CN219834670U - Condensation-preventing laser power module - Google Patents
Condensation-preventing laser power module Download PDFInfo
- Publication number
- CN219834670U CN219834670U CN202321370294.8U CN202321370294U CN219834670U CN 219834670 U CN219834670 U CN 219834670U CN 202321370294 U CN202321370294 U CN 202321370294U CN 219834670 U CN219834670 U CN 219834670U
- Authority
- CN
- China
- Prior art keywords
- upper cover
- pcb
- plate
- cover plate
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009833 condensation Methods 0.000 claims description 21
- 238000005452 bending Methods 0.000 claims description 19
- 125000006850 spacer group Chemical group 0.000 claims description 15
- 230000000903 blocking effect Effects 0.000 claims description 12
- 229920002943 EPDM rubber Polymers 0.000 claims description 6
- 239000003973 paint Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 2
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 17
- 239000000428 dust Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000565 sealant Substances 0.000 description 6
- 230000005494 condensation Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The utility model provides a condensation-preventing laser power module, comprising: the shell comprises an upper cover plate and a lower bottom plate, the upper cover plate is arranged on the lower bottom plate, baffle main bodies are respectively arranged on two sides of the lower bottom plate in the width direction, the baffle main bodies are connected with the upper cover plate, and through the coverage of the upper cover plate, a containing cavity is formed among the lower bottom plate, the baffle main bodies and the upper cover plate; the PCB is fixedly arranged on the lower bottom plate, and two ends of the PCB in the length direction protrude out of the accommodating cavity; the gasket assembly comprises at least two first gaskets and at least two second gaskets, the two first gaskets are respectively arranged at the joint of the upper cover plates on two sides and the baffle main body, and the two second gaskets are respectively arranged at the joint of the upper cover plates and two ends of the length direction of the PCB. The utility model solves the problem that in the prior art, a large amount of condensed water can be generated after the water cooling heat dissipation is cooled, and water flows into a circuit along a gap between the PCB and the glue to cause short circuit.
Description
Technical Field
The utility model relates to the technical field of power supplies, in particular to an anti-condensation laser power supply module.
Background
At present, most of water-cooling power supplies of lasers are open components, the power supplies are water-cooling heat dissipation, and a metal heat dissipation bottom plate of the power supplies is closely attached to a system water cooling plate to conduct heat dissipation; when the power supply is fully loaded, the highest temperature of the water cooling plate can not exceed 60 ℃, under the conditions of the high temperature of 60 ℃ and the high humidity of 95 percent, external hot air contacts with a PCB (the Chinese name of the PCB is a printed circuit board, also called a printed circuit board, which is an important electronic component, is a supporting body of the electronic component and is a carrier for electric connection of the electronic component.
However, the current conventional measures are to spray three-proofing paint on a PCB board for protection, and fill sealant into the whole machine for treatment, but the process is complex and has high material cost, if the sealant has high adhesiveness, the sealant is glued on the surfaces of the PCB board and devices, the subsequent maintenance is difficult, the workload is large, the processing rejection rate is high, if the sealant has low adhesiveness, the sealant on the surfaces of the PCB board and devices is easy to peel, a large amount of condensed water can be generated after the water cooling heat dissipation is cooled, and water flows into a circuit along a gap between the PCB board and the sealant to cause short circuit.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
The utility model aims to provide an anti-condensation laser power supply module, which solves the problem that in the prior art, water cooling heat dissipation generates a large amount of condensed water after encountering cold, and water flows into a circuit along a gap between a PCB and glue to cause short circuit.
In order to achieve the above purpose, the utility model adopts the following technical scheme: provided is a condensation-preventing laser power module including:
the shell comprises an upper cover plate and a lower bottom plate, the upper cover plate is arranged on the lower bottom plate, baffle main bodies are respectively arranged on two sides of the lower bottom plate in the width direction, the baffle main bodies are connected with the upper cover plate, and through the coverage of the upper cover plate, a containing cavity is formed among the lower bottom plate, the baffle main bodies and the upper cover plate;
the PCB is fixedly arranged on the lower bottom plate, and two ends of the PCB in the length direction protrude out of the accommodating cavity;
the gasket assembly comprises at least two first gaskets and at least two second gaskets, the two first gaskets are respectively arranged at the joint of the upper cover plates on two sides and the baffle main body, and the two second gaskets are respectively arranged at the joint of the two ends of the upper cover plate in the length direction of the PCB.
Optionally, the upper cover plate includes:
the first transverse plate is arranged in parallel with the lower bottom plate, and the length of the first transverse plate is matched with the size of the baffle plate;
the at least two second transverse plates are perpendicular to the lower surface of the first transverse plate and are respectively arranged at two sides of the width direction of the first transverse plate;
the upper cover plate forms an opening window at both ends in the width direction, and the baffle body covers the opening window.
Optionally, the first gasket comprises:
the first bending part is arranged at the joint of the first transverse plate and the baffle plate;
the at least two second bending parts are respectively arranged at the joint of the second transverse plates at the two sides and the baffle plate;
the first bending part and the at least two second bending parts are integrally formed.
Optionally, the gasket assembly further comprises a third gasket, and the third gasket is arranged between the PCB board and the lower base plate;
grooves are formed in the second gasket and the third gasket, the grooves in the second gasket are matched with the grooves in the third gasket to form a mounting cavity, and the PCB is embedded in the mounting cavity.
Optionally, the material coated on the front and back surfaces of the PCB is three-proofing paint.
Optionally, the first gasket and the second gasket are ethylene propylene diene rubber gaskets.
Optionally, the PCB board includes:
the first module is arranged on the lower bottom plate and is also provided with an output terminal;
the second module is arranged on the lower bottom plate and is positioned in the accommodating cavity;
and the third module is arranged on the lower bottom plate and is also provided with an input terminal.
Optionally, the PCB board further includes a plurality of blocking holes, and the blocking holes are disposed around the output terminal and the input terminal.
Optionally, a plurality of through holes are further formed in the PCB and the lower bottom plate, and the PCB and the lower bottom plate are fixedly connected through screws.
Optionally, the upper surface of the lower plate is provided as a flat surface, which matches the lower surface of the PCB board.
The anti-condensation laser power supply module provided by the utility model has the beneficial effects that: the first gasket is arranged at the joint of the upper cover plate and the baffle main body, and the second gasket is arranged at the joint of the upper cover plate and the PCB. The baffle main body is propped against the upper cover plate and forms a closed accommodating cavity with the upper cover plate and the lower bottom plate, so that most of PCB boards are in a sealed space, the influence of air humidity in the outside air is reduced, and the condensation is prevented. The accommodating cavity can effectively block the air circulation between the inside and the outside. Can prevent that inside steam, dust, greasy dirt, the foreign matter etc. of power module from getting into to improve power module's protectiveness and stability. In some high temperature or low temperature environment, the first gasket and the second gasket can buffer the influence of external temperature change on the internal components of the power module, so that the normal operation of the power module is ensured. The damage to internal components caused by external force effects such as vibration and vibration of the power supply module can be prevented, so that the reliability and the service life of the power supply module are improved. The upper cover plate is in butt joint with the lower bottom plate, and movable arrangement is between upper cover plate and the lower bottom plate, and when the inside subassembly needs to be maintained and change, the PCB board of being convenient for in the holding chamber is maintained.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a condensation preventing laser power module according to an embodiment of the present utility model;
FIG. 2 is an exploded view of an anti-condensation laser power module according to an embodiment of the present utility model;
FIG. 3 is a top view of an anti-condensation laser power module according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a PCB board according to an embodiment of the present utility model;
fig. 5 is a schematic view of the second gasket and the third gasket in the embodiment of the present utility model.
Wherein, each reference sign in the figure:
10. a housing; 110. an upper cover plate; 111. a second cross plate; 112. a first cross plate; 120. a lower base plate; 130. a baffle main body; 20. a PCB board; 210. a first module; 220. a second module; 230. a third module; 240. blocking the hole; 250. a through hole; 30. a gasket assembly; 310. a first gasket; 311. a second bending part; 312. a first bending part; 313. a third bending part; 320. a second gasket; 330. a third gasket; 340. a first boss; 350. a second boss; 360. a mounting cavity; 370. a first groove; 380. a second groove; 40. an opening window.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
It is noted that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are directions or positions based on the drawings, and are merely for convenience of description and are not to be construed as limiting the present technical solution. The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.
As shown in fig. 1 and 2, the present embodiment provides an anti-condensation laser power module, which is configured to convert an input power into power for output, and mainly includes: the shape of the casing 10 may be set in various forms, without being limited specifically, in order to match the shape of the PCB 20, the baffle main body 130 in this embodiment is set to be rectangular matching with the PCB 20, the casing 10 includes an upper cover plate 110 and a lower base plate 120, the upper cover plate 110 is set on the lower base plate 120, the upper cover plate 110 abuts against the lower base plate 120, at least two baffle main bodies 130 are respectively provided on two sides of the width direction of the lower base plate, the baffle main bodies 130 and the lower base plate 120 are integrally bent and formed, the baffle main bodies 130 are connected with the upper cover plate 110, and the lower base plate 120 is covered by the upper cover plate 110. The baffle main body 130 and the upper cover plate 110 form a closed accommodating cavity, the PCB 20 is fixedly connected to the lower bottom plate 120 through screws and is matched with the shape of the lower bottom plate 120, two ends of the PCB 20 in the length direction protrude out of the accommodating cavity, most of the PCB 20 is in a sealed space, the influence of air humidity in the outside air is reduced, and condensation is prevented. The gasket assembly 30 includes at least two first gaskets 310 and at least two second gaskets 320, the two first gaskets 310 are respectively disposed at the connection position of the upper cover plate 110 and the baffle main body 130, and the two second gaskets 320 are respectively disposed at the connection position of the upper cover plate 110 and the two ends of the PCB board 20 in the length direction. Through setting up first gasket 310 and second gasket 320, can prevent that inside steam, dust, greasy dirt, the foreign matter of power module from getting into to improve power module's protectiveness and stability.
The working principle of this embodiment is that the first spacer 310 is disposed at the junction of the upper cover plate 110 and the baffle main body 130, and the second spacer 320 is disposed at the junction of the upper cover plate 110 and the PCB board 20. The baffle main body 130 abuts against the upper cover plate 110, and forms a closed accommodating cavity with the upper cover plate 110 and the lower bottom plate 120, so that most of the PCB boards 20 are in a sealed space, the influence of air humidity in the outside air is reduced, and the condensation is prevented. The accommodating cavity can effectively block the air circulation between the inside and the outside. Can prevent that inside steam, dust, greasy dirt, the foreign matter etc. of power module from getting into to improve power module's protectiveness and stability. The upper cover plate 110 is abutted with the lower bottom plate, and the upper cover plate 110 and the lower bottom plate 120 are movably arranged, so that the PCB 20 in the accommodating cavity can be maintained conveniently.
The beneficial effect that this embodiment provided a prevent condensing laser power module lies in at least: by disposing the first spacer 310 at the junction of the upper cover plate 110 and the barrier body 130, the second spacer 320 is disposed at the junction of the upper cover plate 110 and the PCB board 20. The baffle main body 130 abuts against the upper cover plate 110, and forms a closed accommodating cavity with the upper cover plate 110 and the lower bottom plate 120, so that most of the PCB boards 20 are in a sealed space, the influence of air humidity in the outside air is reduced, and the condensation is prevented. The accommodating cavity can effectively block the air circulation between the inside and the outside. Can prevent that inside steam, dust, greasy dirt, the foreign matter etc. of power module from getting into to improve power module's protectiveness and stability. In some high-temperature or low-temperature environments, the first gasket 310 and the second gasket 320 can buffer the influence of external temperature changes on the internal components of the power module, thereby ensuring the normal operation of the power module. The damage to internal components caused by external force effects such as vibration and vibration of the power supply module can be prevented, so that the reliability and the service life of the power supply module are improved. The upper cover plate 110 is abutted with the lower bottom plate, the upper cover plate 110 and the lower bottom plate 120 are movably arranged, and when the internal components need to be maintained and replaced, the PCB 20 in the accommodating cavity is convenient to maintain.
As shown in fig. 1 and 2, the upper cover plate 110 in the present embodiment includes: the at least two second transverse plates 111 and the first transverse plate 112, the first transverse plate 112 is arranged in parallel with the lower bottom plate, the length of the first transverse plate 112 is matched with the size of the baffle plate, the at least two second transverse plates 111 are arranged perpendicular to the lower surface of the first transverse plate 112, are oppositely arranged at two sides of the width direction of the first transverse plate, are abutted against the baffle main body 130 and the lower bottom plate 120, the second transverse plates 111 extend towards the direction of the lower bottom plate 120 for a certain distance, the extending length of the second transverse plates 111 corresponds to the height of the baffle main body 130, the upper cover plate 110 is connected with the first transverse plates 112 and the second transverse plates 111 at two ends of the width direction to cover the opening window 40, the second transverse plates 111 and the first transverse plates 112 are integrally bent and formed, and the at least one power module has a series of advantages of reliability, adaptation to the sizes of various PCB (printed circuit boards) 20, pollution reduction, attractive appearance and the like, and the overall performance and quality of the power module can be improved.
As shown in fig. 1, 2 and 4, the first spacer 310 in the present embodiment includes: the at least two second bending parts 311 and the first bending part 312, the at least two second bending parts 311 are respectively arranged at the joint of the second transverse plates 111 at two sides and the baffle plate and are abutted against the upper cover plate 110, the first bending part 312 is arranged at the joint of the first transverse plates 112 and the baffle plate and is abutted against the upper cover plate 110, and the first bending part 312 and the at least two second bending parts 311 are integrally formed. The shape of the first gasket 310 is matched with the shape of the baffle main body 130, and the second bending part 311 and the first bending part 312 can enable the baffle main body 130 to be closely attached to the upper cover plate 110, so that a gap between the baffle main body 130 and the upper cover plate 110 is reduced, and water vapor, dust, greasy dirt, foreign matters and the like outside the shell 10 are prevented from entering the accommodating cavity, so that the protection performance and the stability of the power module are improved.
As shown in fig. 1 and 2, the second spacer 320 in this embodiment further includes a third spacer 330, the third spacer 330 is disposed between the PCB 20 and the lower plate 120 and is disposed corresponding to the second spacer 320, grooves are disposed on the second spacer 320 and the third spacer 330, the size of the grooves is matched with that of the PCB 20, the grooves on the second spacer 320 are matched with the grooves of the third spacer 330 to form a mounting cavity 360, and the PCB 20 is embedded in the mounting cavity 360. Through setting up third gasket 330, can make PCB board 20 mostly be located inclosed holding intracavity, reduce the clearance between PCB board 20 and the upper cover plate 110, prevent outside steam, dust, greasy dirt, the foreign matter of shell 10 etc. entering holding intracavity to improve power module's protectiveness and stability.
As shown in fig. 1, 2 and 5, the second gasket 320 in this embodiment is further provided with a first groove 370 and a first boss 340, the third gasket 330 is further provided with a second groove 380 and a second boss 350, the first boss 340 is clamped in the second groove 380, the second boss 350 is clamped in the first groove 370, and when the contact surfaces of the second gasket 320 and the third gasket 330 are planar, the sealing effect is easily affected by factors such as surface roughness, uneven pressure distribution, and the like. The contact point between the second gasket 320 and the third gasket 330 is arranged in a stepped shape, so that the number of contact points can be increased, the pressure can be distributed uniformly, and the tightness can be enhanced. Meanwhile, the contact area of the gasket can be increased by the step shape, so that the sealing reliability is improved.
As shown in fig. 1, 2 and 3, the PCB board 20 in this embodiment includes: the first module 210, the second module 220 and the third module 230, the first module 210 is disposed on the lower base plate 120, the first module 210 is further provided with an output terminal, the second module 220 is disposed on the lower base plate 120 and is located in the accommodating cavity, the third module 230 is disposed on the lower base plate 120, and the third module 230 is further provided with an input terminal. By placing the second module 220 in the closed accommodating cavity, the ventilation between the interior and the outside can be effectively blocked. And placing the first module 210 and the second module 220 outside the accommodation chamber facilitates the connection of the output terminal and the input terminal to external components.
As shown in fig. 1, 2 and 3, the PCB board 20 in the present embodiment further includes a plurality of blocking holes 240, and the blocking holes 240 are disposed around the output terminal and the input terminal. When there is a signal or power interference between the circuits or between the different layers on the PCB board 20, the circuits or signals may be isolated by providing the blocking holes 240, thereby improving the stability and reliability of the entire circuit system. The blocking holes 240 can effectively isolate signals or power sources of two adjacent areas, and avoid mutual interference between the signals or the power sources, so that the accuracy and the precision of the PCB are maintained. When the PCB needs to be tested, maintained or replaced, the blocking hole 240 can rapidly cut off the connection between the instrument and a part of the circuit, thereby avoiding the influence of external factors on the PCB test result. When a plurality of mutually independent circuits are arranged in the PCB, the circuits can be separated by arranging the blocking holes 240, so that the purpose of saving space is achieved, and the design of the PCB is more compact. Providing a plurality of blocking holes 240 can improve reliability and stability of the PCB while maintaining stability, accuracy and precision thereof, and contribute to space saving and cost reduction.
As shown in fig. 4, a plurality of through holes 250 are further formed in the PCB 20 and the lower plate in this embodiment, and the PCB 20 and the lower plate are fixedly connected by screws. Through hole 250 flows through the inboard, the off-board air flow, can play better radiating effect to reduce the temperature of components and parts on PCB board 20 and the lower plate, alleviate the load of partial components and parts, improve the work efficiency and the life-span of PCB board 20. The PCB 20 and the lower chassis are fixedly connected through screws penetrating through the plurality of through holes 250, thereby improving stability and reliability of the entire circuit system.
As shown in fig. 2 and 4, the upper surface of the lower chassis in this embodiment is provided as a flat surface, which matches the lower surface of the PCB board 20. Through the lower surface phase-match with PCB board 20, the bottom plate can provide stable support and fixed effect to avoid the crooked or deformation of PCB board 20, ensure that PCB board 20 can keep stable form in the operation in-process. The flat surface of the lower base plate can improve the mechanical strength and vibration resistance of the PCB 20, so that vibration and displacement of the PCB 20 in the operation process are reduced, and the stability and reliability of components on the PCB 20 are ensured.
As shown in fig. 1, 2 and 4, the material coated on the front and back sides of the PCB 20 in this embodiment is a three-proofing paint. The three-proofing paint can form a protective layer with good sealing performance, and can prevent components and parts from being damped and malfunctioning due to long-time exposure of the PCB to a humid environment. The three-proofing paint can play a certain dustproof effect, protect the surface of the PCB and components from being damaged by dust and dirt, reduce the cleaning times of the PCB and the components, and further prolong the service life of the PCB.
As shown in fig. 1, 2 and 4, the first gasket 310 and the second gasket 320 in this embodiment are ethylene propylene diene monomer gaskets. The ethylene propylene diene monomer gasket has excellent sealing performance and reliable permeation resistance, and can enable the joints of industrial equipment, pipelines, containers and the like to be tight and seamless, thereby avoiding leakage of liquid or gas and ensuring the safety and stability of industrial production. The ethylene propylene diene monomer gasket has good heat resistance and oxidation resistance, can be stably used for a long time under the conditions of high temperature, low temperature and complex environment, and is not easily affected by chemical substances, ultraviolet rays and other harmful substances to age. The ethylene propylene diene monomer rubber gasket has higher strength and toughness, and can bear certain pressure and extrusion deformation, thereby ensuring the stability and the sealing performance of the joint.
Claims (10)
1. An anti-condensation laser power module, comprising:
the shell comprises an upper cover plate and a lower bottom plate, wherein the upper cover plate is arranged on the lower bottom plate, baffle main bodies are respectively arranged on two sides of the lower bottom plate in the width direction, are connected with the upper cover plate, and form a containing cavity among the lower bottom plate, the baffle main bodies and the upper cover plate through the coverage of the upper cover plate;
the PCB is fixedly arranged on the lower bottom plate, and two ends of the length direction of the PCB protrude out of the accommodating cavity;
the gasket assembly comprises at least two first gaskets and at least two second gaskets, wherein the two first gaskets are respectively arranged at the joint of the upper cover plate and the baffle main body at two sides, and the two second gaskets are respectively arranged at the joint of the upper cover plate and the two ends of the length direction of the PCB.
2. The anti-condensation laser power module as claimed in claim 1, wherein said upper cover plate comprises:
the first transverse plate is arranged in parallel with the lower bottom plate, and the length of the first transverse plate is matched with the size of the baffle plate;
the at least two second transverse plates are perpendicular to the lower surface of the first transverse plate and are oppositely arranged on two sides of the width direction of the first transverse plate;
the upper cover plate forms an opening window at both ends in the width direction, and the baffle body covers the opening window.
3. The anti-condensation laser power module as claimed in claim 2, wherein said first gasket comprises:
the first bending part is arranged at the joint of the first transverse plate and the baffle plate;
the at least two second bending parts are respectively arranged at the joint of the second transverse plates and the baffle plates at the two sides;
the first bending part and the at least two second bending parts are integrally formed.
4. The anti-condensation laser power module as claimed in claim 3, wherein said spacer assembly further comprises a third spacer disposed between said PCB board and said lower base plate;
the second gasket and the third gasket are respectively provided with a groove, the grooves on the second gasket and the grooves on the third gasket are matched to form a mounting cavity, and the PCB is embedded in the mounting cavity.
5. The anti-condensation laser power module as claimed in claim 1, wherein the material coated on the front and back surfaces of the PCB is a three-proofing paint.
6. The anti-condensation laser power module as claimed in claim 5, wherein the first gasket and the second gasket are ethylene propylene diene monomer gaskets.
7. The anti-condensation laser power module as claimed in claim 6, wherein the PCB board comprises:
the first module is arranged on the lower bottom plate and is also provided with an output terminal;
the second module is arranged on the lower bottom plate and is positioned in the accommodating cavity;
and the third module is arranged on the lower bottom plate and is also provided with an input terminal.
8. The anti-condensation laser power module as claimed in claim 7, wherein the PCB board further comprises a plurality of blocking holes, the blocking holes being disposed around the output terminals and the input terminals.
9. The anti-condensation laser power module as claimed in claim 8, wherein a plurality of through holes are further formed in the PCB and the lower plate, and the PCB and the lower plate are fixedly connected by screws.
10. The anti-condensation laser power module as claimed in claim 9, wherein the upper surface of the lower chassis is configured as a flat surface that mates with the lower surface of the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321370294.8U CN219834670U (en) | 2023-05-31 | 2023-05-31 | Condensation-preventing laser power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321370294.8U CN219834670U (en) | 2023-05-31 | 2023-05-31 | Condensation-preventing laser power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219834670U true CN219834670U (en) | 2023-10-13 |
Family
ID=88281439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321370294.8U Active CN219834670U (en) | 2023-05-31 | 2023-05-31 | Condensation-preventing laser power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219834670U (en) |
-
2023
- 2023-05-31 CN CN202321370294.8U patent/CN219834670U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20190269004A1 (en) | Electronic equipment and electronic device | |
| CN219834670U (en) | Condensation-preventing laser power module | |
| WO2018021425A1 (en) | Battery device and battery system | |
| CN215264349U (en) | Heat dissipation system for projection equipment and projection equipment | |
| JP6079421B2 (en) | Power converter | |
| EP3824506A1 (en) | Fuel cell system and integration backplane for fuel cell modules | |
| CN217486729U (en) | Heat dissipation module and industrial power supply | |
| CN210986656U (en) | Dustproof PCB board shell | |
| CN213185905U (en) | Electric automobile dual control ware heat dissipation shell | |
| CN209929669U (en) | IP68 protection level pressure-bearing type laser lamp box | |
| CN211860818U (en) | Light source cabinet | |
| CN216391624U (en) | Waterproof watch cover for industrial watch | |
| CN220326058U (en) | Vehicle-mounted power supply and vehicle | |
| CN112601408A (en) | Electrical apparatus box, controller and ECAS pneumatic system | |
| CN216626397U (en) | Automatically controlled box and sterilizing machine | |
| CN221488141U (en) | Liquid cooling plate structure and power module | |
| CN219780277U (en) | Industrial switch with protection casing | |
| CN111224306A (en) | IP68 protection level pressure-bearing type laser lamp box | |
| CN220173672U (en) | Vehicle-mounted power supply and vehicle | |
| CN219124612U (en) | Intelligent farm informatization service management device | |
| CN215869360U (en) | Cooling plate assembly and chip heat dissipation system | |
| CN219626743U (en) | Multilayer heat dissipation type lithium battery | |
| CN219514378U (en) | Semiconductor laser therapeutic instrument shell assembly and laser therapeutic instrument | |
| CN210348364U (en) | Closed industrial computer | |
| CN216348742U (en) | Sealing structure of encoder shell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518100, Building 4, West Half Floor, 601, 701, Building 301, 401, 501, Fubilun Technology Factory, Tantou Community, Songgang Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Lianming Power Supply Co.,Ltd. Country or region after: China Address before: 518100 10th floor, 11th floor, 1st workshop, 9th floor, 2nd workshop, No. 128, Shangnan East Road, Huangpu Community, Xinqiao Street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN LIANMING POWER Co.,Ltd. Country or region before: China |