CN219852655U

CN219852655U - Cutting device for piezoelectric quartz wafer

Info

Publication number: CN219852655U
Application number: CN202320561252.6U
Authority: CN
Inventors: 丁斐
Original assignee: Yunda New Tech Research & Development Co ltd Changzhou
Current assignee: Yunda New Tech Research & Development Co ltd Changzhou
Priority date: 2023-03-21
Filing date: 2023-03-21
Publication date: 2023-10-20
Anticipated expiration: 2033-03-21

Abstract

The utility model relates to a cutting device for piezoelectric quartz wafers, which comprises a workbench, wherein a supporting table corresponding to the workbench is arranged above the workbench, a plurality of supporting columns are arranged at four corners above the workbench and are connected with the workbench and the supporting table, an upright column which is upwards arranged is arranged at the center of the supporting table, a motor which drives the upright column to rotate is arranged inside the supporting table, a through groove penetrates up and down, a circle of through groove is arranged around the motor, a cutting mechanism and a taking mechanism are arranged at two sides of the top end of the upright column, pushing devices for pushing a plate to be cut are arranged at two sides of the workbench, a clamping mechanism for clamping the plate to be cut is arranged at the front side and the rear side above the workbench, a collecting frame for collecting the quartz wafers taken by the taking mechanism is arranged at the rear side of the workbench, and a controller for controlling the cutting device is arranged on the workbench.

Description

Cutting device for piezoelectric quartz wafer

Technical Field

The utility model belongs to the technical field of piezoelectric quartz wafers, and particularly relates to a cutting device for a piezoelectric quartz wafer.

Background

Piezoelectric quartz is also known as piezocrystal. The crystal quartz refers to a quartz crystal with relatively pure and transparent components, which is also called as crystal. Generally colorless and transparent, and may be purple, yellow, smoke, tea, pale red, pale green, etc. if it contains micro-pigment ions such as Fe, ti or due to the difference of atomic arrangement. The chemical component of the crystal quartz is SiO2, and the crystal quartz can be generally used for manufacturing quartz crystal plates such as quartz clocks, resonators, oscillators, high-frequency oscillators and filters in the electronic industry.

In carrying out the present utility model, the inventors have found that at least the following problems exist in this technology: after the existing cutting machine cuts the quartz wafer, an additional mechanical arm is needed for taking, so that the efficiency is low; therefore, further improvement can be made.

Disclosure of Invention

Aiming at the problem of low efficiency caused by the fact that an additional mechanical arm is needed to take after a quartz wafer is cut by the existing cutting machine in the background technology, the utility model provides the cutting device for the piezoelectric quartz wafer.

The technical scheme adopted for solving the technical problems is as follows:

a cutting device for piezoelectricity quartz wafer, comprises a workbench, the workstation top is equipped with the brace table corresponding with the workstation, workstation top four corners department is equipped with a plurality of support columns and connects workstation and brace table, brace table center department is equipped with the stand that upwards sets up, the inside stand pivoted motor that drives that is equipped with of brace table, the brace table runs through from top to bottom has the through groove, the through groove encircles the motor and is equipped with the round, stand top both sides are equipped with cutting mechanism and take the mechanism, the workstation both sides are equipped with the thrust unit who treats the cutting board and promote, both sides are equipped with the clamping mechanism who treats the cutting board and press from both sides tightly around the workstation top, the workstation rear side is equipped with the collection frame that gathers the quartz wafer that takes the mechanism, be equipped with the controller that carries out control to cutting device on the workstation.

Further, the cutting mechanism comprises a laser cutting head, a horizontal rod arranged horizontally is arranged on one side of the top end of the upright post, a first air cylinder is arranged above the horizontal rod, a first moving rod driven by the first air cylinder to move up and down is arranged below the horizontal rod, and the laser cutting head is arranged below the first moving rod.

Further, the device of taking includes the board of taking, the opposite side that stand top and horizontal pole are relative is equipped with the electric telescopic handle that the level set up, electric telescopic handle top is equipped with the second cylinder, electric telescopic handle below is equipped with the second movable rod that reciprocates by the drive of second cylinder, the second movable rod below is equipped with the board of taking, the board of taking is the fan-shaped with stand center of rotation concentric, the board below of taking is equipped with a plurality of sucking discs.

Further, the pushing device comprises a supporting frame arranged on one side of the workbench, a belt pulley and a belt which drive the plate to be cut to move towards the upper side of the workbench are arranged above the supporting frame, the plate to be cut is pushed to move towards the upper side of the workbench by one side of the pushing device on two sides, and the cut plate is pushed out from the workbench by the other side of the pushing device on two sides.

Further, clamping device is including setting up the fixed box in both sides around workstation top, in the space between fixed box orientation workstation and the supporting bench, fixed box inside is equipped with the cavity, fixed box is equipped with the opening towards one side of waiting to cut the board, fixed box inside is equipped with the gag lever post that sets up about towards open-ended one side, the gag lever post overcoat has been connected with the rack that moves about on the gag lever post, fixed box is kept away from open-ended one side and is equipped with the gear that drives the rack and remove.

Further, clamping device still includes the first pressure strip that sets up in rack towards opening one side, first pressure strip moves in the opening along with the removal of rack, one side that first pressure strip kept away from the rack is equipped with the second pressure strip corresponding with first pressure strip, connect through a plurality of springs between first pressure strip and the second pressure strip, the spring is inside to be equipped with the telescopic column that prevents the spring resilience.

Further, a soft adhesive layer is arranged on one side, far away from the first pressing plate, of the second pressing plate.

The beneficial effects of the utility model are as follows:

1. the stand rotates and drives the laser cutting head to rotate together, and the first cylinder drives the first movable rod to move continuously one by one, so that the cutting head can continuously cut the board to be cut for a plurality of times, and the laser cutting head can contact the board to be cut through the through groove.

2. The device comprises a workbench, a cutting mechanism, a plurality of sucking discs, a second moving rod, a first moving rod, a second moving rod, a cutting plate, a plurality of sucking discs, a plurality of electric telescopic rods, a collecting frame, a controller, a cutting device and a controller, wherein the sucking discs are arranged below the taking plate, the collecting frame is arranged on the rear side of the workbench and used for collecting quartz wafers taken by the taking mechanism, the controller is arranged on the workbench and used for controlling the cutting device, the taking device is arranged on the other side of the workbench and used for simultaneously taking the cut quartz wafers when the cutting mechanism cuts the quartz wafers, the sucking discs can suck the quartz wafers, the electric telescopic rods extend outwards after sucking the quartz wafers until the sucking discs are opposite to the collecting frame, the second moving rod is driven to move downwards through the second air cylinder, the quartz wafers are recovered, and the taking plate can be contacted with the plate to be cut through a through groove.

3. The pushing devices pushing the plate to be cut are arranged on two sides of the workbench, the pushing devices comprise a supporting frame arranged on one side of the workbench, a belt pulley and a belt which drive the plate to be cut to move towards the upper side of the workbench are arranged above the supporting frame, the plate to be cut is pushed to move towards the upper side of the workbench by the pushing devices on one side of the two sides, and the cut plate after being cut is pushed out from the workbench on the other side of the pushing devices, so that the continuity of the cutting devices is guaranteed.

4. When the plate to be cut enters a gap between the workbench and the supporting table, the rack drives the first pressing plate and the second pressing plate to move towards one side where the plate to be cut enters, the first pressing plate and the second pressing plate which are positioned on the front side and the rear side of the workbench clamp the plate to be cut at the same time, and the cutting is finished until the plate to be cut is pushed to one side close to the push-out belt for recovery.

Drawings

The foregoing and other objects, features, and advantages of the utility model will become apparent from the following detailed description taken in conjunction with the accompanying drawings.

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the structure of the suction cup of the present utility model;

FIG. 3 is a schematic view of a collecting frame structure according to the present utility model;

FIG. 4 is a schematic view of the clamping mechanism of the present utility model.

Wherein: 1. a work table; 2. a support table; 3. a support column; 4. a column; 5. a motor; 6. a through groove; 7. a cutting mechanism; 701. a laser cutting head; 702. a cross bar; 703. a first cylinder; 704. a first moving lever; 8. a picking mechanism; 801. taking the plate; 802. an electric telescopic rod; 803. a second cylinder; 804. a second moving lever; 805. a suction cup; 9. a pushing device; 901. a support frame; 902. a belt pulley; 903. a belt; 10. a clamping mechanism; 1001. a fixed box; 1002. a cavity; 1003. an opening; 1004. a limit rod; 1005. a rack; 1006. a gear; 1007. a first compacting plate; 1008. a second compacting plate; 1009. a spring; 1010. a telescopic column; 11. a collection frame; 12. a controller; 13. and a soft adhesive layer.

Detailed Description

The utility model is further described below with reference to the accompanying drawings.

Referring to fig. 1-2, the utility model includes a workbench 1, a supporting table 2 corresponding to the workbench 1 is arranged above the workbench 1, a plurality of supporting columns 3 are arranged at four corners above the workbench 1 to connect the workbench 1 and the supporting table 2, an upright post 4 arranged upwards is arranged at the center of the supporting table 2, a motor 5 for driving the upright post 4 to rotate is arranged inside the supporting table 2, a penetrating groove 6 penetrates up and down the supporting table 2, a circle of penetrating groove 6 is arranged around the motor 5, a cutting mechanism 7 and a taking mechanism 8 are arranged at two sides of the top end of the upright post 4, the cutting mechanism 7 comprises a laser cutting head 701, a horizontal rod 702 arranged at one side of the top end of the upright post 4 is arranged, a first air cylinder 703 is arranged above the horizontal rod 702, a laser cutting head 701 is arranged below the horizontal rod 702, the first air cylinder 703 drives the first moving rod 704 to rotate together, and the first air cylinder 703 drives the first moving rod 704 to move up and down, so that the cutting head cuts a cutting board to be cut continuously for a plurality of times, and the cutting board to be cut is contacted with the cutting board to be cut through the penetrating groove 6.

Referring to fig. 1-3, the device of taking includes a plate 801 of taking, the opposite side that stand 4 top and horizontal pole 702 are equipped with the electric telescopic handle 802 that the level set up, electric telescopic handle 802 top is equipped with the second cylinder 803, electric telescopic handle 802 below is equipped with the second movable rod 804 that is driven by the second cylinder 803 and reciprocates, the plate 801 of taking is equipped with to take under the second movable rod 804, the plate 801 of taking is the fan-shaped with stand 4 center of rotation, the plate 801 of taking below is equipped with a plurality of sucking discs 805, the workstation 1 rear side is equipped with the collection frame 11 that gathers the quartz wafer that takes mechanism 8, be equipped with on the workstation 1 and carry out the controller 12 that controls cutting device, the quartz wafer that the cutting device that is located the opposite side simultaneously takes when cutting mechanism 7 cuts, a plurality of sucking discs 805 can absorb the quartz wafer simultaneously, electric telescopic handle 802 stretches out towards the outside after the absorption until with collection frame 11 is relative, the second movable rod 804 is driven to move down again through the second cylinder, carry out the quartz wafer, and wait to take the plate 801 to contact through the through-hole 6 to cut into the cutting plate 803.

Referring to fig. 1, pushing devices 9 for pushing the board to be cut are arranged on two sides of the workbench 1, each pushing device 9 comprises a supporting frame 901 arranged on one side of the workbench 1, a belt pulley 902 and a belt 903 for driving the board to be cut to move towards the upper side of the workbench 1 are arranged above the supporting frame 901, the board to be cut is pushed to move towards the upper side of the workbench 1 by one side of each pushing device 9 on two sides, and the cut board after being cut is pushed out from the workbench 1 on the other side, so that the continuity of the cutting device is ensured.

Referring to fig. 1 and 4, the clamping mechanism 10 for clamping the plate to be cut is arranged on the front side and the rear side above the workbench 1, the clamping device comprises a fixing box 1001 arranged on the front side and the rear side above the workbench 1, the fixing box 1001 faces the gap between the workbench 1 and the supporting table 2, a cavity 1002 is arranged inside the fixing box 1001, an opening 1003 is arranged on one side of the fixing box 1001 facing the plate to be cut, a limiting rod 1004 arranged left and right is arranged on one side of the fixing box 1001 facing the opening 1003, a rack 1005 moving left and right on the limiting rod 1004 is sleeved outside the limiting rod 1004, and a gear 1006 for driving the rack 1005 to move is arranged on one side of the fixing box 1001 away from the opening 1003.

The clamping device further comprises a first pressing plate 1007 arranged on one side of the rack 1005 facing the opening 1003, the first pressing plate 1007 moves in the opening 1003 along with the movement of the rack 1005, a second pressing plate 1008 corresponding to the first pressing plate 1007 is arranged on one side of the first pressing plate 1007 away from the rack 1005, the first pressing plate 1007 and the second pressing plate 1008 are connected through a plurality of springs 1009, and a telescopic column 1010 for preventing the springs 1009 from rebounding is arranged inside the springs 1009.

When the plate to be cut enters the gap between the workbench 1 and the supporting table 2, the rack 1005 drives the first pressing plate 1007 and the second pressing plate 1008 to move towards the side where the plate to be cut enters, the first pressing plate 1007 and the second pressing plate 1008 positioned on the front side and the rear side of the workbench 1 clamp the plate to be cut at the same time, and the cutting is finished until the plate with the cutting is pushed to the side close to the push-out belt 903 for recycling.

In embodiment 2, referring to fig. 4, a soft adhesive layer 13 is provided on a side of the second pressing plate 1008 away from the first pressing plate 1007 to protect the quartz wafer from damage.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In addition, the descriptions of the "first," "second," and the like, herein are for descriptive purposes only and are not intended to be specifically construed as order or sequence, nor are they intended to limit the utility model solely for distinguishing between components or operations described in the same technical term, but are not to be construed as indicating or implying any relative importance or order of such features. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The foregoing description is only a preferred embodiment of the present utility model, and is not intended to limit the utility model in any way, but any simple modification or equivalent variation of the above embodiment according to the technology of the present utility model falls within the scope of the present utility model.

Claims

1. A cutting device for piezoelectricity quartz wafer, its characterized in that: including the workstation, workstation top is equipped with the brace table corresponding with the workstation, workstation top four corners department is equipped with a plurality of support columns and connects workstation and brace table, brace table center department is equipped with the stand that upwards sets up, the inside stand pivoted motor that is equipped with of brace table, it runs through from top to bottom to have the groove that runs through, it is equipped with the round to run through the groove around the motor, stand top both sides are equipped with cutting mechanism and take the mechanism, the workstation both sides are equipped with the thrust unit that treats the cutting board and promote, both sides are equipped with the clamping mechanism who treats the cutting board and press from both sides tightly around the workstation top, the workstation rear side is equipped with the quartz wafer that takes the mechanism and gathers, be equipped with the controller that controls the cutting device on the workstation.

2. The dicing apparatus for a piezoelectric quartz wafer according to claim 1, wherein: the cutting mechanism comprises a laser cutting head, a horizontal rod which is horizontally arranged is arranged on one side of the top end of the upright post, a first air cylinder is arranged above the horizontal rod, a first moving rod which is driven by the first air cylinder to move up and down is arranged below the horizontal rod, and the laser cutting head is arranged below the first moving rod.

3. The dicing apparatus for a piezoelectric quartz wafer according to claim 1, wherein: the mechanism of taking includes the board of taking, the opposite side that stand top is relative with the horizontal pole is equipped with the electric telescopic handle that the level set up, electric telescopic handle top is equipped with the second cylinder, electric telescopic handle below is equipped with the second movable rod that reciprocates by the drive of second cylinder, the second movable rod below is equipped with the board of taking, the board of taking is the fan-shaped form concentric with stand center of rotation, the board below of taking is equipped with a plurality of sucking discs.

4. The dicing apparatus for a piezoelectric quartz wafer according to claim 1, wherein: the pushing device comprises a supporting frame arranged on one side of the workbench, a belt pulley and a belt which drive the plate to be cut to move towards the upper side of the workbench are arranged above the supporting frame, the plate to be cut is pushed to move towards the upper side of the workbench by the pushing device on one side of the pushing device on the two sides, and the cut plate is pushed out from the workbench by the other side of the pushing device on the two sides.

5. The dicing apparatus for a piezoelectric quartz wafer according to claim 1, wherein: the clamping mechanism comprises fixed boxes arranged on the front side and the rear side of the upper portion of the workbench, the fixed boxes are arranged in gaps between the workbench and the supporting table, cavities are formed in the fixed boxes, openings are formed in the fixed boxes on one sides of the plates to be cut, limiting rods are arranged on one sides of the fixed boxes, which face the openings, of the fixed boxes in a left-right mode, racks which move left and right on the limiting rods are sleeved outside the limiting rods, and gears which drive the racks to move are arranged on one sides, away from the openings, of the fixed boxes.

6. The dicing apparatus for a piezoelectric quartz wafer according to claim 5, wherein: the clamping mechanism further comprises a first pressing plate arranged on one side of the rack, facing the opening, of the rack, the first pressing plate moves in the opening along with movement of the rack, a second pressing plate corresponding to the first pressing plate is arranged on one side, far away from the rack, of the first pressing plate, the first pressing plate is connected with the second pressing plate through a plurality of springs, and a telescopic column for preventing the springs from rebounding is arranged inside the springs.

7. The dicing apparatus for a piezoelectric quartz wafer according to claim 6, wherein: and a soft adhesive layer is arranged on one side, far away from the first pressing plate, of the second pressing plate.