CN219842977U

CN219842977U - Wafer overturning device

Info

Publication number: CN219842977U
Application number: CN202321319451.2U
Authority: CN
Inventors: 俞杰; 周锐
Original assignee: Zhejiang Han's Fuchengde Technology Co ltd
Current assignee: Zhejiang Han's Fuchengde Technology Co ltd
Priority date: 2023-05-25
Filing date: 2023-05-25
Publication date: 2023-10-17
Anticipated expiration: 2033-05-25

Abstract

The utility model discloses a wafer overturning device, and belongs to the technical field of semiconductors. The utility model provides a wafer overturning device, which aims at the problem of overturning a wafer, and comprises a rotary driving mechanism and an overturning module which overturns under the driving of the rotary driving mechanism, wherein the overturning module comprises: the bottom plate is connected with the output end of the rotary driving mechanism; the lifting mechanism is arranged on the bottom plate; the wafer fixing mechanism is driven by the lifting mechanism to lift and is used for fixing the wafer; the stop block assemblies are arranged on the bottom plate and comprise upper stop blocks; the wafer fixing mechanism is driven by the lifting mechanism to ascend so as to drive the wafer to be abutted with at least two upper stop blocks. The wafer fixing mechanism is matched with the upper stop block, so that the wafer is doubly fixed by the wafer fixing mechanism and the upper stop block in the overturning process, and the wafer is prevented from being offset and damaged in the overturning process.

Description

Wafer overturning device

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a wafer overturning device.

Background

The processing of semiconductor devices involves a number of processes, and often different processes are performed on different processing surfaces of the wafer. Many process machines need to process the front and back sides of the wafer, but most of the prior devices only can process one side of the wafer due to the function of the devices, so that the prior process requirements are not met. Therefore, the wafer turning device is used for clamping the wafer and turning the wafer 180 degrees for the next process treatment.

For example, chinese patent application publication No. CN218414541U discloses a wafer flipping device, which includes a rotation driving mechanism and a clamping mechanism, wherein the clamping mechanism is used for clamping a wafer, and the clamping mechanism can be flipped under the driving of the rotation driving mechanism. After the clamping mechanism clamps the wafer, the rotary driving mechanism drives the clamping mechanism to overturn, so that the clamped wafer can be overturned. The wafer overturning device can clamp the wafer to overturn, and the clamping force is convenient to control. Meanwhile, the tiny offset possibly generated when the carrying manipulator places the wafer is made up, and the precision of the clamping mechanism for clamping the wafer is improved. The scheme has the following defects: although the wafer can be pushed to the position where the edge of the wafer is always abutted against the bottom of the slot through the V-shaped structure of the slot, the tiny offset possibly generated when the wafer is placed by the carrying manipulator is made up, but the wafer is easily damaged due to friction in the pushing process, the circumferential edge of the wafer is completely embedded in the arc-shaped surface (the slot bottom) in the vertical direction, namely, the circumferential surface of the wafer is only clamped, and the self gravity of the wafer can increase the friction with the slot, especially in the overturning process.

Therefore, in view of the above problems, it is necessary to propose a further solution to at least one of the problems.

Disclosure of Invention

In order to solve the problem of related wafer overturning, the utility model provides a wafer overturning device. The technical scheme is as follows:

the utility model provides a wafer turning device, includes rotary driving mechanism and the upset module of upset under rotary driving mechanism drive, the upset module includes:

the bottom plate is connected with the output end of the rotary driving mechanism;

the lifting mechanism is arranged on the bottom plate;

the wafer fixing mechanism is used for fixing a wafer;

the stop block assemblies are arranged on the bottom plate and comprise upper stop blocks; wherein,,

the wafer fixing mechanism is driven by the lifting mechanism to ascend so as to drive the wafer to be abutted with at least two upper stop blocks.

In a preferred embodiment of the present utility model, the stop block assembly further includes a lower stop block, and when the bottom plate is in a horizontal state, an upper stop block and a lower stop block in the same stop block assembly are disposed opposite to each other in a vertical direction; and, in addition, the processing unit,

when the bottom plate is in a horizontal state, the upper stop block or the lower stop block is used for bearing the wafer.

In a preferred embodiment of the present utility model, a buffer assembly is disposed on a lifting path of the wafer fixing mechanism, and the buffer assembly includes two buffer blocks respectively disposed at two ends of the lifting path, where the buffer blocks are used to abut against the wafer fixing mechanism or the lifting mechanism.

In a preferred embodiment of the present utility model, the lifting mechanism includes a mounting plate for mounting the wafer fixing mechanism and a lifting driving assembly for driving the mounting plate to lift, and the lifting driving assembly includes a second cylinder.

In a preferred embodiment of the present utility model, the wafer fixing mechanism includes a clamping driving assembly and two clamping blocks that are driven by the clamping driving assembly to move relatively or oppositely, the two clamping blocks move relatively to clamp and fix the wafer, and the two clamping blocks move oppositely to be away from the wafer.

In a preferred embodiment of the present utility model, the wafer fixing mechanism includes an airflow control assembly and a chuck under the control of the airflow control assembly, and the chuck is used for adsorbing or releasing the wafer.

In a preferred embodiment of the present utility model, the rotary drive mechanism comprises a motor, to which a brake is connected.

In a preferred embodiment of the present utility model, each of the upper stop and the lower stop includes an inclined plane, and the planes of the inclined planes in the same stop assembly form a V-shaped structure with an opening facing the center of the wafer.

In a preferred embodiment of the present utility model, the lifting mechanism is provided with a plurality of lifting mechanisms along the length direction of the wafer fixing mechanism, and the plurality of second cylinders are connected with the same electromagnetic valve.

In a preferred embodiment of the present utility model, the clamping block includes a V-shaped groove with an opening facing the center of the wafer, and a bottom of the V-shaped groove is used for abutting against a peripheral surface of the wafer.

Compared with the prior art, the utility model has the beneficial effects that:

(1) According to the utility model, the upper stop block is matched with the wafer fixing mechanism, so that the wafer is doubly fixed by the wafer fixing mechanism and the upper stop block in the overturning process, the wafer is prevented from being damaged in the overturning process, particularly, the upper stop block is contacted with the circumferential upper edge of the wafer before overturning, the offset of the wafer caused by self gravity is reduced, and the bearing capacity is provided for the wafer which is separated from the wafer fixing mechanism after overturning, so that the wafer can be conveniently taken away by subsequent equipment.

(2) The utility model provides bearing capacity for the wafer before overturning through the lower stop block, thereby facilitating the accurate fixing of the wafer by the wafer fixing mechanism and avoiding the wafer from being offset and further damaged by friction in the fixing process of the wafer fixing mechanism.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of the flip module of FIG. 1;

FIG. 3 is a schematic view of the clamping mechanism of FIG. 2 with a portion of the housing removed;

FIG. 4 is a schematic view of the clamping mechanism of FIG. 3 at another angle;

FIG. 5 is a schematic view of the turnover module of FIG. 2 with the clamping mechanism removed;

FIG. 6 is a schematic structural view of the rotary driving mechanism in FIG. 1;

fig. 7 is a schematic view of the rotary driving mechanism shown in fig. 6 with a portion of the housing removed.

Specifically, 100, a turnover module; 101. a bottom plate; 102. rotating the fixing plate; 103. a reinforcing plate; 104. an outer cover; 110. a wafer fixing mechanism; 111. clamping blocks; 112. clamping the driving assembly; 1121. a first cylinder; 1122. a slide rail; 1123. a slide block; 113. a connecting plate; 114. a wafer detection sensor; 115. a displacement detection assembly; 116. a first limit assembly; 120. a stop assembly; 121a, lower stop; 121b, upper stop; 1211. an inclined plane; 122. a connecting seat; 130. a lifting mechanism; 131. a lifting driving assembly; 132. a mounting plate; 133. a buffer assembly; 1331. a buffer block;

200. a rotary driving mechanism; 201. a housing; 210. a motor; 211. a brake; 220. a transmission assembly; 221. a second synchronizing wheel; 222. a third synchronizing wheel; 223. a fourth synchronizing wheel; 224. a synchronous belt; 225. a tensioning wheel; 226. the second limiting component; 227. a horizontal zeroing detection assembly; 230. a bearing seat;

300. and (5) a base.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may include one or more of the feature, either explicitly or implicitly. In the description of the utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

Example 1:

as shown in fig. 1, a wafer turnover device includes a rotation driving mechanism 200 and a turnover module 100 turned under the driving of the rotation driving mechanism 200, wherein a wafer is sent into the turnover module 100 by an external device, such as a wafer handling mechanical arm, the rotation driving mechanism 200 drives the turnover module 100 to turn 180 ° from an initial horizontal state to a turnover horizontal state, so as to realize the wafer turnover, and the turned wafer is taken out from the turnover module 100 by the external device, such as the wafer handling mechanical arm.

To facilitate the installation of the rotation driving mechanism 200, the wafer flipping device may further include a base 300, and the rotation driving mechanism 200 is installed on the base 300.

As shown in fig. 2, the flipping module 100 includes a base plate 101, and a lifting mechanism 130, a wafer holding mechanism 110, and a stop assembly 120 mounted directly or indirectly on the base plate 101.

The bottom plate 101 is connected with the output end of the rotation driving mechanism 200, so that the whole turnover module 100 is turned under the driving of the rotation driving mechanism 200. In order to facilitate connection of the base plate 101 and the rotary driving mechanism 200, a rotary fixing plate 102 is disposed at the connection position of the base plate 101 and the rotary driving mechanism 200, and the rotary fixing plate 102 is connected with an output end of the rotary driving mechanism 200. In order to strengthen the connection between the bottom plate 101 and the rotation fixing plate 102, a strengthening plate 103 is further arranged between the bottom plate 101 and the rotation fixing plate 102, and two ends of the strengthening plate 103 are respectively connected with the bottom plate 101 and the rotation fixing plate 102.

The lifting mechanism 130 is disposed on the bottom plate 101, and the lifting mechanism 130 is used for driving the wafer fixing mechanism 110 to lift, so as to realize the contact between the wafer and the stop block assembly 120.

The wafer fixing mechanism 110 is used for fixing a wafer. The wafer fixing mechanism 110 includes, but is not limited to, clamping and fixing the wafer.

At least two stopper assemblies 120 are provided and are disposed on the base plate 101, and the stopper assemblies 120 include upper stoppers 121b. Specifically, as shown in fig. 5, the stopper assembly 120 may include a connection base 122 connected to the base plate 101, and an upper stopper 121b is provided on the connection base 122. Each block component 120 is independently installed, and can be independently adjusted in terms of height, levelness and the like, so that the complex operation of repeated installation and debugging after disassembly is avoided. To avoid contaminating the wafer, the upper stop 121b preferably includes a bevel 1211, through which bevel 1211 the wafer is abutted.

In this embodiment, the wafer fixing mechanism 110 is driven by the lifting mechanism 130 to lift up to drive the wafer to abut against at least two upper stoppers 121b, so that the wafer is doubly fixed by the wafer fixing mechanism 110 and the upper stoppers 121b in the overturning process, the wafer is prevented from being damaged in the overturning process, especially the upper stoppers 121b are contacted with the circumferential upper edge of the wafer before overturning, the offset of the wafer due to self gravity is reduced, and the bearing capacity is provided for the wafer separated from the wafer fixing mechanism 110 after overturning, so that the wafer can be conveniently taken away by the subsequent equipment.

For example, as shown in fig. 3-4, the wafer fixing mechanism 110 may include a clamping driving assembly 112 and two clamping blocks 111 that are driven by the clamping driving assembly 112 to move relatively or oppositely, wherein the two clamping blocks 111 move relatively to clamp and fix a wafer, and the two clamping blocks 111 move relatively away from the released wafer. Preferably, the clamping block 111 includes a V-shaped groove opening toward the center of the wafer, and the groove bottom of the V-shaped groove is used to abut against the peripheral surface of the wafer, i.e., the surface formed in the circumferential direction of the wafer, such as a slot in CN 218414541U.

The clamping driving assembly 112 may comprise a cylinder or a motor, for example, the clamping driving assembly 112 comprises a first cylinder 1121, and the first cylinder 1121 is preferably a bi-directional cylinder, that is, comprises two parallel piston rods capable of moving relatively or oppositely, and the two piston rods are respectively connected to a clamping block 111. To improve the stability of the movement of the clamping block 111, the clamping driving assembly 112 further includes a slide rail 1122 and two sliding blocks 1123 slidably disposed on the slide rail 1122, the clamping block 111 is connected to the sliding blocks 1123 through a connecting plate 113, and the sliding blocks 1123 are connected to the piston rod. To detect the moving position of the clamping block 111, such as the clamping position and the unclamping position, a displacement detection assembly 115 may be disposed on the reciprocating path of the clamping block 111, where the displacement detection assembly 115 may include a sensor fixed at a corresponding position, such as a slot-type photoelectric sensor, and the sensor may be fixedly disposed at a corresponding position of the housing 104 of the wafer fixing mechanism 110, and the displacement detection assembly 115 further includes a shielding member that moves synchronously with the clamping block 111, so that the photoelectric switch is triggered by the shielding member after the clamping block 111 moves to the corresponding position. A first stop assembly 116 may also be provided on the reciprocating path of the clamp block 111 to limit the travel of the clamp block 111. The first limiting component 116 may include a blocking block fixed at a corresponding clamping position, and a collision block moving synchronously with the clamping block 111, where the blocking block and/or the collision block may be made of rubber, and the blocking block may be connected with the housing 104 through a waist-shaped hole, so as to be capable of being adjusted by fine adjustment to adjust the stroke of the clamping block 111, so that the clamping block 111 just clamps a wafer, preventing the clamping force of the clamping block 111 from being too large, and clamping the wafer or bending the wafer.

The wafer fixing mechanism 110 may also adsorb and fix a wafer, for example, the wafer fixing mechanism 110 may include an airflow control assembly and a chuck under the control of the airflow control assembly, where the chuck is used to adsorb or release the wafer, for example, a chuck body, a chuck seat, a compressed air pipe joint, a vacuum pipe joint, and the like in CN115083986 a.

In order to detect whether a wafer is located on the wafer fixing mechanism 110, the wafer fixing mechanism 110 may further be provided with a wafer detecting sensor 114, and the corresponding position of the outer cover 104 may be provided with an avoidance hole so as to avoid the optical axis of the wafer detecting sensor 114.

As shown in fig. 5, the lifting mechanism 130 is connected to the base plate 101, and an output end thereof is connected to the wafer fixing mechanism 110, thereby driving the wafer fixing mechanism 110 to lift. The elevation mechanism 130 may include a mounting plate 132 for mounting the wafer fixing mechanism 110 and an elevation driving assembly 131 for driving the mounting plate 132 to elevate.

The lifting driving assembly 131 preferably comprises a second cylinder, wherein a piston rod of the second cylinder is connected with the mounting plate 132 to drive the wafer fixing mechanism 110 connected with the mounting plate 132 to lift. The second cylinder is preferably a lead cylinder with a magnetic switch to sense if the cylinder is moving in place.

Preferably, the lifting mechanism 130 is provided with a plurality of lifting mechanisms along the length direction of the wafer fixing mechanism 110, and a plurality of second cylinders are connected with the same electromagnetic valve, so that lifting stability is improved. In this embodiment, lifting mechanisms 130 are respectively disposed at two ends of the wafer fixing mechanism 110, and cylinders in the two lifting mechanisms 130 share one electromagnetic valve through a throttle valve and a tee joint, so that actions of the two cylinders are consistent.

The wafer fixing mechanism 110 is preferably provided with a buffer assembly 133 on a lifting path, and the buffer assembly 133 includes two buffer blocks 1331 disposed at two ends of the lifting path, wherein the buffer blocks 1331 are used for abutting against the wafer fixing mechanism 110 or the lifting mechanism 130. The buffer 1331 is preferably made of polyurethane. In this embodiment, the wafer fixing mechanism 110 includes a housing 104, and the bottom of the housing 104 protrudes, so that the protruding structure abuts against the buffer block 1331.

As shown in fig. 6 to 7, the rotary driving mechanism 200 includes a motor 210, and the motor 210 may be disposed in the base 300, and a fan, a motor 210 driver, a power source, a solenoid valve, etc. may be installed in the base 300.

The motor 210 is connected to a brake 211. The brake 211 is a device having a function of decelerating, stopping, or maintaining a stopped state of a moving member. After the motor 210 is powered off, the power-off brake provides resistance, and the transmission assembly 220 limits the turnover module 100 from turning down due to self gravity due to power-off and power loss, so that the risk of equipment collision is reduced.

The motor 210 is connected with a transmission assembly 220, the transmission assembly 220 can be arranged in the shell 201, the tail end of the transmission assembly 220 is connected with a transmission shaft, and the transmission shaft extends out through a bearing seat 230 arranged on the shell 201 and is connected with the turnover module 100. The transmission assembly 220 may include a first synchronizing wheel, a second synchronizing wheel 221, a third synchronizing wheel 222, a fourth synchronizing wheel 223, and a synchronous belt 224 disposed therebetween, that is, using two groups of one-large-one-small synchronous pulleys, to function as a speed reducer, and to improve the accuracy and torque of the motor 210. The side of the synchronous belt 224 is further provided with a tensioning wheel 225 to adjust tightness of the synchronous belt 224, so that the motor 210 and the turnover module 100 can accurately perform synchronous motion.

In order to prevent the synchronous wheel from rotating excessively, a second limiting assembly 226 is disposed on the rotation path of the fourth synchronous wheel 223, and the second limiting assembly 226 may include a blocking block fixed at a corresponding position and an impact block rotating with the fourth synchronous wheel 223.

The turnover module 100 is turned between 0 ° and 180 °, and after the wafer is turned and removed, the turnover module 100 needs to return to the 0 ° position, i.e. the zero position, for the next turnover. To detect whether the turnover module 100 is located at the zero position, the side edge of the fourth synchronizing wheel 223 also has only a horizontal zeroing detection component 227, the horizontal zeroing detection component 227 includes a sensor fixed at a corresponding position, such as a slot-type photoelectric sensor, and the displacement detection component 115 further includes a shielding member synchronously rotating with the fourth synchronizing wheel 223, so that the photoelectric switch is triggered by the shielding member after the fourth synchronizing wheel 223 rotates to the corresponding position.

Example 2:

in this embodiment, as shown in fig. 2 and 5, the stopper assembly 120 further includes a lower stopper 121a, and the upper stopper 121b and the lower stopper 121a in the same stopper assembly 120 are disposed opposite to each other in the vertical direction when the bottom plate 101 is in the horizontal state.

When the bottom plate 101 is in a horizontal state, the upper stop block 121b or the lower stop block 121a is used for bearing a wafer, and the lower stop block 121a provides bearing capacity for the wafer before overturning, so that the wafer fixing mechanism 110 is convenient to fix the wafer accurately, and the wafer is prevented from being offset and damaged by friction in the fixing process of the wafer fixing mechanism 110; the upturned wafer is provided with bearing capacity through the upper stop block 121b, so that the wafer can be conveniently taken away by subsequent equipment.

Preferably, the upper block 121b and the lower block 121a each include an inclined surface 1211, and the planes of the inclined surfaces 1211 in the same block assembly 120 form a V-shaped structure with an opening toward the center of the wafer, so as to reduce the contact area between the block and the wafer and reduce the risk of wafer contamination.

The upper and lower stoppers 121b and 121a are preferably made of nylon to prevent scratching the wafer.

The working state of the wafer overturning device is as follows:

when the wafer turning device is in a horizontal state, the wafer carrying mechanical arm sends the wafer to the center of the turning module 100 from the side and places the wafer on the lower stop block 121 a;

after the wafer carrying mechanical arm leaves, the wafer is detected by the wafer detection sensor 114 positioned on the wafer fixing mechanism 110, and then the wafer fixing mechanism 110 acts to fix the wafer;

after the wafer is fixed, the lifting mechanism 130 acts upwards to drive the wafer fixing mechanism 110 to move upwards together, and simultaneously drives the wafer to move upwards to abut against the upper stop block;

after the lifting mechanism 130 moves in place, the rotation driving mechanism 200 drives the turnover module 100 to rotate 180 degrees, at this time, the wafer is turned over, and the self gravity of the wafer is borne by the upper stop block 121 b;

the wafer fixing mechanism 110 is reset to loosen the wafer, the wafer carrying mechanical arm acts, and the wafer is taken away from the upper stop block 121 b;

after the wafer leaves the overturning process completely, the lifting mechanism 130 is reset, and then the rotary driving mechanism 200 rotates 180 degrees, the overturning module 100 returns to the horizontal state, and the next wafer is sent by the wafer carrying mechanical arm.

In summary, the upper stop block is matched with the wafer fixing mechanism, so that the wafer is doubly fixed by the wafer fixing mechanism and the upper stop block in the overturning process, the wafer is prevented from being damaged in the overturning process, particularly, the upper stop block is contacted with the upper edge of the wafer circumference before overturning, the offset of the wafer caused by self gravity is reduced, and the bearing capacity is provided for the wafer separated from the wafer fixing mechanism after overturning, so that the wafer can be conveniently taken away by subsequent equipment.

Furthermore, it should be understood that the described embodiments are merely some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Claims

1. The utility model provides a wafer turning device which characterized in that, including rotary drive mechanism and in the upset module of upset under rotary drive mechanism drive, the upset module includes:

the lifting mechanism is arranged on the bottom plate;

the wafer fixing mechanism is used for fixing a wafer;

2. The wafer flipping apparatus of claim 1, wherein the block assembly further comprises a lower block, the upper block and the lower block in the same block assembly being disposed opposite each other in a vertical direction when the bottom plate is in a horizontal state; and, in addition, the processing unit,

3. The wafer overturning device according to any one of claims 1 to 2, wherein a buffer assembly is arranged on a lifting path of the wafer fixing mechanism, the buffer assembly comprises two buffer blocks respectively arranged at two ends of the lifting path, and the buffer blocks are used for being abutted with the wafer fixing mechanism or the lifting mechanism.

4. The wafer flipping apparatus of any one of claims 1-2, wherein the elevation mechanism comprises a mounting plate for mounting the wafer holding mechanism and an elevation drive assembly for driving the mounting plate to elevate, the elevation drive assembly comprising a second cylinder.

5. The wafer flipping apparatus of any one of claims 1-2, wherein the wafer holding mechanism comprises a clamping drive assembly and two clamping blocks that are driven by the clamping drive assembly to move relatively or back to back, the two clamping blocks being moved relatively to clamp and hold the wafer, the two clamping blocks being moved back to release the wafer.

6. The wafer flipping apparatus of any one of claims 1 to 2, wherein the rotary drive mechanism comprises a motor, the motor being coupled to a brake.

7. The wafer flipping apparatus of claim 2, wherein the upper and lower stoppers each comprise a bevel, and the planes of the two bevel in the same stopper assembly form a V-shaped structure with an opening toward the center of the wafer.

8. The wafer overturning device according to claim 4, wherein a plurality of lifting mechanisms are arranged along the length direction of the wafer fixing mechanism, and a plurality of second cylinders are connected with the same electromagnetic valve.

9. The wafer flipping device of claim 5, wherein the clamping block comprises a V-shaped groove opening toward the center of the wafer, the groove bottom of the V-shaped groove being configured to abut the peripheral surface of the wafer.