CN219831451U

CN219831451U - Shell structural member for QSFP+/QSFP28 optical module

Info

Publication number: CN219831451U
Application number: CN202320637963.7U
Authority: CN
Inventors: 王苗庆; 柳涛
Original assignee: Shaoxing Zktel Equipment Co ltd
Current assignee: Shaoxing Zktel Equipment Co ltd
Priority date: 2023-03-23
Filing date: 2023-03-23
Publication date: 2023-10-13
Anticipated expiration: 2033-03-23

Abstract

The utility model relates to the field of manufacturing of optical devices, in particular to a shell structural member for a QSFP+/QSFP28 optical module, which comprises an upper cover and a lower cover, wherein a male-female spigot structure is adopted between the upper cover and the lower cover to realize closing; the advantages are that: the shell structure has the advantages of simple assembly process, good reliability, low manufacturing cost and good electromagnetic shielding and heat dissipation effects.

Description

Shell structural member for QSFP+/QSFP28 optical module

Technical Field

The utility model relates to the field of optical device manufacturing, in particular to a shell structural member for a QSFP+/QSFP28 optical module.

Background

As shown in fig. 1 to 3, most of the current qsfp+/QSFP28 optical modules include an upper cover and a lower cover, and a circuit board assembly and an optical device are installed in a cavity formed by splicing the upper cover and the lower cover, and the circuit board assembly and the optical device release electromagnetic waves when in operation, and the electromagnetic waves can pass through a nonmetal surface and a relatively small gap. The structure has the following defects:

1. as shown in fig. 3, since the contact surfaces of the upper cover and the lower cover are plane, a gap must exist between the upper cover and the lower cover when the upper cover is closed, electromagnetic waves are easy to leak out from the gap, and EMI (Electro Magnetic Interference ) exceeds the standard; in the prior art, a mode of sticking wave-absorbing materials inside the upper cover and the lower cover is adopted to reduce leakage of electromagnetic waves, but the wave-absorbing materials have higher cost, only reduce the leakage amount and can not radically stop leakage;

2. as shown in fig. 1 and 2, the protruding platform of the upper cover and the lower cover is an exposed part of the optical module after being inserted into the server, and since the protruding platform is a plane and the protruding height is smaller, the surface area of the protruding part is smaller, and the defect of insufficient heat dissipation exists (the larger the surface area is, the better the heat dissipation effect is).

Based on this, the present application is hereby proposed.

Disclosure of Invention

The present utility model is directed to a housing structure for a QSFP+/QSFP28 optical module to improve EMI shielding and improve heat dissipation of the optical module.

In order to achieve the above object, the technical scheme of the present utility model is as follows:

a shell structure for a QSFP+/QSFP28 optical module comprises an upper cover and a lower cover, wherein a male-female spigot structure is adopted between the upper cover and the lower cover to realize closing.

Further, a conductive silver adhesive layer is arranged between the male spigot and the female spigot.

Further, fin structures are arranged at the outer walls of the upper cover and/or the lower cover.

Furthermore, the surface of the fin structure is provided with a sand spraying layer and/or a plating layer.

Further, the fin structure comprises a plurality of fins, the width value of each fin is between 0.7mm and 0.9mm, the height value of each fin is not more than 3.3mm, and the distance value between every two adjacent fins is between 1.6mm and 1.8 mm.

Further, the fin structure comprises a plurality of fins, the width value of each fin is 0.85mm, the height value of each fin is 3.3mm, and the distance value between every two adjacent fins is 1.755mm.

The utility model has the advantages that:

1. the shell structure is simple in assembly process: after the upper cover and the lower cover are assembled, screws are arranged, and the conductive silver adhesive is automatically compressed, so that an electromagnetic shielding effect is achieved; the fins and the shell can be integrally formed by die casting, and the heat dissipation effect can be achieved after the assembly;

2. the shell reliability is good: the conductive silver adhesive is solidified after the lower cover, is integrated with the lower cover, is not easy to fall off, and can be repeatedly assembled and extruded; the fins and the shell are integrally formed by die casting, the surface is not easy to damage after sand blasting/electroplating treatment, and the durability is good;

3. the manufacturing cost is low: compared with the scheme that wave absorbing materials are adhered to the inner parts of the upper cover and the lower cover, the scheme that conductive silver glue is added to the spigot structure (the conductive silver glue is made of nickel carbon) has lower cost; the fins and the shell can be integrally formed by die casting, so that the cost is hardly increased;

4. the electromagnetic shielding effect is good: the seam allowance structure is added with conductive silver glue, so that the inner walls of the upper cover and the lower cover have almost no gaps, and electromagnetic waves are difficult to leak out; the scheme of sticking wave-absorbing materials inside is reversely observed, so that the leakage amount can be reduced only;

5. the heat dissipation effect is good: after heat in the module is conducted to the upper cover, the lower cover and the fins, the fins discharge the heat through heat exchange with air (the heat exchange is more complete as the surface area is larger), and compared with a module without the fins, the heat dissipation efficiency is higher.

Drawings

FIG. 1 is a schematic diagram of the top cover side of a QSFP+/QSFP28 optical module according to the background art;

FIG. 2 is a schematic view of the structure of the lower cover side of a QSFP+/QSFP28 optical module in the prior art;

FIG. 3 is a schematic three-dimensional cross-sectional view of FIG. 1;

FIG. 4 is a schematic diagram of the top cover side of a QSFP+/QSFP28 optical module according to an embodiment;

FIG. 5 is a schematic view of the lower cover side of the QSFP+/QSFP28 optical module according to the embodiment;

FIG. 6 is a schematic three-dimensional cross-sectional view of FIG. 4;

description of the reference numerals

1-an upper cover; 2-a lower cover; 3-pull ring; 4-male ends; 5-female seam allowance; 6-conductive silver colloid; 7-fin structure; 8-a platform with a convex upper cover in the background technology; 9-a platform with a protruding lower cover in the background art.

Detailed Description

The present utility model will be described in further detail with reference to the following embodiments, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like herein indicate an orientation or a positional relationship based on the orientation or the positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

This embodiment proposes a housing structure for a qsfp+/QSFP28 optical module, as shown in fig. 4 to 6, comprising three parts, an upper cover 1, a lower cover 2, and a pull ring 3. As shown in fig. 6, the edge of the upper cover 1 is designed to be a male spigot 4, the edge of the lower cover 2 is designed to be a female spigot 5, conductive silver glue 6 is dotted at the female spigot 5 of the lower cover 2, after the upper cover 1 and the lower cover 2 are assembled, the male spigot 4 and the female spigot 5 are just matched to tightly press the conductive silver glue 6, so that a shell has no gap, and the conductive silver glue 6 contains nickel-carbon materials, contains metal elements, so that the conductive silver glue can conduct electricity, and forms a 'metal wall' without gaps with the upper cover 1 and the lower cover 2 after being extruded, thus internal electromagnetic waves can be blocked from leaking.

The process of curing the conductive silver adhesive 6 on the lower cover 2 in the embodiment is mature, and the structural member provider can provide the service, so that the cost is low and controllable, the reliability after curing is good, the conductive silver adhesive is not easy to damage, and the conductive silver adhesive can be repeatedly used. Meanwhile, the upper cover 1 and the lower cover 2 squeeze the conductive silver adhesive 6 without deliberately adding any process, because 4 assembly screws are designed on the upper cover 1 and the lower cover 2, and when the assembly is carried out, the screws are naturally squeezed after tightening, so that time and labor are saved. Of course, if the electromagnetic wave generated in the shell is less, the male and female spigot structure can meet the shielding effect, and at the moment, the conductive silver adhesive 6 can be omitted, so that the cost is saved.

When the optical module in this example is inserted into a server for use, a part of the structure of the housing is exposed outside the server, the exposed part exchanges heat with air, and the heat dissipation performance of the module can be improved by increasing the surface area of the exposed part. In this embodiment, the exposed portions of the upper and lower covers 2 are all made into fin structures 7, and the height dimension is the maximum of the design specification. The fin structures 7 are respectively designed at the positions of the upper cover 1 and the lower cover 2 exposed out of the server, and are integrally formed by using a die casting process, the surface is subjected to sand blasting or nickel plating treatment, the cost is hardly increased, and meanwhile, the difficulty of the die casting and assembly process is not increased.

Preferably, this embodiment gives an optimum sizing of the fin structure for the optical module: the fin structure comprises a plurality of fins, the width value of each fin is 0.85mm, the height value of each fin is 3.3mm, and the distance value between two adjacent fins is 1.755mm.

The above embodiments are only for illustrating the concept of the present utility model and not for limiting the protection of the claims of the present utility model, and all the insubstantial modifications of the present utility model using the concept shall fall within the protection scope of the present utility model.

Claims

1. The shell structural member for the QSFP+/QSFP28 optical module comprises an upper cover and a lower cover, and is characterized in that a male and female spigot structure is adopted between the upper cover and the lower cover to realize closing, a conductive silver adhesive layer is arranged between the male and female spigots, and fin structures are arranged at the outer walls of the upper cover and/or the lower cover.

2. A housing structure for a qsfp+/QSFP28 optical module according to claim 1, wherein the fin structure surface is provided with a sand blasting and/or plating.

3. A housing structure for a qsfp+/QSFP28 optical module according to claim 1, wherein the fin structure comprises a plurality of fins having a width of between 0.7mm and 0.9mm and a height of no more than 3.3mm, and wherein the spacing between adjacent fins is between 1.6mm and 1.8 mm.

4. A housing structure for a qsfp+/QSFP28 optical module according to claim 1, wherein the fin structure comprises a plurality of fins having a width of 0.85mm and a height of 3.3mm, and wherein the spacing between adjacent fins is 1.755mm.