CN215039700U

CN215039700U - Reaction device for producing titanium-doped ternary MOF material

Info

Publication number: CN215039700U
Application number: CN202121562529.4U
Authority: CN
Inventors: 栾奕; 刑莹莹
Original assignee: Suzhou Anshibo Environmental Protection Technology Co ltd
Current assignee: Suzhou Anshibo Environmental Protection Technology Co ltd
Priority date: 2021-07-10
Filing date: 2021-07-10
Publication date: 2021-12-07
Anticipated expiration: 2031-07-10

Abstract

The utility model discloses a reaction device for producing titanium-doped ternary MOF materials, which comprises a base, a heat dissipation component and a fixing component, wherein the heat dissipation component is arranged at the top of the base and specifically comprises a heat absorption box, a water inlet, a water outlet, a semiconductor refrigeration sheet, a fan A, a fan B, a heat dissipation curtain, an exhaust fan, an air outlet, a refrigeration box and a fan C, the top of the base is provided with the refrigeration box and the heat absorption box, the semiconductor refrigeration sheet is arranged in the refrigeration box, cold air is blown to the surface of a die arranged in a clamping groove through the fan B, the exhaust fan is arranged in the heat absorption box to blow hot air to the heat dissipation curtain for cooling and then discharging so as to improve the use of better heat dissipation and cooling for the die arranged in the clamping groove, screw rods spliced at two sides in the clamping groove are connected with two groups of clamping plates through bearings, the two groups of clamping plates are driven to slide relatively under the action of the bearings through the rotation of the screw rods, thereby clamping, fixing, installing and using the die arranged in the clamping groove.

Description

Reaction device for producing titanium-doped ternary MOF material

Technical Field

The utility model relates to a MOF material production facility technical field, in particular to reaction unit is used in production of titanium doping type ternary MOF material.

Background

Metal-organic framework Materials (MOFs) are coordination polymers which develop rapidly in the last decade, have three-dimensional pore structures, generally take metal ions as connecting points, and organic ligands support and form space 3D extension, are another important novel porous material besides zeolite and carbon nanotubes, and are widely applied to catalysis, energy storage and separation. Currently, MOFs have become an important research direction for many chemical branches such as inorganic chemistry and organic chemistry, and metal-organic framework materials refer to crystalline porous materials with periodic network structures formed by self-assembly of transition metal ions and organic ligands. The composite material has the advantages of high porosity, low density, large specific surface area, regular pore channels, adjustable pore diameter, diversity and tailorability of topological structures and the like, and mainly comprises two important components: nodes and bridges, i.e., MOFs, are framework structures composed of organic ligands (bridges) and metal ion nodes with different numbers of connections, and from 12 to 18 in 2020, british scientists have determined a special material, Metal Organic Framework (MOF), which can store solar energy for months to years, according to the knowledge of the journal of materials chemistry.

The reaction device for producing the titanium-doped ternary MOF material on the market has the following defects: reaction unit is used in production of common titanium doping type ternary MOF material is generally when making the material, pours the raw materials into the mould in the back, only uses the exhaust fan to blow the cooling to the mould, and the cooling effect is relatively poor, and efficiency is lower to mould fixed mounting is in the base, can't change the mould when needs use different moulds, and it is inconvenient to use.

SUMMERY OF THE UTILITY MODEL

The main object of the utility model is to provide a titanium doping type ternary MOF material reaction unit for production can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a reaction device for producing titanium-doped ternary MOF materials comprises a base, a heat dissipation component and a fixing component, wherein the heat dissipation component is installed at the top of the base and specifically comprises a heat absorption box, a water inlet, a water outlet, semiconductor refrigeration sheets, a fan A, a fan B, a heat dissipation curtain, an exhaust fan, an air outlet, a refrigeration box and a fan C, the heat absorption box is installed on the left side of the top of the base, the fan B is installed on the left side in the heat absorption box, the water inlet is formed in the top of the heat absorption box, the bottom of the water inlet is connected with the top end of the heat dissipation curtain, the water outlet is formed in the bottom end of the heat dissipation curtain, the exhaust fan is installed on the right side of the heat absorption box, the refrigeration box is installed on the right side of the top of the base, the air outlet is formed in the left side of the refrigeration box, the semiconductor refrigeration sheets are installed on the top of the refrigeration box, and the fan A is installed on the right side in the refrigeration box, the fan C is installed on refrigeration case top right side, fixed subassembly specifically comprises splint, draw-in groove, screw rod, bearing and bottom plate.

Further, a clamping groove is formed in the base, screw rods are inserted into two sides of the clamping groove, the bottom ends of the screw rods are provided with clamping plates through bearings, a bottom plate is arranged at the bottom of the clamping groove, the screw rods inserted into two sides of the clamping groove are connected with two sets of clamping plates through the bearings, the two sets of clamping plates are driven to slide relative to each other under the action of the bearings through rotation of the screw rods, and therefore the die installed in the clamping groove is clamped and fixedly installed for use, and the die is convenient to install and disassemble.

Further, the basin has been seted up to the base bottom, the water inlet has been seted up at the basin top, the delivery port has been seted up on basin bottom right side, the basin that the base bottom was seted up to seted up water inlet and delivery port, can be convenient for add the comdenstion water in to the basin through the water inlet, and the comdenstion water that sets up in the basin can provide the radiating effect of cooling to the mould of installation in the draw-in groove, and the delivery port of seting up can be convenient for discharge the comdenstion water that adds in the basin and recycle.

Furthermore, dust-proof plates are arranged on the outer sides of the fan A and the fan C, and dust can be prevented from entering the fan A and the fan C when the fan A and the fan C are used for a long time.

Compared with the prior art, the utility model discloses following beneficial effect has: set up refrigeration case and heat absorption case at the base top, install semiconductor refrigeration piece and pass through fan B in the refrigeration case, blow the mould surface of installation in the draw-in groove with cold air, thereby use the heat dissipation of cooling down in to the mould, and install the air exhauster at the heat absorption incasement, and install the heat dissipation curtain at the heat absorption incasement, blow hot-blast through installation fan A and discharge after cooling to heat dissipation curtain department, use in order to improve the mould of installing in the draw-in groove and provide better heat dissipation cooling, improve cooling efficiency, the screw rod of both sides grafting in the draw-in groove connects two sets of splint through the bearing, rotate through the screw rod and drive two sets of splint relative sliding under the effect of bearing, thereby press from both sides tight fixed mounting and use to the mould of installing in the draw-in groove, so that the installation and the dismantlement of mould are used.

Drawings

FIG. 1 is a schematic view of the overall three-dimensional structure of a reaction device for producing a titanium-doped ternary MOF material.

Fig. 2 is a schematic plane structure diagram of the heat absorption box of the reaction device for producing the titanium-doped ternary MOF material of the present invention.

Fig. 3 is a schematic plan structure view of the reaction device refrigerating box for producing titanium-doped ternary MOF material of the present invention.

Fig. 4 is a schematic plane structure diagram of a neck of a reaction device for producing titanium-doped ternary MOF material.

In the figure: 1. a base; 2. a water inlet; 3. a water outlet; 4. a heat dissipating component; 401. a heat absorption box; 402. a water inlet; 403. a water outlet; 404. a semiconductor refrigeration sheet; 405. a fan A; 406. a fan B; 407. a heat-dissipating curtain; 408. an exhaust fan; 409. an air outlet; 410. a refrigeration case; 411. a fan C; 5. a fixing assembly; 501. a splint; 502. a card slot; 503. a screw; 504. a bearing; 505. a base plate; 6. a dust-proof plate; 7. a water tank.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-4, a reaction device for producing titanium-doped ternary MOF material comprises a base 1, a heat dissipation assembly 4 and a fixing assembly 5, wherein the heat dissipation assembly 4 is installed on the top of the base 1, the heat dissipation assembly 4 specifically comprises a heat absorption box 401, a water inlet 402, a water outlet 403, a semiconductor refrigeration sheet 404, a fan a405, a fan B406, a heat dissipation curtain 407, an exhaust fan 408, an air outlet 409, a refrigeration box 410 and a fan C411, the heat absorption box 401 is installed on the left side of the top of the base 1, the fan B406 is installed on the left side in the heat absorption box 401, the top of the heat absorption box 401 is provided with a water inlet 402, the bottom end of the water inlet 402 is connected with the top end of the heat dissipation curtain 407, the water outlet 403 is opened at the bottom end of the heat dissipation curtain 407, the exhaust fan 408 is installed on the right side of the top of the heat absorption box 401, the refrigeration box 410 is installed on the right side of the top of the base 1, the left side of the refrigeration box 410 is provided with the water inlet 409, semiconductor refrigeration piece 404 is installed at refrigeration case 410 top, fan A405 is installed on the right side in the refrigeration case 410, fan C411 is installed on refrigeration case 410 top right side, fixed subassembly 5 specifically comprises splint 501, draw-in groove 502, screw 503, bearing 504 and bottom plate 505.

The clamping groove 502 is formed in the base 1, the screw rods 503 are inserted into two sides of the clamping groove 502 in an inserted mode, the bottom ends of the screw rods 503 are provided with the clamping plates 501 through the bearings 504, the bottom plate 505 is installed at the bottom of the clamping groove 502, the screw rods 503 inserted into two sides of the clamping groove 502 are connected with the two sets of clamping plates 501 through the bearings 504, the two sets of clamping plates 501 are driven to slide relatively under the action of the bearings 504 through rotation of the screw rods 503, and therefore a mold installed in the clamping groove 502 is clamped, fixedly installed and used, and the mold is convenient to install and disassemble.

Wherein, basin 7 has been seted up to base 1 bottom, water inlet 2 has been seted up at basin 7 top, delivery port 3 has been seted up on basin 7 bottom right side, basin 7 that base 1 bottom was seted up to seted up water inlet 2 and delivery port 3, can be convenient for add the comdenstion water in basin 7 through water inlet 2, and the comdenstion water that sets up in the basin 7 can provide the radiating effect of cooling to the mould of installation in the draw-in groove 502, and the delivery port 3 of seting up can be convenient for discharge the recycling with the comdenstion water that adds in the basin 7.

The dust-proof plate 6 is mounted on the outer sides of the fan a405 and the fan C411, and the dust-proof plate 6 mounted on the outer sides of the fan a405 and the fan C411 can prevent dust from entering the fan a405 and the fan C411 when the fan a405 and the fan C411 are used for a long time.

It should be noted that, the utility model relates to a titanium doping type ternary MOF material production reaction unit, in operation, when a mold is needed to be used for injection molding, the mold to be used is only needed to be installed in the clamping groove 502, the screw 503 is rotated clockwise, under the action of the bearing 504, the two groups of clamping plates 501 are driven to slide relatively, thereby the two sides of the mold are clamped and fixed, thereby the injection molding treatment is carried out after the mold is fixed, after the injection molding of the mold is completed, because the temperature of the high-temperature metal liquid in the mold is higher, at this time, the external power supply is switched on, the fan A405, the fan B406, the fan C411 and the exhaust fan 408 are started, the exhaust fan 408 sucks the high-temperature hot gas on the surface of the mold into the mold, and the hot air is extracted outwards through the fan B406, the hot air is exhausted from the fan B406 after penetrating through the heat dissipation curtain 407, condensed water is added from the water inlet 402 in the heat dissipation curtain 407, the condensed water circulates in the heat dissipation curtain 407, thereby, the sucked hot gas is cooled and radiated by the condensed water and then discharged, and the semiconductor refrigerating sheet 404 is arranged in the refrigerating box 410 arranged at the right side of the top of the base 1 for refrigeration, the semiconductor refrigerating sheet 404 utilizes the Peltier effect of the semiconductor material, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, the two ends of the galvanic couple can respectively absorb heat and emit heat, thereby realizing the purpose of refrigeration, the semiconductor refrigerating sheet 404 is a heat transfer tool, when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, the heat can be transferred from one end to the other end, thereby generating temperature difference to form a cold and hot end, the heat between the two polar plates can also carry out reverse heat transfer through the air and the semiconductor material, when the cold and hot ends reach certain temperature difference, when the two heat transfer quantities are equal, a balance point is reached, the forward and reverse heat transfer is mutually offset, the temperature at the cold and hot ends cannot be continuously changed, the refrigerating effect is achieved, the refrigerating box 410 is cooled, the fan C411 is installed on the outer side of the top of the semiconductor refrigerating sheet 404 to rotate, the heat dissipation end of the semiconductor refrigerating sheet 404 is cooled to ensure that the temperature in the refrigerating box 410 reaches lower temperature, the low-temperature air in the refrigerating box 410 is blown to the surface of the mold installed in the clamping groove 502 from the air outlet 409 through the fan A405, the mold after injection molding is cooled, the cold air is blown to the surface of the mold, the hot air on the surface of the mold is sucked through the heat absorption box 401 to better perform heat dissipation treatment on the mold, the heat dissipation efficiency of the mold is improved, the use is more convenient, and after the mold is cooled, anticlockwise rotation screw rod 503 slides two sets of splint 501 to both sides under the effect of bearing 504 to loosen the clamp power of splint 501 to the mould, alright directly take out the mould this moment alright, it is more convenient to use, is convenient for change the use to the mould.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A reaction device for producing a titanium-doped ternary MOF material comprises a base (1) and is characterized by further comprising a heat dissipation assembly (4) and a fixing assembly (5), wherein the heat dissipation assembly (4) is installed at the top of the base (1), the heat dissipation assembly (4) specifically comprises a heat absorption box (401), a water inlet (402), a water outlet (403), a semiconductor refrigerating sheet (404), a fan A (405), a fan B (406), a heat dissipation curtain (407), an exhaust fan (408), an air outlet (409), a refrigerating box (410) and a fan C (411), the heat absorption box (401) is installed on the left side of the top of the base (1), the fan B (406) is installed on the left side in the heat absorption box (401), the water inlet (402) is formed in the top of the heat absorption box (401), the top end of the water inlet (402) is connected with the top end of the heat dissipation curtain (407), the water outlet (403) is formed in the bottom end of the heat dissipation curtain (407), air exhauster (408) are installed on heat absorption case (401) right side, refrigeration case (410) are installed on base (1) top right side, air exit (409) have been seted up in refrigeration case (410) left side, semiconductor refrigeration piece (404) are installed at refrigeration case (410) top, fan A (405) are installed on the right side in refrigeration case (410), fan C (411) are installed on refrigeration case (410) top right side, fixed subassembly (5) specifically comprise splint (501), draw-in groove (502), screw rod (503), bearing (504) and bottom plate (505).

2. The reaction device for producing the titanium-doped ternary MOF material according to claim 1, wherein: a clamping groove (502) is formed in the base (1), screw rods (503) are inserted into two sides of the clamping groove (502) in an inserted mode, a clamping plate (501) is installed at the bottom end of each screw rod (503) through a bearing (504), and a bottom plate (505) is installed at the bottom of the clamping groove (502).

3. The reaction device for producing the titanium-doped ternary MOF material according to claim 1, wherein: the water tank (7) is arranged at the bottom of the base (1), the water inlet (2) is arranged at the top of the water tank (7), and the water outlet (3) is arranged on the right side of the bottom of the water tank (7).

4. The reaction device for producing the titanium-doped ternary MOF material according to claim 1, wherein: dust shields (6) are mounted on the outer sides of the fan A (405) and the fan C (411).