CN219869983U - Raman sensing optical module based on integrated optics - Google Patents
Raman sensing optical module based on integrated optics Download PDFInfo
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- CN219869983U CN219869983U CN202320888605.3U CN202320888605U CN219869983U CN 219869983 U CN219869983 U CN 219869983U CN 202320888605 U CN202320888605 U CN 202320888605U CN 219869983 U CN219869983 U CN 219869983U
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- spad detector
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- 230000003287 optical effect Effects 0.000 title claims abstract description 71
- 238000001069 Raman spectroscopy Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 239000013307 optical fiber Substances 0.000 claims description 18
- 239000012788 optical film Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 238000010923 batch production Methods 0.000 abstract description 4
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Abstract
The utility model discloses a Raman sensing optical module based on integrated optics, which comprises an optical silicon substrate, and a laser, a coupler, a Stokes filter, an anti-Stokes filter, a first SPAD detector, a second SPAD detector, an amplifier and a multi-path MEMS optical switch which are integrally connected on the optical silicon substrate; the laser and the MEMS optical switch are connected with the input end of the coupler, the two output ends of the coupler are respectively connected with the input ends of the Stokes filter and the anti-Stokes filter, and the output ends of the Stokes filter and the anti-Stokes filter are respectively connected with the first SPAD detector and the second SPAD detector. The utility model greatly reduces the difficulty of the production process and improves the consistency of the production efficiency and the production quality through the integrated optical scheme. Meanwhile, the method provides possibility for batch and large-scale production, and really solves all problems of batch production by one integrated optical module chip.
Description
Technical Field
The utility model relates to a Raman sensing optical module based on integrated optics.
Background
Based on the prior art, the Raman optical sensing system is complex and difficult to realize mass production, almost all production processes at present cannot be produced by machines, and a pure manual production mode is still adopted. Because at present, most raman sensing instruments and equipment in the industry chain all adopt traditional communication module, splice into, and is bulky, the connecting wire is more. Production consistency and quality control cannot be guaranteed. Due to the production process, the application requirements of the military grade and the vehicle rule grade cannot be met. Patent publication number CN 101975770B: an integrated miniature Raman fiber spectrometer is provided with a substrate, a laser diode, an input optical fiber with fusion lenses at two ends, an output optical fiber group with fusion lenses at two ends, a wedge-shaped optical waveguide cavity with an output slit, a photoelectric detector array and a signal processing circuit; the laser diode, the photoelectric detector array and the signal processing circuit are integrated on a substrate, and the input optical fiber and the output optical fiber group are assembled on the substrate; the wedge-shaped optical waveguide cavity with the output slit is arranged above the surface of the photoelectric detector array, the output end of the photoelectric detector array is connected with the input end of the signal processing circuit, and the output end of the signal processing circuit outputs a digital signal; the substrate is a silicon wafer; one end of the input optical fiber with the melting lens at the two ends is coupled with the laser diode and is fixed with the gold wire through a groove arranged on the substrate, the two ends of the gold wire are fixed, and the other end of the input optical fiber with the melting lens at the two ends and one end of the multiple heads in the output optical fiber group with the melting lens at the two ends are fixed in a through hole arranged on the substrate; and one end of the single end with the fused lens of the output optical fiber group with the fused lens at the two ends is fixed with the gold wire through a groove arranged on the substrate. The volume and weight of the spectrometer are reduced without a large optical path difference by directly manufacturing the wedge-shaped waveguide cavity and the photoelectric detector array.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide a Raman sensing optical module based on integrated optics, which integrates the whole optical device by adopting an integrated optical scheme, an optical channel and a silicon optical chip in a connecting mode to form a chip-level module.
In order to achieve the above purpose, the technical scheme of the utility model is to design a Raman sensing optical module based on integrated optics, which comprises an optical silicon substrate, and a laser, a coupler, a Stokes filter, an anti-Stokes filter, a first SPA D detector, a second SPAD detector, an amplifier and a multi-path MEMS optical switch which are integrally connected on the optical silicon substrate;
the optical silicon substrate is provided with a power interface, a laser control interface, a two-way analog signal interface, an MEMS control interface and four optical fiber interfaces; the laser, the MEMS optical switch, the first SPAD detector and the second SPAD detector are all connected with a power interface and are powered by a power supply circuit outside the optical film group; the laser is connected with an interface module in the laser control interface, the MEMS optical switch is connected with an interface module in the MEMS control interface, the MEMS optical switch is also connected with an interface module in the optical fiber interface, and the first SPAD detector and the second SPAD detector are respectively connected with one interface module in the two-way analog signal interface;
the laser and the MEMS optical switch are connected with the input end of the coupler, the two output ends of the coupler are respectively connected with the input ends of the Stokes filter and the anti-Stokes filter, and the output ends of the Stokes filter and the anti-Stokes filter are respectively connected with the first SPAD detector and the second SPAD detector. MEMS, micro-electro-mechanical systems (MEMS), also called microelectromechanical systems, microsystems, micromechanical etc., refer to high-tech devices with dimensions of a few millimeters or even less. The problem that a Raman sensing optical module is complex and large in size is solved through an integrated optical structure. The device is simple and fresh, and easy to use, and simplifies the external output pins.
The further technical proposal is that the optical fiber interface is an E2000 interface; and the pin of the MEMS control interface is connected with a data acquisition and control unit positioned outside the optical module. The E2000 connector is in push-pull locking arrangement, easy to install, the shell is made of engineering plastics, convenient to densely install, and mainly used for single-mode optical fibers, and the connector is provided with a dust cover. E2000 is a direct plug-in interface, and is simple and convenient. The 4-way fiber interface is used for the channel for light out. The MEMS control interface is controlled by the main board control unit, and corresponds to a controlled pin, corresponds to a pin of a certain chip, and is controlled by the outside.
The further technical scheme is that a laser with the wavelength of 905nm is adopted as the laser.
The further technical proposal is that the length and the width of the optical silicon substrate are 50mm; the thickness of the optical module is 30mm. The volume is reduced to the size of one hundredth of a conventional light system.
The utility model has the advantages and beneficial effects that:
1. the problem that a Raman sensing optical module is complex and large in size is solved by integrating an optical structure
2. Reducing the volume to the size of one hundredth of a conventional light system
3. Simple and fresh external output pin, easy use
4. Can be produced in modularized batch, and greatly reduces the cost
5. Through the modularized production of integrated optics, the production efficiency of the product is improved, and the stability and consistency of the product are improved
6. The traditional mode of taking optical fibers as internal connection is changed into the mode of taking optical waveguides, so that the performances of shock resistance, high temperature resistance and the like are greatly improved, and the conditions of the vehicle standard grade and the military grade can be met.
7. The centralized power supply mode is adopted, the utilization rate of the power supply is reduced, the power consumption is reduced, and the heat dissipation problem is also reduced.
8. By integrating the optical scheme, the optical and electrical components are separated, the equipment assembly is facilitated, and the embedding into the third party equipment is facilitated
9. The weight of the whole machine is reduced to one tenth of that of conventional parts.
Drawings
Fig. 1 is a schematic diagram of a raman sensing optical module based on integrated optics according to the present utility model.
In the figure: 1. optical silicon base; 2. a laser; 3. a coupler; 4. an optical switch; 5. a stokes filter; 6. an inverse stokes filter; 7. SPAD detector; 8. a control pin; 9. an optical fiber external output interface; 10. and an external pin.
Detailed Description
The following describes the embodiments of the present utility model further with reference to the drawings and examples. The following examples are only for more clearly illustrating the technical aspects of the present utility model, and are not intended to limit the scope of the present utility model.
As shown in fig. 1, the utility model is a raman sensing optical module based on integrated optics, wherein a mature and mass-produced 905nm wavelength laser 2, a coupler 3, a mems multiplexing optical switch 4, an integrated stokes filter 5 and an anti-stokes filter 6, an integrated two-way SPAD detector 7 and an amplifier are integrated on an optical silicon substrate 1.
The whole chip module is externally provided with a power supply interface, a laser control interface, a double-path analog signal interface and an MEMS control interface (external pins 10 are arranged at each interface). Forming a complete integrated optical module. The whole system can be formed by only adding the data acquisition and control board.
By integrating the optical scheme, the difficulty of the production process is greatly reduced, and the consistency of the production efficiency and the production quality is improved. Meanwhile, the method provides possibility for batch and large-scale production, and really solves all problems of batch production by one integrated optical module chip.
And the full-integrated system-in-package module reduces the volume to within 50mm by 30mm. The volume is one percent of the volume of a conventional optical system.
In addition, the mode thoroughly changes the connection mode of the current equipment, and can achieve the application meeting the industrial, civil and vehicle-rule level.
The whole system is externally driven by an integrated laser, externally transmits optical pulses, is sent to an integrated MEMS optical switch through a coupler, then a plurality of optical fibers are output to an external output interface 9 (E2000 interfaces, four in FIG. 1) simultaneously, scattered light is reflected back, and is received into a stokes optical filter and an anti-stokes optical filter through the coupler, and then an integrated SPAD photoelectric detector is used for outputting an analog signal carrying temperature information after analog photoelectric conversion. The integrated MEMS is externally led out of the control pin 8, and can be controlled, collected and switched by the data collection and control unit. In addition, the whole module is externally powered. The integrated laser, the integrated MEMS optical switch and the 2-path SPAD detector are all powered by an external power supply circuit.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present utility model, and these modifications and variations should also be regarded as the scope of the utility model.
Claims (4)
1. The Raman sensing optical module based on the integrated optics is characterized by comprising an optical silicon substrate, and a laser, a coupler, a Stokes filter, an anti-Stokes filter, a first SPAD detector, a second SPAD detector, an amplifier and a multi-path MEMS optical switch which are integrally connected on the optical silicon substrate;
the optical silicon substrate is provided with a power interface, a laser control interface, a two-way analog signal interface, an MEMS control interface and four optical fiber interfaces; the laser, the MEMS optical switch, the first SPAD detector and the second SPAD detector are all connected with a power interface and are powered by a power supply circuit outside the optical film group; the laser is connected with an interface module in the laser control interface, the MEMS optical switch is connected with an interface module in the MEMS control interface, the MEMS optical switch is also connected with an interface module in the optical fiber interface, and the first SPAD detector and the second SPAD detector are respectively connected with one interface module in the two-way analog signal interface;
the laser and the MEMS optical switch are connected with the input end of the coupler, the two output ends of the coupler are respectively connected with the input ends of the Stokes filter and the anti-Stokes filter, and the output ends of the Stokes filter and the anti-Stokes filter are respectively connected with the first SPAD detector and the second SPAD detector.
2. The integrated optical based raman sensing optical module according to claim 1 wherein the optical fiber interface is an E2000 interface; and the pin of the MEMS control interface is connected with a data acquisition and control unit positioned outside the optical module.
3. The integrated optical based raman sensor optical module according to claim 2 wherein said laser is a 905nm wavelength laser.
4. The integrated optical based raman sensor optical module according to claim 3 wherein the optical silicon substrate has a length and a width of 50mm; the thickness of the optical module is 30mm.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN2023204653730 | 2023-03-13 | ||
CN202320465373 | 2023-03-13 |
Publications (1)
Publication Number | Publication Date |
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CN219869983U true CN219869983U (en) | 2023-10-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202320888605.3U Active CN219869983U (en) | 2023-03-13 | 2023-04-20 | Raman sensing optical module based on integrated optics |
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CN (1) | CN219869983U (en) |
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2023
- 2023-04-20 CN CN202320888605.3U patent/CN219869983U/en active Active
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