CN219812319U - Chip component and electronic equipment - Google Patents

Abstract

The utility model discloses a patch element and electronic equipment. The electrode lead wire comprises a component body, electrode leads are arranged on opposite surfaces of the component body, one ends of the electrode leads are electrically connected with the component body through welding layers to form a component welding body, the component welding body is coated with an encapsulation layer except for a leading-out end of the electrode leads, uneven surfaces are respectively arranged on the encapsulation layer at the positions where the electrode leads are electrically connected with the component body, one uneven surface is provided with a supporting platform, the supporting platform is far away from the surface of the component body to form a supporting plane, the other ends of the electrode leads serve as welding lead ends, and the welding lead ends are coplanar with the supporting plane. The embodiment of the utility model provides a chip component, which improves the placement stability of the chip component, avoids the problem of false soldering and cold joint caused by lead deflection or tilting of the chip component, and improves the production quality of a PCB circuit.

Description

Chip component and electronic equipment

Technical Field

The embodiment of the utility model relates to the technical field of chip devices, in particular to a chip component and electronic equipment.

Background

The current components in the plug-in form have high degree of automation, so the production cost is lower, but the labor cost of the plug-in components in the production process of the PCB circuit is higher and higher, so the production process advantage of the automatic patch begins to be displayed.

The automatic patch production process needs to use patch components, but the production cost of traditional patch components is higher, so the production cost can be reduced by changing the plug-in components into patch components, but the patch components are easy to cause unstable patches due to the structural influence of the plug-in components during the transformation, and the problem of welding rosin joint is generated.

Disclosure of Invention

The utility model provides a patch element and electronic equipment, which can improve the placement stability of the patch element, avoid the problem of false soldering and cold joint caused by lead deflection or tilting of the patch element, and improve the production quality of a PCB.

In a first aspect, an embodiment of the present utility model provides a chip component, including a component body, an electrode lead is disposed on an opposite surface of the component body, one end of the electrode lead is electrically connected with the component body through a welding layer to form a component welding body, the component welding body is covered with an encapsulation layer except for a lead-out end of the electrode lead, uneven surfaces are respectively disposed on the encapsulation layer at an electrically connected position of the electrode lead and the component body, a supporting platform is disposed on one of the uneven surfaces, a supporting plane is formed on a surface of the supporting platform, which is far away from the component body, the other end of the electrode lead is used as a welding lead end, and the welding lead end is coplanar with the supporting plane.

Optionally, the component body includes a component or a composite component in which a plurality of components are electrically combined.

Optionally, the component body includes a component, and the component includes a metallized varistor chip.

Optionally, the component body comprises a composite device for electrically compositing a plurality of components, the composite device comprises a metallized piezoresistor chip and a ceramic gas discharge tube, and the metallized piezoresistor chip and the ceramic gas discharge tube component are electrically connected in series to form the composite device.

Optionally, another uneven surface is provided with an adsorption platform, and the surface of the adsorption platform, which is far away from the component body, forms an adsorption plane.

Optionally, the coplanarity of the welding lead end and the supporting plane is 0-0.15mm.

Optionally, the cross-sectional shape of the electrode lead includes at least one of a flat shape and a circular shape.

Optionally, the vertical projection of the supporting platform on the extending surface of the supporting plane is adjacent to or intersects with the vertical projection of the component body on the extending surface of the supporting plane.

Optionally, the material of the encapsulating layer includes at least one of thermoplastic and thermosetting resin.

In a second aspect, an embodiment of the present utility model provides an electronic device, including any of the patch components described in the embodiments of the present utility model.

According to the technical scheme provided by the embodiment of the utility model, the support platform is arranged on the uneven surface of the component welding body coated with the encapsulation layer, and the electrode lead is bent towards one side of the support platform, so that the welding lead end far away from the component body and the support plane form a plane. Thereby improving the placement stability of the chip components, reducing the problem of false soldering and cold joint caused by lead wire deflection or tilting of the chip components, and improving the production quality of the PCB circuit.

Drawings

Fig. 1 is a schematic structural diagram of a conventional card component.

Fig. 2 is a schematic front view of a patch device according to an embodiment of the present utility model.

Fig. 3 is a schematic structural diagram of another view angle of a patch device according to an embodiment of the present utility model.

Fig. 4 is a schematic structural diagram of a view angle of a composite component according to an embodiment of the present utility model.

Fig. 5 is a schematic structural diagram of another view angle of a composite component according to an embodiment of the present utility model.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Fig. 1 is a schematic structural diagram of an existing component of an interposer, referring to fig. 1, in the fabrication of the component of the interposer, protruding areas 110 are generated by protruding points and leads at the connection positions of electrodes and leads, and when the component of the interposer is placed on a surface of a PCB board circuit, the protruding points can cause unstable placement of the component, so that the unstable placement is caused by unstable gravity center of the component during placement, and further lead deflection or tilting of the placement causes false solder joint, thereby affecting the working stability of the PCB board circuit.

In view of this, fig. 2 is a schematic front view of a structure of a chip component according to an embodiment of the present utility model, fig. 3 is a schematic view of another chip component according to an embodiment of the present utility model, and referring to fig. 2 and 3, the chip component includes a component body 210, electrode leads 220 are disposed on opposite surfaces of the component body 210, one ends of the electrode leads 220 are electrically connected with the component body 210 through a welding layer 230 to form a component welding body, the component welding body is covered with an encapsulation layer 240 except for a lead-out end of the electrode leads 220, the encapsulation layer 240 at the electrically connected position of the electrode leads 220 and the component body 210 has uneven surfaces, a supporting platform 250 is disposed on one uneven surface, a supporting plane is formed on a surface of the supporting platform 250 away from the component body 210, the other ends of the electrode leads 220 are used as welding leads, and the welding leads are coplanar with the supporting plane.

Specifically, the connection between the electrode lead 220 and the welding layer 230 may form an uneven protrusion, so that an uneven surface may be formed at the connection between the component body 210 and the electrode lead 220, where the component body 210 is a functional body of the chip device, and the component welding body, except for the lead-out end of the electrode lead 220, is illustratively coated with the encapsulation layer 240 to form the component encapsulation body 270, and the uneven surface is distributed on the opposite surface of the component encapsulation body 270. The support platform 250 is disposed on an uneven surface, the support platform 250 may be connected with the component packaging body 270 through an adhesive, the thickness of the support platform 250 at least needs to cover the protrusion of the connection part of the electrode lead 220 and the welding layer 230, the surface of the outer side of the support platform 250, that is, the surface far away from the component welding body, forms a support plane, wherein the other end of the electrode lead 220 is used as a welding lead end, the electrode lead 220 is bent towards one side of the support platform 250, and the bent welding lead end is far away from the component body 210. For convenience of explanation, the electrode lead 220 is exemplarily illustrated as a first lead 221 and a second lead 222. The electrode lead far from the support platform 250 is a first lead 221, and the electrode lead near the support platform 250 is a second lead 222. The welding lead end of the first lead 221 is bent toward a side far from the supporting platform 250, and the position of the welding lead end of the second lead 222 is adjusted by bending, so that the supporting plane, the welding lead end of the first lead 221 and the welding lead end of the second lead 222 form a plane. The coplanarity of the three is within a reasonable range, the three are considered to be on the same plane, and the coplanarity is 0-0.15mm in an exemplary manner, the three are considered to be coplanar, and the coplanarity is preferably designed to be 0-0.1mm. A plane is formed by the support plane, the welding lead end of the first lead and the welding lead end of the second lead, so that the problem of uneven surface is solved, the placement stability of the chip components is improved, the problem of false welding and cold joint caused by lead deflection or tilting of the chip components is reduced, and the production quality of a PCB circuit is improved.

Optionally, the component body includes a component or a composite component in which a plurality of components are electrically combined. Specifically, the component body is a functional main body of the chip device, and the component body 210 may be formed by one element or may be a composite component formed by electrically connecting a plurality of components, where the components include one or more of a metallized varistor chip, a transient suppression diode, a ceramic gas discharge tube, a fuse, and the like.

Optionally, the component body includes a component, and the component includes a metallized varistor chip. Specifically, when the component body includes a component, the component may be a metallized varistor chip, and it should be noted that the type of the component is only schematically illustrated and is not limited by the specific type of the component.

Optionally, the component body comprises a composite component electrically compounded by a plurality of components, the composite component comprises a metallized piezoresistor chip and a ceramic gas discharge tube, and the metallized piezoresistor chip and the ceramic gas discharge tube component are electrically connected in series to form the composite component.

Specifically, fig. 4 is a schematic structural diagram of one view angle of a composite component according to an embodiment of the present utility model, and fig. 5 is a schematic structural diagram of another view angle of the composite component according to an embodiment of the present utility model, referring to fig. 4 and 5, the composite component includes a metallized varistor chip 420 and a ceramic gas discharge tube 410, the metallized varistor chip 420 and the ceramic gas discharge tube 410 are electrically connected to form the composite component, the composite component is used as a component body 210, wherein the electrical connection between the metallized varistor chip 420 and the ceramic gas discharge tube 410 includes a series electrical connection. The combination of the components in the composite device is described, but the embodiment only describes the specific types of the components in the composite device, and the components in the composite device can be selected and compounded according to practical application.

With continued reference to fig. 2 and 3, another uneven surface is provided with an adsorption platform 260, and the surface of the adsorption platform 260 away from the component body 210 forms an adsorption plane.

Specifically, in the surface mounting welding, the uneven adsorption surface can cause the surface mounting machine to throw the material, thereby causing raw material waste. Therefore, the adsorption platform 260 is disposed on the other uneven surface of the component packaging body 270, the adsorption platform 260 can be connected with the component packaging body 270 through an adhesive, the thickness of the adsorption platform 260 at least needs to cover the protrusion at the connection position of the first lead 221 and the welding layer 230, an adsorption plane is formed on the outer surface of the adsorption platform 260, namely, the surface far away from the component packaging body, and the adsorption plane is a flat surface, so that the material throwing phenomenon is reduced when the chip of the chip mounter is adsorbed, and the cost is saved.

Optionally, the coplanarity of the soldering lead end and the supporting plane is 0-0.15mm.

Specifically, with continued reference to fig. 2 and 3, the outer surface of the support platform 250, that is, the surface far from the component soldering body forms a support plane, wherein the other end of the electrode lead 220 is used as a soldering lead end, the electrode lead 220 is bent toward the support platform 250, and the bent soldering lead end is far from the component body 210. For convenience of illustration, the electrode lead 220 is illustrated as a first lead 221 and a second lead 222 by way of example. The electrode lead 220 far from the support platform 250 is a first lead 221, and the electrode lead 220 near the support platform 250 is a second lead 222. The welding lead end of the first lead 221 is bent toward the supporting platform 250 side, and the position of the welding lead end of the second lead 222 is adjusted so that the supporting plane, the welding lead end of the first lead 221, and the welding lead end of the second lead 222 form a plane. The coplanarity of the three is within 0-0.15mm, and the three are considered to be on the same plane, preferably, the coplanarity is designed to be 0-0.1mm, so that the placement stability of the patch element can be further improved.

Optionally, the cross-sectional shape of the electrode lead 220 includes at least one of a flat shape and a circular shape.

Specifically, the electrode lead 220 may be formed into a flat shape by subsequent processing, and a larger flat contact area may provide a more stable support, and at the same time, the bottom of the flat plane of the electrode lead 220 and the support plane are on the same surface, so that the placement stability may be further improved. The lead wire may also be circular, and the circular electrode lead 220 is tangential to the extended surface of the support plane, so that the electrode lead 220 is on the same surface as the support plane.

Optionally, the perpendicular projection of the support platform 250 onto the extended surface of the support plane is adjacent to or intersects the perpendicular projection of the component body 210 onto the extended surface of the support plane.

Specifically, the support platform 250 may be completely adhered to the uneven surface of the component package 270, or the support platform 250 may be disposed on the bent electrode lead 220, that is, the tangential plane of the bent electrode lead 220 and the support plane are on the same surface, so that the support platform 250 may perform a fixing function on the electrode lead 220. The support platform 250 may also be partially disposed on the uneven surface of the component encapsulation 270 while being partially disposed on the bent electrode leads 220. In either arrangement, it is desirable to ensure that the support plane and the weld lead end of the electrode lead 220 meet the coplanarity requirement, i.e., are on the same plane.

Optionally, the material of the encapsulating layer 240 includes at least one of a thermoplastic and a thermosetting resin.

Specifically, the encapsulation layer 240 applies at least one of thermoplastic and thermosetting resin to the device by brushing, dipping, spraying, or the like, so that the outer surface is entirely encapsulated as a protective coating or insulating layer.

Based on the above embodiment, optionally, when the supporting platform 250 is disposed on an uneven surface of the component package 270, the contact area between the supporting platform 250 and the uneven surface is smaller than or equal to the area of the uneven surface. Specifically, the contact area between the supporting platform 250 and the uneven surface may be smaller than or equal to the area of the uneven surface, the device is kept horizontally in the manufacturing process, the supporting platform 250 is manufactured on the uneven surface, the thickness of the supporting platform 250 at least covers the protruding position, the contact area is larger, and the better the supporting stability can be provided by the supporting platform 250.

Optionally, the perpendicular projections of the bent electrode leads 220 on the extension plane of the support plane are parallel to each other. Specifically, the vertical projections of the first lead and the second lead on the extending surface of the bottom supporting surface are parallel, the first lead and the second lead are on two sides of the symmetry axis of the component body 210, and the leads are distributed in pairs, so that the stability of the directions of two sides of the symmetry axis can be improved. Further improves the stability of the chip components and the device, and can avoid the short circuit caused by the crossing of leads and influence the functions of the device.

Optionally, the materials of the support platform 250 and the adsorption platform 260 include at least one of epoxy and an electronic insulating potting adhesive. Specifically, the epoxy resin and the electronic insulation pouring sealant have the characteristics of insulation, high pressure resistance, high and low temperature resistance, environmental protection, no toxicity, high hardness and the like, and the adsorption layer is more stable in a high-temperature environment in the production process.

The embodiment of the utility model also provides electronic equipment comprising any patch element. Specifically, the electronic device refers to an application device composed of electronic components such as an integrated circuit, a PCB, a transistor, and an electronic tube, and in the production of the electronic device, the electronic device includes the patch component according to the embodiment of the present utility model, so that the electronic device has the same beneficial effects and is not described herein.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (10)

1. The utility model provides a paster components and parts, includes the components and parts body, the relative surface of components and parts body is provided with electrode lead, electrode lead one end pass through the weld layer with components and parts body electricity is connected, forms the components and parts welded body, the components and parts welded body except the leading-out terminal of electrode lead all coats and has the envelope layer, electrode lead with the envelope layer of components and parts body electricity junction has the unevenness face respectively, a serial communication port, one be provided with supporting platform on the unevenness face, supporting platform keeps away from the surface formation supporting plane of components and parts body, the electrode lead other end is as the welding lead end, the welding lead end with supporting plane coplanarity.

2. The patch device of claim 1, wherein the device body comprises a component or a composite device of a plurality of components electrically combined.

3. The patch element of claim 2, wherein the element body comprises an element comprising a metallized varistor chip.

4. The patch device of claim 2, wherein the device body comprises a composite device of a plurality of components electrically combined, the composite device comprising a metallized varistor chip and a ceramic gas discharge tube, the metallized varistor chip and the ceramic gas discharge tube components electrically connected in series to form the composite device.

5. The chip component according to claim 1, wherein another uneven surface is provided with an adsorption platform, and the surface of the adsorption platform away from the component body forms an adsorption plane.

6. The chip component of claim 1, wherein the solder lead terminal is coplanar with the support plane at a coplanarity of 0-0.15mm.

7. The chip component of claim 1, wherein the cross-sectional shape of the electrode lead includes at least one of a flat shape and a circular shape.

8. The patch component of claim 1, wherein a perpendicular projection of the support platform on the extended face of the support plane is adjacent to or intersects a perpendicular projection of the component body on the extended face of the support plane.

9. The patch element of any one of claims 1-8, wherein the material of the encapsulation layer comprises at least one of a thermoplastic and a thermosetting resin.

10. An electronic device comprising the patch element of any one of claims 1-9.