CN219810319U - Uniform temperature plate - Google Patents
Uniform temperature plate Download PDFInfo
- Publication number
- CN219810319U CN219810319U CN202321087202.5U CN202321087202U CN219810319U CN 219810319 U CN219810319 U CN 219810319U CN 202321087202 U CN202321087202 U CN 202321087202U CN 219810319 U CN219810319 U CN 219810319U
- Authority
- CN
- China
- Prior art keywords
- hole
- plate body
- plate
- heat pipe
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003466 welding Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000006056 electrooxidation reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a temperature equalizing plate, which aims to install a heat pipe by using a through hole, wherein a plate body and the through hole can be integrally formed, so that the processing technology is simplified, and the technical scheme is as follows: the utility model provides a samming board, includes the plate body, a plurality of through-holes have been arranged side by side in the plate body, be fixed with the heat pipe in the through-hole, the length direction of through-hole is first direction, the plate body is the open end along the both ends of first direction, be fixed with the end cover on the open end, the end cover covers the through-hole belongs to radiator technical field.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a temperature equalizing plate.
Background
The temperature equalizing plate is a heat radiating device which utilizes the phase change principle to rapidly equalize temperature, and heat is rapidly transferred through continuous circulation of evaporation and condensation, so that the heat radiating efficiency is very high. In the prior art, a heat pipe is embedded in an aluminum plate to manufacture a temperature equalizing plate.
For example, CN212350711U discloses a casing of a temperature equalizing plate for installing a buried heat pipe, a mounting notch is provided on a lower end surface of the casing of the temperature equalizing plate, a fixed cover plate is provided outside the mounting notch, a first heat pipe notch is provided on an inner surface of the mounting notch, a second heat pipe notch is provided on one side of the first heat pipe notch, and a third heat pipe notch is provided on one side of the second heat pipe notch;
the heat pipe is embedded into the heat pipe notch in the installation notch, and the heat pipe notch and the installation notch are further processed after the plate body is molded under the structure, so that the processing technology is complex; and under this kind of structure, need the strict control precision, ensure its fixed apron laminating heat pipe, if the solder fills out the mistake, lead to appearing more gaps or gap great between fixed apron and the heat pipe, can influence the radiating effect.
Disclosure of Invention
The utility model mainly aims to provide a temperature equalizing plate, which aims to install a heat pipe by using a through hole, and a plate body and the through hole can be integrally formed, so that the processing technology is simplified.
According to a first aspect of the present utility model, there is provided a temperature equalization plate, including a plate body, in which a plurality of through holes are arranged side by side, a heat pipe is fixed in the through holes, a length direction of the through holes is a first direction, two ends of the plate body along the first direction are open ends, and end covers are fixed on the open ends, and cover the through holes.
In the above-mentioned temperature equalization plate, the cross section of the through hole in the direction perpendicular to the first direction is circular or elliptical.
In the above-mentioned temperature equalization plate, the end cap covers all the through holes on the open end corresponding thereto.
In the above temperature equalizing plate, a groove is formed in the end face of the open end, and the end cover is embedded into the groove.
In the temperature equalizing plate, the depth of the groove is 2.5-5.5 mm; the difference between the depth of the groove and the thickness of the end cap is not more than 1mm.
In the above temperature equalization plate, the groove is in a shape of a long waist hole.
In the above temperature equalizing plate, the plate body and the end cover are fixed together by friction stir welding or argon arc welding or laser welding to form an integral structure.
In the above temperature equalizing plate, the plate body and the end cover are both made of aluminum alloy.
In the above temperature equalizing plate, a plating layer is arranged on the wall of the through hole, and the plating layer is made of weldable metal; the heat pipe is fixed in the through hole by soldering.
In the above-mentioned temperature equalization plate, the plurality of through holes are arranged at intervals along a second direction, and the second direction is perpendicular to the first direction.
One of the above technical solutions of the present utility model has at least one of the following advantages or beneficial effects:
in the utility model, the structure for installing the heat pipe is optimized, the heat pipe is fixed by arranging the through holes on the plate body, the plate body can be produced by adopting an aluminum extrusion process due to the penetration of the through holes, the plate body and the through holes can be formed at one time, even the special-shaped holes such as oval holes can be formed, and the method is simple and convenient;
and the end cover is arranged to cover the through hole, the through hole is not exposed, the solder and the plating layer in the through hole are not exposed, the electrochemical corrosion among the plate body, the heat pipe, the plating layer or the solder is avoided, and the corrosion resistance of the temperature equalization plate is improved.
Drawings
The utility model is further described below with reference to the drawings and examples;
FIG. 1 is a schematic view of a first embodiment of the present utility model;
FIG. 2 is a schematic view of the internal structure of a first embodiment of the present utility model;
fig. 3 is a schematic structural view of a board body according to a first embodiment of the present utility model.
Wherein reference numerals for the respective figures:
1. a plate body; 11. a through hole; 12. a groove; 2. a heat pipe; 3. an end cap.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present utility model and are not to be construed as limiting the present utility model.
The following disclosure provides many different embodiments, or examples, for implementing different aspects of the utility model.
Referring to fig. 1 to 3, in one embodiment of the present utility model, a temperature equalizing plate includes a plate body 1, a plurality of through holes 11 are arranged in the plate body 1 side by side, heat pipes 2 are fixed in the through holes 11, the length direction of the through holes 11 is a first direction, two ends of the plate body 1 along the first direction are open ends, end covers 3 are fixed on the open ends, and the end covers 3 cover the through holes 11; the plate body 1 and the end cover 3 are made of aluminum alloy;
the cross section of the through hole 11 in the direction perpendicular to the first direction is circular or elliptical, when the through hole 11 is elliptical, the through hole 11 can fix the flattened heat pipe 2, so that the overall thickness of the temperature equalizing plate is reduced;
the utility model optimizes the structure for installing the heat pipe 2, the heat pipe 2 is fixed by arranging the through holes 11 on the plate body 1, the plate body 1 can be produced by adopting an aluminum extrusion process because the through holes 11 penetrate, the plate body 1 and the through holes 11 can be formed at one time, even oval special-shaped holes can be formed, and the utility model is simple and convenient.
The walls of the through holes 11 are provided with a plating layer made of a weldable metal, and generally speaking, the plating layer is made of nickel, silver or copper; the heat pipe 2 is fixed in the through hole 11 by soldering; if the end cover 3 is not arranged, the through holes 11 on the end face of the open end are open, the plating layer and the tin material are exposed, and electrochemical corrosion is easy to occur among the plate body 1, the heat pipe 2, the plating layer and the tin material, so that the corrosion resistance of the whole temperature equalizing plate is poor; in this embodiment, the end cover 3 covers the through hole 11, so that the through hole 11 is closed, the plating layer and the tin material are not exposed, and electrochemical corrosion at two ends of the through hole 11 is not generated, thereby improving the corrosion resistance of the temperature equalizing plate.
In this embodiment, the end caps 3 cover all the through holes 11 on the corresponding open ends, that is, only one end cap 3 is needed on one open end, and the outer edge of the end cap 3 is fixedly connected with the plate body 1, so that all the through holes 11 on the open end can be closed.
In other embodiments, multiple end caps 3 may be provided on one open end, and one end cap 3 may cover 1, 2, or 3 through holes 11, thereby closing each through hole 11.
In this embodiment, a groove 12 is provided on the end face of the open end, and the end cap 3 is embedded in the groove 12; the plate body 1 and the end cover 3 are fixed together by using a friction stir welding technology to form an integrated structure, and the plate body 1 and the end cover 3 are fused together without adopting welding flux due to the friction stir welding technology, and the end cover 3 and the plate body 1 are made of the same material, so that the outer surface of the temperature equalization plate is made of aluminum alloy, electrochemical corrosion cannot occur, and the corrosion resistance of the temperature equalization plate is better.
If the end cap 3 and the plate body 1 are welded by argon arc welding or laser welding, the groove 12 does not need to be machined.
In order to facilitate the installation of the end cover 3, the depth of the groove 12 is close to the thickness of the end cover 3, after the end cover 3 is installed, whether the end cover 3 is installed in place or not is easily judged, and the peripheral surface of the end cover 3 can be completely attached to the groove wall of the groove 12;
however, it is necessary to limit the height difference from the end face of the open end to the top face of the end cap 3, ensuring that friction stir welding can be performed and the quality after friction stir welding; in this embodiment, the depth of the groove 12 is 2.5-5.5 mm, and the difference between the depth of the groove 12 and the thickness of the end cover 3 is not more than 1mm, so that a good friction stir welding effect can be obtained.
In this embodiment, the groove 12 is in a shape of a long waist hole, which is convenient in processing the groove 12, and only a knife is needed to be milled on the end face of the open end.
In this embodiment, the plurality of through holes 11 are arranged at intervals along the second direction, the second direction is perpendicular to the first direction, the whole plate body 1 is flat, the heat pipe 2 just has one layer, two planes with larger areas opposite to the plate body 1 are contact surfaces, and the heat pipe 2 can absorb two heat from two heat dissipation surfaces;
in order to ensure heat transfer efficiency, the distance between the heat pipe 2 and the heat radiating surface is not too large, and the distance between the outer wall of the heat pipe 2 and the heat radiating surface is generally about 0.5-5.5 mm.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The utility model provides a samming board, includes the plate body, its characterized in that has arranged a plurality of through-holes side by side in the plate body, be fixed with the heat pipe in the through-hole, the length direction of through-hole is first direction, the both ends of plate body along first direction are open end, be fixed with the end cover on the open end, the end cover covers the through-hole.
2. The isopipe of claim 1 wherein the cross-section of the through-hole perpendicular to the first direction is circular or oval.
3. The isopipe of claim 1 wherein the end caps cover all of the through holes on their corresponding open ends.
4. A temperature equalization plate as set forth in any one of claims 1-3 wherein said open end face is provided with a recess into which said end cap is inserted.
5. The isopipe of claim 4 wherein the depth of the recess is from 2.5 mm to 5.5mm; the difference between the depth of the groove and the thickness of the end cap is not more than 1mm.
6. The isopipe of claim 4 wherein the grooves are in the shape of long waistholes.
7. The temperature equalization plate of claim 1, wherein the plate body and the end cap are fixed together by friction stir welding or argon arc welding or laser welding to form an integral structure.
8. The temperature equalization plate of claim 1, wherein the plate body and the end cap are both aluminum alloy.
9. The temperature equalization plate according to claim 1, wherein a plating layer is arranged on the wall of the through hole, and the plating layer is made of a weldable metal; the heat pipe is fixed in the through hole by soldering.
10. The temperature uniformity plate according to claim 1, wherein a plurality of the through holes are arranged at intervals along a second direction, the second direction being perpendicular to the first direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321087202.5U CN219810319U (en) | 2023-05-07 | 2023-05-07 | Uniform temperature plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321087202.5U CN219810319U (en) | 2023-05-07 | 2023-05-07 | Uniform temperature plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219810319U true CN219810319U (en) | 2023-10-10 |
Family
ID=88212113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321087202.5U Active CN219810319U (en) | 2023-05-07 | 2023-05-07 | Uniform temperature plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219810319U (en) |
-
2023
- 2023-05-07 CN CN202321087202.5U patent/CN219810319U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101566440B (en) | Sintered soaking plate and manufacturing method thereof | |
| CN100383959C (en) | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member | |
| CN219810319U (en) | Uniform temperature plate | |
| CN112648870A (en) | Manufacturing process of lightweight uniform temperature plate and uniform temperature plate | |
| JP2012099744A (en) | Metal plate low resistance chip resistor and method of manufacturing the same | |
| CN202282935U (en) | Water cooled plate | |
| CN101345363A (en) | Terminal structure for preventing tin climbing | |
| CN217363612U (en) | Heat pipe mounting structure of radiator | |
| CN217363614U (en) | Heat radiation unit for radiator | |
| CN101522010B (en) | Heat dissipating device and manufacturing method thereof | |
| CN215818755U (en) | High-strength aluminum alloy substrate structure for manufacturing backlight plate | |
| CN105387439A (en) | Manufacturing method of LED light source module radiator and manufacturing method of LED lighting equipment | |
| CN110267430B (en) | Circuit board for blind groove coating and preparation process thereof | |
| CN210868549U (en) | High heat conduction soaking plate structure and active phased array TR subassembly heat radiation structure | |
| CN210325774U (en) | Liquid cooling radiator | |
| JP5032802B2 (en) | Electrodeposition drum | |
| CN116618958A (en) | Processing technology of temperature equalization plate with built-in heat pipe | |
| CN213991454U (en) | Corrosion-resistant cold plate with additional heat pipe | |
| CN211656502U (en) | High heat dissipating aluminium base board | |
| US20230266076A1 (en) | Two-phase immersion-type heat dissipation structure | |
| CN213586414U (en) | Composite circuit board | |
| US20030201871A1 (en) | Process for producing new metal strip resistors and their structure | |
| CN210711802U (en) | Conductive copper V seat with automatic pressing function | |
| WO2020087389A1 (en) | Radiator, circuit board and computing device | |
| CN216253358U (en) | High-precision small-aperture electronic circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |