CN219811199U - Anti-metal RFID antenna card - Google Patents

Anti-metal RFID antenna card Download PDF

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Publication number
CN219811199U
CN219811199U CN202321095835.0U CN202321095835U CN219811199U CN 219811199 U CN219811199 U CN 219811199U CN 202321095835 U CN202321095835 U CN 202321095835U CN 219811199 U CN219811199 U CN 219811199U
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metal
antenna
laminated board
layer
rfid chip
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CN202321095835.0U
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章国庆
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SHANGHAI BOYING INFORMATION TECHNOLOGY CO LTD
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SHANGHAI BOYING INFORMATION TECHNOLOGY CO LTD
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Abstract

The utility model relates to an anti-metal RFID antenna card, which adopts an innovative structural design, realizes coupling by a bottom metal layer (3) and an Inlay layer containing a metal antenna (2), introduces the structure of an upper laminated board (4) and a lower laminated board (5), fixes the relative position between the Inlay layer and the bottom metal layer (3) through the lower laminated board (5), realizes the protection of the Inlay layer by the upper laminated board (4), and further designs a through hole and is matched with a connecting rod to realize the reinforcement of the integral structure.

Description

Anti-metal RFID antenna card
Technical Field
The utility model relates to an anti-metal RFID antenna card, and belongs to the technical field of radio frequency antennas.
Background
In conventional anti-metal RFID antenna designs, the following 4 schemes are generally employed: the first is to raise the label by one quarter wavelength, and forward superposition is formed by the wave path difference of the incident wave and the reflected wave to improve the label performance, which has the disadvantage of too high height and is not suitable for the application of most scenes; the second scheme is that a layer of wave-absorbing material is added between the tag and the metal, the generation of induced current is reduced through the wave-absorbing material, and then the influence of the mirror current on the impedance and radiation of the antenna is reduced, and the wave-absorbing material has the defects of high price and inapplicability to ultra-high frequency RFID; the third scheme is to design the UHF RFID tag in a form of a microstrip antenna or a PIFA antenna, and the microstrip antenna or the PIFA antenna needs a metal ground plane, so the UHF RFID tag is a mainstream scheme in RFID anti-metal tags, and the tags adopting the scheme at present are generally in a PCB form or a flexible anti-metal form, so that the cost is much higher than that of the common Inlay; the fourth scheme is to adopt a high-impedance surface material, the material shows the magnetic wall characteristic in a certain frequency range, can inhibit the propagation of surface waves, and reduce backward radiation and sidelobe level, and has the defects that the application of the surface metamaterial is not yet applied on a large scale in the RFID industry, and has no cost advantage;
when designing tags in the form of microstrip antennas or PIFA antennas, conductive vias are typically required to connect the upper and lower metal conductors to form cavity resonances. Taking an ultrahigh frequency flexible anti-metal RFID tag as an example, no matter a half-wavelength or quarter-wavelength microstrip antenna or a butterfly antenna is adopted, the antenna needs to be bent, the processing technology is complex, and the requirement on precision is high; in addition, the flexible anti-metal label is limited in use scene, is difficult to fully exert performance in environments such as rain, fog and dust, and the like, and is generally adhered through double faced adhesive tape in installation, so that the risk of easy tearing and falling exists.
Disclosure of Invention
The utility model aims to solve the technical problem of providing an anti-metal RFID antenna card, which adopts an innovative structural design and can effectively improve the practical application efficiency of a radio frequency antenna.
The utility model adopts the following technical scheme for solving the technical problems: the utility model designs an anti-metal RFID antenna card, which comprises an RFID chip, a metal antenna and a bottom metal layer, wherein the metal antenna is in a flat plate shape, the RFID chip and the metal antenna are in signal transmission connection to form an Inlay layer, the bottom metal layer is positioned on one side of the Inlay layer, the surface of the bottom metal layer is parallel to the surface of the metal antenna in the Inlay layer, a preset interval is kept between the bottom metal layer and the metal antenna, and the metal antenna projection is positioned in the bottom metal layer projection along the projection direction perpendicular to the surface of the metal antenna, so that the metal antenna and the bottom metal layer are coupled.
As a preferred technical scheme of the utility model: the antenna is characterized by further comprising an upper laminated board made of insulating materials, wherein the upper laminated board is positioned on one side of the Inlay layer, which is away from the bottom metal layer, the surface of the upper laminated board is parallel to the surface of the metal antenna in the Inlay layer, and the projection of the metal antenna is positioned in the projection of the upper laminated board along the projection direction perpendicular to the surface of the metal antenna.
As a preferred technical scheme of the utility model: the antenna assembly comprises an Inlay layer, a bottom metal layer, a lower laminated board made of insulating materials, and a metal antenna, wherein the lower laminated board is positioned between the Inlay layer and the bottom metal layer, the surfaces of the lower laminated board and the metal antenna in the Inlay layer are parallel to each other, and the metal antenna projection is positioned in the lower laminated board projection along the projection direction perpendicular to the metal antenna surface.
As a preferred technical scheme of the utility model: the upper laminate and the Inlay layer are in surface contact with each other, the Inlay layer and the lower laminate are in surface contact with each other, and the lower laminate and the bottom metal layer are in surface contact with each other.
As a preferred technical scheme of the utility model: based on signal transmission connection between the RFID chip and the metal antenna, the RFID chip is arranged on one surface of the metal antenna, an upper laminated board or a lower laminated board facing the RFID chip is defined as a target laminated board, a groove with the inner size being matched with the outer size of the RFID chip is formed in the position corresponding to the RFID chip on the surface facing the RFID chip on the target laminated board, and the surface facing the RFID chip on the target laminated board is contacted with the surface of the metal antenna on which the RFID chip is arranged on the basis that the RFID chip is positioned in the groove.
As a preferred technical scheme of the utility model: the RFID chip is arranged on one surface of the metal antenna, the thickness of the insulating gasket is not smaller than that of the RFID chip, the insulating gasket is connected to the surface of the metal antenna arranged on the RFID chip, the insulating gasket is positioned around the RFID chip, an upper laminated board or a lower laminated board facing the RFID chip is defined as a target pressing board, and the insulating gasket is in contact with the surface of the target pressing board facing the RFID chip.
As a preferred technical scheme of the utility model: the connecting rod structure comprises a laminated board, a bottom metal layer, at least one connecting rod, and at least one through hole, wherein the through holes are arranged on the laminated board, the through holes are arranged on the bottom metal layer, the number of the connecting rods is equal to that of the through holes, the inner diameters of the through holes are matched with the outer diameters of the connecting rods, the connecting rods penetrate through the through holes in a one-to-one correspondence mode respectively to fix the positions of the laminated board and the bottom metal layer, and the positions of the laminated board and the bottom metal layer relative to each other are fixed.
Compared with the prior art, the metal-resistant RFID antenna card has the following technical effects:
(1) The metal-resistant RFID antenna card is designed, adopts an innovative structural design, realizes coupling between a bottom metal layer and an Inlay layer containing a metal antenna, introduces an upper laminated board and a lower laminated board structure, fixes the relative position between the Inlay layer and the bottom metal layer through the lower laminated board, realizes the protection of the Inlay layer through the upper laminated board, and is provided with a through hole and a connecting rod in a matching manner, so that the reinforcement of the integral structure is realized, the signal receiving and transmitting effect of the high-efficiency radio frequency antenna is realized, the omnibearing protection of the radio frequency antenna is realized, and the working efficiency in practical application is comprehensively improved.
Drawings
FIG. 1 is a schematic perspective view of a metallic resistant RFID antenna card of the present utility model;
fig. 2 is a schematic cross-sectional view of a metallic resistant RFID antenna card in accordance with the present utility model.
The RFID chip comprises a RFID chip body, a metal antenna body, a bottom metal layer, an upper laminated board, a lower laminated board, a through hole and a groove.
Detailed Description
The following describes the embodiments of the present utility model in further detail with reference to the drawings.
In practical application, as shown in fig. 1 and 2, the anti-metal RFID antenna card of the present utility model specifically includes an RFID chip 1, a metal antenna 2, a bottom metal layer 3, an upper laminate 4 made of an insulating material, and a lower laminate 5 made of an insulating material.
The metal antenna 2 is in a flat plate shape, signal transmission connection between the RFID chip 1 and the metal antenna 2 forms an Inlay layer, the bottom metal layer 3 is located on one side of the Inlay layer, the surface of the bottom metal layer 3 is parallel to the surface of the metal antenna 2 in the Inlay layer, a preset interval is kept between the bottom metal layer 3 and the metal antenna 2, the projection of the metal antenna 2 is located in the projection of the bottom metal layer 3 along the projection direction perpendicular to the surface of the metal antenna 2, and coupling is achieved between the metal antenna 2 and the bottom metal layer 3.
The bottom metal layer 3 can be metal with good conductivity such as aluminum, copper and the like, and the metal antenna 2 projection is positioned in the bottom metal layer 3 projection, so that the stability of the coupling effect between the bottom metal layer 3 and the Inlay layer metal antenna 2, namely the stability of the equivalent capacitance value formed between the upper metal layer and the lower metal layer, is ensured.
The upper laminate 4 is located on the side of the Inlay layer facing away from the bottom metal layer 3, and the surface of the upper laminate 4 is parallel to the surface of the metal antenna 2 in the Inlay layer, and the metal antenna 2 projection is located within the upper laminate 4 projection along the projection direction perpendicular to the surface of the metal antenna 2.
The lower laminate 5 is located between the Inlay layer and the bottom metal layer 3, and the surface of the lower laminate 5 and the surface of the metal antenna 2 in the Inlay layer are parallel to each other, and the metal antenna 2 projection is located within the lower laminate 5 projection along the projection direction perpendicular to the surface of the metal antenna 2.
Regarding the upper laminate 4 and the lower laminate 5, in use, the laminates can be made of one or more materials such as PET/PVC/PTFE, namely, laminates made of insulating materials, and the thickness of the upper laminate 4 is adjustable, and the thickness of the upper laminate 4 mainly has 2 functions, namely, the upper laminate 4 covers an Inlay layer and serves as a protective layer for protecting the Inlay layer; secondly, information can be written on the surface of the upper laminated board 4 facing away from the Inlay layer in a printing, laser and other modes, so that a marking effect is achieved; the lower laminate 5 is made of a material and has a thickness that mainly provides a support between the Inlay layer and the bottom metal layer 3 and ensures a stable coupling between the Inlay layer and the bottom metal layer 3.
Regarding the Inlay layer, the practical application can be dry Inlay or wet Inlay, wherein the dry Inlay consists of a metal antenna and a chip which are connected with each other through signal transmission, and the wet Inlay is one layer of double faced adhesive tape more than the dry Inlay, namely, one layer of double faced adhesive tape is wrapped on the surface of the whole structure of the dry Inlay, so that the rapid connection on the set carrier is realized; whether dry or wet, in which the metal antenna and the chip are connected by means of conductive glue or soldering, has initial properties that are closely related to the material, thickness, and bottom metal layer 3 of the upper laminate 4, lower laminate 5.
In further practical applications, as shown in fig. 1 and 2, the upper laminate 4 and the Inlay layer are designed to be in surface contact with each other, the Inlay layer and the lower laminate 5 are designed to be in surface contact with each other, and the lower laminate 5 and the bottom metal layer 3 are designed to be in surface contact with each other.
Regarding the signal transmission connection between the RFID chip 1 and the metal antenna 2, in practical application, the RFID chip 1 is disposed on one surface of the metal antenna 2, so regarding the above-mentioned design of contact connection between adjacent layers, two structures are specifically designed for the position of the RFID chip 1 in the Inlay layer, so as to avoid damage caused by excessive stress of the RFID chip 1 during lamination; first, as shown in fig. 2, based on signal transmission connection between the RFID chip 1 and the metal antenna 2, the RFID chip 1 is disposed on one surface of the metal antenna 2, an upper laminate 4 or a lower laminate 5 facing the RFID chip 1 is defined as a target pressing plate, a groove 7 with an inner dimension corresponding to an outer dimension of the RFID chip 1 is disposed on a surface facing the RFID chip 1 on the target pressing plate and corresponding to a position of the RFID chip 1, and based on the RFID chip 1 being disposed in the groove 7, a surface facing the RFID chip 1 on the target pressing plate contacts with a surface on which the RFID chip 1 is disposed on the metal antenna 2.
Secondly, the utility model designs an insulating gasket aiming at the position of the RFID chip 1 in the Inlay layer, the insulating gasket is further arranged on one surface of the metal antenna 2 based on signal transmission connection between the RFID chip 1 and the metal antenna 2, the thickness of the insulating gasket is not smaller than that of the RFID chip 1, the insulating gasket is connected to the surface of the metal antenna 2 arranged on the RFID chip 1, the insulating gasket is positioned around the RFID chip 1, an upper laminated board 4 or a lower laminated board 5 facing the RFID chip 1 is defined as a target laminated board, and the insulating gasket is contacted with the surface of the target laminated board facing the insulating gasket.
After the structure of the upper laminated board 4, the Inlay layer, the lower laminated board 5 and the bottom metal layer 3 from top to bottom is constructed, in practical application, the structure further comprises at least one connecting rod, based on the relative positions between the laminated board and the bottom metal layer 3, each through hole 6 which respectively penetrates through the laminated board and the bottom metal layer 3 and does not pass through the Inlay layer is arranged in a preset number, the number of the connecting rods is equal to the number of the through holes 6, the inner diameter of the through holes 6 is matched with the outer diameter of the connecting rods, each connecting rod respectively penetrates through each through hole 6 in a one-to-one correspondence mode to be fixed, and the fixing of the relative positions of the laminated board and the bottom metal layer 3 is realized. In application, the connecting rod can be a rivet or a screw.
The design of the anti-metal RFID antenna card adopts an innovative structural design, realizes coupling by using the bottom metal layer 3 and the Inlay layer containing the metal antenna 2, introduces the structure of the upper laminated board 4 and the lower laminated board 5, fixes the relative position between the Inlay layer and the bottom metal layer 3 by using the lower laminated board 5, realizes the protection of the Inlay layer by using the upper laminated board 4, and in addition, the through holes are designed and matched with connecting rods to realize the reinforcement of the integral structure, realizes the omnibearing protection of the radio-frequency antenna while having the signal receiving and transmitting effect of the high-efficiency radio-frequency antenna, and comprehensively improves the working efficiency in practical application.
In practical application, based on the structural design, the performance of the Inlay layer is designed in advance, so that after the Inlay layer is laminated, the Inlay layer is just resonated in a required frequency band, for example, an FCC frequency band is 902-928MHz under the influence of the dielectric constant of a laminated board material and the coupling effect formed between metals; compared with the flexible anti-metal tag, the flexible anti-metal tag has the advantages that the process and the flow are simpler and more mature, the yield of products is greatly improved, the flexible anti-metal tag is wider in use scene, dust and fog can be prevented, and the working efficiency of the radio frequency antenna in practical application is improved.
The embodiments of the present utility model have been described in detail with reference to the drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present utility model.

Claims (7)

1. An anti-metal RFID antenna card, characterized in that: including RFID chip (1), metal antenna (2), and bottom metal layer (3), wherein, metal antenna (2) are dull and stereotyped shape, signal transmission connects between RFID chip (1) and metal antenna (2) and constitutes the Inlay layer, bottom metal layer (3) are located one side on Inlay layer, and metal antenna (2) surface is parallel in bottom metal layer (3) surface and the Inlay layer, keep predetermineeing the interval between bottom metal layer (3) and metal antenna (2), and along the projection direction on perpendicular to metal antenna (2) surface, metal antenna (2) projection is located bottom metal layer (3) projection, realize the coupling between metal antenna (2) and bottom metal layer (3).
2. The metal resistant RFID antenna card of claim 1, wherein: the antenna is characterized by further comprising an upper laminated board (4) made of insulating materials, wherein the upper laminated board (4) is positioned on one side of the Inlay layer, which is away from the bottom metal layer (3), the surface of the upper laminated board (4) is parallel to the surface of the metal antenna (2) in the Inlay layer, and the projection of the metal antenna (2) is positioned in the projection of the upper laminated board (4) along the projection direction perpendicular to the surface of the metal antenna (2).
3. The metal resistant RFID antenna card of claim 2, wherein: the antenna is characterized by further comprising a lower laminated board (5) made of insulating materials, wherein the lower laminated board (5) is positioned between the Inlay layer and the bottom metal layer (3), the surfaces of the lower laminated board (5) and the surfaces of the metal antennas (2) in the Inlay layer are parallel to each other, and the projection of the metal antennas (2) is positioned in the projection of the lower laminated board (5) along the projection direction perpendicular to the surfaces of the metal antennas (2).
4. A metal resistant RFID antenna card according to claim 3, wherein: the upper laminated board (4) and the Inlay layer are in opposite surface contact, the Inlay layer and the lower laminated board (5) are in opposite surface contact, and the lower laminated board (5) and the bottom metal layer (3) are in opposite surface contact.
5. The metal resistant RFID antenna card of claim 4, wherein: based on signal transmission connection between the RFID chip (1) and the metal antenna (2), the RFID chip (1) is arranged on one surface of the metal antenna (2), an upper laminated board (4) or a lower laminated board (5) facing the RFID chip (1) is defined as a target pressing board, a groove (7) with the inner size being matched with the outer size of the RFID chip (1) is formed in the surface facing the RFID chip (1) on the target pressing board and corresponds to the position of the RFID chip (1), the surface facing the RFID chip (1) on the target pressing board is in contact with the surface of the RFID chip (1) on the metal antenna (2) based on the fact that the RFID chip (1) is located in the groove (7).
6. The metal resistant RFID antenna card of claim 4, wherein: the RFID chip (1) is arranged on one surface of the metal antenna (2), the thickness of the insulating gasket is not smaller than that of the RFID chip (1), the insulating gasket is connected to the surface of the metal antenna (2) arranged on the RFID chip (1), the insulating gasket is located around the RFID chip (1), an upper laminated board (4) or a lower laminated board (5) facing the RFID chip (1) is defined as a target pressing board, and the insulating gasket is in contact with the surface of the target pressing board facing the insulating gasket.
7. An anti-metal RFID antenna card according to any one of claims 2 to 6, characterized in that: the connecting rod structure comprises a laminated board and a bottom metal layer (3), and is characterized by further comprising at least one connecting rod, wherein the preset number of connecting rods respectively penetrates through the laminated board and the bottom metal layer (3) and does not pass through all through holes (6) of the Inlay layer based on the relative positions between the laminated board and the bottom metal layer (3), the number of the connecting rods is equal to the number of the through holes (6), the inner diameter of each through hole (6) is matched with the outer diameter of the connecting rod, all the connecting rods respectively pass through all the through holes (6) in a one-to-one correspondence mode to be fixed, and the relative positions of the laminated board and the bottom metal layer (3) are fixed.
CN202321095835.0U 2023-05-09 2023-05-09 Anti-metal RFID antenna card Active CN219811199U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321095835.0U CN219811199U (en) 2023-05-09 2023-05-09 Anti-metal RFID antenna card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321095835.0U CN219811199U (en) 2023-05-09 2023-05-09 Anti-metal RFID antenna card

Publications (1)

Publication Number Publication Date
CN219811199U true CN219811199U (en) 2023-10-10

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Application Number Title Priority Date Filing Date
CN202321095835.0U Active CN219811199U (en) 2023-05-09 2023-05-09 Anti-metal RFID antenna card

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CN (1) CN219811199U (en)

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