CN219873449U - Feeding and discharging mechanism for wafer box and full-automatic wet single wafer cleaning equipment - Google Patents
Feeding and discharging mechanism for wafer box and full-automatic wet single wafer cleaning equipment Download PDFInfo
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- CN219873449U CN219873449U CN202321005762.1U CN202321005762U CN219873449U CN 219873449 U CN219873449 U CN 219873449U CN 202321005762 U CN202321005762 U CN 202321005762U CN 219873449 U CN219873449 U CN 219873449U
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- 238000004140 cleaning Methods 0.000 title claims abstract description 23
- 230000007246 mechanism Effects 0.000 title claims abstract description 23
- 238000007599 discharging Methods 0.000 title claims description 4
- 238000001514 detection method Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 101
- 238000004891 communication Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to the technical field of cleaning, and particularly relates to a loading and unloading mechanism for a wafer box and full-automatic wet single wafer cleaning equipment, wherein the full-automatic wet single wafer cleaning equipment comprises a platform and a limiting assembly, the limiting assembly is arranged on the top surface of the platform, and the limiting assembly is suitable for limiting the wafer box when the wafer box is placed on the platform; the rotating assembly is arranged on the bottom surface of the platform and is suitable for driving the platform to rotate so as to drive the wafer box to rotate; the wafer box is limited, so that the wafer box is prevented from shaking when the wafer box is driven to rotate, and the angle of the wafer box can be adjusted by rotating the wafer box, so that the wafer can be placed into the wafer box by the manipulator.
Description
Technical Field
The utility model belongs to the technical field of cleaning, and particularly relates to a loading and unloading mechanism for a wafer box and full-automatic wet single wafer cleaning equipment.
Background
In the cleaning industry, a material piece to be cleaned is sent to a position required by grabbing by a manipulator in a full-automatic wet single wafer cleaning device by using the manipulator to convey the material piece to the wafer box in a loading and unloading manner and rotate a fixed angle. The robot may not grasp the location where the wafer cassette is manually placed.
Therefore, based on the above technical problems, a new loading and unloading mechanism for a wafer box and a full-automatic wet single wafer cleaning device are needed to be designed.
Disclosure of Invention
The utility model aims to provide a loading and unloading mechanism for a wafer box and full-automatic wet single wafer cleaning equipment, so as to solve the technical problem that wafers cannot be placed due to the fact that the wafer box cannot be moved.
In order to solve the above technical problems, the present utility model provides a loading and unloading mechanism for a wafer box, including:
a platform, and
the limiting assembly is arranged on the top surface of the platform and is suitable for limiting the wafer box when the wafer box is placed on the platform;
the rotating assembly is arranged on the bottom surface of the platform and is suitable for driving the platform to rotate so as to drive the wafer box to rotate.
Further, the spacing assembly includes: a plurality of limiting blocks;
the limiting block is arranged on the top surface of the platform, and the area surrounded by the limiting block is matched with the wafer box.
Further, the spacing assembly further includes: a pressure sensor;
the pressure sensor is arranged on the bottom surface of the platform, and the detection end of the pressure sensor penetrates through the platform and then is located in an area surrounded by the limiting block.
Further, the rotating assembly includes: a rotary cylinder;
the rotating end of the rotating cylinder is connected with the bottom surface of the platform.
Further, the rotating assembly further includes: a buffer;
the buffer is in contact with the bottom surface of the platform.
Further, the loading and unloading mechanism for the wafer box further comprises: a lifting assembly;
the lifting component is connected with the rotating component;
the lifting component is suitable for driving the rotating component to lift so as to drive the platform to lift.
Further, the lifting assembly includes: a supporting plate and a lifting cylinder;
the lifting cylinder is arranged on the supporting plate;
the telescopic end of the lifting cylinder is connected with the rotating assembly through a connecting rod, namely, the lifting cylinder and the buffer in the rotating assembly are arranged on the connecting rod.
Further, the lifting assembly further comprises: a lifting sensor;
the lifting sensor is arranged on the telescopic end of the lifting cylinder.
Further, a fixed block is arranged on the supporting plate;
a plurality of support rods are arranged on the support plate and connected with the outer cover through the support rods.
On the other hand, the utility model also provides full-automatic wet single wafer cleaning equipment for the loading and unloading mechanism of the wafer box, which comprises the following components:
and the manipulator is suitable for placing the wafer in the wafer box on the loading and unloading mechanism.
The wafer box has the beneficial effects that the wafer box passes through the platform and the limiting assembly, the limiting assembly is arranged on the top surface of the platform, and the limiting assembly is suitable for limiting the wafer box when the wafer box is placed on the platform; the rotating assembly is arranged on the bottom surface of the platform and is suitable for driving the platform to rotate so as to drive the wafer box to rotate; the wafer box is limited, so that the wafer box is prevented from shaking when the wafer box is driven to rotate, and the angle of the wafer box can be adjusted by rotating the wafer box, so that the wafer can be placed into the wafer box by the manipulator.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and drawings.
In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a loading and unloading mechanism for a wafer cassette according to the present utility model;
FIG. 2 is a side view of a loading and unloading mechanism for a wafer cassette of the present utility model;
FIG. 3 is a schematic view of the internal structure of the housing of the present utility model;
fig. 4 is a schematic view of a wafer cassette support according to the present utility model.
In the figure:
1, a platform, 11 limiting blocks and 12 pressure sensors;
2, a rotary cylinder and a 21 buffer;
the device comprises a support plate 3, a lifting cylinder 31, a connecting rod 32, a lifting sensor 33, a fixing block 34, a support rod 35, a housing 36 and a speed regulating valve 37;
4 wafer cassettes.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
As shown in fig. 1 to 4, embodiment 1 provides a loading and unloading mechanism for a wafer cassette, including: the wafer box comprises a platform 1 and a limiting assembly, wherein the limiting assembly is arranged on the top surface of the platform 1 and is suitable for limiting the wafer box 4 when the wafer box 4 is placed on the platform 1; the rotating assembly is arranged on the bottom surface of the platform 1 and is suitable for driving the platform 1 to rotate so as to drive the wafer box 4 to rotate; the limit of the wafer box 4 is realized, so that the wafer box 4 is prevented from shaking when the wafer box 4 is driven to rotate, and the angle of the wafer box 4 can be adjusted by rotating the wafer box 4, so that a wafer can be placed into the wafer box 4 by a mechanical arm.
In this embodiment, the limiting assembly includes: a plurality of limiting blocks 11; the limiting block 11 is arranged on the top surface of the platform 1, and the area surrounded by the limiting block 11 is matched with the wafer box 4; the shape of stopper 11 can with wafer box 4 appearance adaptation to make each stopper 11 enclose the regional can be perfect with wafer box 4 appearance adaptation, place wafer box 4 in the region that stopper 11 encloses, in order to take place rotatory or the lift at platform 1, carry out the spacing through stopper 11 to wafer box 4, avoid wafer box 4 to take place the skew or rock, avoid wafer box 4 in the wafer damage.
In this embodiment, the limiting assembly further includes: a pressure sensor 12; the pressure sensor 12 is arranged on the bottom surface of the platform 1, and the detection end of the pressure sensor 12 passes through the platform 1 and is positioned in the area surrounded by the limiting block 11; the pressure sensor 12 can detect whether the wafer cassette 4 is placed on the platform 1, and by extending the detection end of the pressure sensor 12 out of the platform 1 to be located in the area surrounded by the limiting block 11, when the wafer cassette 4 is placed in the area, the bottom surface of the wafer cassette 4 can be pressed on the detection end of the pressure sensor 12, and when the pressure sensor 12 detects the wafer cassette 4, the placement accuracy of the wafer cassette 4 can be judged.
In this embodiment, the rotating assembly includes: a rotary cylinder 2; the rotating end of the rotating cylinder 2 is connected with the bottom surface of the platform 1; the rotary cylinder 2 can drive the platform 1 to rotate so as to drive the wafer box 4 on the platform 1 to rotate, and the rotary cylinder 2 can enable the wafer box 4 to rotate to a desired angle, so that the wafer can be placed in the wafer box 4 one by the mechanical arm; the rotation angle of the rotary cylinder 2 can be adjusted by 0-180 degrees according to the requirement.
In this embodiment, the rotating assembly further includes: a buffer 21; the buffer 21 is in contact with the bottom surface of the platform 1; the damper 21 can be used to preserve the stability of the rotation process and the absorption of kinetic energy during the rotation of the platform 1 by the revolving cylinder 2, since the lifting process is generally not unexpected and the rotation needs to be stable.
In this embodiment, the loading and unloading mechanism for a wafer box further includes: a lifting assembly; the lifting component is connected with the rotating component; the lifting assembly is suitable for driving the rotating assembly to lift so as to drive the platform 1 to lift; the platform 1 can be lifted to a desired height by the lifting assembly to lift the wafer cassette 4 to a desired height, facilitating the placement of wafers one by one in the wafer cassette 4 by the robot.
In this embodiment, the lifting assembly includes: a support plate 3 and a lifting cylinder 31; the lifting cylinder 31 is arranged on the supporting plate 3; the telescopic end of the lifting cylinder 31 is connected with the rotating assembly through a connecting rod 32, namely the lifting cylinder 31 and the buffer 21 in the rotating assembly are both arranged on the connecting rod 32; can fix lift cylinder 31 through backup pad 3, can set up dustcoat 36 in backup pad 3 to cover lift cylinder 31, avoid lift cylinder 31 to receive collision etc. and cause harm to lift cylinder 31, ensure the lift effect of lift cylinder 31.
In this embodiment, the lifting assembly further includes: a lift sensor 33; the lifting sensor 33 is arranged on the telescopic end of the lifting cylinder 31; the sub-components of the lifting sensor 33 can be arranged on the telescopic end of the lifting cylinder 31, the main component of the lifting cylinder 31 is arranged on the inner wall of the outer cover 36, and when the telescopic end of the lifting cylinder 31 stretches, the lifting cylinder 31 is controlled to regulate the lifting height by mutual signal matching of the sub-components and the main component of the lifting sensor 33, so that the excessive high or the excessively low lowering of the position of the platform 1 is avoided.
In this embodiment, the support plate 3 is provided with a fixing block 34; a plurality of support rods 35 are arranged on the support plate 3, and are connected with a housing 36 through the support rods 35; the supporting plate 3 can be fixed through the fixing block 34 so as to install the feeding and discharging mechanism; the supporting rod 35 supports the outer cover 36, so that the outer cover 36 is covered outside the lifting cylinder 31 to protect the lifting cylinder 31; a speed regulating valve 37 can be arranged at the bottom end of the lifting cylinder 31 to regulate the lifting speed of the lifting cylinder 31.
In the embodiment, the wafer box 4 is firstly placed on the platform 1 in a manual or automatic mode, the wafer box 4 is limited by the limiting block 11, and the wafer box 4 is ensured to be placed in place through the pressure sensor 12; after the placement of the wafer box 4 is finished, the lifting cylinder 31 ascends the platform 1 to a required height through the connecting rod 32, and after the ascent of the platform 1 is finished, the rotating cylinder 2 drives the platform 1 to rotate, so that the wafer box 4 rotates to a required angle; taking out unwashed wafers in the wafer cassette 4 by a manipulator after the wafer cassette 4 is rotated, and placing clean wafers back into the cassette; the manipulator is a single-piece picking manipulator, and is not used for directly taking away the wafer box 4, two mechanical fingers are very thin and extend to a gap between two wafers of the wafer box 4, and a wafer above the manipulator is taken away. Then, the cleaned wafer is returned to the wafer cassette 4 with fingers at the blanking end. In the blanking stage, the rotary cylinder 2 rotates at an angle, and the lifting cylinder 31 descends to an initial position.
Example 2
On the basis of embodiment 1, embodiment 2 further provides a full-automatic wet single wafer cleaning apparatus using the loading and unloading mechanism for the wafer cassette in embodiment 1, which includes: the manipulator is suitable for placing the wafer in the wafer box 4 on the loading and unloading mechanism; the loading and unloading mechanism is suitable for the loading and unloading mechanism in the embodiment 1.
In summary, the present utility model is provided with the platform 1 and the limiting component, wherein the limiting component is disposed on the top surface of the platform 1, and the limiting component is adapted to limit the wafer box 4 when the wafer box 4 is placed on the platform 1; the rotating assembly is arranged on the bottom surface of the platform 1 and is suitable for driving the platform 1 to rotate so as to drive the wafer box 4 to rotate; the limit of the wafer box 4 is realized, so that the wafer box 4 is prevented from shaking when the wafer box 4 is driven to rotate, and the angle of the wafer box 4 can be adjusted by rotating the wafer box 4, so that a wafer can be placed into the wafer box 4 by a mechanical arm.
The components (components not illustrating the specific structure) selected in the present utility model are common standard components or components known to those skilled in the art, and the structures and principles thereof are known to those skilled in the art through technical manuals or through routine experimental methods.
In the description of embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided by the present utility model, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present utility model may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
With the above-described preferred embodiments according to the present utility model as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
1. A full-automatic wet single wafer cleaning apparatus, comprising:
the manipulator is suitable for placing the wafer in the wafer box on the loading and unloading mechanism;
the feeding and discharging mechanism comprises:
the wafer box positioning device comprises a platform and a limiting assembly, wherein the limiting assembly is arranged on the top surface of the platform and is suitable for limiting the wafer box when the wafer box is placed on the platform;
the rotating assembly is arranged on the bottom surface of the platform and is suitable for driving the platform to rotate so as to drive the wafer box to rotate.
2. The full-automatic wet single wafer cleaning apparatus according to claim 1, wherein,
the spacing subassembly includes: a plurality of limiting blocks;
the limiting block is arranged on the top surface of the platform, and the area surrounded by the limiting block is matched with the wafer box.
3. The full-automatic wet single wafer cleaning apparatus according to claim 2, wherein,
the spacing assembly further includes: a pressure sensor;
the pressure sensor is arranged on the bottom surface of the platform, and the detection end of the pressure sensor penetrates through the platform and then is located in an area surrounded by the limiting block.
4. The full-automatic wet single wafer cleaning apparatus according to claim 1, wherein,
the rotating assembly includes: a rotary cylinder;
the rotating end of the rotating cylinder is connected with the bottom surface of the platform.
5. The full-automatic wet single wafer cleaning apparatus according to claim 4, wherein,
the rotating assembly further includes: a buffer;
the buffer is in contact with the bottom surface of the platform.
6. The full-automatic wet single wafer cleaning apparatus according to claim 1, wherein,
the loading and unloading mechanism for the wafer box further comprises: a lifting assembly;
the lifting component is connected with the rotating component;
the lifting component is suitable for driving the rotating component to lift so as to drive the platform to lift.
7. The full-automatic wet single wafer cleaning apparatus according to claim 6, wherein,
the lifting assembly includes: a supporting plate and a lifting cylinder;
the lifting cylinder is arranged on the supporting plate;
the telescopic end of the lifting cylinder is connected with the rotating assembly through a connecting rod, namely, the lifting cylinder and the buffer in the rotating assembly are arranged on the connecting rod.
8. The full-automatic wet single wafer cleaning apparatus according to claim 7, wherein,
the lifting assembly further comprises: a lifting sensor;
the lifting sensor is arranged on the telescopic end of the lifting cylinder.
9. The full-automatic wet single wafer cleaning apparatus according to claim 8, wherein,
a fixed block is arranged on the supporting plate;
a plurality of support rods are arranged on the support plate and connected with the outer cover through the support rods.
10. A loading and unloading mechanism for a wafer cassette employed in the full-automatic wet single wafer cleaning apparatus as set forth in claim 1, comprising:
the wafer box positioning device comprises a platform and a limiting assembly, wherein the limiting assembly is arranged on the top surface of the platform and is suitable for limiting the wafer box when the wafer box is placed on the platform;
the rotating assembly is arranged on the bottom surface of the platform and is suitable for driving the platform to rotate so as to drive the wafer box to rotate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321005762.1U CN219873449U (en) | 2023-04-28 | 2023-04-28 | Feeding and discharging mechanism for wafer box and full-automatic wet single wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321005762.1U CN219873449U (en) | 2023-04-28 | 2023-04-28 | Feeding and discharging mechanism for wafer box and full-automatic wet single wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219873449U true CN219873449U (en) | 2023-10-20 |
Family
ID=88318008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321005762.1U Active CN219873449U (en) | 2023-04-28 | 2023-04-28 | Feeding and discharging mechanism for wafer box and full-automatic wet single wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219873449U (en) |
-
2023
- 2023-04-28 CN CN202321005762.1U patent/CN219873449U/en active Active
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