CN219821960U - Packaging module for testing packaging machine - Google Patents
Packaging module for testing packaging machine Download PDFInfo
- Publication number
- CN219821960U CN219821960U CN202321186674.6U CN202321186674U CN219821960U CN 219821960 U CN219821960 U CN 219821960U CN 202321186674 U CN202321186674 U CN 202321186674U CN 219821960 U CN219821960 U CN 219821960U
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- chip
- carrier tape
- cover
- carrier
- tape
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 238000012360 testing method Methods 0.000 title claims abstract description 18
- 238000003466 welding Methods 0.000 claims abstract description 38
- 238000012937 correction Methods 0.000 claims abstract description 14
- 238000001514 detection method Methods 0.000 claims description 42
- 230000001681 protective effect Effects 0.000 claims description 23
- 230000007246 mechanism Effects 0.000 claims description 22
- 238000005520 cutting process Methods 0.000 claims description 13
- 230000005622 photoelectricity Effects 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 12
- 230000002159 abnormal effect Effects 0.000 abstract description 8
- 238000012858 packaging process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model discloses a packaging module for a test packaging machine, which is characterized in that a chip is transported to a chip loading device through a conveyor belt on a chip placing table to load the chip and the carrier belt, and the chip can be transported smoothly and stably through the conveyor belt, so that the chip can be guaranteed not to deviate in position in the transportation process, and the abnormal occurrence rate of the chip and the carrier belt in the loading process is reduced. After the chip is loaded on the carrier tape, the CCD carrier tape can detect whether the chip is turned over, laterally standing or not in the carrier tape placing groove before reaching the cover tape welding device, and the carrier tape correction protection cover is opened in time to correct the chip, so that the accuracy of placing the chip is ensured, the position of the chip is avoided from being abnormal, and the problem that the chip is abnormally packaged due to the deviation of the position of the chip in the chip packaging welding process is solved.
Description
Technical Field
The utility model relates to the field of chip packaging, in particular to a packaging module for a test packaging machine.
Background
Currently, in the semiconductor integrated circuit manufacturing process, further testing and transferring to a packaging process of the finished chips after dicing and packaging are required, and packaging is required in the packaging process to make the chips protective and more convenient to transport.
In the prior art CN110203544B, a chip packaging device is disclosed, and the packaging processing work of the chip can be completed by using the structures of a packaging cavity, a clamping reversing device, a lifting plate and the like, but the chip is easy to be packaged abnormally because the placement state of the chip cannot be judged in the packaging process.
Accordingly, there is a need for an improvement in the chip packaging apparatus of the prior art to solve the above-described problems.
Disclosure of Invention
The utility model overcomes the defects of the prior art, provides a packaging module for a test packaging machine, and aims to solve the problem that the chip is abnormally packaged due to deviation of the chip position in the welding process of chip packaging.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a packaging module for a test packaging machine, comprising: the chip bonding device comprises a carrier tape mechanism, a welding mechanism and a chip structure, wherein the welding mechanism and the chip structure are respectively arranged on the carrier tape mechanism;
the carrier tape mechanism includes: the device comprises a workbench, a carrier tape clamping device, a REL cutting device and a REL receiving tray, wherein the carrier tape is arranged on the workbench, and the carrier tape clamping device and the REL cutting device are sequentially arranged along the working direction of the carrier tape; the workbench is provided with a cover belt discharging disc;
the welding mechanism includes: the carrier tape protection cover is respectively arranged on the carrier tape correction protection cover and the cover tape welding device, and the CCD carrier tape detection bracket and the CCD carrier tape detection device are arranged on one side of the carrier tape protection cover; the carrier tape protection cover is provided with a carrier tape detection hole, and the cover tape welding device is fixedly connected with the workbench;
the chip structure comprises: the chip placing table is provided with a chip detection photoelectricity arranged on one side of the chip placing table, a chip protecting cover arranged above the chip placing table and a chip loading device connected with one end of the chip protecting cover; the chip loading device is fixedly connected with the workbench.
In a preferred embodiment of the utility model, a REL carrier feeding guide device is arranged on the workbench, a REL receiving tray support is arranged on the REL receiving tray, the REL receiving tray support is fixedly connected with the workbench, the REL receiving tray is nested on the REL receiving tray support, and the REL receiving tray is rotatably connected with the REL receiving tray support.
In a preferred embodiment of the present utility model, the cover tape discharging tray, the carrier tape clamping device, the REL cutting device, the REL carrier tape feeding guide device, the carrier tape protecting cover, the chip placing table, the chip detecting photoelectricity and the CCD carrier tape detecting bracket are fixedly connected with the workbench; the carrier tape correction protection cover is detachably connected with the workbench.
In a preferred embodiment of the present utility model, the carrier tape clamping device, the REL cutting device, the cover tape welding device, the carrier tape protecting cover, the carrier tape correcting protecting cover and the REL receiving tray are located on the same plane; the carrier tape is in sliding connection with the carrier tape clamping device.
In a preferred embodiment of the present utility model, the carrier tape clamping device, the REL cutting device, the cover tape welding device, the carrier tape protecting cover, the carrier tape correcting protecting cover, the chip placing table, the chip detecting photoelectricity, and the chip loading device are located on the same plane; the cover tape welding device is characterized in that the chip loading device is fixedly connected with the carrier tape protecting cover, and the carrier tape correcting protecting cover is detachably connected with the carrier tape protecting cover.
In a preferred embodiment of the present utility model, the CCD carrier detection is disposed at an upper end of the CCD carrier detection support, the CCD carrier detection is disposed directly above the carrier detection hole, and the CCD carrier detection support is fixedly connected with the CCD carrier detection; the CCD carrier band detection device comprises a CCD carrier band detection support, wherein the carrier band detection support is positioned on the same plane.
In a preferred embodiment of the utility model, a chip placing groove is formed in the upper surface of the chip placing table, one end of the chip placing groove is connected with a conveyor belt, the working direction of the conveyor belt is along the chip protection cover, and the chip protection cover is located right above the conveyor belt.
In a preferred embodiment of the present utility model, the carrier tape protecting cover and the carrier tape correcting protecting cover are both located right above the carrier tape, and the carrier tape is suspended in the carrier tape protecting cover and the carrier tape correcting protecting cover.
In a preferred embodiment of the present utility model, the chip detection photo-electricity and the chip placement groove are located at the same horizontal plane.
In a preferred embodiment of the present utility model, the carrier tape protection cover is disposed parallel to the chip protection cover.
The utility model solves the defects existing in the background technology, and has the following beneficial effects:
(1) After the chip is loaded on the carrier tape, the CCD carrier tape can detect whether the chip is turned over, laterally standing or not in the carrier tape placing groove before reaching the cover tape welding device, and the carrier tape correction protection cover is opened in time to correct the chip, so that the accuracy of placing the chip is ensured, the position of the chip is avoided from being abnormal, and the problem that the chip is abnormally packaged due to the deviation of the position of the chip in the chip packaging welding process is solved.
(2) On the chip placing table, the chips are transported to the chip loading device through the conveyor belt to load the chips and the carrier belt, and the chips can be transported smoothly and stably through the conveyor belt, so that the chips can be guaranteed to be free from position deviation in the transportation process with high quality, and the abnormal occurrence rate of the chips and the carrier belt in the loading process is reduced.
(3) The carrier tape is in a straight and horizontal state all the time in the whole process from the carrier tape clamping device to the cover tape welding device, and the chip can be well kept in the position state in the carrier tape due to small shaking after being loaded on the carrier tape.
Drawings
The utility model is further described below with reference to the drawings and examples;
FIG. 1 is a perspective view of a preferred embodiment of the present utility model;
FIG. 2 is a schematic view of a carrier tape mechanism according to a preferred embodiment of the present utility model;
FIG. 3 is a schematic view of the welding mechanism of the preferred embodiment of the present utility model;
FIG. 4 is an enlarged view of the structure at A in FIG. 3 in accordance with the preferred embodiment of the present utility model;
FIG. 5 is a schematic diagram of the chip mechanism structure of the preferred embodiment of the present utility model;
in the figure: 100. a carrier tape mechanism; 110. a work table; 120. a cover tape discharging disc; 131. a carrier tape clamping device; 132. a REL cutter; 133. a carrier tape; 140. REL carrier tape guides; 151. REL material receiving disc; 152. REL receiving tray support frame; 200. a welding mechanism; 210. a cover tape welding device; 221. a carrier tape protective cover; 222. a carrier tape correction protective cover; 231. a CCD carrier tape detection bracket; 232. detecting a CCD carrier tape; 240. a carrier tape detection hole; 300. a chip mechanism; 311. a chip loading device; 312. a chip protection cover; 321. a chip placement table; 322. the chip detects photoelectricity.
Detailed Description
The utility model will now be described in further detail with reference to the drawings and examples, which are simplified schematic illustrations of the basic structure of the utility model, which are presented only by way of illustration, and thus show only the structures that are relevant to the utility model.
As shown in fig. 1 and 2, a packaging module for a test packaging machine, comprising: the carrier tape mechanism 100, and the fusion bonding mechanism 200 and the chip structure 300 provided on the carrier tape mechanism 100, respectively.
The carrier tape mechanism 100 includes: a table 110, a carrier tape 13 provided on the table 110), a carrier tape clamping device 131, a rel cutting device 132, and a rel receiving tray 151 provided in this order along the working direction of the carrier tape 133; the table 110 is provided with a cover tape discharge tray 120.
As shown in fig. 3, 4, and 5, the welding mechanism 200 includes: a carrier tape protective cover 221, a carrier tape correction protective cover 222 and a cover tape welding device 210 respectively provided on the carrier tape protective cover 221, and a CCD carrier tape detection bracket 231 and a CCD carrier tape detection 232 provided on one side of the carrier tape protective cover 221; the carrier tape protecting cover 221 is provided with a carrier tape detecting hole 240, and the cover tape welding apparatus 210 is fixedly connected to the table 110.
The chip structure 300 includes: a chip placing stage 321, a chip detecting photoelectric 322 provided on one side of the chip placing stage 321, a chip protecting cover 312 provided above the chip placing stage 321, and a chip loading device 311 connected to one end of the chip protecting cover 312; the chip loading device 311 is fixedly connected to the table 110.
The workbench 110 is provided with a plurality of rollers, and the rollers between the cover tape discharging tray 120 and the cover tape welding device 210 sequentially convey the cover tapes and change the conveying angle of the cover tapes, so that the cover tapes can enter in the direction opposite to the cover tape welding device 210.
The cover tape welding device 210 is provided with a mechanical arm and a hot-melting device, when the cover tape is transported to the cover tape welding device 210 by the cover tape discharging disc 120, the cover tape is carried to the upper surface of the carrier tape 133 by the mechanical arm and is uniformly paved on the carrier tape 133, and when the cover tape is closely attached to the carrier tape 133, the cover tape and the carrier tape 133 are subjected to fusion bonding by the hot-melting device, so that chips in the carrier tape 133 can be sealed and packaged.
The chip loading device 311 is provided with a mechanical arm, and after the chip is transferred to the chip loading device 311 by the conveyor belt, the mechanical arm sequentially places the chips into the small grooves on the carrier belt.
The workbench 110 is provided with a REL carrier tape feeding guide device 140, the REL receiving tray 151 is provided with a REL receiving tray support 152, the REL receiving tray support 152 is fixedly connected with the workbench 110, the REL receiving tray 151 is nested on the REL receiving tray support 152, and the REL receiving tray 151 is rotatably connected with the REL receiving tray support 152.
The cover tape discharging tray 120, the carrier tape clamping device 131, the rel cutting device 132, the rel carrier tape feeding guide device 140, the carrier tape protecting cover 221, the chip protecting cover 312, the chip placing table 321, the chip detecting photoelectricity 322 and the CCD carrier tape detecting bracket 231 are fixedly connected with the workbench 110; the carrier correction boot 222 is detachably connected to the table 110.
The carrier tape clamping device 131, the REL cutting device 132, the cover tape welding device 210, the carrier tape protecting cover 221, the carrier tape correcting protecting cover 222 and the REL receiving tray 151 are positioned on the same plane; the carrier tape 133 is slidably coupled to the carrier tape clamping device 131.
The carrier tape clamping device 131, the rel cutting device 132, the cover tape welding device 210, the carrier tape protective cover 221, the carrier tape correction protective cover 222, the chip protective cover 312, the chip placing table 321, the chip detecting photoelectric device 322, and the chip loading device 311 are located on the same plane; the cover tape welding device 210, the chip loading device 311 and the carrier tape protecting cover 221 are fixedly connected, and the carrier tape correcting protecting cover 222 and the carrier tape protecting cover 221 are detachably connected.
The CCD carrier band detection 232 is arranged at the upper end of the CCD carrier band detection bracket 231, the CCD carrier band detection 232 is arranged right above the carrier band detection hole 240, and the CCD carrier band detection bracket 231 is fixedly connected with the CCD carrier band detection 232; the CCD carrier tape detection 232 and the CCD carrier tape detection bracket 231, and the carrier tape detection holes 240 are positioned on the same plane.
The upper surface of the chip placing table 321 is provided with a chip placing groove, one end of the chip placing groove is connected with a conveyor belt, the working direction of the conveyor belt is along the chip protection cover 312, and the chip protection cover 312 is positioned right above the conveyor belt. The chip detection photo-electricity 322 and the chip placing groove are positioned on the same horizontal plane.
The carrier tape protective cover 221 and the carrier tape correction protective cover 222 are both positioned right above the carrier tape 133, and the carrier tape 133 is suspended in the carrier tape protective cover 221 and the carrier tape correction protective cover 222. The carrier tape protective cover 221 is disposed parallel to the chip protective cover 312.
When the chip packaging and welding device is used, after the chip is loaded on the carrier tape, the CCD carrier tape can detect whether the chip is turned over, standing or not in the carrier tape placing groove and other abnormal conditions before the chip reaches the cover tape welding device, and the carrier tape correcting protective cover is opened in time to correct the chip, so that the accuracy of chip placement is ensured, the abnormal chip position is avoided, and the problem of abnormal chip packaging caused by the deviation of the chip position in the chip packaging and welding process is solved.
When the chip loading device is used, chips are transported to the chip loading device through the conveyor belt on the chip placing table to load the chips and the carrier belt, the chips can be transported smoothly and stably through the conveyor belt, the chips can be guaranteed not to deviate in position in the transportation process with high quality, and the abnormal occurrence rate of the chips and the carrier belt in the loading process is reduced.
When the chip carrier tape is used, the carrier tape is always in a straight and horizontal state in the whole process from the carrier tape clamping device to the cover tape welding device, and the chip carrier tape has small shaking after being loaded on the carrier tape, so that the position state of the chip in the carrier tape can be better maintained.
The above-described preferred embodiments according to the present utility model are intended to suggest that, from the above description, various changes and modifications can be made by the person skilled in the art without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
1. A packaging module for a test packaging machine, comprising: a carrier tape mechanism (100), and a welding mechanism (200) and a chip structure (300) respectively arranged on the carrier tape mechanism (100), characterized in that;
the carrier tape mechanism (100) includes: a table (110), a carrier tape (133) provided on the table (110), a carrier tape clamping device (131), a REL cutting device (132), and a REL receiving tray (151) provided in order along the working direction of the carrier tape (133); a cover tape discharging disc (120) is arranged on the workbench (110);
the welding mechanism (200) includes: a carrier tape protective cover (221), a carrier tape correction protective cover (222) and a cover tape welding device (210) respectively arranged on the carrier tape protective cover (221), and a CCD carrier tape detection bracket (231) and a CCD carrier tape detection (232) arranged on one side of the carrier tape protective cover (221); the carrier tape protection cover (221) is provided with a carrier tape detection hole (240), and the cover tape welding device (210) is fixedly connected with the workbench (110);
the chip structure (300) comprises: a chip placement table (321), a chip detection photoelectric device (322) arranged on one side of the chip placement table (321), a chip protection cover (312) arranged above the chip placement table (321), and a chip loading device (311) connected with one end of the chip protection cover (312); the chip loading device (311) is fixedly connected with the workbench (110), and the carrier tape protective cover (221) and the chip protective cover (312) are arranged in parallel.
2. A packaging module for a test packaging machine as defined in claim 1, wherein: be provided with REL carrier band feeding guider (140) on workstation (110), be provided with REL receipts charging tray support frame (152) on REL receipts charging tray (151), REL receipts charging tray support frame (152) with workstation (110) fixed connection, REL receipts charging tray (151) nest are in on REL receipts charging tray support frame (152), REL receipts charging tray (151) with REL receipts charging tray support frame (152) swivelling joint.
3. A packaging module for a test packaging machine as defined in claim 2, wherein: the cover tape discharging disc (120), the carrier tape clamping device (131), the REL cutting device (132), the REL carrier tape feeding guide device (140), the carrier tape protecting cover (221), the chip protecting cover (312), the chip placing table (321), the chip detecting photoelectricity (322) and the CCD carrier tape detecting bracket (231) are fixedly connected with the workbench (110); the carrier correction boot (222) is detachably connected to the table (110).
4. A packaging module for a test packaging machine as defined in claim 1, wherein: the carrier tape clamping device (131), the REL cutting device (132), the cover tape welding device (210), the carrier tape protecting cover (221), the carrier tape correcting protecting cover (222) and the REL receiving tray (151) are positioned on the same plane; the carrier tape (133) is slidably connected to the carrier tape clamping device (131).
5. A packaging module for a test packaging machine as defined in claim 1, wherein: the carrier tape clamping device (131), the REL cutting device (132), the cover tape welding device (210), the carrier tape protecting cover (221), the carrier tape correcting protecting cover (222), the chip protecting cover (312), the chip placing table (321), the chip detecting photoelectricity (322), and the chip loading device (311) are located on the same plane; the cover tape welding device (210), the chip loading device (311) is fixedly connected with the carrier tape protecting cover (221), and the carrier tape correcting protecting cover (222) is detachably connected with the carrier tape protecting cover (221).
6. A packaging module for a test packaging machine as defined in claim 1, wherein: the CCD carrier band detection (232) is arranged at the upper end of the CCD carrier band detection support (231), the CCD carrier band detection (232) is arranged right above the carrier band detection hole (240), and the CCD carrier band detection support (231) is fixedly connected with the CCD carrier band detection (232).
7. A packaging module for a test packaging machine as defined in claim 1, wherein: the chip placing table (321) is characterized in that a chip placing groove is formed in the upper surface of the chip placing table, one end of the chip placing groove is connected with a conveying belt, the working direction of the conveying belt is along the chip protecting cover (312), and the chip protecting cover (312) is located right above the conveying belt.
8. A packaging module for a test packaging machine as defined in claim 1, wherein: the carrier tape protection cover (221) and the carrier tape correction protection cover (222) are both positioned right above the carrier tape (133), and the carrier tape (133) is in suspended movement inside the carrier tape protection cover (221) and the carrier tape correction protection cover (222).
9. A packaging module for a test packaging machine as defined in claim 7, wherein: the chip detection photo-electricity (322) and the chip placing groove are positioned on the same horizontal plane.
10. A packaging module for a test packaging machine as defined in claim 1, wherein: the CCD carrier band detection device comprises a CCD carrier band detection support (231) and carrier band detection holes (240) which are positioned on the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321186674.6U CN219821960U (en) | 2023-05-17 | 2023-05-17 | Packaging module for testing packaging machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321186674.6U CN219821960U (en) | 2023-05-17 | 2023-05-17 | Packaging module for testing packaging machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219821960U true CN219821960U (en) | 2023-10-13 |
Family
ID=88277282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321186674.6U Active CN219821960U (en) | 2023-05-17 | 2023-05-17 | Packaging module for testing packaging machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219821960U (en) |
-
2023
- 2023-05-17 CN CN202321186674.6U patent/CN219821960U/en active Active
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| GR01 | Patent grant |