CN101287357A - Electro-magnetic shielding cover - Google Patents
Electro-magnetic shielding cover Download PDFInfo
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- CN101287357A CN101287357A CNA2008101126637A CN200810112663A CN101287357A CN 101287357 A CN101287357 A CN 101287357A CN A2008101126637 A CNA2008101126637 A CN A2008101126637A CN 200810112663 A CN200810112663 A CN 200810112663A CN 101287357 A CN101287357 A CN 101287357A
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- magnetic shielding
- shielding cover
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- plastic cement
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Abstract
The invention provides an electromagnetic shielding case which comprises a metal top made of metal materials and a plastic conducting frame which is jointed under the metal top, wherein, the plastic conducting frame comprises a plastic frame body made of plastic materials and a conducting layer covering the surface of the plastic frame body. The bottom of the plastic conducting frame is electrically jointed on a PCB. By adopting the electromagnetic shielding case of the invention, the through-thickness space can be saved and the manufacturing process can be simplified. Furthermore, material cost and manufacturing cost can be reduced.
Description
Technical field
The present invention relates to a kind of screening arrangement, specifically, relate to a kind of electro-magnetic shielding cover that is used to prevent electromagnetic interference (EMI).
Background technology
In normal running, the electronic/electric in the equipment can produce the electromagnetic energy of not expecting usually, because the EMI that produces by radiation transmits, this electromagnetic energy can be disturbed the operation of adjacent electronic/electric.In order to eliminate or to alleviate the negative effect that produces by electromagnetic interference at least, can use electro-magnetic shielding cover/device to come to provide electromagnetic interference shield as electronic/electric.
Existing electro-magnetic shielding cover normally adopts zinc-plated steel band or the good metal material of other solderabilities to make, and mainly comprises top cover portion and the side that extends from top cover portion downwards, is fixed on the PCB (printed circuit board (PCB)) by welding manner.The die sinking cost of this metal electro-magnetic shielding cover need be offered a plurality of moulds than higher separately when particularly carrying out electromagnetic shielding for a plurality of electric components, and cost is than higher.And, owing to need be fixed by welding on the pcb board, having increased the installation difficulty of metal electro-magnetic shielding cover, installation cost is also than higher.In addition, after being welded to the metal electromagnetic shielding on the PCB, if need keep in repair to the electronic device that surrounded by electro-magnetic shielding cover (for example IC part etc.), then must be down with the electro-magnetic shielding cover weldering, damage the electronic device that is surrounded by electro-magnetic shielding cover so especially easily, and maintenance is also very inconvenient.
For solving the problem that above-mentioned metal electro-magnetic shielding cover exists, someone has proposed to adopt plastic material to make the electro-magnetic shielding cover that metal conducting layer is set on the surface after the moulding, and for example publication number provides a kind of mobile phone electro-magnetic shielding cover of material plastic material for the Chinese patent of CN200969597Y.This plastic material lays the electro-magnetic shielding cover of metal conducting layer, electroplating or spray is established metal conducting layer and formed owing to can adopt after the plastic material injection mo(u)lding, thereby can save the die sinking cost, particularly can make electro-magnetic shielding cover by injection mo(u)lding with a plurality of separate chamber, thereby avoided the situation of the independent die sinking of a plurality of metallic shields, reduced manufacturing cost.But be subjected to the restriction of Shooting Technique and intensity, adopting this plastic material to cover the thickness of the electro-magnetic shielding cover of metal conducting layer more usually need be more than 0.6mm, will take up room at thickness direction so more, do not meet the electronic product requirement do the very thin market demand.
Therefore, be necessary to provide a kind of new electromagnetic shielding cover structure, overcome the defective that above-mentioned existing electro-magnetic shielding cover exists.
Summary of the invention
The objective of the invention is to, a kind of electro-magnetic shielding cover is provided, not only can reduce manufacturing cost, and can not influence space at thickness direction.
Above-mentioned purpose of the present invention can adopt following technical scheme to realize, a kind of electro-magnetic shielding cover is characterized in that, this electro-magnetic shielding cover comprises:
Metal top, it is made by metal material;
The plastic cement conductive frame, it is engaged in metal top below, and comprises the plastic frame body of being made by plastic material and cover in the conductive layer of plastic frame body surface;
The lower end of this plastic cement conductive frame is engaged on the pcb board.
Like this,, can do thinlyyer (for example 0.2mm), thereby can not take too many thickness space because metal top is adopted at the top of electro-magnetic shielding cover, help satisfying with electronic product make the very thin market demand; And form owing to framework adopts plastic material to make to cover conductive layer again after the plastic frame main body, its manufacturing process is simple, and manufacturing cost is lower.When particularly a plurality of electric components being carried out electromagnetic shielding for needs, this framework can directly inject a plurality of chambers, each chamber can correspondingly shield an electric component, thereby utilize an electro-magnetic shielding cover of the present invention to carry out electromagnetic shielding to a plurality of electric components simultaneously, offer the metallic shield of a plurality of moulds with needs and compare, greatly reduced manufacturing cost.
In an optional execution mode of the present invention, described metal top can be provided with a plurality of weldings hole, and described metal top lumps together by this welding hole and the thermal welding of plastic cement conductive frame.
In another optional execution mode of the present invention, described metal top and the injection moulding of plastic cement conductive frame are bonded together.
In an optional execution mode of the present invention, the conductive layer that described plastic cement conductive frame surface covers is by forming at plastic frame body surfaces spraying conductive paint.
In another optional execution mode of the present invention, the conductive layer that described plastic cement conductive frame surface covers is by forming at plastic frame body surfaces electroplated metal layer.
In the present invention, described plastic cement conductive frame lower end is bonded with conducting resinl, and this plastic cement conductive frame is engaged on the pcb board by the soft contact crimping of this conducting resinl.Like this, when needs are removed electro-magnetic shielding cover and are come wherein electric component keeped in repair, only need to remove the pressure that is applied on metallic shield and the pcb board, can easily electro-magnetic shielding cover be removed from pcb board, very convenient quick, and can not cause damage to electric component yet.
This plastic cement conductive frame and pcb board are bonded together by a crimp (for example parts such as housing, support) crimping.
In the present invention, described plastic cement conductive frame can include outer frame and be arranged on the interior more than one partition interior wall of outer frame, by this partition interior wall the inner chamber of electro-magnetic shielding cover is separated into plural chamber, thereby utilizes an electro-magnetic shielding cover by plural electric component is carried out electromagnetic shielding.
Description of drawings
Accompanying drawing described here only is used for task of explanation, and does not represent the intention that limits scope disclosed by the invention by any way.In addition, the shape of each parts among the figure and proportional sizes etc. only are schematically, are used to help the understanding of the present invention, are not shape and the proportional sizes that specifically limits each parts of the present invention.Those skilled in the art can select various possible shapes and proportional sizes to implement the present invention under instruction of the present invention as the case may be.
Fig. 1 is the metal top of electro-magnetic shielding cover of the present invention and the structural representation that the framework thermal welding lumps together;
Fig. 2 is the main TV structure schematic diagram of the metal top among Fig. 1;
Fig. 3 is the metal top of electro-magnetic shielding cover of the present invention and the structural representation that the framework injection moulding is bonded together;
Fig. 4 is the main TV structure schematic diagram of the metal top among Fig. 3;
The structural representation that Fig. 5 is bonded together by crimp and pcb board crimping for electro-magnetic shielding cover of the present invention.
Embodiment
Below in conjunction with accompanying drawing, describe the details of the specific embodiment of the present invention in detail.But, need to prove that following description only is exemplary in essence, disclose, use or use and be not intended to limit the present invention.
Therefore and do not mean that and limit in description, only be used for reference at this employed some term.For example, such as " on ", D score, " ... on ", " ... under ", term such as " top ", " below " is meant the direction in the accompanying drawing of institute's reference.
As Fig. 1-shown in Figure 5, the invention provides a kind of electro-magnetic shielding cover 1, this electro-magnetic shielding cover 1 comprises the top and is engaged in the framework of below, top, thereby after this electro-magnetic shielding cover 1 is engaged on the pcb board 2, the electric component on the pcb board 2 covered in the inner chamber 10 that top and framework limit and realizes electromagnetic shielding electric component.Wherein, in the present invention, the metal top 11 of described top for making by metal material, described framework is a plastic cement conductive frame 12, this plastic cement conductive frame 12 comprises by plastic material makes plastic frame main body 121 and the conductive layer 122 that is covered in these plastic frame main body 121 surfaces, and the lower end of this plastic cement conductive frame 12 is engaged on the pcb board.As Fig. 1, shown in Figure 3, the lower end of this plastic cement conductive frame 12 can specifically be engaged in the leakage copper district 21 of pcb board 2, thereby forms the electrical connection between them.Like this, make metal top 11 owing to adopt metal material, this metal top 11 can be done thinlyyer, for example the thickness of this metal top 11 can be 0.2mm, thereby the thickness space of having saved metallic shield 1, make electronic product to such an extent that the very thin market demand provides advantage for satisfying; And owing to framework is to adopt plastic material to make to cover conductive layer 122 again after the plastic frame main body 121 to form, compare with metallic shield, its manufacturing process is simple, and manufacturing cost is also lower.When particularly a plurality of electric components being carried out electromagnetic shielding for needs, this kind plastic cement conductive frame 12 can directly inject a plurality of chambers, each chamber can correspondingly shield an electric component, thereby utilize an electro-magnetic shielding cover 1 of the present invention to carry out electromagnetic shielding to a plurality of electric components simultaneously, offer the metallic shield of a plurality of moulds with needs and compare, greatly reduced manufacturing cost.
As shown in Figure 1 and Figure 2, in an optional execution mode of the present invention, described metal top 11 can be provided with a plurality of weldings hole 111, and described metal top 11 lumps together with 12 thermal weldings of plastic cement conductive frame by those welding holes 111.
As shown in Figure 3, Figure 4, as the optional execution mode of another kind, described metal top 11 can be bonded together by injection mo(u)lding with plastic cement conductive frame 12.Engage can be specifically in injection moulding plastic frame main body 121 time carrying out injection mo(u)lding, earlier metal top 11 is placed on mould inside, injection mo(u)lding goes out plastic frame then, thereby this metal top 11 is bonded together with 121 injection mouldings of plastic frame main body; Cover conductive layer 122 on plastic frame main body 121 surfaces more afterwards and form plastic cement conductive frame 12.
Though provided the above-mentioned two kind combinations of metal top 11 with plastic cement conductive frame 12, but be not limited in this, as long as metal top 11 and plastic cement conductive frame 12 can be combined, make electro-magnetic shielding cover 1 play electromagnetic shielding action, its concrete combination can not limit.
In the present invention, the conductive layer 122 that covers of described plastic cement conductive frame 12 surfaces can be by forming at plastic frame main body 122 surface spraying conductive paints.Perhaps, the conductive layer 122 that covers of these plastic cement conductive frame 12 surfaces also can be by forming at plastic frame main body 121 electroplating surface metal layers.Its concrete generation type can adopt multiple, as long as can form conductive layer 122 on plastic frame main body 121 surfaces the plastic cement conductive frame can be conducted electricity, and its concrete form does not limit at this.
In the present invention, as Fig. 1, shown in Figure 3, described plastic cement conductive frame 12 lower ends can be bonded with conducting resinl 13, and this plastic cement conductive frame 13 is engaged on the pcb board 2 in the soft contact crimping in back of exerting pressure by this conducting resinl 13.Like this, utilize this crimping connected structure, not only reduced welding cost, and when needs are removed electro-magnetic shielding cover 1 wherein electric component are keeped in repair, only need to remove the pressure that is applied on metallic shield 1 and the pcb board 2, can easily electro-magnetic shielding cover 1 be removed from pcb board 2, very convenient quick, and can not cause damage to electric component yet.And, because electro-magnetic shielding cover 1 is to be bonded together by conducting resinl 13 soft contact crimping and pcb board 2, plastic deformation by conducting resinl 13 when the crimping, can there be the slit between this conducting resinl 13 and the pcb board 2, realized that electro-magnetic shielding cover 1 engages with the seamless of pcb board 2, thereby avoided producing electromagnetic exposure by the slit.
As shown in Figure 5, the pressure that can be specifically provides by a crimp 3 of this plastic cement conductive frame 12 and pcb board 2 and crimping is bonded together.This crimp 3 can be parts such as housing, support for example, this crimp 3 can have a plurality of pressure contact portions 31 that are crimped on electro-magnetic shielding cover 1 and pcb board 2 respectively, so that certain crimp force to be provided, thereby when assembling, electro-magnetic shielding cover 1 is crimped on pcb board 2.
In the present invention, as an optional example, this plastic cement conductive frame 12 can include outer frame 123 and the partition interior wall 124 that (comprises) more than that is arranged in the outer frame 123, by this partition interior wall 124 inner chamber 10 of electro-magnetic shielding cover 1 is separated into plural chamber 101,102, thereby utilizes an electro-magnetic shielding cover 1 simultaneously the electric component that (comprises two) more than two to be carried out electromagnetic shielding.Because the main body of this plastic cement conductive frame 12 can be passed through the plastic material injection mo(u)lding, thereby the outer frame 123 of this plastic cement conductive frame 12 and cut off interior wall 124 can integrated injection molding, compare with existing metal electro-magnetic shielding cover, greatly simplified manufacturing process, reduced manufacturing cost.As example, Fig. 1, Fig. 3, Fig. 5 only illustrate has a partition interior wall 124, thereby inner chamber 10 is separated into the example of two chambers 101,102, it will be appreciated by those skilled in the art that this electro-magnetic shielding cover 1 can be provided with the quantity of this chamber as required.
Certainly, as optional example, described plastic cement conductive frame 12 can only have outer frame 123, to limit a chamber, comes single electric component is carried out electromagnetic shielding, and is not shown.
Electro-magnetic shielding cover 1 of the present invention can be used for electronic products such as the mechanical, electrical brain of adversary and carry out electromagnetic shielding.
Foregoing description of the present invention only is exemplary attribute, and the various distortion that therefore do not depart from main idea of the present invention ought to be within the scope of the present invention.These distortion should not be regarded as departing from the spirit and scope of the present invention.
Claims (8)
1, a kind of electro-magnetic shielding cover is characterized in that, this electro-magnetic shielding cover comprises:
Metal top, it is made by metal material;
The plastic cement conductive frame, it is engaged in metal top below, and comprises the plastic frame body of being made by plastic material and cover in the conductive layer of plastic frame body surface;
The lower end of this plastic cement conductive frame is engaged on the pcb board.
2, electro-magnetic shielding cover as claimed in claim 1 is characterized in that, described metal top is provided with a plurality of weldings hole, and described metal top lumps together by this welding hole and the thermal welding of plastic cement conductive frame.
3, electro-magnetic shielding cover as claimed in claim 1 is characterized in that, described metal top and the injection moulding of plastic cement conductive frame are bonded together.
4, electro-magnetic shielding cover as claimed in claim 1 is characterized in that, the conductive layer that described plastic cement conductive frame surface covers is by forming at plastic frame body surfaces spraying conductive paint.
5, electro-magnetic shielding cover as claimed in claim 1 is characterized in that, the conductive layer that described plastic cement conductive frame surface covers is by forming at plastic frame body surfaces electroplated metal layer.
6, electro-magnetic shielding cover as claimed in claim 1 is characterized in that, described plastic cement conductive frame lower end is bonded with conducting resinl, and this plastic cement conductive frame is engaged on the pcb board by the soft contact crimping of this conducting resinl.
7, electro-magnetic shielding cover as claimed in claim 6 is characterized in that, described plastic cement conductive frame and pcb board are bonded together by a crimp crimping.
8, electro-magnetic shielding cover as claimed in claim 1, it is characterized in that, described plastic cement conductive frame includes outer frame and is arranged on more than one partition interior wall in the outer frame, by this partition interior wall the inner chamber of electro-magnetic shielding cover is separated into plural chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101126637A CN101287357A (en) | 2008-05-26 | 2008-05-26 | Electro-magnetic shielding cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101126637A CN101287357A (en) | 2008-05-26 | 2008-05-26 | Electro-magnetic shielding cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101287357A true CN101287357A (en) | 2008-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101126637A Pending CN101287357A (en) | 2008-05-26 | 2008-05-26 | Electro-magnetic shielding cover |
Country Status (1)
| Country | Link |
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| CN (1) | CN101287357A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724855A (en) * | 2012-05-22 | 2012-10-10 | 宁海县弗莱克斯电气有限公司 | Shielding case of microwave probe |
| CN103094258A (en) * | 2013-01-25 | 2013-05-08 | 华为机器有限公司 | Air cavity type encapsulation and manufacturing method thereof |
| CN107509383A (en) * | 2017-09-22 | 2017-12-22 | 昆山维开安电子科技有限公司 | A kind of Transparent shielding cover for pcb board |
| CN110518750A (en) * | 2018-05-21 | 2019-11-29 | 德昌电机(深圳)有限公司 | Motor and electric machine assembly |
| CN111587057A (en) * | 2020-05-15 | 2020-08-25 | 深圳市飞荣达科技股份有限公司 | Shielding box |
| CN111988952A (en) * | 2019-12-19 | 2020-11-24 | 东莞市正为精密塑胶有限公司 | Method for manufacturing electromagnetic shielding case |
-
2008
- 2008-05-26 CN CNA2008101126637A patent/CN101287357A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724855A (en) * | 2012-05-22 | 2012-10-10 | 宁海县弗莱克斯电气有限公司 | Shielding case of microwave probe |
| CN102724855B (en) * | 2012-05-22 | 2015-09-30 | 宁海县弗莱克斯电气有限公司 | Microwave probe radome |
| CN103094258A (en) * | 2013-01-25 | 2013-05-08 | 华为机器有限公司 | Air cavity type encapsulation and manufacturing method thereof |
| CN103094258B (en) * | 2013-01-25 | 2015-11-25 | 华为机器有限公司 | Air cavity type package and manufacture method thereof |
| CN107509383A (en) * | 2017-09-22 | 2017-12-22 | 昆山维开安电子科技有限公司 | A kind of Transparent shielding cover for pcb board |
| CN110518750A (en) * | 2018-05-21 | 2019-11-29 | 德昌电机(深圳)有限公司 | Motor and electric machine assembly |
| CN111988952A (en) * | 2019-12-19 | 2020-11-24 | 东莞市正为精密塑胶有限公司 | Method for manufacturing electromagnetic shielding case |
| CN111587057A (en) * | 2020-05-15 | 2020-08-25 | 深圳市飞荣达科技股份有限公司 | Shielding box |
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Open date: 20081015 |