, and the thickness of the platinum alloy layer and the platinum layer or the other platinum alloy layer is 1 inch to 100 inches respectively.
Preferably, the nickel or nickel alloy layer is a nickel tungsten alloy layer, a nickel phosphorus alloy layer, a nickel cobalt alloy layer, a nickel palladium alloy layer or a nickel tin alloy layer.
Preferably, the conductive terminal is a blanking terminal, a bent terminal, a pogo pin terminal or a crown spring terminal.
Preferably, the material of the base material is copper or a copper alloy.
Preferably, the silver, palladium alloy or nickel alloy layer includes a palladium-nickel alloy layer, and the Vickers hardness of the palladium-nickel alloy layer is HV 600-HV 750.
Based on the above, the docking section of the conductive terminal is configured with the copper layer, the nickel or nickel alloy layer, the silver, the palladium alloy or the nickel alloy layer, the platinum alloy layer, and the platinum layer or another platinum alloy layer on the surface of the substrate, in addition to simplifying the structural characteristics of the multi-layer electroplated layer in the prior art, the docking section further is further configured with the platinum alloy layer and the platinum layer respectively on two opposite stacking sides of the silver, the palladium alloy or the nickel alloy layer, or is configured with two platinum alloy layers (i.e., the platinum alloy layer and the another platinum alloy layer) respectively on the two opposite stacking sides, so as to provide the conductive terminal with the functions of electrolytic corrosion resistance, chemical corrosion resistance, and abrasion resistance (abrasion loss resistance).
Drawings
Fig. 1 is a schematic view of a plating structure of a conductive terminal according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of an electrical connector according to an embodiment of the present invention.
Fig. 3 is a schematic view of one of the terminals of the electrical connector of fig. 2.
Fig. 4 is a schematic diagram of an electrical connector according to another embodiment of the present invention.
Fig. 5 is a schematic view of one of the terminals of the electrical connector of fig. 4.
FIG. 6 and FIG. 7 are schematic views of the plating structures according to different embodiments.
Description of the symbols
20. 30: electric connector
21. 31 insulating body
22. 32, 100 conductive terminal
110 base material
120 copper layer
130 layer of nickel or nickel alloy
140 layer of silver, palladium alloy or nickel alloy
150 platinum alloy layer
160 platinum layer
170. 180 gold layer
311 inner side surface
A1, B1 welding segment
A2, B2 butt joint section
A21, B21 contact zone
A3, B3 connecting segment
CT, CT1, CT2 multilayer plating layer
S1, S2 stacking side.
Detailed Description
Fig. 1 is a schematic view of a plating structure of a conductive terminal according to an embodiment of the present invention. Referring to fig. 1, in the present embodiment, the conductive terminal 100 is suitable for an electrical connector, and includes a substrate 110 and a plurality of plated layers CT disposed thereon, wherein the plurality of plated layers CT are stacked from a surface of the substrate 110 and include: the copper layer 120, the nickel (element) or the nickel alloy layer 130, the silver (element), the palladium alloy or the nickel alloy layer 140, wherein in particular a platinum alloy layer is further arranged on one of the two opposite stacking sides of the silver, palladium alloy or nickel alloy layer 140 and a platinum layer or another platinum alloy layer is further arranged on the other of the two opposite stacking sides of the silver, palladium alloy or nickel alloy layer 140.
Further, taking fig. 1 as an example, the silver, palladium alloy or nickel alloy layer 140 has two stacking sides S1, S2 opposite to each other, wherein the stacking side S1 is adjacent to the substrate 110, and the stacking side S2 is away from the substrate 110. In the present embodiment, the platinum alloy layer 150 is disposed on the stacking side S1, the platinum layer 160 is disposed on the stacking side S2, and the platinum alloy layer 150 on the stacking side S1 is disposed between the nickel or nickel alloy layer 130 and the silver, palladium alloy or nickel alloy layer 140.
Furthermore, the multilayer electroplated layer CT of the present embodiment further includes a plurality of gold layers 170, and the gold layers 170 are respectively sandwiched between any two adjacent layers of the nickel or nickel alloy layer 130, the silver, palladium alloy or nickel alloy layer 140, the platinum alloy layer 150, and the platinum layer 160. In other words, the three gold layers 170 of the present embodiment include two gold layers 170 on the stacking side S1 of the ag, pd alloy or ni alloy layer 140, and another gold layer 170 on the stacking side S2 of the ag, pd alloy or ni alloy layer 140. In addition, the multilayer plating layer CT of the present embodiment further includes a gold layer 180, which is the outermost layer of the multilayer plating layer CT far from the substrate 110 to become an appearance layer of the conductive terminal 100, so as to provide the conductive terminal 100 with visual aesthetics.
In the present embodiment, the thickness of the copper layer 120 is 10 inches to 80 inches, the thickness of the nickel or nickel alloy layer 130 is 1 inch to 600 inches, the thickness of the silver, palladium alloy or nickel alloy layer 140 is 1 inch to 100 inches, and the thicknesses of the platinum alloy layer 150 and the platinum layer 160 are 1 inch to 100 inches, respectively. The thickness of the gold layer 170 is 1 to 40 inches, respectively, and the thickness of the gold layer 180 as the appearance layer is 3 inches.
In detail, the material of the substrate 110 of the conductive terminal 100 is copper or its alloy, and is a plate made of copper or other structural members with different shapes, which depends on the type of the electrical connector for which the conductive terminal 100 is adapted. Further, the copper layer 120 is disposed on the surface of the substrate 110, which is used to primarily provide surface-filling for the substrate 110 and also serves to enhance the adhesion strength of the subsequent plating layer. In short, the substrate 110 needs to be processed by stamping, bending or molding to form the shape of the conductive terminal 100, so that the surface of the substrate 110 is easily damaged during the processing, and the copper layer 120 can provide an initial repairing effect on the surface of the substrate 110.
Next, the conductive terminal 100 is disposed on the copper layer 120 by a nickel or nickel alloy layer 130. Here, the nickel or nickel alloy layer 130 is a nickel-tungsten alloy layer, a nickel-phosphorus alloy layer, a nickel-cobalt alloy layer or a nickel-tin alloy layer, and excludes a nickel-palladium alloy layer or a palladium-nickel alloy layer, so that the corrosion resistance of the nickel or nickel alloy layer can also provide a preliminary protection effect for the substrate 110 and the copper layer 120 covered by the nickel or nickel alloy layer, and can also provide an isolation effect for a subsequent electroplated layer, so as to prevent impurities on the substrate 110 from affecting the plating process and quality of the subsequent electroplated layer.
Next, a gold layer 170 is disposed on the nickel or nickel alloy layer 130, and then a platinum alloy layer 150 is disposed on the gold layer 170. The gold layer 170 has good ductility, and can reduce the internal stress between the electroplated layers or be used as a buffer layer to effectively improve the structural strength of the multi-layer electroplated layer CT, and prevent the occurrence of cracks and even peeling-off due to the excessively thick electroplated layer, and the subsequent gold layer 170 has the characteristics as described herein.
More importantly, a platinum alloy layer 150, a gold layer 170, silver, palladium alloy or nickel alloy layer 140, a gold layer 170 and a platinum layer 160 are sequentially disposed on the nickel or nickel alloy layer 130, wherein the gold layer 170 is not described in detail. The platinum alloy layer 150 of the present embodiment, particularly the platinum-ruthenium alloy layer, has a ruthenium content of 1% to 3%, and a vickers hardness of HV500 to HV650, and thus has an anti-wear characteristic, such that the conductive terminal 100 can cope with wear when being butted with a conductive terminal (not shown) of an electric connector of a hand. Similarly, the platinum layer 160 of the present embodiment also has similar wear resistance characteristics due to its Vickers hardness of HV 400-HV 550. Similarly, the silver, palladium alloy or nickel alloy layer 140 particularly further includes a palladium-nickel alloy layer, and the vickers hardness of the palladium-nickel alloy layer is HV600 to HV750, so as to further improve the wear resistance of the conductive terminal 100. For example, when an abrasion resistance test (Bosch-Weinmann) is performed, the palladium-nickel alloy layer plating film has an abrasion thickness of 2.6 μm/1000strokes, and the platinum-ruthenium alloy layer plating film has an abrasion thickness of 2.1 μm/1000 strokes.
In another embodiment, the platinum alloy layer 150 can also be a platinum-rhodium alloy layer, wherein the rhodium content is 3% to 5%. In yet another embodiment, the platinum alloy layer 150 can also be a platinum palladium alloy layer, wherein the palladium content is 15% to 20%. In short, the platinum alloy layer 150 of the present invention may be selected from the above three.
In addition, the silver, palladium alloy or nickel alloy layer 140, the platinum alloy layer 150 and the platinum layer 160 can also improve the corrosion resistance effect required by the conductive terminal 100. For example, moisture may exist in the environment of the electrical connector, or even when a user accidentally turns over a beverage, the moisture or the beverage may easily corrode the conductive terminal 100 due to an electrochemical reaction caused by electrical conduction during the operation of the electrical connector, so that the conductive terminal 100 using the multi-layer electroplated layer CT of the present embodiment can effectively improve the tolerance and the service life thereof.
Fig. 2 is a schematic diagram of an electrical connector according to an embodiment of the present invention. Fig. 3 is a schematic view of one of the terminals of the electrical connector of fig. 2. Referring to fig. 2 and fig. 3, in the present embodiment, the aforementioned multi-layer plating layer CT is applied to the electrical connector 20, as shown in fig. 2, the electrical connector 20 includes an insulating body 21 and a plurality of conductive terminals 22 disposed thereon, the conductive terminals 22 are, for example, bent terminals, and each conductive terminal 22 is further divided into a soldering section B1, a butting section B2 and a connecting section B3 as shown in fig. 3, wherein the electrical connector 20 is, for example, a socket connector, the soldering section B1 is, for example, used for soldering on a circuit board (not shown), the connecting section B3 is connected between the soldering section B1 and the butting section B2, and the connecting section B3 substantially penetrates through the insulating body 21. Accordingly, the multi-layer plating layer CT of the present embodiment is suitable for being disposed in the contact region B21 of the mating segment B2, i.e. the portion of the insulating body 21 exposed, so as to enable the contact region B21 to maintain its electrical conductivity when mating with another conductive terminal of another electrical connector, and to have the required wear resistance and corrosion resistance due to the multi-layer plating layer CT.
Fig. 4 is a schematic diagram of an electrical connector according to another embodiment of the present invention. Fig. 5 is a schematic view of one of the terminals of the electrical connector of fig. 4. Referring to fig. 4 and 5, the electrical connector 30 of the present embodiment is, for example, a socket connector, which includes an insulating body 31 and a plurality of conductive terminals 32, the conductive terminals 32 are, for example, blanking terminals, and each conductive terminal 32 is further divided into a welding section a1, a butt section a2 and a connecting section A3, the connecting section A3 is connected between the welding section a1 and the butt section a2, and the butt section a2 has a contact area a21 exposing the inner side 311 of the insulating body 31 to be electrically connected to another conductive terminal of another electrical connector, so that the contact area a21 of the present embodiment is configured with the aforementioned multi-layer plating layer CT, so that the conductive terminal 32 has wear resistance and corrosion resistance in the contact area a 21.
In addition to the embodiments shown in fig. 2 to 5, the multi-layer plated layer CT disclosed in the present invention can be further applied to a pogo pin terminal (pogo pin) or a crown spring terminal (crown spring terminal), that is, the multi-layer plated layer CT is disposed in the electrical contact area of the terminal.
FIG. 6 and FIG. 7 are schematic views of the plating structures according to different embodiments.
Referring to fig. 6 and comparing fig. 1, unlike the previous embodiment, the multi-layer plating layer CT1 of the present embodiment is formed by disposing two platinum alloy layers 150 on two opposite stacking sides S1 and S2 of a silver, palladium alloy or nickel alloy layer 140, wherein the two platinum alloy layers 150 can be selected from a platinum-ruthenium alloy layer, a platinum-rhodium alloy layer and a platinum-palladium alloy layer, respectively, so as to have the characteristics of improving wear resistance and corrosion resistance, and the rest of the plating layers are the same as those of the previous embodiment and are not repeated.
Referring to fig. 7 and referring to fig. 1 or fig. 6, the difference between the present embodiment and the previous embodiment is that the platinum layer 160 is disposed on the stacking side S1 of the silver, palladium alloy or nickel alloy layer 140 and is adjacent to the substrate 110, and the platinum alloy layer 150 is disposed on the stacking side S2 of the silver, palladium alloy or nickel alloy layer 140 and is away from the substrate 110, and the rest of the plating layers are the same as those in the previous embodiment and are not repeated.
Based on the above embodiments, it is clear that two layers of plating layers with specific wear and corrosion resistance are required to be present on the two opposite stacked sides S1, S1 of the ag, pd or ni alloy layer 140, and at least one of the two layers is the pt alloy layer 150.
To sum up, the butt-joint section of the conductive terminal is configured with a copper layer, a nickel or nickel alloy layer, a silver, palladium alloy or nickel alloy layer, a platinum alloy layer, and a platinum layer or another platinum alloy layer on the surface of the substrate, and besides simplifying the structural characteristics of the multilayer electroplated layer in the prior art, the two opposite stacking sides of the silver, palladium alloy or nickel alloy layer are further respectively provided with the platinum alloy layer and the platinum layer, or the two opposite stacking sides are respectively provided with the two platinum alloy layers, wherein particularly, the platinum alloy layer is particularly a platinum-ruthenium alloy layer, so as to provide better functions of resisting electrolytic corrosion, chemical corrosion and abrasion (abrasion wear) for the conductive terminal.
Claims (14)
1. An electrically conductive terminal adapted for use in an electrical connector, the electrically conductive terminal having a mating section for electrically mating with an electrically conductive terminal of another electrical connector, the mating section comprising a substrate and a plurality of electroplated layers disposed on the substrate, the electrically conductive terminal comprising:
a copper layer disposed on a surface of the substrate;
a nickel or nickel alloy layer disposed over the copper layer;
a silver, palladium alloy or nickel alloy layer disposed over the nickel or nickel alloy layer;
a platinum alloy layer disposed on one of two opposing stacked sides of the silver, palladium alloy or nickel alloy layer; and
a platinum layer or another platinum alloy layer disposed on the other of the opposing two stacked sides of the silver, palladium alloy or nickel alloy layer.
2. An electrically conductive terminal as claimed in claim 1, wherein: the multilayer electroplated layer also comprises a multilayer gold layer which is respectively sandwiched between any two adjacent layers of the nickel or nickel alloy layer, the silver, palladium alloy or nickel alloy layer, the platinum layer or another platinum alloy layer.
3. An electrically conductive terminal as claimed in claim 1, wherein: the multilayer electroplated layer also comprises a gold layer which is the outermost layer of the multilayer electroplated layer far away from the base material so as to become the appearance layer of the conductive terminal.
4. An electrically conductive terminal as claimed in claim 2 or 3, wherein: each of the gold layers is 1 inch to 40 inches thick.
5. An electrically conductive terminal as claimed in claim 1, wherein: the platinum alloy layer or the further platinum alloy layer is a platinum ruthenium alloy layer.
6. An electrically conductive terminal as claimed in claim 1, wherein: the platinum alloy layer or the further platinum alloy layer is a platinum rhodium alloy layer.
7. An electrically conductive terminal as claimed in claim 1, wherein: the platinum alloy layer or the further platinum alloy layer is a platinum palladium alloy layer.
8. An electrically conductive terminal as claimed in claim 1, wherein: the Vickers hardness of the platinum alloy layer and the other platinum alloy layer is HV 500-HV 650.
9. An electrically conductive terminal as claimed in claim 1, wherein: the Vickers hardness of the platinum layer is HV 400-HV 550.
10. An electrically conductive terminal as claimed in claim 1, wherein: the copper layer is from 10 inches to 80 inches thick, the nickel or nickel alloy layer is from 1 inch to 600 inches thick, the silver, palladium alloy or nickel alloy layer is from 1 inch to 100 inches thick, and the platinum alloy layer and the platinum layer or the further platinum alloy layer are each from 1 inch to 100 inches thick.
11. An electrically conductive terminal as claimed in claim 1, wherein: the nickel or nickel alloy layer is a nickel-tungsten alloy layer, a nickel-phosphorus alloy layer, a nickel-cobalt alloy layer, a nickel-palladium alloy layer or a nickel-tin alloy layer.
12. An electrically conductive terminal as claimed in claim 1, wherein: the conductive terminal is a blanking terminal, a bending terminal, a spring pin terminal or a crown spring terminal.
13. An electrically conductive terminal as claimed in claim 1, wherein: the material of the base material is copper or an alloy thereof.
14. An electrically conductive terminal as claimed in claim 1, wherein: the silver, palladium alloy or nickel alloy layer comprises a palladium-nickel alloy layer, and the Vickers hardness of the palladium-nickel alloy layer is HV 600-HV 750.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220098546.5U CN217334454U (en) | 2022-01-14 | 2022-01-14 | Conductive terminal |
| TW111213728U TWM640592U (en) | 2022-01-14 | 2022-12-12 | Electrical conducting terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220098546.5U CN217334454U (en) | 2022-01-14 | 2022-01-14 | Conductive terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217334454U true CN217334454U (en) | 2022-08-30 |
Family
ID=82993435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220098546.5U Active CN217334454U (en) | 2022-01-14 | 2022-01-14 | Conductive terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN217334454U (en) |
| TW (1) | TWM640592U (en) |
-
2022
- 2022-01-14 CN CN202220098546.5U patent/CN217334454U/en active Active
- 2022-12-12 TW TW111213728U patent/TWM640592U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWM640592U (en) | 2023-05-01 |
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