CN219812404U - Heat dissipation liquid cooling plate based on phase change heat transfer - Google Patents
Heat dissipation liquid cooling plate based on phase change heat transfer Download PDFInfo
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- CN219812404U CN219812404U CN202321006027.2U CN202321006027U CN219812404U CN 219812404 U CN219812404 U CN 219812404U CN 202321006027 U CN202321006027 U CN 202321006027U CN 219812404 U CN219812404 U CN 219812404U
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- liquid
- copper pipe
- heat dissipation
- refrigerant
- cooling plate
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- 239000007788 liquid Substances 0.000 title claims abstract description 129
- 238000001816 cooling Methods 0.000 title claims abstract description 53
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 45
- 230000008859 change Effects 0.000 title claims abstract description 25
- 238000012546 transfer Methods 0.000 title claims abstract description 18
- 239000003507 refrigerant Substances 0.000 claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 claims abstract description 65
- 239000010949 copper Substances 0.000 claims abstract description 65
- 230000005540 biological transmission Effects 0.000 claims abstract description 14
- 238000009835 boiling Methods 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 238000005213 imbibition Methods 0.000 claims 3
- 239000011148 porous material Substances 0.000 claims 2
- 239000006210 lotion Substances 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 10
- 230000009471 action Effects 0.000 abstract description 7
- 239000012071 phase Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 9
- 239000012782 phase change material Substances 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
The utility model relates to a heat dissipation liquid cooling plate based on phase change heat transfer, which comprises a liquid cooling plate, a bent copper pipe and a liquid absorption core, wherein the liquid cooling plate comprises an upper shell and a lower shell, the upper shell and the lower shell are buckled to form a heat dissipation cavity, a copper pipe groove is formed in the inner side of the lower shell, the bent copper pipe is arranged in the copper pipe groove and forms a liquid refrigerant transmission channel, the liquid absorption core is filled and attached to the bent copper pipe, the copper pipe is provided with a plurality of through holes, the refrigerant flows into the liquid absorption core from the through holes under the action of capillary force of the liquid absorption core, an air hole is formed in the first side surface of the upper shell, and the other end of the air hole is connected with a vacuum compressor through a heat dissipation pipeline to form a gaseous refrigerant transmission channel. The utility model can obviously improve the heat dissipation condition of the liquid cooling plate and maximize the cooling efficiency of the refrigerant, thereby reducing the safety problem of electronic elements caused by the heat dissipation efficiency.
Description
Technical Field
The utility model relates to a phase transition heat dissipation technical field, concretely relates to radiator liquid cooling board based on phase transition heat transfer.
Background
With the advent of the 5G era, various electronic components have been rapidly developed, and the power density of the electronic components is continuously increased, and the heat productivity is increased accordingly, so that a set of mature heat dissipation system is particularly important for solving the safety problem caused by high heat productivity. At present, the liquid cooling heat dissipation scheme of most electronic components adopts the principle of convective heat transfer to dissipate heat, namely, liquid cooling working medium is continuously led into a flow channel to take away heat, however, the efficiency of the cooling mode is lower, and the cooling efficiency of the liquid working medium cannot be maximized;
the phase-change heat dissipation technology gradually becomes the main stream of academic circles in recent years, and also starts to slowly enter the line of sight of engineering circles, namely the phase-change thermal control is to place a phase-change material between controlled equipment and an external environment, and when the temperature of the controlled equipment is higher than a phase-change point, the phase-change material absorbs heat through phase change, so that the temperature of the equipment is maintained below a critical temperature, and the equipment is prevented from overheating; when the temperature of the controlled equipment is reduced to be lower than the phase change point, the phase change material emits heat through phase change; therefore, the temperature of the controlled equipment is maintained above the critical temperature, and the equipment temperature is prevented from being too low, so that the thermal control of the equipment is realized. As a passive thermal control mode, the device has the advantages of no working parts, energy conservation, reliability, infinite use in principle, high economy, high heat storage density and the like, so that the device can well meet the requirements of a thermal control device on light weight, compactness, safety and reliability, and especially as the heating parts are increasingly integrated, miniaturized and high-power in recent years, the traditional heat dissipation mode faces new challenges, and the advantages of phase change thermal control in the thermal control field are more apparent;
therefore, aiming at the problem that the cooling efficiency of the liquid working medium cannot be maximized by the traditional liquid cooling heat dissipation scheme, a heat dissipation structure combining a phase-change heat control technology and traditional convection heat exchange is needed, and the cooling efficiency of the liquid working medium is improved.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the heat radiation liquid cooling plate based on phase change heat transfer, which remarkably improves the cooling efficiency of liquid working media and reduces the potential safety hazard of electronic components.
The utility model provides a heat dissipation liquid cooling plate based on phase change heat transfer, which comprises a liquid cooling plate, a bent copper pipe and a liquid absorption core, wherein the liquid cooling plate comprises an upper shell and a lower shell, the upper shell and the lower shell are buckled to form a heat dissipation cavity, a copper pipe groove is formed in the inner side of the lower shell, the bent copper pipe is arranged in the copper pipe groove and forms a liquid refrigerant transmission channel, the liquid absorption core is filled and attached to the bent copper pipe, the copper pipe is provided with a plurality of through holes, the refrigerant flows into the liquid absorption core from the through holes under the action of capillary force of the liquid absorption core, an air hole is formed in the first side surface of the upper shell, and the other end of the air hole is connected with a vacuum compressor through a heat dissipation pipeline to form a gaseous refrigerant transmission channel.
The preferable technical scheme of the utility model is that a hollow pipeline is arranged in the bent copper pipe and used for providing a transmission channel for a refrigerant, the bent copper pipe is arranged in the copper pipe groove in a winding way, and the bent copper pipe is flattened.
The preferred technical scheme of the utility model is that the liquid suction core is attached and filled at the edge of the bending copper pipe, and the height of the liquid suction core is the same as the height of the bending copper pipe protruding out of the copper pipe groove.
The preferred technical scheme of the utility model is that the surface of the liquid suction core is provided with a plurality of capillary holes, and the capillary holes are used for sucking the refrigerant in the bent copper pipe serving as a liquid refrigerant transmission channel into the liquid suction core.
The liquid-phase heat dissipation device is characterized in that a liquid refrigerant is arranged in the liquid suction core, and the liquid refrigerant is converted into a gaseous refrigerant through phase change heat dissipation and then is discharged out of a liquid cooling plate through the vacuum compressor.
The preferable technical scheme of the utility model is that the aperture of the through hole is larger than the aperture of the capillary hole.
The preferable technical scheme of the utility model is that the boiling point of the liquid refrigerant is less than 10 ℃.
The preferable technical scheme of the utility model is that the lower shell is respectively provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are respectively communicated with two ends of the bent copper pipe.
The preferable technical scheme of the utility model is that the vacuum compressor is communicated with the liquid inlet, and the refrigerant is condensed and then flows into the bent copper pipe again through the liquid inlet.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the liquid cooling plate is arranged to be a structure capable of circularly utilizing liquid and gaseous refrigerants to dissipate heat by the principle of refrigerant phase change heat absorption, so that the heat dissipation condition of the liquid cooling plate is remarkably improved, the cooling efficiency of the liquid cooling plate is maximized, the safety problem of electronic elements caused by the heat dissipation efficiency is reduced, the structure is simple, the operation is convenient, the production precision is low, the processing is convenient, and the liquid cooling plate can be widely applied to heat dissipation of electronic elements such as lithium batteries and chips.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of a heat sink according to an embodiment of the present utility model;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a plan view of FIG. 1;
fig. 4 is a plane view of a radiator cooling plate in a second embodiment of the utility model.
The attached drawings are identified: 1. an upper housing; 11. air holes; 2. bending the copper pipe; 21-a through hole; 3. a wick; 4. a lower housing; 41. a liquid inlet; 42. a liquid outlet; 43. copper tube grooves.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Example 1
Referring to fig. 1 to 3, the heat dissipation liquid cooling plate based on phase change heat transfer comprises a liquid cooling plate, a bent copper pipe 2 and a liquid suction core 3, wherein the liquid cooling plate comprises an upper shell 1 and a lower shell 4, the upper shell 1 and the lower shell 4 are buckled to form a heat dissipation cavity, a copper pipe groove 43 is formed in the inner side of the lower shell 4, the bent copper pipe 2 is installed in the copper pipe groove 43 and forms a liquid refrigerant transmission channel, a washing liquid core is filled and attached to the bent copper pipe 2, the copper pipe is provided with a plurality of through holes 21, a refrigerant flows into the liquid suction core 3 from the through holes 21 under the capillary action of the liquid suction core 3, an air hole 11 is formed in the first side surface of the upper shell 1, and the other end of the air hole 11 is connected with a vacuum compressor through a heat dissipation pipeline to form a gaseous refrigerant transmission channel.
It should be noted that, the electronic component that generates heat is placed in the heat dissipation chamber and absorbs part of heat through the refrigerant flowing through the bending copper pipe 2, and the liquid suction core 3 has a larger contact area with the electronic component, after the refrigerant flows into the bending copper pipe 2, the liquid suction core 3 sucks the refrigerant in the bending copper pipe 2 into the liquid suction core 3 through the action of capillary force, and the liquid refrigerant generates phase change due to the heat emitted by the electronic component, the liquid refrigerant is converted into gaseous refrigerant and takes away a large amount of heat, the refrigerant after forming gaseous state is sucked out of the liquid cooling plate from the air hole 11 under the action of the vacuum compressor, so that the heat of the electronic component is taken away.
Further, after the gaseous refrigerant is sucked out of the liquid cooling plate through the vacuum compressor, the gaseous refrigerant is condensed and is changed back into the liquid refrigerant again, and the liquid refrigerant is recycled and input into the liquid cooling plate again for recycling, so that the effects of recycling heat dissipation and maximizing heat transfer by utilizing refrigerant phase change are achieved, and the heat dissipation efficiency of the liquid cooling plate is improved.
In this embodiment, a hollow pipe is disposed in the bent copper pipe 2 to provide a transmission channel for the refrigerant, the bent copper pipe 2 is arranged in the copper pipe groove 43 in a meandering manner, and the bent copper pipe 2 is flattened.
It should be noted that, the bending hollow tube 2 which is arranged in a winding way can input as much refrigerant as possible for the liquid cooling plate to achieve the maximum heat dissipation efficiency by the refrigerant, and the flattening treatment can reduce the volume of the liquid cooling plate, so that the space occupied by the liquid suction core 3 in the heat dissipation cavity is increased, more heat is taken away by the refrigerant in the liquid suction core 3, and the heat dissipation efficiency is improved.
In this embodiment, the liquid suction core 3 is attached to and filled in the edge of the bent copper tube 2, and the height of the liquid suction core 3 is the same as the height of the bent copper tube 2 protruding out of the copper tube groove 43.
In this embodiment, the surface of the liquid absorbing core 3 is provided with a plurality of capillary holes, and the capillary holes are used for sucking the refrigerant in the bent copper tube 2 serving as a liquid refrigerant transmission channel into the liquid absorbing core 3.
In this embodiment, the hole diameter of the through hole 21 is larger than the hole diameter of the capillary hole.
By the capillary force between the capillary holes and the through holes 21, the efficiency of the refrigerant entering the wick 3 can be improved, which corresponds to the improvement of the replacement speed of the refrigerant, and further the heat dissipation efficiency.
In this embodiment, a liquid refrigerant is disposed in the wick 3, and the liquid refrigerant is converted into a gaseous refrigerant through phase change heat dissipation, and then is discharged from the liquid cooling plate through the vacuum compressor.
In this embodiment, the boiling point of the liquid refrigerant is <10 ℃.
It should be noted that the boiling point of the liquid refrigerant can be adjusted according to the heat dissipation requirements of different electronic components, and the boiling point of the refrigerant can be specifically set with the temperature critical value of the electronic components to be controlled, so that different liquid refrigerants are selected.
In this embodiment, the lower housing 4 is provided with a liquid inlet 41 and a liquid outlet 42, and the liquid inlet 41 and the liquid outlet 42 are respectively communicated with two ends of the bent copper tube 2.
It should be noted that, the liquid cooling plate may not be provided with the liquid outlet 42, and the liquid outlet may be used to re-flow the refrigerant incapable of being inhaled by the wick 3, and input the refrigerant into the wick 3 through the next cycle.
In this embodiment, the vacuum compressor is connected to the liquid inlet 41, and the refrigerant is condensed and then flows into the bent copper tube 2 again through the liquid inlet 41.
Example two
As shown in fig. 4, the difference between the present embodiment and the first embodiment is that the bent copper tube 2 can be completely embedded in the copper tube groove 43, and the wick 3 can be completely covered above the bent copper tube 2, so that the coolant in the bent copper tube 2 can be sucked into the wick 3 through the through hole 21 by capillary force, and the specific design structure can be adjusted according to the actual heat dissipation requirement of the electronic component.
According to the utility model, the liquid suction core 3 and the electronic element have larger contact area, after the refrigerant flows into the bending copper pipe 2, the liquid suction core 3 sucks the refrigerant in the bending copper pipe 2 into the liquid suction core 3 through the action of capillary force, the liquid refrigerant generates phase change due to the heat emitted by the electronic element, the liquid refrigerant is converted into the gaseous refrigerant and takes away a large amount of heat, the gaseous refrigerant is sucked out of the liquid cooling plate through the air hole 11 under the action of the vacuum compressor, and therefore, the heat of the electronic element is taken away, and the electronic element has the following advantages:
through the principle of refrigerant phase transition heat absorption, set up the liquid cooling board into the radiating structure of cyclic utilization liquid refrigerant and gaseous refrigerant, show the radiating condition that improves the liquid cooling board, maximize the cooling efficiency of liquid cooling board to reduce the electronic component because of the safety problem that radiating efficiency leads to, simple structure, convenient operation's a plurality of spare parts constitute, the production precision is low, convenient processing, but wide application in the heat dissipation of electronic components such as lithium cell, chip.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any modifications, equivalents, and improvements made within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (9)
1. The utility model provides a heat dissipation liquid cooling board based on phase transition heat transfer which characterized in that: including liquid cooling board, buckling copper pipe and imbibition core, the liquid cooling board includes casing and lower casing, go up the casing and form the heat dissipation chamber with lower casing lock, the casing inboard is provided with the copper pipe groove down, buckling copper pipe install in the copper pipe inslot and form liquid refrigerant transmission channel, lotion core fill laminate in buckling copper pipe sets up, the copper pipe is equipped with a plurality of through-holes, the refrigerant warp in the capillary force effect of imbibition core is by the through-hole flow direction imbibition core, go up the first side of casing and seted up the gas pocket, the gas pocket other end has vacuum compressor to form gaseous refrigerant transmission channel through the heat dissipation pipe connection.
2. The heat dissipation liquid cooling plate based on phase change heat transfer according to claim 1, wherein a hollow pipeline is arranged in the bent copper pipe and used for providing a transmission channel for a refrigerant, the bent copper pipe is arranged in the copper pipe groove in a winding manner, and the bent copper pipe is flattened.
3. The heat dissipation liquid cooling plate based on phase change heat transfer according to claim 1, wherein the liquid suction core is filled at the edge of the bent copper pipe in a fitting mode, and the height of the liquid suction core is the same as the height of the bent copper pipe protruding out of the copper pipe groove.
4. The heat dissipation liquid cooling plate based on phase change heat transfer according to claim 1, wherein the surface of the liquid suction core is provided with a plurality of capillary holes, and the capillary holes are used for sucking the refrigerant in the bent copper pipe serving as a liquid refrigerant transmission channel into the liquid suction core.
5. The heat dissipation liquid cooling plate based on phase change heat transfer according to claim 4, wherein a liquid refrigerant is arranged in the liquid suction core, and the liquid refrigerant is converted into a gaseous refrigerant through phase change heat dissipation and then is discharged out of the liquid cooling plate through the vacuum compressor.
6. The heat sink plate based on phase change heat transfer according to claim 4, wherein the pore diameter of the through hole is larger than the pore diameter of the capillary hole.
7. The heat sink plate based on phase change heat transfer according to claim 4, wherein the boiling point of the liquid refrigerant is <10 ℃.
8. The heat dissipation liquid cooling plate based on phase change heat transfer according to claim 1, wherein the lower shell is provided with a liquid inlet and a liquid outlet respectively, and the liquid inlet and the liquid outlet are communicated with two ends of the bent copper pipe respectively.
9. The heat sink cooling plate based on phase change heat transfer according to claim 8, wherein the vacuum compressor is communicated with the liquid inlet, and the refrigerant is condensed and then flows into the bent copper pipe again through the liquid inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321006027.2U CN219812404U (en) | 2023-04-28 | 2023-04-28 | Heat dissipation liquid cooling plate based on phase change heat transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321006027.2U CN219812404U (en) | 2023-04-28 | 2023-04-28 | Heat dissipation liquid cooling plate based on phase change heat transfer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219812404U true CN219812404U (en) | 2023-10-10 |
Family
ID=88213110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321006027.2U Active CN219812404U (en) | 2023-04-28 | 2023-04-28 | Heat dissipation liquid cooling plate based on phase change heat transfer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219812404U (en) |
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2023
- 2023-04-28 CN CN202321006027.2U patent/CN219812404U/en active Active
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