CN219716060U - Heat dissipation liquid cooling module and memory - Google Patents

Abstract

The utility model relates to a heat dissipation liquid cooling module and a memory. The heat dissipation liquid cooling module comprises a clamp and a liquid cooling heat dissipation plate, wherein the clamp comprises a first clamping plate, a second clamping plate and a driving piece, the liquid cooling heat dissipation plate is connected with a circulating cooling mechanism, at least two liquid cooling heat dissipation plates are arranged and fixedly connected with the first clamping plate and the second clamping plate respectively, and the driving piece drives the first clamping plate and the second clamping plate to drive the two liquid cooling heat dissipation plates to be close to or far away from each other. The liquid cooling heat dissipation plate is clamped on two sides of the heating piece through the clamp, so that the effect of convenience in installation is achieved; when dismantling, reach and dismantle convenient effect, solve waistcoat installation and dismantle inconvenient problem among the conventional art, simultaneously, liquid cooling heat dissipation compares the forced air cooling heat dissipation and has better heat exchange efficiency, has better radiating effect for this heat dissipation liquid cooling module is fit for high-energy high-power memory, simple structure, and the radiating effect is good, ensures the performance of memory.

Description

Heat dissipation liquid cooling module and memory

Technical Field

The utility model relates to the technical field of heat dissipation modules, in particular to a heat dissipation liquid cooling module and a memory.

Background

With the development of internet computer technology, the computer server field occupies a significant position, and the memory is an important component of the computer, namely, an internal memory and a main memory, and is used for temporarily storing operation data in the CPU and data exchanged with an external memory such as a hard disk. The memory is a bridge for communicating the external memory with the CPU, and all programs in the computer are run in the memory, so that the strength of the memory performance affects the level of the whole exertion of the computer.

The existing memory can generate heat in the use process, and when the heat generation amount is high, the running frequency of the memory can be reduced, so that the use performance of the memory can be directly affected.

Disclosure of Invention

Based on the above, a heat dissipation liquid cooling module and a memory are provided to alleviate the problem that the heat of a hard disk affects the service performance of the memory.

An embodiment of a first aspect of the present utility model provides a heat dissipation liquid cooling module, including:

a clamp including a first clamp plate, a second clamp plate, and a driving member;

the liquid cooling heating panel, the liquid cooling heating panel is connected with circulation cooling mechanism, the liquid cooling heating panel is provided with two at least, and respectively with first splint with second splint fixed connection, the driving piece drive first splint with the second splint drives two the liquid cooling heating panel is close to or keeps away from.

According to the heat radiation liquid cooling module provided by the embodiment of the utility model, the liquid cooling heat radiation plates are clamped at the two sides of the heating element through the clamp, when the heating element is a memory, the driving element drives the liquid cooling heat radiation plates which are respectively arranged at the two sides of the memory to be mutually close, namely, the liquid cooling heat radiation plates are clamped at the two sides of the memory, and the liquid cooling heat radiation plates perform liquid cooling heat radiation for the memory, so that the effect of convenience in installation is achieved; when dismantling, the driving piece drive is separated the liquid cooling heating panel of memory both sides of putting each other, the outer wall separation of liquid cooling heating panel and memory, about to the radiator liquid cooling module dismantles from the memory, reach and dismantle convenient effect, solve waistcoat installation and dismantle inconvenient problem among the conventional art, simultaneously, liquid cooling heat dissipation compares forced air cooling heat dissipation and has better heat exchange efficiency, has better radiating effect for this radiator liquid cooling module is fit for high-energy high-power memory, simple structure, the radiating effect is good, ensure the performance of memory.

In one embodiment, two sides of the liquid cooling heat dissipation plates, which are close to each other, are respectively provided with a heat conduction pad. Because the side that the liquid cooling heating panel is close to each other is used for with the piece butt that generates heat, when using, the heat conduction pad sets up between liquid cooling heating panel and the piece that generates heat, increases the heat conduction effect of memory and liquid cooling heating panel.

In one embodiment, the heat conducting pad is fixedly connected with the liquid cooling plate. Therefore, the heat conduction pad is fixed on the liquid cooling heat dissipation plate, so that the heat conduction pad is more convenient and more integrated when in use, the assembly time of the heat dissipation liquid cooling module is saved, the installation efficiency of the heat dissipation liquid cooling module is further improved,

in one embodiment, the thermal pad is configured as a flexible member. The heat conducting pad configured as the flexible piece has certain elasticity, firstly, can play a role in damping and preventing impact on the memory, and ensures the safe use of the memory; secondly, the flexible piece enables the clamping force of the clamp to act on the memory more uniformly, so that damage to the memory caused by too tight clamping force is avoided; thirdly, the flexible piece can be better filled and attached in the gap between the internal memory and the liquid cooling heat dissipation plate, so that the effective contact area is increased, and the heat exchange efficiency of the liquid cooling heat dissipation module is further improved.

In one embodiment, a liquid cooling flow channel is arranged in the liquid cooling heat dissipation plate, and the circulating cooling mechanism comprises a liquid inlet pipe and a liquid outlet pipe which are respectively communicated with the liquid cooling flow channel. The refrigerant enters the liquid cooling flow channel from the liquid inlet pipe, exchanges heat with the internal memory through the liquid cooling heat dissipation plate, then flows out of the liquid cooling flow channel through the liquid outlet pipe to complete one-time circulation, and thus, the cooling effect of liquid cooling liquid in the liquid cooling heat dissipation plate is ensured.

In one embodiment, the liquid cooling flow channel is configured as a microchannel or S-shaped conduit. The micro-channel is also called a micro-channel heat exchanger, namely the equivalent diameter of the channel is between 10 and 1000 mu m, so that the liquid cooling heat dissipation plate has the effects of compact structure, light weight, high efficiency and energy conservation; the S-shaped pipeline is spirally wound in the liquid cooling heat dissipation plate, so that the effective length of the liquid cooling flow channel in the liquid cooling heat dissipation plate can be increased, and an effective heat exchange path is increased; the liquid cooling runner is configured into a micro-channel or an S-shaped pipeline, so that the liquid cooling effect of the liquid cooling plate can be improved.

In one embodiment, the heat dissipation liquid cooling module further comprises a water main and a plurality of water diversion pipes, the water diversion pipes are respectively communicated with the water main, and the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the water diversion pipes. In the in-service use scene, if there are a plurality of memories in the server, the liquid cooling heating panel of a plurality of memories can share a water header, through the reposition of redundant personnel effect of distributive pipe, with every liquid cooling heating panel and every distributive pipe intercommunication to time and the indirect intercommunication of water header only need concentrate the cooling to the refrigerant in the water header can, when above-mentioned structural design made there be a plurality of memories in the server, the structure is compacter and can the energy saving.

In one embodiment, the clamp is configured as a spring clamp, the driving member is configured as a torsion spring, a rotating rod is arranged in the torsion spring, the first clamping plate and the second clamping plate are respectively connected with the rotating rod in a rotating mode, one end of the torsion spring is connected with the first clamping plate, and the other end of the torsion spring is connected with the second clamping plate. Therefore, the clamp configured as the spring clamp can have very stable clamping effect, and the torsion spring drives the first clamping plate and the second clamping plate to respectively drive the two liquid cooling heat dissipation plates to be close to each other, so that the rapid installation of the heat dissipation liquid cooling heat dissipation module is realized; through pressing the spring clamp, the elastic force of torsion spring is resisted for first splint and second splint separation, thereby realize the quick dismantlement of radiator liquid cooling module.

In one embodiment, the clamp is arranged at the center of the top of the two liquid cooling heat dissipation plates. Through above-mentioned setting for the driving force of driving piece to the liquid cooling heating panel of anchor clamps is more even, makes the structure more stable when using.

An embodiment of a second aspect of the present utility model provides a memory, including a memory body and the heat dissipation liquid cooling module described in the foregoing embodiment, where the driving member drives two liquid cooling heat dissipation plates to clamp two sides of the memory body.

The memory in the above-mentioned embodiment, installation heat dissipation liquid cooling module, the liquid cooling heating panel of driving piece drive division memory both sides is close to each other, be about to the liquid cooling heating panel clamp in the memory both sides, the liquid cooling heating panel carries out liquid cooling heat dissipation for the memory, reach the effect of easy to assemble and dismantlement, solve in the conventional art waistcoat installation and dismantle inconvenient problem, simultaneously, liquid cooling heat dissipation compares the forced air cooling heat dissipation and has better heat exchange efficiency, better radiating effect has, make this heat dissipation liquid cooling module be fit for high-energy high-power memory, and a structure is simple, the radiating effect is good, ensure the performance of memory.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation liquid cooling module according to an embodiment of the utility model.

Fig. 2 is a partial view of a heat sink cooling module according to an embodiment of the utility model.

Fig. 3 is a side view of a heat dissipation liquid cooling module according to an embodiment of the utility model.

Fig. 4 is a cross-sectional view of a liquid-cooled panel in a liquid-cooled module according to an embodiment of the utility model.

Fig. 5 is a schematic structural diagram of a water header and a water diversion pipe in a heat dissipation liquid cooling module according to an embodiment of the utility model.

Reference numerals:

1. a heat dissipation liquid cooling module; 11. a clamp; 111. a first clamping plate; 112. a second clamping plate; 113. a driving member; 1131. a torsion spring; 1132. a rotating lever; 12. liquid cooling heat dissipation plate; 121. a liquid cooling runner; 13. a circulation cooling mechanism; 131. a liquid inlet pipe; 132. a liquid outlet pipe; 14. a thermal pad; 15. a water main; 151. a water diversion pipe;

2. and (3) a memory.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that, if any, these terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship indicated by the drawings, for convenience of description and simplicity of description only, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

With the development of internet computer technology, the computer server field is currently in the dominant position, and the memory is an important component of the computer, namely, an internal memory and a main memory, and is used for temporarily storing operation data in a CPU and data exchanged with an external memory such as a hard disk. The memory is a bridge for communicating the external memory with the CPU, and all programs in the computer are run in the memory, so that the strength of the memory performance affects the level of the whole exertion of the computer.

The existing memory can generate heat in the use process, and when the heat generation amount is high, the running frequency of the memory can be reduced, so that the use performance of the memory can be directly affected.

The inventor notices that the memory module is a heat dissipation bottleneck in the server due to the limitations of large power consumption, low allowable highest temperature, compact structure, difficulty in designing a large-sized heat sink for heat dissipation, and the like. Currently, the memory is updated from DDR4 to DDR5, and for DDR5 memory, the biggest characteristic is naturally that the frequency is higher, so that higher transmission speed and bandwidth are brought. In addition, the DDR5 memory also supports ECC and other functions, so that an automatic error correction function is realized, however, DDR5 has a serious problem that heat is excessively generated. One of the important reasons is that the voltage regulation module is inherited in the DDR5 memory module, and the original function should be placed on the motherboard, that is, the voltage regulation module will emit a large amount of heat during operation, so as to raise the temperature of the DDR5 memory. Common memory heat dissipation module mainly adds the heat dissipation waistcoat by forced air cooling heat dissipation in memory both sides, and traditional forced air cooling is difficult to satisfy DDR5 memory radiating demand, and installs and dismantle very inconvenient.

In order to alleviate the problem that the heat of the hard disk affects the service performance of the memory, the inventor researches and discovers that the liquid cooling is used as a high-efficiency heat dissipation mode, so that the problem of heat dissipation of the memory can be well solved. The clamp and the liquid cooling heat dissipation plate can be provided for the memory in design. Specifically, through the clamping-force of anchor clamps with liquid cooling heating panel centre gripping in the memory both sides, realize the liquid cooling heat dissipation to the memory promptly, reach and dismantle convenient effect, solve waistcoat installation and dismantle inconvenient problem among the conventional art, have better heat exchange efficiency simultaneously.

Referring to fig. 1, fig. 1 is a schematic diagram illustrating a heat dissipation liquid cooling module 1 according to an embodiment of the utility model. The embodiment of the first aspect of the present utility model provides a heat dissipation liquid cooling module 1, which comprises a fixture 11 and a liquid cooling plate 12, wherein the fixture 11 comprises a first clamping plate 111, a second clamping plate 112 and a driving member 113, the liquid cooling plate 12 is connected with a circulation cooling mechanism 13, the liquid cooling plate 12 is provided with at least two liquid cooling plates, and is respectively and fixedly connected with the first clamping plate 111 and the second clamping plate 112, and the driving member 113 drives the first clamping plate 111 and the second clamping plate 112 to drive the two liquid cooling plates 12 to approach or separate.

According to the heat dissipation liquid cooling module 1 of the embodiment of the utility model, the liquid cooling heat dissipation plates 12 are clamped at two sides of the heating element through the clamp 11, when the heating element is the memory 2, the driving element 113 drives the liquid cooling heat dissipation plates 12 which are respectively arranged at two sides of the memory 2 to be close to each other, namely, the liquid cooling heat dissipation plates 12 are clamped at two sides of the memory 2, and the liquid cooling heat dissipation plates 12 perform liquid cooling heat dissipation for the memory 2, so that the effect of convenient installation is achieved; when dismantling, driving piece 113 drive divides the liquid cooling heating panel 12 mutual separation of memory 2 both sides, liquid cooling heating panel 12 and memory 2's outer wall separation, will heat dissipation liquid cooling module 1 dismantle from memory 2, reach and dismantle convenient effect, solve the waistcoat in the conventional art and install and dismantle inconvenient problem, simultaneously, liquid cooling heat dissipation compares the forced air cooling heat dissipation and has better heat exchange efficiency, have better radiating effect, make this heat dissipation liquid cooling module 1 be fit for high-energy high-power memory 2, and a structure is simple, and the radiating effect is good, ensures memory 2's performance.

Referring to fig. 1 and 2, fig. 2 is a partial view of a heat sink cooling module 1 according to an embodiment of the utility model. In some embodiments, the clamp 11 is configured as a spring clamp, the driving member 113 is configured as a torsion spring 1131, a rotation rod 1132 is disposed in the torsion spring 1131, the first clamping plate 111 and the second clamping plate 112 are respectively connected with the rotation rod 1132 in a rotation way, one end of the torsion spring 1131 is connected with the first clamping plate 111, and the other end is connected with the second clamping plate 112.

It can be understood that the fixture 11 of the heat dissipation liquid cooling module 1 in the present utility model may be configured in other forms, such as an air cylinder driving the first clamping plate 111 and the second clamping plate 112 to move toward or away from each other, or wherein the first clamping plate 111 is fixed, and an air cylinder driving the second clamping plate 112 to move to achieve the mutual approaching or separating of the first clamping plate 111 and the second clamping plate 112. The clamp 11 only has a clamping function, and can drive the liquid cooling heat dissipation plate 12 to clamp on two sides of the heating element, and details are omitted here. The driving member 113 may also have other elastic structures, and may have a rebound effect, so that the first clamping plate 111 and the second clamping plate 112 have stable clamping forces.

Specifically, in some implementations, the liquid cooling plate 12 and the spring clip are made of aluminum, the spring clip and the liquid cooling plate 12 are connected by welding, and the welded spring clip and the liquid cooling plate 12 are connected by the spring clip. In the actual use scene, if install in the server, just can make memory 2 heat dissipation liquid cooling module 1 press from both sides to memory 2 through holding the spring clamp to accessible spring clamp makes memory 2 heat dissipation liquid cooling module 1 dismantle from memory 2 both sides, convenient operation.

Through the arrangement, the clamp 11 configured as the spring clamp can have very stable clamping effect, the torsion spring 1131 drives the first clamping plate 111 and the second clamping plate 112 to respectively drive the two liquid cooling heat dissipation plates 12 to be close to each other, and the rapid installation of the heat dissipation liquid cooling heat dissipation module is realized; by pressing the spring clip, the first clamping plate 111 and the second clamping plate 112 are separated against the elastic force of the torsion spring 1131, so that the rapid disassembly of the heat dissipation liquid cooling module 1 is realized.

In some embodiments, the clamp 11 is positioned at the top center of two liquid-cooled heat sinks 12. Through the above arrangement, the driving force of the driving member 113 of the clamp 11 to the liquid cooling plate 12 is more uniform, so that the structure is more stable in use.

Referring to fig. 2, in some embodiments, heat conductive pads 14 are disposed on sides of the two liquid cooling plates 12 that are close to each other.

Because the side that the liquid cooling heating panel 12 is close to each other is used for with the piece butt that generates heat, when using, the thermal pad 14 sets up between liquid cooling heating panel 12 and the piece that generates heat, increases the heat conduction effect of memory 2 and liquid cooling heating panel 12.

Referring to fig. 3, fig. 3 shows a side view of a heat dissipation liquid cooling module 1 according to an embodiment of the utility model. In some embodiments, the thermal pad 14 is fixedly coupled to the liquid-cooled heat sink 12.

Specifically, when the heat dissipation module 1 of the memory 2 is assembled, that is, before the spring clip and the liquid cooling plate 12 are connected by the torsion spring 1131, the heat conduction pad 14 can be adhered and fixed on the liquid cooling plate 12, and then connected by the torsion spring 1131, so that the use is more convenient.

Through the arrangement, the heat conducting pad 14 is fixed on the liquid cooling heat dissipation plate 12, so that the heat conducting pad 14 is more convenient and integrated when in use, the assembly time of the heat dissipation liquid cooling module 1 is saved, the installation efficiency of the heat dissipation liquid cooling module 1 is further improved,

in some embodiments, the thermal pad 14 is configured as a flexible member. Specifically, the heat conducting pad 14 configured as a flexible member has a certain elasticity, and first, can play a role in damping and preventing impact on the memory 2, so as to ensure safe use of the memory 2; secondly, the flexible piece enables the clamping force of the clamp 11 to act on the memory 2 more uniformly, so that damage to the memory 2 due to overtightening of the clamping force is avoided; thirdly, the flexible piece can be better filled and attached in the gap between the internal memory 2 and the liquid cooling heat dissipation plate 12, so that the effective contact area is increased, and the heat exchange efficiency of the liquid cooling heat dissipation module is further improved.

Referring to fig. 4, fig. 4 is a cross-sectional view of a liquid cooling plate 12 in a liquid cooling module 1 according to an embodiment of the utility model. In some embodiments, the liquid cooling heat dissipation plate 12 is provided with a liquid cooling flow channel 121, and the circulation cooling mechanism 13 includes a liquid inlet pipe 131 and a liquid outlet pipe 132 respectively communicated with the liquid cooling flow channel 121.

Specifically, the refrigerant enters the liquid cooling channel 121 from the liquid inlet pipe 131, the refrigerant in the liquid cooling channel 121 exchanges heat with the memory 2 through the liquid cooling plate 12, and then flows out of the liquid cooling channel 121 through the liquid outlet pipe 132 to complete one cycle, so that the refrigerant reciprocates, and the cooling effect of the liquid cooling liquid in the liquid cooling plate 12 is ensured. If the memory 2 has a socket in the server, the memory 2 is inserted on the motherboard, and the liquid inlet pipe 131 and the liquid outlet pipe 132 should avoid the position of the socket when designed, so as to avoid the position interference with the socket.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a water header 15 and a water diversion pipe 151 in the liquid cooling module 1 according to an embodiment of the utility model. In some embodiments, the liquid-cooled flow channels 121 are configured as microchannels or S-shaped channels.

Specifically, the liquid cooling heat dissipation plate 12 is provided with a micro-channel or an S-shaped pipeline, so that the heat exchange efficiency between the particles in the memory 2 and the refrigerant can be increased, and the heat response rate is high and the controllability is good. The liquid cooling plate 12 is provided with a liquid inlet and a liquid outlet, and a refrigerant can flow in from the liquid inlet through driving of a pump, flow through a micro-channel or an S-shaped pipeline, take away heat transferred from the particles in the memory 2 to the heat conducting pad 14 and then to the liquid cooling plate 12, and flow to the liquid outlet.

The micro-channel is also called a micro-channel heat exchanger, namely the equivalent diameter of the channel is between 10 and 1000 mu m, so that the liquid cooling heat dissipation plate 12 has the effects of compact structure, light weight, high efficiency and energy conservation; the S-shaped pipeline spirals in the liquid cooling heat dissipation plate 12, so that the effective length of the liquid cooling flow channel 121 in the liquid cooling heat dissipation plate 12 can be increased, and an effective heat exchange path is increased; the liquid cooling flow passage 121 is configured as a microchannel or an S-shaped pipe, and can enhance the liquid cooling effect of the liquid cooling plate 12.

Referring to fig. 5, in some embodiments, the heat dissipation liquid cooling module 1 further includes a main water pipe 15 and a plurality of water diversion pipes 151, the plurality of water diversion pipes 151 are respectively communicated with the main water pipe 15, and the liquid inlet pipe 131 and the liquid outlet pipe 132 are respectively communicated with the water diversion pipes 151.

In an actual use scene, if a plurality of memories 2 exist in the server, the liquid cooling heat dissipation plates 12 of the memories 2 can share one water main 15, each liquid cooling heat dissipation plate 12 is communicated with each water division pipe 151 through the split flow action of the water division pipes 151, so that time is indirectly communicated with the water main 15, and only the refrigerants in the water main 15 are required to be intensively cooled.

An embodiment of the second aspect of the present utility model provides a memory 2, which includes a memory 2 body and the heat dissipation liquid cooling module 1 in the above embodiment, and a driving member 113 drives two liquid cooling plates 12 to clamp two sides of the memory 2 body.

The heat dissipation liquid cooling module 1 is installed to the memory 2 in the above-mentioned embodiment, the driving piece 113 drive is separated and is put the liquid cooling heating panel 12 of memory 2 both sides and be close to each other, i.e. the liquid cooling heating panel 12 presss from both sides in memory 2 both sides, liquid cooling heating panel 12 carries out liquid cooling heat dissipation for memory 2, reach the effect of easy to assemble and dismantlement, solve the waistcoat in the conventional art and install and dismantle inconvenient problem, simultaneously, liquid cooling heat dissipation compares the forced air cooling heat dissipation and has better heat exchange efficiency, better radiating effect has, make this heat dissipation liquid cooling module 1 be fit for high energy high power memory 2, and a structure is simple, the radiating effect is good, ensure the performance of memory 2.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The utility model provides a heat dissipation liquid cooling module which characterized in that includes:

a clamp including a first clamp plate, a second clamp plate, and a driving member;

the liquid cooling heating panel, the liquid cooling heating panel is connected with circulation cooling mechanism, the liquid cooling heating panel is provided with two at least, and respectively with first splint with second splint fixed connection, the driving piece drive first splint with the second splint drives two the liquid cooling heating panel is close to or keeps away from.

2. The heat dissipation liquid cooling module according to claim 1, wherein heat conducting pads are respectively arranged on one side of the two liquid cooling heat dissipation plates, which are close to each other.

3. The heat dissipation liquid cooling module according to claim 2, wherein the heat conducting pad is fixedly connected with the liquid cooling plate.

4. The heat sink cooling module of claim 2, wherein the thermal pad is configured as a flexible member.

5. The heat dissipation liquid cooling module according to claim 1, wherein a liquid cooling flow channel is arranged in the liquid cooling plate, and the circulating cooling mechanism comprises a liquid inlet pipe and a liquid outlet pipe which are respectively communicated with the liquid cooling flow channel.

6. The heat dissipation liquid cooling module according to claim 5, wherein the liquid cooling flow channel is configured as a micro channel or an S-shaped pipeline.

7. The cooling module of claim 5, further comprising a water header and a plurality of water distribution pipes, wherein the plurality of water distribution pipes are respectively connected to the water header, and wherein the liquid inlet pipe and the liquid outlet pipe are respectively connected to the water distribution pipes.

8. The heat dissipation liquid cooling module according to claim 1, wherein the clamp is configured as a spring clamp, the driving member is configured as a torsion spring, a rotating rod is arranged in the torsion spring, the first clamping plate and the second clamping plate are respectively connected with the rotating rod in a rotating manner, one end of the torsion spring is connected with the first clamping plate, and the other end of the torsion spring is connected with the second clamping plate.

9. The heat dissipation liquid cooling module according to claim 1, wherein the clamp is disposed at a top center position of the two liquid cooling plates.

10. The heat dissipation liquid cooling module of any one of claims 1-9, wherein the driving member drives two liquid cooling plates to be clamped at two sides of the memory body.