CN219842651U - Temperature control carrier for semiconductor product test - Google Patents
Temperature control carrier for semiconductor product test Download PDFInfo
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- CN219842651U CN219842651U CN202320901796.2U CN202320901796U CN219842651U CN 219842651 U CN219842651 U CN 219842651U CN 202320901796 U CN202320901796 U CN 202320901796U CN 219842651 U CN219842651 U CN 219842651U
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- refrigerating
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- 238000012360 testing method Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 60
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 230000008859 change Effects 0.000 claims abstract description 10
- 238000005057 refrigeration Methods 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 33
- 238000001179 sorption measurement Methods 0.000 claims description 29
- 238000005192 partition Methods 0.000 claims description 11
- 238000009423 ventilation Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 230000006978 adaptation Effects 0.000 claims description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims 1
- 238000004088 simulation Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Devices For Use In Laboratory Experiments (AREA)
Abstract
The utility model discloses a temperature control carrier for testing semiconductor products, which comprises a placing plate, wherein the upper surface of the placing plate is fixedly provided with a carrier plate, the upper surface of the placing plate is provided with a mounting groove, the inside of the mounting groove is provided with a TEC refrigerating and heating plate for heating and refrigerating, the bottom of the placing plate is provided with a cooling mechanism, and the bottom surface of the placing plate is fixedly provided with a sealing plate. The beneficial effects of the utility model are as follows: through the TEC refrigeration heating plate that is equipped with at mounting groove internally mounted and can heat and heat passes through the carrier plate with heat or cold volume transfer to the product that is located the carrier plate upper surface, utilizes TEC refrigeration heating plate itself can heat and refrigerated characteristic to the temperature of simulation product during operation to and research temperature variation compares the device that can only heat with current, not only can heat and refrigerate, and simple structure moreover, and the volume is less to the change of product operating condition.
Description
Technical Field
The utility model relates to the technical field of product testing, in particular to a temperature control carrier for testing semiconductor products.
Background
In the process of chip development experiments, the working parameters of chips (particularly OLEDs) after long-term working temperature rise are found to be obviously changed, which leads to unstable and deviation phenomena of chip working, and in order to rapidly debug the product working temperature under different temperature backgrounds in the chip production process, the temperature control of the existing simulation temperature equipment can only heat, but can not simulate a high-temperature environment, for example, the existing Chinese patent document application number is 201820430235.8, the name is a controllable temperature heating stage, a resistance type heating device is adopted for heating, but the test under the low-temperature environment, such as the temperature below zero, can not be refrigerated, and therefore, the temperature control stage for semiconductor product test is provided for solving the problems.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provides a temperature control carrier for testing semiconductor products.
The aim of the utility model is achieved by the following technical scheme:
the utility model provides a semiconductor product test is with control by temperature change microscope carrier, is including placing the board, place board upper surface fixed mounting and have the carrier plate, place the board upper surface and seted up the mounting groove, mounting groove internally mounted has the TEC refrigeration heating plate that is used for heating and refrigerating, the bottom of placing the board is provided with cooling body, place board bottom fixed mounting and have the closing plate.
Preferably, the cooling mechanism comprises a cooling cavity formed in the bottom surface of the placing plate, a plurality of partition plates are fixedly arranged in the cooling cavity, a plurality of serpentine channels are formed in the cooling cavity between the partition plates, liquid inlet channels and liquid outlet channels are formed in the side walls of the placing plate, and the liquid inlet channels and the liquid outlet channels are respectively located at an inlet and an outlet of the serpentine channels.
Preferably, the inlet end of the liquid inlet channel and the outlet end of the liquid discharge channel are both provided with connectors.
Preferably, the upper surface of the carrier plate is provided with an adsorption fixing assembly, the adsorption fixing assembly comprises annular grooves formed in the upper surface of the carrier plate, adsorption holes are formed in each bottom surface, and ventilation channels are formed in the carrier plate and connected with the adsorption holes.
Preferably, the annular groove comprises a first annular groove and a second annular groove which are formed in the upper surface of the carrier plate, the adsorption hole comprises a first adsorption hole formed in the bottom surface of the first annular groove and a second adsorption hole formed in the bottom surface of the second annular groove, and the ventilation channel comprises a first channel formed in the carrier plate and communicated with the first adsorption hole and a second channel communicated with the second adsorption hole.
Preferably, the mounting groove is internally provided with a bearing mechanism, the bearing mechanism comprises a fixed block fixedly arranged on the bottom surface of the mounting groove, a first bearing strip is fixedly arranged on the side wall of the fixed block, a second bearing strip is fixedly arranged on three sides of the inner wall of the mounting groove, and a bearing surface which is formed by the first bearing strip and the second bearing strip and is positioned on three sides of the inner wall and is matched with the TEC refrigerating and heating plate.
Preferably, the upper surface of the placing plate is positioned on one side of the carrier plate and is also provided with a power line cover plate.
The utility model has the following advantages:
1. according to the utility model, the TEC refrigerating and heating plate capable of heating and heating is arranged in the mounting groove, heat or cold is transferred to a product positioned on the upper surface of the carrier plate through the carrier plate, and the characteristics of the TEC refrigerating and heating plate capable of heating and refrigerating are utilized, so that the temperature of the product in working is simulated, the change of the temperature change on the working state of the product is researched, and compared with the existing device capable of heating only, the device not only can heat and refrigerate, but also has a simple structure and a small volume.
2. According to the utility model, the baffle plates are arranged on the bottom surface of the placement plate, so that cooling liquid from the liquid inlet channel can pass through the serpentine channel formed by the plurality of baffle plates, thereby absorbing heat generated by the TEC refrigerating and heating plate, and preventing the heat generated by the back surface of the TEC refrigerating and heating plate from being unable to be dissipated when the TEC refrigerating and heating plate provides a low-temperature environment for a product, so that the TEC refrigerating and heating plate is damaged and cannot be used.
3. According to the utility model, the first annular groove and the second annular groove are formed in the upper surface of the carrier plate, the first suction hole and the second suction hole are formed in the bottom surfaces of the first annular groove and the second annular groove, and the first suction hole and the second suction hole are used for vacuumizing, so that a product is tightly attached to the upper surface of the carrier plate, and the product is prevented from moving on the upper surface of the carrier plate, so that the test is influenced.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present utility model.
Fig. 2 is a schematic diagram of the overall explosive structure of the present utility model.
Fig. 3 is a schematic structural view of a cooling mechanism according to the present utility model.
Fig. 4 is a schematic structural diagram of an adsorption fixing assembly according to the present utility model.
Fig. 5 is a schematic view of a first channel and a second channel in the interior of the carrier plate of the present utility model.
Fig. 6 is a schematic view of a carrying mechanism according to the present utility model.
In the figure, 1, placing a plate; 2. a carrier plate; 3. an adsorption fixing assembly; 31. a first ring groove; 32. a first suction hole; 33. a first channel; 34. a second ring groove; 35. a second suction hole; 36. a second channel; 4. a mounting groove; 5. TEC refrigerating and heating plate; 6. a closing plate; 7. a cooling mechanism; 71. a cooling chamber; 72. a partition plate; 73. a liquid inlet channel; 74. a liquid discharge channel; 8. a joint; 9. a carrying mechanism; 91. a fixed block; 92. a first carrier strip; 93. a second carrier strip; 10. a power cord cover plate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model.
Such as the embodiments shown in fig. 1-6.
The utility model provides a semiconductor product test is with control by temperature change microscope carrier, is including placing board 1, place board 1 upper surface fixed mounting has carrier plate 2, place board 1 upper surface and seted up mounting groove 4, mounting groove 4 internally mounted has the TEC refrigeration heating piece 5 that is used for heating and refrigerating, the bottom of placing board 1 is provided with cooling mechanism 7, place board 1 bottom surface fixed mounting has closing plate 6.
The TEC refrigerating and heating plate 5 is made of the peltier effect of semiconductor materials, has the characteristics of heating one side surface and refrigerating the other side surface, and can change the refrigerating surface and the heating surface only by changing the current direction, and the heating efficiency of the TEC refrigerating and heating plate 5 is larger than the refrigerating efficiency.
Referring to fig. 1 and 2, heat or cold generated by the TEC refrigerating and heating plate 5 is transferred to the carrier plate 2, and the product on the carrier plate 2 is heated or cooled, so that the change of the product in actual use is simulated, and the change of the product state caused by temperature change is studied.
Specifically, since the TEC refrigerating and heating plate 5 has a refrigerating surface and a heating surface, when an environment with a low temperature of a product needs to be simulated, that is, the upper surface of the TEC refrigerating and heating plate 5 is the refrigerating surface, the back surface is the heating surface, so as to prevent the TEC refrigerating and heating plate 5 from being damaged due to the fact that heat generated by the long-time working back surface of the TEC refrigerating and heating plate 5 cannot be rapidly dissipated, and the heat generated by the back surface of the TEC is absorbed through the cooling mechanism 7 positioned on the bottom surface of the placement plate 1, thereby preventing the TEC refrigerating and heating plate 5 from being damaged.
When a high-temperature environment needs to be simulated, the upper surface is a heating surface, the bottom surface is a refrigerating surface, and in order to influence the cooling capacity generated by the refrigerating surface on the TEC refrigerating and heating plate 5 unnecessarily, the temperature of the back surface of the TEC refrigerating and heating plate 5 can be controlled by controlling the temperature of water entering the cooling mechanism 7, and the specific temperature is not elaborated here and can be defined automatically according to the actual use condition.
The cooling mechanism 7 comprises a cooling cavity 71 formed in the bottom surface of the placement plate 1, a plurality of partition plates 72 are fixedly arranged in the cooling cavity 71, a plurality of serpentine channels are formed in the cooling cavity 71 between the partition plates 72, a liquid inlet channel 73 and a liquid outlet channel 74 are formed in the side wall of the placement plate 1, and the liquid inlet channel 73 and the liquid outlet channel 74 are respectively located at an inlet and an outlet of the serpentine channels.
Referring to fig. 3, the cooling liquid enters the serpentine channel formed by the partition plates 72 through the liquid inlet channel 73, and flows in the serpentine channel, so as to take away heat or cold generated by the back surface of the TEC refrigerating and heating plate 5, and the liquid inlet channel 73 and the liquid outlet channel 74 can be exchanged, i.e. the liquid outlet channel 74 can be set as a liquid inlet, the liquid inlet channel 73 is set as a liquid outlet, in this case, the liquid inlet channel 73 is adopted as the liquid inlet, and the liquid outlet channel 74 is adopted as the liquid outlet, as indicated by the direction of fig. 3.
In this embodiment, the partition plate 72 plays a role of forming a serpentine channel and also plays a role of increasing a heat dissipation area, and since the partition plate 72 is connected with the placing plate 1, heat received by the placing plate 1 can be transferred to the partition plate 72, thereby increasing the heat dissipation area, improving the heat dissipation efficiency, and correspondingly increasing the heat dissipation efficiency if the back surface of the TEC refrigerating and heating plate 5 is a refrigerating surface.
The inlet end of the liquid inlet channel 73 and the outlet end of the liquid outlet channel 74 are both provided with connectors 8.
The cooling liquid is externally connected through the connector 8, so that the cooling liquid flows into the serpentine channel through the liquid inlet channel 73, and heat generated on the back surface of the TEC refrigerating and heating plate 5 is absorbed, so that heat dissipation is realized.
The adsorption fixing assembly 3 is arranged on the upper surface of the carrier plate 2, the adsorption fixing assembly 3 comprises annular grooves formed in the upper surface of the carrier plate 2, adsorption holes are formed in each bottom surface, and ventilation channels are formed in the carrier plate 2 and connected with the adsorption holes.
The annular grooves comprise a first annular groove 31 and a second annular groove 34 which are formed in the upper surface of the carrier plate 2, the adsorption holes comprise a first adsorption hole 32 formed in the bottom surface of the first annular groove 31 and a second adsorption hole 35 formed in the bottom surface of the second annular groove 34, and the ventilation channels comprise a first channel 33 formed in the carrier plate 2 and communicated with the first adsorption hole 32 and a second channel 36 communicated with the second adsorption hole 35.
Referring to fig. 4 and 5, in this embodiment, the first channel 33 and the second channel 36 are externally connected with a pneumatic device, that is, can perform vacuumizing, when a product is placed on the upper surface of the carrier plate 2, an external device performs vacuumizing through the second channel 36 and the second suction hole 35 and a channel formed by the first channel 33 and the first suction hole 32, and performs vacuumizing on the second ring groove 34 and the first ring groove 31, so that the product is tightly attached to the surface of the carrier plate 2, and the product is prevented from affecting the test due to movement, in this embodiment, the first ring groove 31 and the second ring groove 34 are concentrically arranged, and the diameter of the first ring groove 31 is smaller than that of the second ring groove 34, so that the products with different specifications can be fixed.
The inside carrier 9 that is provided with of mounting groove 4, carrier 9 includes fixed block 91 of fixed mounting in mounting groove 4 bottom surface, fixed block 91 lateral wall fixed mounting has first carrier strip 92, the trilateral fixed second carrier strip 93 that is provided with of inner wall of mounting groove 4, the first carrier strip 92 and the second carrier strip 93 that is located the trilateral second carrier strip 93 of inner wall constitute with the loading surface of TEC refrigeration heating piece 5 adaptation.
The bearing surface formed by the first bearing strip 92 and the second bearing strip 93 is convenient for the installation and fixation of the TEC refrigeration heating plate 5.
The upper surface of the placing plate 1 is positioned on one side of the carrier plate 2 and is also provided with a power line cover plate 10. Pressing and sending out the power line of TEC refrigeration heating piece 5 or the pipeline to the evacuation is carried out to power line apron 10, prevents to lead to the fact the influence to the product test because the circuit is chaotic
The working process of the utility model is as follows: the working environment of a product positioned on the upper surface of the carrier plate 2 is simulated by heat or cold generated by the TEC refrigerating and heating plate 5, when a low-temperature environment needs to be simulated, namely the upper surface of the TEC refrigerating and heating plate 5 is a refrigerating surface, the bottom surface is a heating surface, and the cold generated by the refrigerating surface is transmitted to the product positioned on the upper surface of the carrier plate 2, so that the working environment of the product is simulated, at the moment, the back surface of the TEC refrigerating and heating plate 5 is a heating surface, and the heat generated by the heating surface is absorbed by the cooling mechanism 7, so that the TEC refrigerating and heating plate 5 is prevented from being damaged due to overhigh temperature; when the test needs a high-temperature environment, only the current direction of the TEC refrigerating and heating plate 5 needs to be changed, at this time, the upper surface of the TEC refrigerating and heating plate 5 is a heating surface, the back surface is a refrigerating surface, and heat generated by the heating surface is transferred to a product positioned on the upper surface of the carrier plate 2, so that the high-temperature environment is simulated.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (7)
1. The utility model provides a semiconductor product test is with control by temperature change microscope carrier which characterized in that: including placing board (1), place board (1) upper surface fixed mounting has carrier plate (2), mounting groove (4) have been seted up to place board (1) upper surface, mounting groove (4) internally mounted has TEC refrigeration heating piece (5) that are used for heating and refrigerating, the bottom of placing board (1) is provided with cooling mechanism (7), place board (1) bottom surface fixed mounting has closure plate (6).
2. The temperature-controlled carrier for semiconductor product testing as recited in claim 1, wherein: the cooling mechanism (7) comprises a cooling cavity (71) formed in the bottom surface of the placing plate (1), a plurality of partition plates (72) are fixedly arranged in the cooling cavity (71), a plurality of serpentine channels are formed between the partition plates (72) in the cooling cavity (71), liquid inlet channels (73) and liquid outlet channels (74) are formed in the side walls of the placing plate (1), and the liquid inlet channels (73) and the liquid outlet channels (74) are respectively located at the inlet and the outlet of the serpentine.
3. The temperature-controlled carrier for semiconductor product testing as claimed in claim 2, wherein: the inlet end of the liquid inlet channel (73) and the outlet end of the liquid outlet channel (74) are both provided with connectors (8).
4. The temperature-controlled carrier for semiconductor product testing as recited in claim 1, wherein: the adsorption fixing assembly (3) is arranged on the upper surface of the carrier plate (2), the adsorption fixing assembly (3) comprises annular grooves formed in the upper surface of the carrier plate (2), adsorption holes are formed in the bottom surface of each annular groove, and ventilation channels are formed in the carrier plate (2) and connected with the adsorption holes.
5. The temperature-controlled carrier for semiconductor product testing as recited in claim 4, wherein: the annular groove comprises a first annular groove (31) and a second annular groove (34) which are formed in the upper surface of the carrier plate (2), the adsorption hole comprises a first adsorption hole (32) formed in the bottom surface of the first annular groove (31) and a second adsorption hole (35) formed in the bottom surface of the second annular groove (34), and the ventilation channel comprises a first channel (33) formed in the carrier plate (2) and communicated with the first adsorption hole (32) and a second channel (36) communicated with the second adsorption hole (35).
6. The temperature-controlled carrier for semiconductor product testing as recited in claim 1, wherein: the utility model discloses a TEC refrigerating and heating plate, including installation groove (4), inside be provided with carrier mechanism (9) of installation groove (4), carrier mechanism (9) are including fixed block (91) of fixed mounting in installation groove (4) bottom surface, fixed block (91) lateral wall fixed mounting has first carrier strip (92), the trilateral fixed second carrier strip (93) that is provided with of inner wall of installation groove (4), first carrier strip (92) and the trilateral second carrier strip (93) that are located the inner wall constitute with the carrier surface of TEC refrigerating and heating plate (5) adaptation.
7. The temperature-controlled carrier for semiconductor product testing as recited in claim 1, wherein: the upper surface of the placing plate (1) is positioned on one side of the carrier plate (2) and is also provided with a power line cover plate (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320901796.2U CN219842651U (en) | 2023-04-20 | 2023-04-20 | Temperature control carrier for semiconductor product test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320901796.2U CN219842651U (en) | 2023-04-20 | 2023-04-20 | Temperature control carrier for semiconductor product test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219842651U true CN219842651U (en) | 2023-10-17 |
Family
ID=88305220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320901796.2U Active CN219842651U (en) | 2023-04-20 | 2023-04-20 | Temperature control carrier for semiconductor product test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219842651U (en) |
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2023
- 2023-04-20 CN CN202320901796.2U patent/CN219842651U/en active Active
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