CN212114009U - Novel coplanar waveguide broadband antenna matched with low-profile microstrip line - Google Patents

Novel coplanar waveguide broadband antenna matched with low-profile microstrip line Download PDF

Info

Publication number
CN212114009U
CN212114009U CN202020976054.2U CN202020976054U CN212114009U CN 212114009 U CN212114009 U CN 212114009U CN 202020976054 U CN202020976054 U CN 202020976054U CN 212114009 U CN212114009 U CN 212114009U
Authority
CN
China
Prior art keywords
pcb
hole
positioning
microstrip transmission
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020976054.2U
Other languages
Chinese (zh)
Inventor
盛洪宇
牛雪彬
徐春阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Amphenol Airwave Communication Electronics Co Ltd
Original Assignee
Shanghai Amphenol Airwave Communication Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Amphenol Airwave Communication Electronics Co Ltd filed Critical Shanghai Amphenol Airwave Communication Electronics Co Ltd
Priority to CN202020976054.2U priority Critical patent/CN212114009U/en
Application granted granted Critical
Publication of CN212114009U publication Critical patent/CN212114009U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model provides a novel coplanar waveguide wide band antenna of low section microstrip line matching, include: the PCB comprises a first PCB, a second PCB and a third PCB; the first PCB is parallel to the third PCB, and the second PCB is positioned between the first PCB and the third PCB and is perpendicular to the first PCB and the third PCB; the first side of the first PCB board includes: the monopole radiation unit is positioned in the middle, the metal stratum is arranged around the monopole radiation unit, and a gap exists between the monopole radiation unit and the metal stratum; a first microstrip transmission matched line is arranged in the middle of the first surface of the second PCB; the second surface of the second PCB board is a first reference ground; a second microstrip transmission matched line is arranged in the middle of the first surface of the third PCB; the second face of the third PCB board is a second reference ground.

Description

Novel coplanar waveguide broadband antenna matched with low-profile microstrip line
Technical Field
The utility model relates to a communication technology, concretely relates to novel coplane waveguide wide band antenna of low section microstrip line matching.
Background
In recent years, with the rapid development of wireless communication technology, antennas having characteristics of miniaturization, wide frequency band, low cost, easy fabrication, etc. have become one of the most important circuit component devices in modern mobile communication systems, and have attracted much attention. With the arrival of the fifth generation mobile communication, the number of antennas required by communication equipment is also increasing, and antenna equipment with the same volume can cover wider frequency bands and has undoubtedly greater advantages, and can help manufacturers to establish standards and quickly occupy the market.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model aims at providing a novel coplanar waveguide wide band antenna of low section microstrip line matching. The technical scheme of the utility model as follows:
a novel low-profile microstrip line matched coplanar waveguide broadband antenna comprises:
the PCB comprises a first PCB, a second PCB and a third PCB;
the first PCB is parallel to the third PCB, and the second PCB is positioned between the first PCB and the third PCB and is perpendicular to the first PCB and the third PCB;
the first side of the first PCB board includes: the monopole radiation unit is positioned in the middle, the metal stratum is arranged around the monopole radiation unit, and a gap exists between the monopole radiation unit and the metal stratum;
the second surface of the first PCB is connected with the second PCB;
a first microstrip transmission matched line is arranged in the middle of the first surface of the second PCB and corresponds to the monopole radiation unit; the second surface of the second PCB board is a first reference ground; the first microstrip transmission matching line is connected with the monopole radiation unit; the first reference ground is connected with the second surface of the first PCB board;
a second microstrip transmission matched line is arranged in the middle of the first surface of the third PCB, and corresponds to the first microstrip transmission matched line in position; the second surface of the third PCB board is a second reference ground; the first microstrip transmission matching line is connected with the second microstrip transmission matching line;
the second face of the second PCB board is connected with the first face of the third PCB board.
Optionally, a plurality of first via holes are formed in one side of the first PCB, and the first via holes are located in an area where a metal ground layer is disposed; the first through hole penetrates through the first PCB and connects the metal ground layer with the second surface of the PCB;
a plurality of second through holes are formed in one side of the third PCB, and the second through holes correspond to the first through holes in position; the second via hole penetrates through the third PCB and connects the first surface of the third PCB with a second reference ground.
Optionally, the first PCB is further provided with a connecting through hole, a first positioning through hole, and a second positioning through hole; the first positioning through hole and the second positioning through hole are located in an area provided with a metal stratum, and the connecting through hole is located between the metal stratum and the monopole radiation unit.
Optionally, the first microstrip transmission matching line is disposed along an upper end to a lower end of the first face of the second PCB; a first end of the first microstrip transmission matching line corresponds to the upper end of the first surface of the second PCB; a second end of the first microstrip transmission matching line corresponds to the lower end of the first surface of the second PCB;
a first bulge, a second bulge and a third bulge are arranged at the upper end of the second PCB; a fourth bulge and a fifth bulge are arranged at the lower end of the second PCB;
the first bulge is positioned in the middle of the upper end of the second PCB;
the first end of the first microstrip transmission matching line is arranged on the first bulge; the first bulge is clamped in the connecting through hole, and the first end of the first microstrip transmission matched line is connected with the monopole radiation unit;
the second protrusion and the third protrusion are respectively clamped into the first positioning through hole and the second positioning through hole.
Optionally, the third PCB is further provided with a third positioning through hole and a fourth positioning through hole;
the second microstrip transmission match line is connected with the second end of the first microstrip transmission match line;
the fourth protrusion and the fifth protrusion are respectively clamped into the third positioning through hole and the fourth positioning through hole.
Optionally, the connecting through hole, the first positioning through hole, and the second positioning through hole are all disposed close to the first via hole.
Optionally, the third positioning through hole and the fourth positioning through hole are both disposed close to the second via hole.
Optionally, the antenna further comprises: a reflective plate; the second reference ground is fixed with the reflection plate.
Optionally, the antenna further includes an inductor, and the inductor is located on the first surface of the first PCB and is connected to the monopole radiation unit and the metal ground layer, respectively.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses a good matching characteristic can be realized to the feed in the frequency band of broad.
The utility model discloses a great inductance of inductance value has satisfied antistatic and lightning protection demand parallelly connected in feed department of coplanar waveguide.
The utility model discloses a PCB pieces together to insert and carries out the structure realization, also can realize on plastic support with the LDS technology, and implementation is simple, easy operation.
The utility model discloses can realize 2G, 3G, 4G, 5G frequency channel 2 to 3 combinations between the frequency channel or realize WIFI2.4G and 5G dual-frenquency antenna's combination, possess good doublet or wide band characteristic.
The utility model discloses at angle of pitch 0 within range to 90, full frequency band has good horizontal omnidirectional characteristic.
The utility model discloses owing to be the coplane waveguide structure of placing horizontally, consequently it has good low section characteristic.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of a novel coplanar waveguide broadband antenna with a low-profile microstrip line matching according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an overall structure of a first PCB according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first side of a first PCB according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a second surface of the first PCB according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an overall structure of a second PCB according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a first surface of a second PCB board according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a second surface of a second PCB board according to an embodiment of the present invention;
fig. 8 is a schematic view of the overall structure of a third PCB according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a first surface of a third PCB according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a second surface of a third PCB according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
As shown in fig. 1, the present embodiment discloses a novel low-profile microstrip line-matched coplanar waveguide broadband antenna, which includes: the PCB comprises a first PCB (printed circuit board) 1, a second PCB 2, a third PCB 3 and a reflecting plate; wherein:
the first PCB board 1 is parallel to the third PCB board 3, and the second PCB board 2 is positioned between the first PCB board 1 and the third PCB board 3 and is perpendicular to the first PCB board 1 and the third PCB board 3.
In order to strengthen the structural strength, the first PCB and the third PCB can be supported and reinforced through a plastic bracket or the PCB perpendicular to the first PCB and the third PCB.
As shown in fig. 2 to 4, the first surface of the first PCB 1 is a coplanar waveguide structure, and includes: the monopole radiation unit 11 is positioned in the middle, the metal stratum 12 is arranged around the monopole radiation unit, and a gap exists between the monopole radiation unit 11 and the metal stratum 12; the second side of the first PCB 1 is connected to the second PCB 2.
A plurality of first via holes 121 are formed in one side of the first PCB, and the first via holes 121 are located in an area where the metal ground layer 12 is disposed; the first via 121 penetrates the first PCB to connect the metal ground layer 12 and the second surface of the PCB.
The first PCB board 1 is provided with a connecting through hole 13, a first positioning through hole 14 and a second positioning through hole 15; the first positioning through hole 14 and the second positioning through hole 15 are located in an area where a metal ground layer is disposed, and the connection through hole 13 is located between the metal ground layer 12 and the monopole radiation unit 11 and adjacent to the monopole radiation unit 11.
The connecting through hole 13, the first positioning through hole 14 and the second positioning through hole 15 are all arranged close to the first via hole 121.
As shown in fig. 5 to 7, a first microstrip transmission matching line 26 is disposed in the middle of the first surface of the second PCB 2 and is disposed along the upper end to the lower end of the first surface of the second PCB; the first microstrip transmission matching line 26 is arranged corresponding to the position of the monopole radiation unit 11; the second surface of the second PCB board is a first reference ground; a first end of the first microstrip transmission matching line corresponds to the upper end of the first surface of the second PCB; and the second end of the first microstrip transmission matching line corresponds to the lower end of the first surface of the second PCB.
A first bulge 21, a second bulge 22 and a third bulge 23 are arranged at the upper end of the second PCB; the first projection 21 is located at the middle of the upper end of the second PCB.
A first end of the first microstrip transmission match line 26 is disposed on the first projection 21; the first protrusion 21 is clamped in the connection through hole 13, and a first end of the first microstrip transmission matching line 26 is welded to the monopole radiation unit 11 through a first welding strip 201, so that the monopole radiation unit 11 and the first microstrip transmission matching line 26 are connected together.
The second protrusion 22 and the third protrusion 23 are respectively clamped into the first positioning through hole 14 and the second positioning through hole 15; and the second face of the second PCB 2 is soldered to the second face of the first PCB 1 by a second solder bar 202; the second face of the first PCB board 1 is connected to a first reference ground so that the metal ground layer 12 is connected to the first reference ground. The second welding bar 202 is positioned adjacent to the first projection, the second projection, and the third projection.
And a fourth bulge 24 and a fifth bulge 25 are arranged at the lower end of the second PCB.
As shown in fig. 8 to 10, 6 and 7, a second microstrip transmission matching line 31 is disposed in the middle of the first surface of the third PCB, and the second microstrip transmission matching line 31 corresponds to the first microstrip transmission matching line 26; the second surface of the third PCB board is a second reference ground; the second reference ground is fixed with the reflecting plate through a conductive screw or an elastic sheet.
A plurality of second via holes 32 are formed in one side of the third PCB 3, and the second via holes 32 correspond to the first via holes 121; the second via hole 32 penetrates the third PCB board to connect the first surface of the third PCB board with the second reference ground.
The third PCB is also provided with a third positioning through hole 33 and a fourth positioning through hole 34; the third positioning through hole 33 and the fourth positioning through hole 34 are disposed close to the second via hole 32.
The second microstrip transmission match line 31 and the second end of the first microstrip transmission match line 26 are connected together by a third welding bar 203.
The fourth protrusion 24 and the fifth protrusion 25 are respectively clamped into the third positioning through hole 33 and the fourth positioning through hole 34.
The second surface of the second PCB is soldered to the first surface of the third PCB by a fourth solder bar 204, so that the metal ground layer 12, the first reference ground and the second reference ground are sequentially connected.
The fourth welding bar is positioned close to the fourth projection 24 and the fifth projection 25.
In this embodiment, the antenna further includes an inductor, and the inductor is located on the first surface of the first PCB and is connected to the monopole radiation unit 11 and the metal ground layer 12, respectively. It is used for satisfying the demand of antistatic and lightning protection.
In the embodiment, a microstrip matching structure is adopted, and a coplanar waveguide structure with broadband characteristics is placed in parallel with a reference, so that a novel ultra-wideband antenna is obtained. The microstrip matching structure enables the feed of the antenna to realize good matching characteristics in a wider frequency band; the novel coplanar waveguide structure converts a coplanar waveguide antenna which is normally vertically arranged relative to a reference ground into a coplanar waveguide antenna which is arranged parallel to the reference ground; meanwhile, the anti-static and anti-lightning requirements are met for partial products, the problem that an inductor with a large inductance value is selectively connected in parallel at the feed position of the coplanar waveguide is solved, the structure is realized by splicing and inserting the PCB, and the structure can also be realized on a plastic support by an LDS process.
Because the novel coplanar waveguide antenna adopts a mode of combining coplanar waveguide and microstrip matching, the novel coplanar waveguide antenna can realize the combination of 2G, 3G, 4G and 5G frequency bands from 2 to 3 frequency bands or the combination of WIFI2.4G and 5G dual-frequency antennas, and has good dual-splicing or broadband characteristics; the novel coplanar waveguide antenna has good horizontal omnidirectional characteristic in a full frequency band within a range from 0 degree to 90 degrees of a pitch angle; the antenna has good low-profile characteristics due to the horizontally arranged coplanar waveguide structure.
The foregoing description of the specific embodiments of the invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims (9)

1. The utility model provides a novel coplane waveguide wide band antenna of low section microstrip line matching which characterized in that includes:
the PCB comprises a first PCB, a second PCB and a third PCB;
the first PCB is parallel to the third PCB, and the second PCB is positioned between the first PCB and the third PCB and is perpendicular to the first PCB and the third PCB;
the first side of the first PCB board includes: the monopole radiation unit is positioned in the middle, the metal stratum is arranged around the monopole radiation unit, and a gap exists between the monopole radiation unit and the metal stratum;
the second surface of the first PCB is connected with the second PCB;
a first microstrip transmission matched line is arranged in the middle of the first surface of the second PCB and corresponds to the monopole radiation unit; the second surface of the second PCB board is a first reference ground; the first microstrip transmission matching line is connected with the monopole radiation unit; the first reference ground is connected with the second surface of the first PCB board;
a second microstrip transmission matched line is arranged in the middle of the first surface of the third PCB, and corresponds to the first microstrip transmission matched line in position; the second surface of the third PCB board is a second reference ground; the first microstrip transmission matching line is connected with the second microstrip transmission matching line;
the second face of the second PCB board is connected with the first face of the third PCB board.
2. The antenna of claim 1,
a plurality of first through holes are formed in one side of the first PCB and are positioned in an area where a metal stratum is arranged; the first through hole penetrates through the first PCB and connects the metal ground layer with the second surface of the PCB;
a plurality of second through holes are formed in one side of the third PCB, and the second through holes correspond to the first through holes in position; the second via hole penetrates through the third PCB and connects the first surface of the third PCB with a second reference ground.
3. The antenna of claim 2,
the first PCB is also provided with a connecting through hole, a first positioning through hole and a second positioning through hole; the first positioning through hole and the second positioning through hole are located in an area provided with a metal stratum, and the connecting through hole is located between the metal stratum and the monopole radiation unit.
4. The antenna of claim 3,
the first microstrip transmission matching line is arranged along the upper end to the lower end of the first surface of the second PCB; a first end of the first microstrip transmission matching line corresponds to the upper end of the first surface of the second PCB; a second end of the first microstrip transmission matching line corresponds to the lower end of the first surface of the second PCB;
a first bulge, a second bulge and a third bulge are arranged at the upper end of the second PCB; a fourth bulge and a fifth bulge are arranged at the lower end of the second PCB;
the first bulge is positioned in the middle of the upper end of the second PCB;
the first end of the first microstrip transmission matching line is arranged on the first bulge; the first bulge is clamped in the connecting through hole, and the first end of the first microstrip transmission matched line is connected with the monopole radiation unit;
the second protrusion and the third protrusion are respectively clamped into the first positioning through hole and the second positioning through hole.
5. The antenna of claim 4,
the third PCB is also provided with a third positioning through hole and a fourth positioning through hole;
the second microstrip transmission match line is connected with the second end of the first microstrip transmission match line;
the fourth protrusion and the fifth protrusion are respectively clamped into the third positioning through hole and the fourth positioning through hole.
6. The antenna of claim 3, wherein the connecting through hole, the first positioning through hole, and the second positioning through hole are disposed adjacent to the first via hole.
7. The antenna of claim 5, wherein the third positioning through hole and the fourth positioning through hole are both disposed proximate to the second via hole.
8. The antenna of claim 1, further comprising: a reflective plate; the second reference ground is fixed with the reflection plate.
9. The antenna of claim 1 further comprising an inductor on the first side of the first PCB board and connected to the monopole radiating element and the metal ground layer, respectively.
CN202020976054.2U 2020-06-01 2020-06-01 Novel coplanar waveguide broadband antenna matched with low-profile microstrip line Active CN212114009U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020976054.2U CN212114009U (en) 2020-06-01 2020-06-01 Novel coplanar waveguide broadband antenna matched with low-profile microstrip line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020976054.2U CN212114009U (en) 2020-06-01 2020-06-01 Novel coplanar waveguide broadband antenna matched with low-profile microstrip line

Publications (1)

Publication Number Publication Date
CN212114009U true CN212114009U (en) 2020-12-08

Family

ID=73615041

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020976054.2U Active CN212114009U (en) 2020-06-01 2020-06-01 Novel coplanar waveguide broadband antenna matched with low-profile microstrip line

Country Status (1)

Country Link
CN (1) CN212114009U (en)

Similar Documents

Publication Publication Date Title
CN210956994U (en) Antenna assembly and electronic equipment
CN101106211B (en) Dual loop multi-frequency antenna
US7612734B2 (en) Wide bandwidth antenna device
CN210443665U (en) Radiating unit with 880-960MHz band filtering characteristic and base station antenna
US20100052997A1 (en) Antenna modules and portable electronic devices using the same
CN101471486A (en) An antenna
US20120262354A1 (en) High gain low profile multi-band antenna for wireless communications
US20120262355A1 (en) High gain low profile multi-band antenna for wireless communications
CN101997160B (en) Dual band antenna and wireless communication device using same
CN208797175U (en) Double frequency WiFi antenna and electronic equipment
CN201498596U (en) multi-frequency antenna
US8035566B2 (en) Multi-band antenna
CN212114009U (en) Novel coplanar waveguide broadband antenna matched with low-profile microstrip line
US11862866B2 (en) Antenna module and electronic device
CN200986972Y (en) High gain built-in aerial
CN2872624Y (en) Planar reversed F-shaped antenna
CN214542532U (en) Four-arm helical antenna based on fractal design
CN112448140B (en) Antenna module and terminal
CN113839209B (en) Antenna structure
CN211017381U (en) Small patch antenna and PCB antenna
CN209016271U (en) A kind of broad-band antenna for through-wall radar imaging
US20050088351A1 (en) Antenna having a protection film and method of protecting the antenna
CN111864358A (en) Novel metal antenna
US8477071B2 (en) Multi-band antenna
CN2891322Y (en) Antenna

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant