CN219873564U - Etching device - Google Patents

Etching device Download PDF

Info

Publication number
CN219873564U
CN219873564U CN202320664773.4U CN202320664773U CN219873564U CN 219873564 U CN219873564 U CN 219873564U CN 202320664773 U CN202320664773 U CN 202320664773U CN 219873564 U CN219873564 U CN 219873564U
Authority
CN
China
Prior art keywords
etching
unit
connecting pipe
tank body
solar cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202320664773.4U
Other languages
Chinese (zh)
Inventor
吴廷斌
杨欣
冯良波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Haoshen Intelligent Technology Co ltd
Original Assignee
Suzhou Haoshen Intelligent Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Haoshen Intelligent Technology Co ltd filed Critical Suzhou Haoshen Intelligent Technology Co ltd
Priority to CN202320664773.4U priority Critical patent/CN219873564U/en
Application granted granted Critical
Publication of CN219873564U publication Critical patent/CN219873564U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • ing And Chemical Polishing (AREA)

Abstract

The utility model relates to an etching device which is used for etching after electroplating of a solar cell, and comprises a tank body unit, a solar cell etching device and a solar cell etching device, wherein the tank body unit comprises an etching tank, and a spraying device is arranged in the etching tank; the regeneration unit comprises a containing cavity, an anode plate unit and a cathode plate unit are arranged in the containing cavity, a first connecting pipe and a second connecting pipe are arranged between the containing cavity and the etching tank, the first connecting pipe is connected with the spraying device, and a valve is arranged on the second connecting pipe; a power supply unit connected to the regeneration unit; and the monitoring unit is connected with the tank body unit and the power supply unit. The utility model can ensure that the solar cell always maintains higher etching precision in the etching process, and the concentration parameter of the etching liquid is also in a better state, thereby effectively improving the etching effect and the etching quality of the solar cell. The etching liquid consumption is reduced, meanwhile, the energy is effectively saved, the pollution emission is reduced, and compared with the prior art, the emission is reduced to 1/5.

Description

Etching device
Technical Field
The utility model relates to the technical field of etching after electroplating of solar cells, in particular to an etching device.
Background
In the prior art, when etching is performed after solar cell electroplating, a traditional etching device is generally used, and the liquid medicine is pumped to a pipeline nozzle and then sprayed to the surface of the solar cell so as to achieve the purpose of etching and removing an electroplating seed layer.
However, under the existing device and mode, the etching precision can only be realized by adjusting the pumping pressure, the accurate control is difficult to realize, the excessive etching is easy to cause, the normal copper electroplating layer is damaged, meanwhile, the use amount of the etching liquid medicine is large, when the copper ion content in the etching liquid medicine reaches a certain value, namely when the copper ion content in the etching liquid medicine reaches a certain value, about 45G/L can reach saturation, the etching efficiency at the moment is very low, the etching liquid medicine needs to be replaced regularly (about one week), the time for 4-5 hours is required in the replacement process, the waste of resources is caused, the production stagnation is also brought, and the discharge amount generated by adopting the device and the method in the prior art is large, so that the environment is polluted, and the device and the method are not friendly to the environment.
Disclosure of Invention
Therefore, the technical problem to be solved by the utility model is to overcome the defects in the prior art, and provide the etching device which is used for etching after electroplating of the solar cell, achieves the purpose of rapidly etching the seed layer of the solar cell by atomizing the etching solution, realizes the recycling of the liquid medicine through the regeneration unit, reduces the consumption of the liquid medicine and reduces the pollution discharge amount, thereby effectively saving energy and reducing the pollution to the environment.
In order to solve the technical problems, the utility model provides an etching device for etching after electroplating a solar cell, which comprises,
the groove body unit comprises an etching groove, and a spraying device is arranged in the etching groove;
the regeneration unit comprises a containing cavity, an anode plate unit and a cathode plate unit are arranged in the containing cavity, a first connecting pipe and a second connecting pipe are arranged between the containing cavity and the etching tank, the first connecting pipe is connected with the spraying device, and a valve is arranged on the second connecting pipe;
a power supply unit connected to the regeneration unit;
and the monitoring unit is connected with the tank body unit and the power supply unit and comprises a hydrometer device.
Preferably, the spraying device comprises a spray pipe and a two-fluid atomization device, the spray pipe is connected with the two-fluid atomization device, and the spray pipe is connected with the first connecting pipe.
Preferably, the anode plate unit includes a plurality of anode plates, the cathode plate unit includes a plurality of cathode plates, and the plurality of anode plates and the plurality of cathode plates are alternately disposed in the accommodating chamber.
Preferably, the etching tank comprises a first tank body and a second tank body which are communicated with each other, the height of the second tank body is smaller than that of the first tank body, and the spraying device is arranged in the first tank body.
Preferably, the height of the accommodating cavity is lower than the height of the second groove body.
Preferably, an overflow port is arranged at the top of the accommodating cavity, and the second connecting pipe is connected with the overflow port.
Preferably, the first connecting pipe is provided with a circulating pump.
Preferably, the tank unit is further provided with a filter device, and the filter device is connected with the first connecting pipe.
Preferably, the power supply unit comprises a rectifier.
Preferably, an observation window is arranged at the top of the second groove body.
Compared with the prior art, the technical scheme of the utility model has the following advantages:
according to the etching device, the tank body unit, the regeneration unit, the power supply unit and the monitoring unit are arranged, etching liquid can be led out from the regeneration unit through the circulating pump and sprayed to the upper surface and the lower surface of the solar cell to be etched through the spraying device, copper on the surface of the solar cell is oxidized into copper ions after oxidation-reduction reaction and is dissolved in the etching liquid, the monitoring unit is used for monitoring the copper ions in the etching liquid, when the concentration of the copper ions in the etching liquid reaches a certain value, the regeneration unit is started, the valve of the second connecting pipe is opened, the etching liquid overflows into the accommodating cavity of the regeneration unit through the second connecting pipe, and the etching liquid, the anode plate unit and the cathode plate unit perform oxidation-reduction reaction, so that the copper ions in the etching liquid are reduced into copper. By the etching device, the solar cell can always maintain higher etching precision in the etching process, and meanwhile, the concentration parameter of the etching liquid is also in a better state, so that the etching effect and the etching quality of the solar cell can be effectively improved. The etching liquid consumption is reduced, meanwhile, the energy is effectively saved, the pollution emission is reduced, and compared with the prior art, the emission is reduced to 1/5.
Drawings
In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which
Fig. 1 is a schematic structural view of a preferred embodiment of the present utility model.
Description of the specification reference numerals: 1. a receiving chamber; 11. a first connection pipe; 12. a second connection pipe; 13. a circulation pump; 31. a first tank body; 32. a second tank body; 33. and an observation window.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the utility model and practice it.
Examples
Referring to fig. 1, the present utility model discloses an etching apparatus for post-plating etching of a solar cell, comprising,
the solar cell comprises a cell body unit and a solar cell body unit, wherein the cell body unit comprises an etching cell, a spraying device is arranged in the etching cell, and a solar cell piece to be etched is arranged in the etching cell;
the regeneration unit comprises a containing cavity 1, an anode plate unit and a cathode plate unit are arranged in the containing cavity 1, a first connecting pipe 11 and a second connecting pipe 12 are arranged between the containing cavity 1 and the etching tank, the first connecting pipe 11 is connected with the spraying device, a circulating pump 13 is arranged on the first connecting pipe 11, and an overflow valve is arranged on the second connecting pipe 12, so that the circulating pump 13 can pump the etching solution in the containing cavity 1 into the etching tank;
a power supply unit 2 connected to the regeneration unit;
and the monitoring unit is connected with the tank body unit and the power supply unit and comprises a hydrometer device which is used for monitoring the concentration of copper ions in the etching tank.
It can be seen that the etching device to be protected is provided with the tank body unit, the regeneration unit, the power supply unit and the monitoring unit, the etching solution can be led out from the regeneration unit through the circulating pump and sprayed to the upper surface and the lower surface of the solar cell to be etched through the spraying device, copper on the surface of the solar cell is oxidized into copper ions after oxidation-reduction reaction and is dissolved in the etching solution, the monitoring unit monitors the copper ions in the etching solution, when the concentration of the copper ions in the etching solution reaches a certain value, the regeneration unit is started, the valve of the second connecting pipe is opened, the etching solution overflows into the accommodating cavity of the regeneration unit through the second connecting pipe, and the etching solution, the anode plate unit and the cathode plate unit perform oxidation-reduction reaction, so that the copper ions in the etching solution are reduced into copper. By the etching device, the solar cell can always maintain higher etching precision in the etching process, and meanwhile, the concentration parameter of the etching liquid is also in a better state, so that the etching effect and the etching quality of the solar cell can be effectively improved. The etching liquid consumption is reduced, meanwhile, the energy is effectively saved, the pollution emission is reduced, and compared with the prior art, the emission is reduced to 1/5.
In detail, the spraying device comprises a spraying pipe and a two-fluid atomization device, the spraying pipe is connected with the two-fluid atomization device, etching liquid is atomized by the two-fluid atomization device and then sprayed onto the solar cell panel, so that the spraying uniformity of the etching liquid is ensured, and meanwhile, the spraying pipe is connected with the first connecting pipe 11.
It should be noted that, still be equipped with filter equipment in the cell body unit, filter equipment links to each other with first connecting pipe 11, filter equipment still with the spray tube links to each other, etching solution is through filter equipment filters the back, and rethread spray tube reaches two fluid atomizing equipment, atomizes the back, sprays to the upper and lower surface of solar wafer.
Further, the anode plate unit includes a plurality of anode plates, the cathode plate unit includes a plurality of cathode plates, and a plurality of anode plates and a plurality of cathode plates are alternately disposed in the accommodating cavity 1, that is, an anode plate, a cathode plate, an anode plate, and a cathode plate … … are sequentially disposed.
Further, the etching tank includes a first tank body 31 and a second tank body 32 which are mutually communicated, the height of the second tank body 32 is smaller than that of the first tank body 31, and the spraying device is arranged in the first tank body 31.
It should be noted that the height of the accommodating cavity 1 is lower than the height of the second groove 32. The top of the accommodating cavity 1 is provided with an overflow port, and the second connecting pipe 12 is connected with the overflow port, so that the liquid in the etching groove can flow into the accommodating cavity 1 through the second connecting pipe 12.
Specifically, the power supply unit 2 includes a rectifier, the rectifier is connected to the regeneration unit, and the rectifier is further connected to the hydrometer device, so that the electrolyte concentration in the etching bath is monitored by the hydrometer device, and the data is sent to the rectifier, and after the rectifier obtains the electrolyte concentration data, the regeneration unit is controlled to operate by internal software.
In addition, the top of the second tank body 32 is provided with an observation window 33, and the observation window 33 can facilitate the operator to observe the situation in the etching tank.
The working principle and the working process of the utility model are as follows:
and (3) leading the etching solution out of the accommodating cavity 1 by using a circulating pump, filtering the etching solution by using a filtering device, atomizing the etching solution by using a two-fluid atomizing device, spraying the atomized etching solution onto the upper and lower surfaces of the solar cell, oxidizing copper on the surface of the solar cell into copper ions by using oxidation-reduction reaction, and dissolving the copper ions in the etching solution.
And monitoring the concentration of copper ions in the etching solution, when the concentration of the copper ions reaches a certain value, starting the regeneration unit, opening the overflow valve, enabling the etching solution to flow into the accommodating cavity of the regeneration unit, and reducing the copper ions in the etching solution into copper, thereby achieving the purpose that the etching solution can be used for a long time.
In the subsequent production, the device and the method of the utility model are continuously adopted, thereby ensuring that the etching precision is always at a higher level, and further ensuring the etching effect and the etching quality. The etching device can realize high-precision etching, the etching precision can reach the nano level, the long-term recycling of the liquid medicine can be realized, and the liquid medicine can be replaced once in about 3 months according to the data obtained in actual production, so that the discharge of the etching liquid is greatly reduced while the working efficiency is improved.
In summary, the etching device to be protected in the present utility model is provided with a tank unit, a regeneration unit, a power supply unit and a monitoring unit, wherein the etching solution can be led out from the regeneration unit through a circulating pump and sprayed to the upper surface and the lower surface of the solar cell to be etched through a spraying device, copper on the surface of the solar cell is oxidized into copper ions after oxidation-reduction reaction and is dissolved in the etching solution, the monitoring unit monitors the copper ions in the etching solution, when the concentration of the copper ions in the etching solution reaches a certain value, the regeneration unit is started, the valve of the second connecting pipe is opened, the etching solution overflows into the accommodating cavity of the regeneration unit through the second connecting pipe, and the etching solution, the anode plate unit and the cathode plate unit perform oxidation-reduction reaction, so that the copper ions in the etching solution are reduced into copper. By the etching device, the solar cell can always maintain higher etching precision in the etching process, and meanwhile, the concentration parameter of the etching liquid is also in a better state, so that the etching effect and the etching quality of the solar cell can be effectively improved. The etching liquid consumption is reduced, meanwhile, the energy is effectively saved, the pollution emission is reduced, and compared with the prior art, the emission is reduced to 1/5.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present utility model will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.

Claims (10)

1. An etching device for etching after solar cell electroplating, which is characterized in that: comprising the steps of (a) a step of,
the groove body unit comprises an etching groove, and a spraying device is arranged in the etching groove;
the regeneration unit comprises a containing cavity, an anode plate unit and a cathode plate unit are arranged in the containing cavity, a first connecting pipe and a second connecting pipe are arranged between the containing cavity and the etching tank, the first connecting pipe is connected with the spraying device, and a valve is arranged on the second connecting pipe;
a power supply unit connected to the regeneration unit;
and the monitoring unit is connected with the tank body unit and the power supply unit and comprises a hydrometer device.
2. An etching apparatus according to claim 1, wherein: the spray device comprises a spray pipe and a two-fluid atomization device, wherein the spray pipe is connected with the two-fluid atomization device, and the spray pipe is connected with the first connecting pipe.
3. An etching apparatus according to claim 1, wherein: the anode plate unit comprises a plurality of anode plates, the cathode plate unit comprises a plurality of cathode plates, and the anode plates and the cathode plates are alternately arranged in the accommodating cavity.
4. An etching apparatus according to claim 1, wherein: the etching tank comprises a first tank body and a second tank body which are communicated with each other, the height of the second tank body is smaller than that of the first tank body, and the spraying device is arranged in the first tank body.
5. An etching apparatus according to claim 4, wherein: the height of the accommodating cavity is lower than that of the second groove body.
6. An etching apparatus according to claim 5, wherein: the top of the accommodating cavity is provided with an overflow port, and the second connecting pipe is connected with the overflow port.
7. An etching apparatus according to claim 1, wherein the first connecting pipe is provided with a circulation pump.
8. An etching apparatus according to claim 1, wherein: the tank body unit is also provided with a filter device, and the filter device is connected with the first connecting pipe.
9. An etching apparatus according to claim 1, wherein: the power supply unit includes a rectifier.
10. An etching apparatus according to claim 4, wherein: and an observation window is arranged at the top of the second groove body.
CN202320664773.4U 2023-03-30 2023-03-30 Etching device Active CN219873564U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320664773.4U CN219873564U (en) 2023-03-30 2023-03-30 Etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320664773.4U CN219873564U (en) 2023-03-30 2023-03-30 Etching device

Publications (1)

Publication Number Publication Date
CN219873564U true CN219873564U (en) 2023-10-20

Family

ID=88320593

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320664773.4U Active CN219873564U (en) 2023-03-30 2023-03-30 Etching device

Country Status (1)

Country Link
CN (1) CN219873564U (en)

Similar Documents

Publication Publication Date Title
CN102586851B (en) Electrolytic method for relieving and reducing tin sludge generated in tin plating solution
CN106929857A (en) Cupric acidity etching liquid recycling equipment for reclaiming and method
TW201821654A (en) Acid copper electroplating process using insoluble anode and equipment therefor
CN219873564U (en) Etching device
CN111235623A (en) Electrochemical etching method for titanium or titanium alloy surface
CN202401147U (en) Electrolyte circulating system
CN106745538A (en) Elemental phosphorous method is reclaimed in a kind of waste water from hypophosphites
CN117721511A (en) Semiconductor wafer electrochemical deposition equipment capable of rapidly supplementing metal ions
CN212476405U (en) Water quality regulation and control system
CN201047832Y (en) Tester of observing anode bottom palm air bubble action under electrolysis condition
CN102154793A (en) Dyeing apparatus for electrochemical reduction of cotton yarns
CN108217856A (en) A kind of electro-chemical water processing system and its method for treating water
CN113668017A (en) High-purity indium apparatus for producing
CN214088729U (en) Wafer horizontal electroplating device
CN208182670U (en) A kind of electro-chemical water processing system
CN113026041A (en) Hydrogen storage device for preparing sodium borohydride by reducing sodium metaborate based on jet electrochemical device
CN202170371U (en) Device combining coarsening production and trivalent chromium electrolysis technology
CN201857437U (en) Electrolysis device used in client-to-client protocol (CTcP) board manufacture
CN115787011B (en) Electroplating solution and electroplating method for preparing platinum coating on surface of titanium current collector for hydrogen production by water electrolysis
CN111621829A (en) Method and equipment for ceramic surface treatment of aluminum alloy with high Cu content and/or Si content
CN115029700B (en) Preparation method of corrosion-resistant coating electrode for circulating external drainage desalination
CN217378052U (en) Circulating device for electrolyte in copper electrolysis induction copper removal tank
CN217948314U (en) Liquid medicine exchanging anode box
CN210596300U (en) Electrophoresis production line electrophoresis tank circulation system
CN206814844U (en) Cupric acidity etching liquid recycling equipment for reclaiming

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant