CN219793086U

CN219793086U - Semiconductor coating device

Info

Publication number: CN219793086U
Application number: CN202320713059.XU
Authority: CN
Inventors: 唐钰程
Original assignee: Chengdu Weihan Electric Co ltd
Current assignee: Chengdu Weihan Electric Co ltd
Priority date: 2023-04-04
Filing date: 2023-04-04
Publication date: 2023-10-03
Anticipated expiration: 2033-04-04

Abstract

The utility model discloses a semiconductor coating device which comprises a bottom plate, a coating barrel, a clamping mechanism for clamping a semiconductor and enabling the coating of the semiconductor to be more uniform, a coating liquid box and a separating mechanism for separating a working area so that the working area can be coated and the semiconductor can be replaced at the same time. The beneficial effects are that: after the clamping mechanism clamps the semiconductor, the first baffle plate, the partition plate and the second baffle plate divide the film plating barrel into two areas, vapor generated by the film plating liquid box is used for plating one semiconductor, after film plating is finished, the first baffle plate and the second baffle plate are driven to rotate through the rotation of the connecting shaft, the working area is switched, the other semiconductor is placed in the vapor, the cover plate is prevented from leaking outside the vapor when the working area is switched, the cover plate is pulled away from the non-working area, the semiconductor is replaced, the film plating liquid box is enabled to be capable of replacing the semiconductor without waiting for cooling after the film plating of the semiconductor is finished through the partition mechanism, and meanwhile, the next group of semiconductor film plating is carried out.

Description

Semiconductor coating device

Technical Field

The utility model relates to the field of semiconductor production, in particular to a semiconductor film plating device.

Background

Semiconductors refer to materials having conductivity properties at ordinary temperatures between those of conductors and insulators, and are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, and the like, and as diodes, devices fabricated using semiconductors.

The Chinese patent with the prior patent number of CN216473449U discloses a film plating device for semiconductor production, which comprises a shell, an upper cover, a rotating motor and a material receiving tank, wherein the upper side of the shell is provided with the upper cover, the upper side of the upper cover is provided with a handle, one side of the shell is provided with a screw rod, the other side of the screw rod is provided with a rotary rod, the other side of the shell is provided with the rotating motor, the front side of the rotating motor is provided with the material receiving tank, the outer side of the material receiving tank is provided with a hoop frame, the upper side of the material receiving tank is provided with a return pipe, one side of the rotating motor, which is close to the shell, is provided with a rotating shaft, the other end of the rotating shaft is provided with a clamp, one side of the screw rod, which is close to the shell, is provided with an internal threaded rod, the other side of the internal threaded rod is provided with a pressing plate, and a return groove is arranged on the inner wall, which is close to one side of the rotating motor, of the shell;

according to the patent document, the semiconductor is placed on the clamp, the rotating rod is rotated to enable the pressing plate to tightly prop against the semiconductor, the heating pipe is used for heating the crucible to enable the plating solution to be gasified, the rotating motor drives the semiconductor to rotate, so that the plating film is more uniform, but after the plating film of the semiconductor is completed, steam is still generated because the temperature in the crucible is not reduced, the generation of the steam is stopped after the cooling of the crucible is completed, the upper cover can be opened, and the next group of semiconductors can be taken out and replaced.

Disclosure of Invention

The present utility model has been made to solve the above-mentioned problems, and an object of the present utility model is to provide a semiconductor coating device.

The utility model realizes the above purpose through the following technical scheme:

the semiconductor coating device comprises a bottom plate, a coating barrel, clamping mechanisms and a coating solution box, wherein the clamping mechanisms are used for clamping a semiconductor and enabling the coating of the semiconductor to be more uniform, the separating mechanisms are used for separating a working area so that the semiconductor can be coated and replaced at the same time, the upper side of the bottom plate is provided with the coating barrel, the separating mechanisms are arranged in the coating barrel, the clamping mechanisms are arranged on two sides of the separating mechanisms, and the coating solution box is arranged between the bottom plate and the separating mechanisms;

the separation mechanism comprises a connecting shaft, the connecting shaft is arranged on the inner side of the bottom plate, a separation plate is arranged on the outer portion of the connecting shaft, a first baffle is arranged on the lower side of the separation plate, a second baffle is arranged on the upper side of the separation plate, a cover plate is arranged on the upper side of the second baffle, and a second hand wheel is arranged at the power receiving end of the connecting shaft.

Preferably: the clamping mechanism comprises a screw, the screw is installed inside the bottom plate, the screw is arranged on two sides of the partition plate, a transmission shaft is installed on the rear side of the screw and located inside the bottom plate, a motor is installed at the power receiving end of the transmission shaft, a first hand wheel is installed at the power receiving end of the screw, and clamping plates are installed at the power output ends of the screw and the transmission shaft.

Preferably: and a heating plate is arranged on the outer side of the plating solution box.

Preferably: the cover plate is in sliding connection with the coating barrel, and the number of the cover plates is two.

Preferably: the connecting shaft is connected with the partition plate through a bearing, the connecting shaft is connected with the bottom plate and the coating barrel through bearings, and the second baffle plate and the first baffle plate are connected with the connecting shaft through keys.

Preferably: the first baffle plate and the second baffle plate are semicircular, and the first baffle plate and the connecting shaft are both in sliding connection with the coating barrel.

Preferably: the transmission shaft is connected with the coating barrel bearing, the screw is in threaded connection with the coating barrel, and the clamping plate is connected with the screw bearing.

Compared with the prior art, the utility model has the following beneficial effects:

after the clamping mechanism clamps the semiconductor, the first baffle plate, the partition plate and the second baffle plate divide the film plating barrel into two areas, vapor generated by the film plating liquid box is used for plating one semiconductor, after film plating is finished, the first baffle plate and the second baffle plate are driven to rotate through the rotation of the connecting shaft, the working area is switched, the other semiconductor is placed in the vapor, the cover plate is prevented from leaking outside the vapor when the working area is switched, the cover plate is pulled away from the non-working area, the semiconductor is replaced, the film plating liquid box is enabled to be capable of replacing the semiconductor without waiting for cooling after the film plating of the semiconductor is finished through the partition mechanism, and meanwhile, the next group of semiconductor film plating is carried out.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a schematic view of a semiconductor coating device according to the present utility model;

FIG. 2 is a cross-sectional view of a semiconductor coating apparatus according to the present utility model;

FIG. 3 is a cross-sectional view of A-A of a semiconductor coating apparatus according to the present utility model;

FIG. 4 is a schematic view of a separating mechanism of a semiconductor coating device according to the present utility model;

fig. 5 is a schematic structural view of a clamping mechanism of a semiconductor coating device according to the present utility model.

The reference numerals are explained as follows:

1. a bottom plate; 2. a coating barrel; 3. a clamping mechanism; 301. a screw; 302. a transmission shaft; 303. a motor; 304. a clamping plate; 305. a first hand wheel; 4. a partition mechanism; 401. a first baffle; 402. a connecting shaft; 403. a partition plate; 404. a second baffle; 405. the second hand wheel; 406. a cover plate; 5. a plating solution tank; 6. and (5) heating the plate.

Detailed Description

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

The utility model is further described below with reference to the accompanying drawings:

as shown in fig. 1 to 5, a semiconductor coating device comprises a base plate 1, a coating barrel 2, a clamping mechanism 3 for clamping a semiconductor and enabling the coating of the semiconductor to be more uniform, a coating solution box 5, and a separation mechanism 4 for separating a working area so that the semiconductor can be coated and replaced at the same time, wherein the coating barrel 2 is arranged on the upper side of the base plate 1, the separation mechanism 4 is arranged in the coating barrel 2, the clamping mechanisms 3 are arranged on two sides of the separation mechanism 4, and the coating solution box 5 is arranged between the base plate 1 and the separation mechanism 4.

In this embodiment: the separation mechanism 4 comprises a connecting shaft 402, the connecting shaft 402 is arranged on the inner side of the bottom plate 1, a separation plate 403 is arranged outside the connecting shaft 402, a first baffle 401 is arranged on the lower side of the separation plate 403, a second baffle 404 is arranged on the upper side of the separation plate 403, a cover plate 406 is arranged on the upper side of the second baffle 404, and a second hand wheel 405 is arranged at the power receiving end of the connecting shaft 402; the cover plate 406 is slidably connected with the coating barrel 2, the number of the cover plates 406 is two, the connecting shaft 402 is in bearing connection with the partition plate 403, the connecting shaft 402 is connected with the bottom plate 1 and the coating barrel 2 through bearings, the second baffle 404 and the first baffle 401 are in key connection with the connecting shaft 402, the first baffle 401 and the second baffle 404 are semicircular, and the first baffle 401 and the connecting shaft 402 are in sliding connection with the coating barrel 2; the second baffle 404, the partition plate 403 and the first baffle 401 divide the inside of the film plating barrel 2 into two areas, the semiconductors are clamped on the two groups of clamping mechanisms 3, one of the semiconductors is plated through the plating solution box 5, after film plating is finished, the second hand wheel 405 is rotated, the connecting shaft 402 drives the second baffle 404 and the first baffle 401 to rotate, the working area is converted, the other semiconductor is placed in steam for film plating, the cover plate 406 prevents the steam from leaking out when the second baffle 404 and the first baffle 401 rotate, the cover plate 406 positioned on the upper side of the semiconductor with film plating is opened for semiconductor replacement, the cover plate 406 is reset, the former group of semiconductors are waited for to be plated, the working area is switched, the two groups of semiconductors are respectively in working and non-working states through the partition mechanism 4, the plating solution box 5 is used for semiconductor replacement when the plating is not cooled, and film plating work is continuously carried out.

In this embodiment: the clamping mechanism 3 comprises a screw 301, the screw 301 is arranged in the bottom plate 1, screws 301 are arranged on two sides of the partition plate 403, a transmission shaft 302 is arranged on the rear side of the screw 301 and is positioned in the bottom plate 1, a motor 303 is arranged at the power receiving end of the transmission shaft 302, a first hand wheel 305 is arranged at the power receiving end of the screw 301, and clamping plates 304 are arranged at the power output ends of the screw 301 and the transmission shaft 302; the transmission shaft 302 is connected with a bearing of the coating barrel 2, the screw 301 is in threaded connection with the coating barrel 2, and the clamping plate 304 is connected with the bearing of the screw 301; the semiconductor is placed between the clamping plates 304, the first hand wheel 305 is rotated to enable the screw 301 to move, the clamping plates 304 clamp the semiconductor, the motor 303 is started, and the semiconductor is rotated by being connected with the clamping plates 304 through the transmission shaft 302, so that the coating is more uniform.

In this embodiment: a heating plate 6 is arranged outside the plating solution tank 5; the heating plate 6 heats the plating solution tank 5 to make the plating solution tank 5 generate vapor for plating.

Working principle: the second baffle 404, the partition plate 403 and the first baffle 401 divide the film plating barrel 2 into two areas, the cover plate 406 is pulled open, the semiconductor is placed between the clamping plates 304, the first hand wheel 305 is rotated to enable the screw 301 to move so as to clamp the semiconductor, the connecting shaft 402 is rotated to drive the second baffle 404 and the first baffle 401 to rotate, the second group of clamping mechanisms 3 clamp the semiconductor, the cover plate 406 is inserted back into the original position, the heating plate 6 heats the plating solution box 5, the plating solution box 5 generates vapor, the semiconductor clamped by one of the clamping mechanisms 3 is plated, the motor 303 is started, the clamping plates 304 are rotated through the transmission shaft 302, so that the vapor film is more uniform, after the film plating is finished, the second hand wheel 405 is rotated, the connecting shaft 402 drives the second baffle 404 and the first baffle 401 to rotate, the working area is switched, the other group of semiconductor is placed in the vapor generated by the plating solution box 5, the cover plate 406 prevents the vapor from leaking out when the working area is switched, the cover plate 406 on the side after the film plating is finished, the semiconductor is taken out and replaced, the semiconductor is reset, the cover plate 406 is reset, and the work area 4 is separated from the two semiconductor clamping mechanisms 3 when the two work areas are separated, and the semiconductor needs to be replaced, and the semiconductor can be continuously replaced when the work area is not required to be replaced.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims

1. The utility model provides a semiconductor coating device, includes bottom plate (1), coating barrel (2), is used for centre gripping semiconductor and makes its coating film more even fixture (3), plating solution case (5), its characterized in that: the device also comprises a separation mechanism (4) for separating the working area so that the working area can be coated and replaced with a semiconductor at the same time, wherein the upper side of the bottom plate (1) is provided with the coating barrel (2), the separation mechanism (4) is arranged in the coating barrel (2), the clamping mechanisms (3) are arranged on two sides of the separation mechanism (4), and the plating solution tank (5) is arranged between the bottom plate (1) and the separation mechanism (4);

the separation mechanism (4) comprises a connecting shaft (402), the connecting shaft (402) is installed on the inner side of the bottom plate (1), a separation plate (403) is arranged on the outer side of the connecting shaft (402), a first baffle (401) is installed on the lower side of the separation plate (403), a second baffle (404) is installed on the upper side of the separation plate (403), a cover plate (406) is arranged on the upper side of the second baffle (404), and a second hand wheel (405) is installed at the power receiving end of the connecting shaft (402).

2. The semiconductor coating device according to claim 1, wherein: the clamping mechanism (3) comprises a screw rod (301), the screw rod (301) is installed inside the bottom plate (1), the screw rods (301) are all arranged on two sides of the partition plate (403), a transmission shaft (302) is installed on the rear side of the screw rod (301), the screw rod is located inside the bottom plate (1), a motor (303) is installed at a power receiving end of the transmission shaft (302), a first hand wheel (305) is installed at the power receiving end of the screw rod (301), and clamping plates (304) are installed at the power output ends of the screw rod (301) and the transmission shaft (302).

3. The semiconductor coating device according to claim 1, wherein: a heating plate (6) is arranged on the outer side of the plating solution box (5).

4. The semiconductor coating device according to claim 1, wherein: the cover plates (406) are in sliding connection with the coating barrel (2), and the number of the cover plates (406) is two.

5. The semiconductor coating device according to claim 1, wherein: the connecting shaft (402) is in bearing connection with the partition plate (403), the connecting shaft (402) is in bearing connection with the bottom plate (1) and the coating barrel (2), and the second baffle (404) and the first baffle (401) are in key connection with the connecting shaft (402).

6. The semiconductor coating device according to claim 1, wherein: the first baffle plate (401) and the second baffle plate (404) are semicircular, and the first baffle plate (401) and the connecting shaft (402) are both in sliding connection with the coating barrel (2).

7. The semiconductor coating device according to claim 2, wherein: the transmission shaft (302) is connected with the bearing of the coating barrel (2), the screw rod (301) is in threaded connection with the coating barrel (2), and the clamping plate (304) is connected with the bearing of the screw rod (301).