CN219696694U - Miniaturized interdigital microstrip type 90-degree mixer - Google Patents
Miniaturized interdigital microstrip type 90-degree mixer Download PDFInfo
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- CN219696694U CN219696694U CN202321083334.0U CN202321083334U CN219696694U CN 219696694 U CN219696694 U CN 219696694U CN 202321083334 U CN202321083334 U CN 202321083334U CN 219696694 U CN219696694 U CN 219696694U
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Abstract
The utility model belongs to the field of radio frequency communication, in particular to a miniaturized interdigital microstrip type 90-degree mixer, wherein a first module and a second module of the mixer have the same structure and comprise a first high-impedance microstrip line, a plurality of first open-circuit microstrip lines and a plurality of second open-circuit microstrip lines; one end of each first open-circuit microstrip line is connected with the first high-impedance microstrip line, and the other end of each first open-circuit microstrip line is open-circuited; one end of each second open-circuit microstrip line is connected with the floor, and the other end of each second open-circuit microstrip line is open-circuited; the first open-circuit microstrip lines and the second open-circuit microstrip lines are arranged in a staggered mode to form an interdigital structure, and a certain gap is arranged between the adjacent first open-circuit microstrip lines and the adjacent second open-circuit microstrip lines; the third module has the same structure as the fourth module, and adopts a structure similar to the first module. The interdigital microstrip 90-degree mixer has the advantages of miniaturization, low cost, stable performance, easiness in integration with other circuit modules and the like, and can better meet the requirements of the current wireless communication system.
Description
Technical Field
The utility model belongs to the field of radio frequency communication, and particularly relates to a miniaturized interdigital microstrip type 90-degree mixer.
Background
With the rapid development of wireless communication technology, requirements for radio frequency devices are increasing, for example: miniaturization, low cost, excellent performance, etc. The hybrid has a wide range of applications as an important passive device in wireless communication systems. Two methods of designing the mixer are mainly adopted, one method is to build the mixer by adopting lumped elements, but when the lumped elements work at high frequency, serious parasitic effects can be generated, so that the performance of the mixer is deteriorated, and the processing and production cost is also improved by using the lumped elements to build the mixer; the other is to design a microstrip type 90-degree mixer, which has the advantages of low cost, stable performance, easy processing, convenient integrated design with other circuit modules, etc., but the traditional microstrip type 90-degree mixer is formed by connecting four straight microstrip lines with the electrical length of 1/4 wavelength, when working at low frequency, the structural size of the mixer is larger, which is not beneficial to the miniaturization and integration of the whole radio frequency communication system, so the miniaturized, low-cost and stable-performance microstrip type 90-degree mixer has great research value and significance.
Disclosure of Invention
In order to solve the problems in the prior art, the structure size of the designed interdigital structure microstrip type 90-degree mixer is obviously reduced based on the equivalent transmission line theory and the microwave network theory, the performance meets the requirements, the cost is reduced, and the requirements of the current wireless communication system can be better met.
The utility model is realized by the following technical scheme: a miniaturized interdigital microstrip type 90-degree mixer comprises a floor, a first module, a second module, a third module, a fourth module, an input port, a through port, a coupling port and an isolation port; the input port is led out from between the first module and the third module, the straight-through port is led out from between the first module and the fourth module, the coupling port is led out from between the second module and the fourth module, and the isolation port is led out from between the second module and the third module;
the first module and the second module have the same structure and comprise a first high-impedance microstrip line, a plurality of first open-circuit microstrip lines and a plurality of second open-circuit microstrip lines; one end of each first open-circuit microstrip line is connected with the first high-impedance microstrip line, and the other end of each first open-circuit microstrip line is open-circuited; one end of each second open-circuit microstrip line is connected with the floor, and the other end of each second open-circuit microstrip line is open-circuited; the first open-circuit microstrip lines and the second open-circuit microstrip lines are arranged in a staggered mode to form an interdigital structure, and gaps are formed between the adjacent first open-circuit microstrip lines and the adjacent second open-circuit microstrip lines;
the third module and the fourth module have the same structure and comprise a second high-impedance microstrip line, a plurality of third open-circuit microstrip lines and a plurality of fourth open-circuit microstrip lines; one end of each third open-circuit microstrip line is connected with the second high-impedance microstrip line, and the other end of each third open-circuit microstrip line is open-circuited; one end of each fourth-path microstrip line is connected with the floor, and the other end is opened; the third open-circuit microstrip lines and the fourth open-circuit microstrip lines are arranged in a staggered mode to form an interdigital structure, and gaps are arranged between the adjacent third open-circuit microstrip lines and fourth open-circuit microstrip lines.
Preferably, two ends of a first high-impedance microstrip line in the first module are respectively connected with the input port and the through port; two ends of a first high-impedance line in the second module are respectively connected with the coupling port and the isolation port.
Preferably, two ends of the second high-impedance microstrip line in the third module are respectively connected with the input port and the isolation port; and two ends of the second high-impedance microstrip line in the fourth module are respectively connected with the through port and the coupling port.
Preferably, the first high-impedance microstrip line is bent and folded into a polygonal line shape; the second high-impedance microstrip line is bent and folded into a polygonal line shape.
Preferably, the first module, the second module, the third module and the fourth module are all equivalent to microstrip lines with the electrical length of one quarter wavelength.
Further preferably, the characteristic impedance of the microstrip line equivalent to the first module and the second module is smaller than the characteristic impedance of the microstrip line equivalent to the third module and the fourth module.
Preferably, in the first module and/or the second module, the equivalent inductance effect of the first open-circuit microstrip line and the second open-circuit microstrip line is stronger than the capacitance effect; the interdigital structure formed by the adjacent first open-circuit microstrip line and second open-circuit microstrip line introduces a capacitance effect.
Preferably, in the third module and/or the fourth module, the equivalent inductance effect of the third open-circuit microstrip line and the fourth open-circuit microstrip line is stronger than the capacitance effect; the interdigital structure formed by the adjacent third open-circuit microstrip line and fourth open-circuit microstrip line introduces a capacitance effect.
Compared with the prior art, the utility model has the following advantages: the interdigital microstrip type 90-degree mixer provided by the utility model verifies the correctness and feasibility of a circuit structure through electromagnetic simulation and experiments, has the advantages of miniaturization, low cost, stable performance, convenience in integrated design with other circuit modules and the like, and can better meet the requirements of the current wireless communication system.
Drawings
FIG. 1 is a schematic diagram of a miniaturized interdigital microstrip type 90-degree mixer in an embodiment of the utility model;
FIG. 2 is a schematic diagram of simulation results of a miniaturized mixer S11 (input matching) in an embodiment of the present utility model;
FIG. 3 is a schematic diagram of transmission loss simulation results of a miniaturized mixer in accordance with an embodiment of the present utility model;
fig. 4 is a schematic diagram of the phase difference simulation result of the miniaturized mixer according to the embodiment of the utility model.
Detailed Description
The present utility model will be further described with reference to the drawings and examples, but the embodiments of the present utility model are not limited thereto.
Examples
As shown in fig. 1, the miniaturized interdigital microstrip type 90 ° hybrid of the present embodiment includes a floor 9, a first module 1, a second module 2, a third module 3, a fourth module 4, a first port 5 (i.e., an input port), a second port 6 (i.e., a through port), a third port 7 (i.e., a coupling port), and a fourth port 8 (i.e., an isolation port); the first port is led out from between the first module and the third module, the second port is led out from between the first module and the fourth module, the third port is led out from between the second module and the fourth module, and the fourth port is led out from between the second module and the third module.
In this embodiment, the first module, the second module, the third module and the fourth module are respectively disposed around the floor 9, so that the microstrip type mixer is rectangular in shape as a whole, and the first port, the second port, the third port and the fourth port are located at four corners of the rectangle.
The first module and the second module have the same structure and comprise a first high-impedance microstrip line 13, a plurality of first open-circuit microstrip lines 11 and a plurality of second open-circuit microstrip lines 12. One end of each first open-circuit microstrip line is connected with the first high-impedance microstrip line, and the other end of each first open-circuit microstrip line is open-circuited; one end of each second open-circuit microstrip line is connected with the floor 9, and the other end is open-circuited; the first open-circuit microstrip lines and the second open-circuit microstrip lines are arranged in a staggered mode to form an interdigital structure, and a certain gap is arranged between the adjacent first open-circuit microstrip lines and the second open-circuit microstrip lines. Two ends of a first high-impedance microstrip line in the first module are respectively connected with a first port and a second port; two ends of a first high-impedance line in the second module are respectively connected with the third port and the fourth port.
The third module and the fourth module have the same structure and comprise a second high-impedance microstrip line 22, a plurality of third open-circuit microstrip lines 31 and a plurality of fourth open-circuit microstrip lines 32. One end of each third open-circuit microstrip line is connected with the second high-impedance microstrip line, and the other end of each third open-circuit microstrip line is open-circuited; one end of each fourth-path microstrip line is connected with the floor 9, and the other end is opened; the third open-circuit microstrip lines and the fourth open-circuit microstrip lines are arranged in a staggered mode to form an interdigital structure, and a certain gap is arranged between every two adjacent third open-circuit microstrip lines and fourth open-circuit microstrip lines. Two ends of a second high-impedance microstrip line in the third module are respectively connected with the first port and the fourth port; two ends of a second high-impedance microstrip line in the fourth module are respectively connected with the second port and the third port.
In addition, the present embodiment provides a plurality of evenly arranged metallized vias 91 on the floor. The via hole is used for introducing the upper surface grounding surface, and the metal surface of the upper surface and the metal ground of the back surface are connected through the via hole to form the grounding surface together.
In this embodiment, the first module and the second module may be equivalently microstrip lines with characteristic impedance of 35.3 Ω and electrical length of 1/4 wavelength. The functions among the structures of the first high-impedance microstrip line, the first open-circuit microstrip line and the second open-circuit microstrip line of the first module and the second module are described as follows:
1. according to the theoretical knowledge of a microwave circuit, the effect generated by the microstrip circuit can be equivalent to the effect generated by the inductance and the capacitance of the concentrated element, the broadband of the first open-circuit microstrip line and the second open-circuit microstrip line is narrower, the width is 0.2mm, so that the equivalent inductance effect of the first open-circuit microstrip line and the second open-circuit microstrip line is stronger than the capacitance effect, and the inductance effect is the main part; a certain gap is arranged between the adjacent first open-circuit microstrip line and the second open-circuit microstrip line, and the two open-circuit microstrip lines form an interdigital structure circuit, so that the capacitive effect is introduced; the inductance effect generated by the first open-circuit microstrip line and the second open-circuit microstrip line and the capacitance effect generated by the interdigital structure circuit formed by the two open-circuit microstrip line structures are beneficial to realizing miniaturization.
2. The first high-impedance microstrip line and the second high-impedance microstrip line are bent and folded into a certain shape, such as a fold line shape, so that the internal space is fully utilized, and the miniaturization characteristic is further realized.
3. The line width of the first high-impedance microstrip line is small and is 0.2mm, the equivalent inductance effect is strong, and the inductance effect generated by the first open-circuit microstrip line and the second open-circuit microstrip line and the capacitance effect generated by an interdigital structure circuit formed by the two open-circuit microstrip line structures together enable an input signal to generate a slow wave effect when passing through the first module, so that miniaturization is realized.
In this embodiment, the third module and the fourth module may be equivalently microstrip lines with characteristic impedance of 50Ω and electrical length of 1/4 wavelength. In the same way, the structure in the third and fourth modules can be analyzed in the same way as theory, with similar effects and effects as in the first and second modules.
Compared with the prior art, the product structure of the utility model has the advantages of miniaturization, low cost, stable performance, easy integration with other circuit modules and the like, and is analyzed in detail as follows:
1. the first open-circuit microstrip line and the second open-circuit microstrip line form an interdigital structure circuit together to generate a capacitance effect, and the working principle is similar to that of a parallel plate capacitor; the smaller the distance between the first open-circuit microstrip line and the second open-circuit microstrip line is, the stronger the capacitance effect generated by the first open-circuit microstrip line is, which is more beneficial to realizing miniaturization. Meanwhile, a capacitive effect formed between the first open-circuit microstrip line and the second open-circuit microstrip line can replace a lumped capacitive element, so that the cost of the mixer is further reduced. Similarly, the interdigital structure circuit formed by the third open-circuit microstrip line and the fourth open-circuit microstrip line has the same function.
2. The first high-impedance microstrip line and the second high-impedance microstrip line are bent and folded into a certain shape, such as a fold line shape, so that the internal space is fully utilized, and the miniaturization is facilitated.
3. The line width of the first high-impedance microstrip line in the first module and the second module is small, the equivalent inductance effect generated by the first high-impedance microstrip line is strong, and meanwhile, a strong capacitance effect is generated between the first open-circuit microstrip line and the second open-circuit microstrip line. Due to inductance and capacitance effects generated by the first module and the second module, slow wave effects can be generated when input signals pass through the modules, and miniaturization is facilitated. The principle of slow wave effect is analyzed as follows:
as can be seen from the following three formulas, the characteristic impedance Z of the transmission line increases the equivalent inductance and capacitance effects of the transmission line simultaneously and in equal ratio 0 The phase velocity Vp of the signal on the transmission line is unchanged, so that the wave line lambda of the transmission line is reduced at the same operating frequency, and the corresponding physical size is reduced when the wavelength is reduced, thereby achieving the purpose of miniaturization.
Therefore, under the same working frequency, the utility model introduces a slow wave effect in the structure so that the physical size of the mixer is reduced, thereby achieving the purpose of miniaturization.
The equivalent inductance effect of the first high-impedance microstrip line in the first module and the second module and the capacitance effect generated by the interdigital structure circuit formed between the first open-circuit microstrip line and the second open-circuit microstrip line are based on the slow wave effect principle, so that the purpose of miniaturization is achieved. Similarly, the third module and the fourth module operate in a similar manner to the first module and the second module.
4. Based on the theoretical analysis, electromagnetic modeling simulation and experimental demonstration are carried out on the miniaturized interdigital micro-strip type 90-degree mixer, and from the simulation results of fig. 2, 3 and 4, the structure in fig. 1 has excellent performance, and the size and the area of the structure in fig. 1 are reduced by about 77% compared with the traditional mixer.
The foregoing is only illustrative of the preferred embodiments of the present utility model, but the scope of the utility model is not limited thereto, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principles of the present utility model should be made therein and are intended to be equivalent substitutes.
Claims (10)
1. A miniaturized interdigital microstrip type 90-degree mixer comprises a floor, a first module, a second module, a third module, a fourth module, an input port, a through port, a coupling port and an isolation port; the input port is led out from between the first module and the third module, the straight-through port is led out from between the first module and the fourth module, the coupling port is led out from between the second module and the fourth module, and the isolation port is led out from between the second module and the third module; the method is characterized in that:
the first module and the second module have the same structure and comprise a first high-impedance microstrip line, a plurality of first open-circuit microstrip lines and a plurality of second open-circuit microstrip lines; one end of each first open-circuit microstrip line is connected with the first high-impedance microstrip line, and the other end of each first open-circuit microstrip line is open-circuited; one end of each second open-circuit microstrip line is connected with the floor, and the other end of each second open-circuit microstrip line is open-circuited; the first open-circuit microstrip lines and the second open-circuit microstrip lines are arranged in a staggered mode to form an interdigital structure, and gaps are formed between the adjacent first open-circuit microstrip lines and the adjacent second open-circuit microstrip lines;
the third module and the fourth module have the same structure and comprise a second high-impedance microstrip line, a plurality of third open-circuit microstrip lines and a plurality of fourth open-circuit microstrip lines; one end of each third open-circuit microstrip line is connected with the second high-impedance microstrip line, and the other end of each third open-circuit microstrip line is open-circuited; one end of each fourth-path microstrip line is connected with the floor, and the other end is opened; the third open-circuit microstrip lines and the fourth open-circuit microstrip lines are arranged in a staggered mode to form an interdigital structure, and gaps are arranged between the adjacent third open-circuit microstrip lines and fourth open-circuit microstrip lines.
2. The microstrip type 90 ° hybrid according to claim 1, wherein both ends of the first high impedance microstrip line in the first module are connected to the input port and the through port, respectively; two ends of a first high-impedance line in the second module are respectively connected with the coupling port and the isolation port.
3. The microstrip type 90 ° hybrid according to claim 1, wherein both ends of the second high impedance microstrip line in the third module are connected to the input port and the isolation port, respectively; and two ends of the second high-impedance microstrip line in the fourth module are respectively connected with the through port and the coupling port.
4. The microstrip type 90 ° hybrid according to claim 1, wherein the first high impedance microstrip line is folded in a meander line shape.
5. The microstrip type 90 ° hybrid according to claim 1, wherein the second high impedance microstrip line is folded in a meander line shape.
6. The microstrip type 90 ° hybrid according to claim 1, wherein the first module, the second module, the third module and the fourth module are all equivalent to microstrip lines having an electrical length of one quarter wavelength.
7. The microstrip 90 ° hybrid of claim 6, wherein the characteristic impedance of the microstrip line equivalent to the first and second modules is less than the characteristic impedance of the microstrip line equivalent to the third and fourth modules.
8. The microstrip type 90 ° hybrid according to claim 1, wherein a plurality of uniformly arranged metallized vias are provided on the floor.
9. The microstrip type 90 ° hybrid according to claim 1, wherein in the first module and/or the second module, the first open-circuit microstrip line and the second open-circuit microstrip line have a stronger self-equivalent inductance effect than capacitance effect; the interdigital structure formed by the adjacent first open-circuit microstrip line and second open-circuit microstrip line introduces a capacitance effect.
10. The microstrip type 90 ° hybrid according to claim 1, wherein in the third module and/or the fourth module, the third open-circuit microstrip line and the fourth open-circuit microstrip line have a stronger self-equivalent inductance effect than capacitance effect; the interdigital structure formed by the adjacent third open-circuit microstrip line and fourth open-circuit microstrip line introduces a capacitance effect.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321083334.0U CN219696694U (en) | 2023-05-08 | 2023-05-08 | Miniaturized interdigital microstrip type 90-degree mixer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202321083334.0U CN219696694U (en) | 2023-05-08 | 2023-05-08 | Miniaturized interdigital microstrip type 90-degree mixer |
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| CN219696694U true CN219696694U (en) | 2023-09-15 |
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| CN202321083334.0U Active CN219696694U (en) | 2023-05-08 | 2023-05-08 | Miniaturized interdigital microstrip type 90-degree mixer |
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