CN102361533A - Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof - Google Patents
Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof Download PDFInfo
- Publication number
- CN102361533A CN102361533A CN2011102943213A CN201110294321A CN102361533A CN 102361533 A CN102361533 A CN 102361533A CN 2011102943213 A CN2011102943213 A CN 2011102943213A CN 201110294321 A CN201110294321 A CN 201110294321A CN 102361533 A CN102361533 A CN 102361533A
- Authority
- CN
- China
- Prior art keywords
- ebg
- coplane
- layer
- periodic
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses an electromagnetic band gap structure for optimizing a power distribution network of a PCB (printed circuit board), and the electromagnetic band gap structure is of a periodic structure. The shape of a periodic unit is formed by four large-size narrow-bridge-shaped connecting metal branches, eight small-size narrow-bridge-shaped connecting metal branches with same shapes, and square metal patches. All the periodic units are connected by utilizing the narrow-bridge-shaped connecting metal branches of all the edges. A construction method comprises the following seven main steps: (1) establishing a periodic structure unit layer of a zero-thickness composite coplanar EBG (Electromagnetic Band Gap) layer; (2) establishing a medium layer of the periodic structure units of the composite coplanar EBG layer; (3) establishing a dispersion diagram simulation model of the composite coplanar EBG periodic structure units; (4) carrying out periodic prolongation on the periodic structure units of the composite coplanar EBG layer obtained by the step (1) along the X and Y directions to obtain the composite coplanar EBG layer; (5) establishing a medium layer of an EGB structure and embedding the composite coplanar EBG structure layer into a substrate of a medium; (6) adding a simulation port to calculate an S parameter of the EBG structure; and (7) practically plating and testing the transmission characteristic of the composite coplanar EBG structure.
Description
(1) technical field
The present invention relates to a kind of electromagnetic bandgap structure and construction method thereof of optimizing the pcb board power distribution network.This electromagnetic bandgap structure can suppress the high frequency and the hyperfrequency power supply noise of high speed circuit power distribution network (" power distribution network " is hereinafter to be referred as PDN).It belongs to the high speed circuit microwave technical field.
(2) background technology
Along with the progress of semiconductor technology and continuing to bring out of circuit new technology, Circuits System is towards the trend development of high-speed, high density, high power consumption, low-voltage and big electric current.The reliability and stability of Circuits System work become the high speed circuit development key, and this has just proposed severe challenge for the power distribution network design of contemporary electronic system with the power supply integrity analysis.
PDN is electronic system the most complicated the hugest interconnect architecture, and all devices all are connected on the PDN directly or indirectly in the system, and about 40% interconnected space is used for PDN placement-and-routing.The design of PDN is directly related with circuit power integrality (PI), also closely links to each other with electromagnetic interference (EMI) with signal integrity (SI).Transistorized synchro switch behavior on the pcb board need be drawn a large amount of transient currents, has caused the fluctuation of power supply rail voltage, and voltage fluctuation is propagated on PDN and formed the distributed power source noise.Power supply noise is coupled on the holding wire through PDN, causes signal distortion, and eye pattern is closed.The resonant cavity of power supply ground level formation by the return current of high-speed digital signal and simultaneous switching noise (SSN) excitation and generation resonance, causes serious electromagnetic radiation on the power supply ground level edge easily.
Current research to PI does not form a complete system, and research direction is mainly modeling and analysis, the analysis of decoupling capacitor network and four aspects of electromagnetic compatibility of design, mains switch noise and PCB of power plane.For optimization and the design of PDN, the decoupling capacitor network is its important component part, and the design of decoupling network also is the design difficulty of PDN.How distributing the position of decoupling capacitor, decoupling capacitor whether to influence problems such as the effect of decoupling is bone of contention.The inhibition of SSN also is an important content of PDN design.Developed at present and multiple SSN inhibition method: discrete decoupling capacitor is added in (1); (2) adopt embedded decoupling capacitor; (3) position of optimization via hole; (4) the power supply ground level is cut apart; (5) increase resistive matching element at the PCB edge; (6) employing diminishes element; (7) design via hole guard rail; (8) adopt difference signaling etc.But it is not enough that these methods exist when suppressing SSN, makes capacitor increase and make noise suppressed lose efficacy in the impedance of high frequency like the stray inductance of decoupling capacitor, and the scope of decoupling of general Surface Mount encapsulation decoupling capacitor is about 100MHz.Introduce the method that a kind of employing electromagnetic bandgap structure (EBG structure) suppresses power supply noise among the PDN in recent years, and derived multiple broadband EBG structure and design and analysis method thereof.
The EBG structure is the periodic structure with band resistance characteristic, can adopt metal, medium, ferromagnetic or ferroelectric implantation host material, is perhaps directly formed by various material periodic arrangement.The EBG structure that proposes both at home and abroad at present is varied, such as in the medium substrate middle punch, perhaps in medium substrate, fills other materials or metal, forms EBG structure etc. on the microstrip circuit surface around redundancy section.The EBG structure is incorporated into and suppresses in the noise suppressed of power supply ground level that SSN and its principle of electromagnetic radiation are in the High Speed System: the EBG structural table reveals a kind of peculiar electromagnetic characteristic, and it is that two interplanar high-frequency currents (or noise) provide low impedance path.Two reference planes ac short circuits, this noise that just makes the power supply ground level produce forms the loop through local low impedance path rapidly, can not outwards propagate, thereby reach the effect of noise suppressed.The repressed while of noise has also reduced electromagnetic radiation.
Generally speaking, the smaller bandwidth of EBG structure and lower-cut-off frequency are very high, and the SSN frequency range of digital signal covers the high order harmonic component from DC to the clock frequency.Therefore how to reduce the lower-cut-off frequency of EBG structure or increase bandwidth and become research focus to obtain better noise suppression feature.Should weigh SSN in addition suppresses and the cost problem.The electro-magnetic bandgap notion is incorporated in the design and manufacture craft of integrated circuit; Utilize prior integrated circuit process; Like reactive ion body etching, based on the MEMS process technology of X-ray lithography technology etc.; Realize the combination of electro-magnetic bandgap and integrated circuit, reduce the manufacture difficulty and the cost of electro-magnetic bandgap.Design a kind of novel blanketing frequency bandwidth among the present invention and reached the above compound coplane EBG structure of 10GHz.It has realized that the characteristic and the cost of manufacture of low lower limit cut-off frequency high bandwidth are low.
(3) summary of the invention
1, goal of the invention
Because the noise in the power distribution network system of electronic circuit extends in the frequency range of high frequency, hyperfrequency gradually; The at present traditional interpolation decoupling capacitor and the EBG structure of existing classics can not well be applied to so high frequency range; And need consider the problem such as manufacture craft and production cost of electronic circuit; The present invention provides a kind of electromagnetic bandgap structure and construction method thereof of optimizing the pcb board power distribution network, and it has realized the characteristic requirements that the relative band bandwidth is high, cost of manufacture is low.This compound coplane EBG structure is compared with the EBG structure of traditional classical, has overcome the narrower shortcoming of traditional E BG OILS STRUCTURE DEPRESSION noise band width.It is more and more wideer that it can be applied in SSN noise profile scope, in the increasingly high high-speed signal circuit of the upper frequency limit that require to suppress.This structure is through the power plane etching of two kinds of identical shaped different size shapes, and the size of effectively having dwindled electromagnetic bandgap structure has realized the EBG design of miniization, helps the integrated of circuit.
2, technical scheme
A kind of electromagnetic bandgap structure of optimizing the pcb board power distribution network of the present invention, it is a kind of compound coplane EBG structure, this structure is a periodic structure, it be by EBG construction unit (being periodic unit) along X, Y direction periodic extension forms.
(1) design of the construction unit of compound coplane electromagnetic bandgap structure (EBG construction unit)
The resonance effect of compound coplane EBG structural cycle unit itself plays a major role in the formation of band gap.As long as the cell size of periodic electromagnetism bandgap structure is much littler than the signal wavelength of propagating on it; The electromagnetic bandgap structure unit can equivalence be the more intense parallelly connected LC resonant circuit of particular resonance characteristic; To increase the resonance performance of unit; The infinitely-great characteristic of reactance when utilizing unit resonance then stops near the electromagnetic wave propagation of resonance frequency, to form the frequency band gap.The centre frequency and the bandwidth of band gap are determined by following formula:
Wherein, L and C are the equivalent inductance and the equivalent capacity of EBG construction unit.η is the free space wave impedance, ω
0Be centre frequency, BW is a relative bandwidth.Electromagnetic bandgap structure unit among the present invention is connected the metal branch by the square metal paster with narrow bridge shape and constitutes, and is as shown in Figure 1.The main corresponding equivalent capacity of square metal paster among the figure, narrow bridge shape connects the equivalent inductance of the main corresponding EBG cellular construction of metal branch.Be that capacitance size is determined by the square metal paster, the inductance size connects the decision of metal branch by narrow bridge shape.Therefore can change the cellular construction size, control its equivalent LC resonant circuit, thus control bandgap center frequency and relative bandwidth.
The area of metal patch more greatly then electric capacity is big more, and the longer then equivalent inductance of equivalent path that narrow bridge shape connects the metal branch is big more.Can find out that by formula (2) band gap width and unit equivalent capacity square root are inversely proportional to, be inversely proportional to unit equivalent inductance square root.Increase electric capacity and when reducing frequency, can make that band gap width reduces, and the increase inductance makes that when reducing frequency band gap width increases, when therefore selecting the increase inductance to reduce centre frequency, increase the bandwidth width.NEW TYPE OF COMPOSITE coplane EBG structure among the present invention is exactly through making full use of the unit redundancy space; Increase narrow bridge shape and connect the spatial distribution rate of metal branch in the unit; Promptly increase the equivalent path that narrow bridge shape connects the metal branch; Realized that new E BG structure hangs down lower limit cut-off frequency high bandwidth characteristic, condition is provided for realizing the miniaturization of EBG structure.
(2) parameter designing of compound coplane electromagnetic bandgap structure
The frequency response of compound coplane EBG structure is by three parameter determining: the lower-cut-off frequency of stopband, bandwidth of rejection, and accessible isolation in the stopband.Can obtain the stopband lower-cut-off frequency and the bandwidth of compound coplane EBG structure to the dispersion map analysis of the single structure unit of compound coplane EBG structure.Compound coplane EBG structure to limited compound coplane EBG construction unit formed can be observed stopband lower-cut-off frequency, bandwidth of rejection and the stopband isolation of compound coplane EBG structure through the S parameter of calculating the EBG structure.
Compound coplane EBG structure Design in two steps.The first step calculates dispersion map by the single structure unit of compound coplane EBG structure, tentatively obtains the dispersion map stopband lower-cut-off frequency and the bandwidth of rejection information of EBG structure.What dispersion map was described is electromagnetic wave wave phase constant and the curved line relation between the frequency, the i.e. relation of propagating in the EBG structure between β and the f.The two-dimentional compound coplane EBG structure in the present invention, when electromagnetic wave is propagated in this structure, can it be regarded as respectively and propagate, wherein along X and Y both direction
k
x, k
yWave constant for x and y direction.
From dispersion map, can obviously observe the bandgap range of EBG structure.Do not exist electromagnetic band gap band table plain telegram magnetic wave in this frequency range, can not propagate.Ghz area when using dispersion map can obtain to use compound coplane EBG structure to suppress noise as isolation.The dispersion map of two dimension EBG structure is found the solution the Brillouin zone structural theory that can adopt in the photon crystal structure theoretical system, and the Brillouin zone figure that two-dimentional compound coplane EBG construction unit is corresponding is as shown in Figure 3.Γ wherein, X, M is corresponding k respectively
x=k
y=0;
k
y=0;
3 points (a is an EBG construction unit size).Can observe thus along X and Y might wave vector with other directions on two particular points of minimum and maximum wave vector, can obtain enough about being with and the information of band gap through calculating in this special section.
The present invention uses the HFSS of FInite Element simulation software to set up EBG construction unit model.Analysis obtains the two-dimension chromatic dispersion figure of compound coplane EBG structure to cycle endless through supposing compound coplane EBG construction unit to an EBG construction unit.For realizing that EBG construction unit cycle endless adopts principal and subordinate's boundary condition and uses the Floquet emulated port.Secondly; Be the situation of analog electrical magnetic wave at infinitely great spatial transmission; Reduce the obvious reflection of truncated position, border ripple; A kind of effective ground method is that a kind of absorbing boundary condition is set in the truncated position, the ripple that is transferred to the truncated position is absorbed by the border and does not produce reflection, thereby reach the purpose of simulation infinite space.Adopt the very outstanding PML boundary condition of a kind of absorbent properties among the present invention, it can absorb electromagnetic wave in limited perfect match layer fully, and electricity, magnetic field energy are split in the absorbing boundary differentiation, and the field component of each division is composed with different losses.The EBG cellular construction dispersion map model of setting up is as shown in Figure 4.
This method is applicable to that the dispersion map of random two-dimensional electromagnetic bandgap structure finds the solution.The dispersion map curve of compound coplane EBG structure is as shown in Figure 5 among the present invention.After calculating the dispersion map of unit, we have just known the band gap characteristic of the type electromagnetic bandgap structure that compacts.
Second step is through calculating the isolation that the S parameter obtains compound coplane EBG structure.Attainable isolation improves with the increase of the type electromagnetic bandgap structure cell number that compacts.The S CALCULATION OF PARAMETERS is expanded the EBG plane of forming for limited EBG construction unit to liking with compound coplane EBG construction unit, and is as shown in Figure 6.In order to calculate the S parameter, we carry out modeling and simulating with the HFSS of 3 D electromagnetic simulation software to the compound coplane EBG structure of finite size and calculate.The simulation model of setting up is as shown in Figure 7.This model be one 3 * 3 form the two-dimentional compound coplane EBG structure that is of a size of 90mm * 90mm by the EBG construction unit.This simulation model is by bus plane, and dielectric layer and stratum constitute, position annexation such as Fig. 7 between them: wherein 1 is positioned at top layer for bus plane (EBG plane layer), and 3 for the stratum is positioned at bottom, and centre 2 is dielectric layers.And this bus plane is designed to the EBG plane of compound coplane, and this stratum is complete metal flat, and this dielectric layer is the thick FR4 dielectric material of 0.4mm, and dielectric constant is ε
r=4.3, loss angle tangent is tan δ=0.02.In order to calculate the insertion loss of this structure; Simulation calculation go out the to compact isolation degree of depth of type electromagnetic bandgap structure is added two discrete port simulation analysis in the power plane corresponding position, and the rectangular coordinate initial point is positioned at the upper left side of Fig. 7; Input port port1 (excitation port) and output port port2 are positioned at (30mm respectively successively; 10mm) (30mm, 50mm), application of finite element software HFSS adopts 50 ohm of standard coaxial excitations.This EBG structure of emulation is in 0 transmission characteristic in the 10GHz band limits, and the simulation result that obtains is as shown in Figure 8.There is tangible band gap properties in the NEW TYPE OF COMPOSITE coplane EBG structure that can be found out design by simulation architecture figure, when suppressing the degree of depth is-during 30dB, and bandgap range is from 800MHz to 10GHz even higher.Realized the frequency range suppression characteristic of its low lower limit cut-off frequency high bandwidth well, it is more and more wider to have adapted to modem electronic circuitry PDN system noise distribution, the trend that the distribution frequency range upper limit is increasingly high.
In sum; A kind of electromagnetic bandgap structure of optimizing the pcb board power distribution network of the present invention; It is a kind of compound coplane EBG structure, and this structure is a periodic structure, and its periodic unit (being the EBG construction unit) shape is one and is connected by the narrow bridge shapes of four large scales that the metal branches are connected the metal branch with the identical shaped narrow bridge shape of eight small sizes and the square metal paster constitutes; The connected mode of each periodic unit is to utilize the narrow bridge shape on each limit of periodic unit to connect the connection of metal branch, and is as shown in Figure 6.The shape facility that this narrow bridge shape connects the metal branch is: this structure is the rectangle metal, across two EBG construction units, the square metal paster of two EBG construction units is coupled together.Electromagnetic bandgap structure Simulation Calculation among the present invention is by bus plane, and dielectric layer and stratum constitute, position annexation such as Fig. 7 between them: wherein 1 is positioned at top layer for bus plane (EBG plane layer), and 3 for the stratum is positioned at bottom, and centre 2 is dielectric layers.And this bus plane is designed to the EBG plane of compound coplane, and this stratum is complete metal flat, and this dielectric layer is the FR4 dielectric material; The making of this compound coplane EBG periodic structure is on complete power supply metal flat, to utilize the circuit etching technics to carve, and compound coplane EBG structural material adopts double face copper.According to different practical applications, different sizes can etch the periodic unit of corresponding varying number on power plane.As long as surpassing three at power plane structure horizontal and vertical, periodic unit quantity just the good restraining effect can be provided.The EBG construction unit of emulation testing 3 * 3 among the present invention is formed the EBG structure that is of a size of 90mm * 90mm.For measuring transmission loss result and simulation calculation with compound coplane electromagnetic structure compare, add two test ports, the transmission characteristic of test compound coplane EBG structure at the EBG of reality structural slab power plane same position place.The test result that obtains is as shown in Figure 9.Can find out by test curve figure, when suppressing the degree of depth be-during 30dB that bandgap range is from 800MHz to 10GHz even higher.The bandwidth trend of test result and simulation result is identical basically.But because manufacture craft and spillage of material, there are nuance in simulation result and test result, but this does not influence use.
(3) a kind of construction method of optimizing the electromagnetic bandgap structure of pcb board power distribution network of the present invention, these method concrete steps are following;
Step 1: the periodic structure elementary layer of setting up the compound coplane EBG layer of a zero thickness;
Step 2: the dielectric layer of setting up the periodic structure unit of compound coplane EBG layer;
Step 3: set up compound coplane EBG periodic structure unit dispersion map simulation model;
Step 4: the periodic structure unit of the compound coplane EBG layer that step 1 is obtained is along X, and the Y direction is done periodic extension and obtained compound coplane EBG layer;
Step 5: the dielectric layer of setting up the EBG structure.Compound coplane EBG structure sheaf is embedded in the substrate of medium;
Step 6: add the S parameter that emulated port is calculated the EBG structure;
Step 7: actual making sheet is also tested the transmission characteristic of NEW TYPE OF COMPOSITE coplane EBG structure.
3, advantage and effect
1) in design process, because the bandwidth characteristic of compound coplane EBG structure is that the selectivity of its frequency band is directly related with the size of periodic unit itself by the resonance effect decision of its periodic unit itself.The periodic unit size of the compound coplane EBG of direct modification structure just can be revised its corresponding frequency band range like this, and the unit etching shape in should inventing is comparatively regular.Therefore, be convenient to the EBG construction unit is revised fast, accelerate the process of design.
2) this compound coplane EBG structure has low lower limit cut-off frequency high bandwidth characteristic.Overcome the narrower shortcoming of traditional E BG OILS STRUCTURE DEPRESSION noise band width.It is more and more wideer that it can be applied in SSN noise profile scope, in the increasingly high high-speed signal circuit of the upper frequency limit that require to suppress.
3) this compound coplane EBG structure is through the power plane etching of two kinds of identical shaped different size shapes, and the size of effectively having dwindled electromagnetic bandgap structure has realized the EBG design of miniization, helps the integrated of circuit.
4) this compound coplane EBG is simple in structure, and this structure is covered with at common upper and lower surfaces on the dielectric substrate of metal and just can realizes.The construction unit shape and size and the size in cycle that in design process, only need to regulate EBG structure bus plane just can obtain needed performance.These structural parameters are few, save the time of design optimization greatly.
5) this EBG structure with low lower limit cut-off frequency high bandwidth is made simple and conveniently, adopts existing conventional printed circuit board manufacturing process just can realize that cost is lower.
(4) description of drawings
Fig. 1 is a compound coplane EBG construction unit layer sketch map among the present invention
Fig. 2 is a compound coplane EBG construction unit sketch map among the present invention
Fig. 3 is the corresponding Brillouin zone sketch map of two-dimentional compound coplane EBG construction unit among the present invention
Compound coplane EBG construction unit dispersion map simulation model sketch map among Fig. 4 the present invention
Fig. 5 is the dispersion curve figure of compound coplane EBG structure among the present invention
Fig. 6 is 3 * 3EBG floor map that compound coplane EBG construction unit is formed among the present invention
Fig. 7 is a compound coplane EBG structure S parameters simulation model sketch map among the present invention
Fig. 8 is compound coplane EBG structure S parameters simulation figure as a result among the present invention
Fig. 9 is compound coplane EBG structure S parameter testing figure as a result among the present invention
Symbol description is following among the figure:
1: bus plane; 2: dielectric layer; 3: the stratum; Γ: k
x=k
y=0; X:
k
y=0; M:
The main boundary face of Mx:EBG cellular construction directions X; Sx:EBG cellular construction directions X from boundary face;
The main boundary face of My:EBG cellular construction Y direction; Sy:EBG cellular construction Y direction from boundary face;
PML: absorbing boundary condition; Port1: emulated port 1; Port: emulated port 2;
PCB: printed circuit board (PCB); PDN: power distribution network; EBG: electro-magnetic bandgap; PI: power supply integrality;
SI: signal integrity; EMI: electromagnetic radiation; SSN: mains switch noise.
(5) embodiment
To combine accompanying drawing that the present invention is done further detailed description below.
A kind of compound coplane EBG structure with low lower limit cut-off frequency high bandwidth that the present invention is directed to the high speed circuit system design, it has realized high-speed signal circuit PDN medium-high frequency section Noise Suppression.This structure increases narrow bridge shape and connects metal branch path on the basis of traditional classical plane EBG structure; Make full use of the construction unit redundant space; Increase narrow bridge shape and connect the spatial distribution rate of metal branch at construction unit; Realized the low lower limit cut-off frequency high bandwidth characteristic of new E BG structure, condition is provided for realizing the miniaturization of EBG structure.Compound coplane EBG structure among the present invention is by one-period construction unit one 3 * 3 EBG structure becoming of periodic extension in one plane.
Electromagnetic bandgap structure Simulation Calculation among the present invention is by bus plane, and dielectric layer and stratum constitute, position annexation such as Fig. 7 between them: wherein 1 is positioned at top layer for bus plane (EBG plane layer), and 3 for the stratum is positioned at bottom, and centre 2 is dielectric layers.And this bus plane is designed to the EBG plane of compound coplane, and this stratum is complete metal flat, and this dielectric layer is the thick FR4 dielectric material of 0.4mm, and dielectric constant is ε
r=4.3, loss angle tangent is tan δ=0.02.
Said compound coplane EBG structural plan such as Fig. 6, it is on complete power supply metal flat, to utilize the circuit etching technics to carve, compound coplane EBG structural material adopts double face copper.This structure is a periodic structure; The periodic unit shape is one and is connected by the narrow bridge shapes of four large scales that the metal branches are connected the metal branch with the identical shaped narrow bridge shape of eight small sizes and the square metal paster constitutes; The connected mode of each periodic unit is to utilize the bridge type branch on each limit of periodic unit to connect, and is as shown in Figure 6.According to different practical applications, different sizes can etch the periodic unit of corresponding varying number on power plane.As long as surpassing three at power plane structure horizontal and vertical, periodic unit quantity just the good restraining effect can be provided.The EBG cellular construction of emulation testing 3 * 3 among the present invention is formed the EBG structure that is of a size of 90mm * 90mm.For simulation calculation with test out the type electromagnetic bandgap structure that compacts to the effect of power distribution system Noise Suppression, add two discrete ports in the power plane corresponding position.The rectangular coordinate initial point is positioned at the upper left side of Fig. 7, input port port1 (excitation port) and output port port2 be positioned at successively respectively (30mm, 10mm) (30mm, 50mm).As shown in Figure 7.The Brillouin zone figure that the compound coplane EBG construction unit of two dimension is corresponding is as shown in Figure 3.
A kind of electromagnetic bandgap structure of optimizing the pcb board power distribution network of the present invention need be used a computer that can move based on finite element algorithm HFSS software and carry out modeling and simulation calculating.A kind of construction method of optimizing the electromagnetic bandgap structure of pcb board power distribution network of the present invention, these method concrete steps are following:
Step 1: the periodic structure elementary layer of setting up the compound coplane EBG layer of a zero thickness.At first use the drawing tool in the HFSS simulation software to set up a square complete plane that is of a size of 30mm * 30mm.Use the boolean operation add-minus function in the drawing tool that the cutting combination is carried out on the complete plane of square then.The periodic structure unit of EBG layer is a symmetrical structure; Therefore also can select 1/4th sizes on the complete plane of square are operated; Use the image feature in the HFSS software then, obtain the periodic structure unit of complete compound coplane EBG layer, as shown in Figure 1.The bridge type that the periodic structure unit of compound coplane EBG layer comprises two kinds of sizes connects the metal branch.Wherein large-sized bridge type connects the long 8.5mm of metal branch, and wide 1.5mm is positioned at the center of plane, EBG periodic structure unit four avris.Undersized bridge type connects the long 5mm of metal branch, wide 1mm, and large-sized bridge type connects the metal branch plane, EBG periodic structure unit is divided into four part metals sheet pieces, and undersized bridge type connects the center that the metal branch is positioned at each sheet metal piece edge.Make full use of the unit redundancy space like this, increase the spatial distribution rate of metal branch, promptly increase the equivalent path of metal branch, realized that new E BG structure hang down lower limit cut-off frequency high bandwidth characteristic, for the miniaturization of realization EBG structure provides condition in the unit.
Step 2: the dielectric layer of setting up the periodic structure unit of compound coplane EBG layer.Compound coplane EBG construction unit layer is embedded in the substrate of medium.At first make the cuboid of a 30mm * 30mm * 0.4mm with the drawing tool in the HFSS simulation software, the lower surface of cuboid end face and compound coplane EBG periodic structure elementary layer overlaps.It is 4.3 that the cuboid material is set to dielectric constant, and magnetic permeability is 1, and loss angle tangent is 0.02.And then make the rectangle of a 30mm * 30mm with the drawing tool in the HFSS software, with its stratum as compound coplane EBG periodic structure unit.Rectangle upper surface and cuboid bottom surface overlap.So just obtain a periodic structure unit that adds the compound coplane EBG layer of dielectric layer, as shown in Figure 2.
Step 3: set up compound coplane EBG periodic structure unit dispersion map simulation model.Use HFSS software on EBG periodic structure unit, to set up a cuboid air shell that is of a size of 30mm * 30mm * 12mm.The lower surface of cuboid overlaps with the upper surface of EBG structure sheaf in the EBG structure.On the upper surface of cuboid air shell, set up the PML layer, thereby reach the purpose of simulation infinite space, the electromagnetic wave that is transferred to the truncated position, border is absorbed by the border and do not produce reflection, the thickness of PML layer is 15mm.Set up the cuboid air shell of a 30mm * 30mm * 27.4mm, its upper surface is overlapped with the upper surface of PML layer, lower surface overlaps with the stratum lower surface of EBG structure.For realizing EBG construction unit cycle endless condition, the border, four sides of model is set to principal and subordinate's boundary condition, and the simulation model of foundation is as shown in Figure 4.The dispersion map simulation result that obtains is as shown in Figure 5.Can find out that by the dispersion map simulation result bandgap range is distributed in 800MHz to 10GHz, even higher upper cut-off frequency.
Step 4: the periodic structure unit of the compound coplane EBG layer that step 1 is obtained is along X, and the Y direction is done periodic extension and obtained compound coplane EBG layer.Use the figure translation functions in the modeling of HFSS simulation software; With the periodic structure unit of the compound coplane EBG layer that obtains in the step 1 along X; The Y direction is done periodic extension; The translation distance of X and Y direction figure is 30mm, and the cross spiral FSS structure sheaf after the translation is 3 * 3 structural plan, and is as shown in Figure 6.
Step 5: the dielectric layer of setting up the EBG structure.Compound coplane EBG structure sheaf is embedded in the substrate of medium.At first make the cuboid of a 90mm * 90mm * 0.4mm with the drawing tool in the HFSS simulation software, the lower surface of cuboid end face and compound coplane EBG structure sheaf overlaps.It is 4.3 that the cuboid material is set to dielectric constant, and magnetic permeability is 1, and loss angle tangent is 0.02.And then make the rectangle of a 90mm * 90mm with the drawing tool in the HFSS software, with its stratum as the EBG structure.Rectangle upper surface and cuboid bottom surface overlap.So just obtain a compound coplane EBG structure of adding dielectric layer, as shown in Figure 7.
Step 6: add the S parameter that emulated port is calculated the EBG structure.For simulation calculation with test out the type electromagnetic bandgap structure that compacts to the effect of power distribution system Noise Suppression, use HFSS to add two discrete ports in the power plane corresponding position.The rectangular coordinate initial point is positioned at the upper left side of Fig. 6, input port port1 (excitation port) and output port port2 be positioned at successively respectively (30mm, 10mm) (30mm, 50mm) as shown in Figure 7.Simulation result figure is as shown in Figure 8.The novel plane EBG structure that can be found out design by the S parameter has tangible band gap properties.When suppressing the degree of depth be-during 30dB, bandgap range is from 800MHz to 10GHz even higher, with dispersion map simulation architecture basically identical.
Step 7: actual making sheet is also tested the transmission characteristic of NEW TYPE OF COMPOSITE coplane EBG structure.According to the optimal size that step 5 is confirmed, processing and fabricating electromagnetic bandgap structure.Use the processes electromagnetic bandgap structure of the present invention of circuit board etching.Here select the FR4 base material for use, dielectric constant is 4.3, and thickness is 0.4mm, and the material upper and lower surfaces is a copper film.The hole is got through in the position that simulation model points out to add discrete port in step 6, uses the SMA head to carry out feed, and the coaxial probe of SMA head is welded on the electromagnetic bandgap structure plane, and the earth terminal of SMA head is welded on ground plane (complete deposited copper plane).The outer conductor end face directly contacts with ground level, makes the insertion loss drop to minimum.Use the Amway vector network analyzer to test, scanning frequency is set to the 0-10GHz test result and is directly read by the GPIB card, and test result is as shown in Figure 9.
Claims (2)
1. electromagnetic bandgap structure of optimizing the pcb board power distribution network; It is characterized in that: it is a kind of compound coplane EBG structure; This structure is a periodic structure; Its periodic unit shape is one and is connected by the narrow bridge shapes of four large scales that the metal branches are connected the metal branch with the identical shaped narrow bridge shape of eight small sizes and the square metal paster constitutes; The connected mode of each periodic unit is to utilize the narrow bridge shape on each limit of periodic unit to connect the metal branch to connect, and this narrow bridge shape connects the rectangle that is shaped as of metal branch, couples together across two EBG construction units and with the square metal paster of two EBG construction units; The Simulation Calculation of this structure is by bus plane, and dielectric layer and stratum constitute, and bus plane is that the EBG plane layer is positioned at top layer, and the stratum is positioned at bottom, and the centre is a dielectric layer; This bus plane is the EBG plane of compound coplane, and this stratum is complete metal flat, and this dielectric layer is the FR4 dielectric material.
2. construction method of optimizing the electromagnetic bandgap structure of pcb board power distribution network, it is characterized in that: these method concrete steps are following:
Step 1: the periodic structure elementary layer of setting up the compound coplane EBG layer of a zero thickness;
Step 2: the dielectric layer of setting up the periodic structure unit of compound coplane EBG layer;
Step 3: set up compound coplane EBG periodic structure unit dispersion map simulation model;
Step 4: the periodic structure unit of the compound coplane EBG layer that step 1 is obtained is along X, and the Y direction is done periodic extension and obtained compound coplane EBG layer;
Step 5: set up the dielectric layer of EBG structure, compound coplane EBG structure sheaf is embedded in the substrate of medium;
Step 6: add the S parameter that emulated port is calculated the EBG structure;
Step 7: actual making sheet is also tested the transmission characteristic of NEW TYPE OF COMPOSITE coplane EBG structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102943213A CN102361533B (en) | 2011-09-30 | 2011-09-30 | Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102943213A CN102361533B (en) | 2011-09-30 | 2011-09-30 | Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102361533A true CN102361533A (en) | 2012-02-22 |
| CN102361533B CN102361533B (en) | 2013-11-13 |
Family
ID=45586785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102943213A Active CN102361533B (en) | 2011-09-30 | 2011-09-30 | Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102361533B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630127A (en) * | 2012-04-01 | 2012-08-08 | 北京航空航天大学 | Embedded snake-shaped plane electromagnetic bandgap structure and construction method thereof |
| CN103683904A (en) * | 2013-12-09 | 2014-03-26 | 上海交通大学 | Power source distribution network with small electromagnetic band gap structure units |
| CN106645909A (en) * | 2016-12-20 | 2017-05-10 | 中国电子科技集团公司第五十四研究所 | Power supply noise suppression device based on embedded capacitor substrate |
| CN107135606A (en) * | 2017-06-09 | 2017-09-05 | 郑州云海信息技术有限公司 | It is a kind of to improve the method for PCB Power Integrities using full cavity model |
| CN107256309A (en) * | 2017-06-09 | 2017-10-17 | 郑州云海信息技术有限公司 | A kind of SI, PI and EMC collaborative design method of high performance PCB |
| CN107301290A (en) * | 2017-06-20 | 2017-10-27 | 西安交通大学 | A kind of power distribution network growth formula Topology Optimization Method of electro-magnetic bandgap power panel |
| CN107402383A (en) * | 2017-09-11 | 2017-11-28 | 重庆邮电大学 | A kind of bi-phase modulated plate and method for implementing radar frequency spectrum shift |
| CN107490732A (en) * | 2016-06-13 | 2017-12-19 | 株式会社村田制作所 | Transmission characteristic assay method and transmission characteristic measure device |
| CN107896420A (en) * | 2017-11-10 | 2018-04-10 | 英业达科技有限公司 | Circuit board and its electromagnetic bandgap structure |
| CN108777360A (en) * | 2018-06-05 | 2018-11-09 | 海宁利伊电子科技有限公司 | The extremely stable high performance communication antenna house of angle based on strong coupled mechanism |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1787281A (en) * | 2004-12-09 | 2006-06-14 | 上海方盛信息科技有限责任公司 | Electromagnetic forbidden band structure material |
| US20100156523A1 (en) * | 2008-12-23 | 2010-06-24 | Jong Hwa Kwon | Arrangement structure of electromagnetic band-gap for suppressing noise and improving signal integrity |
| CN102033976A (en) * | 2010-09-17 | 2011-04-27 | 北京航空航天大学 | Compact electromagnetic band gap structure for avoiding high-speed circuit noise |
-
2011
- 2011-09-30 CN CN2011102943213A patent/CN102361533B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1787281A (en) * | 2004-12-09 | 2006-06-14 | 上海方盛信息科技有限责任公司 | Electromagnetic forbidden band structure material |
| US20100156523A1 (en) * | 2008-12-23 | 2010-06-24 | Jong Hwa Kwon | Arrangement structure of electromagnetic band-gap for suppressing noise and improving signal integrity |
| CN102033976A (en) * | 2010-09-17 | 2011-04-27 | 北京航空航天大学 | Compact electromagnetic band gap structure for avoiding high-speed circuit noise |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630127B (en) * | 2012-04-01 | 2014-11-05 | 北京航空航天大学 | Embedded snake-shaped plane electromagnetic bandgap structure and construction method thereof |
| CN102630127A (en) * | 2012-04-01 | 2012-08-08 | 北京航空航天大学 | Embedded snake-shaped plane electromagnetic bandgap structure and construction method thereof |
| CN103683904A (en) * | 2013-12-09 | 2014-03-26 | 上海交通大学 | Power source distribution network with small electromagnetic band gap structure units |
| CN107490732B (en) * | 2016-06-13 | 2019-11-29 | 株式会社村田制作所 | Transmission characteristic measuring method and transmission characteristic measurement device |
| CN107490732A (en) * | 2016-06-13 | 2017-12-19 | 株式会社村田制作所 | Transmission characteristic assay method and transmission characteristic measure device |
| CN106645909B (en) * | 2016-12-20 | 2019-03-29 | 中国电子科技集团公司第五十四研究所 | Power supply rejection device based on embedded capacitance substrate |
| CN106645909A (en) * | 2016-12-20 | 2017-05-10 | 中国电子科技集团公司第五十四研究所 | Power supply noise suppression device based on embedded capacitor substrate |
| CN107135606A (en) * | 2017-06-09 | 2017-09-05 | 郑州云海信息技术有限公司 | It is a kind of to improve the method for PCB Power Integrities using full cavity model |
| CN107256309A (en) * | 2017-06-09 | 2017-10-17 | 郑州云海信息技术有限公司 | A kind of SI, PI and EMC collaborative design method of high performance PCB |
| CN107301290A (en) * | 2017-06-20 | 2017-10-27 | 西安交通大学 | A kind of power distribution network growth formula Topology Optimization Method of electro-magnetic bandgap power panel |
| CN107301290B (en) * | 2017-06-20 | 2020-07-10 | 西安交通大学 | Power distribution network growth type topology optimization method of electromagnetic band gap power panel |
| CN107402383A (en) * | 2017-09-11 | 2017-11-28 | 重庆邮电大学 | A kind of bi-phase modulated plate and method for implementing radar frequency spectrum shift |
| CN107896420A (en) * | 2017-11-10 | 2018-04-10 | 英业达科技有限公司 | Circuit board and its electromagnetic bandgap structure |
| CN107896420B (en) * | 2017-11-10 | 2020-02-28 | 英业达科技有限公司 | Circuit board and electromagnetic band gap structure thereof |
| CN108777360A (en) * | 2018-06-05 | 2018-11-09 | 海宁利伊电子科技有限公司 | The extremely stable high performance communication antenna house of angle based on strong coupled mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102361533B (en) | 2013-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102361533B (en) | Electromagnetic band gap structure for optimizing power distribution network of PCB (printed circuit board) and construction method thereof | |
| CN102176543B (en) | Cross spiral frequency selective surface (FSS) structure with dual band characteristics and construction method thereof | |
| So et al. | Modeling of metamaterials with negative refractive index using 2-D shunt and 3-D SCN TLM networks | |
| CN202310276U (en) | Electromagnetic band gap structure of optimized PCB PDN | |
| CN102630127B (en) | Embedded snake-shaped plane electromagnetic bandgap structure and construction method thereof | |
| CN107565223A (en) | A kind of stealthy random surface of ultra wide band complete polarization and its design method | |
| Mohajer-Iravani et al. | Wideband circuit model for planar EBG structures | |
| CN106887661A (en) | Slow wave substrate integration wave-guide based on the loading of lumped parameter inductance | |
| Hassan et al. | Modeling and design empirical formulas of microstrip ridge gap waveguide | |
| Shi et al. | Ultra-wideband suppression of power/ground noise in high-speed circuits using a novel electromagnetic bandgap power plane | |
| Wu et al. | Mitigation of noise coupling in multilayer high-speed PCB: State of the art modeling methodology and EBG technology | |
| Selga et al. | Synthesis of split-rings-based artificial transmission lines through a new two-step, fast converging, and robust aggressive space mapping (ASM) algorithm | |
| CN102694221A (en) | Miniature embedded S-shaped bridge plane electromagnetic bandgap structure and building method thereof | |
| Rudolph et al. | The design of broadband, volumetric NRI media using multiconductor transmission-line analysis | |
| Feng et al. | Electromagnetic wave propagation in anisotropic metamaterials created by a set of periodic inductor-capacitor circuit networks | |
| Boutejdar et al. | Compensating for DGS filter loss | |
| CN102395245B (en) | U-shaped electromagnetic band gap circuit board with low-frequency simultaneous switching noise inhibiting function | |
| CN102033976B (en) | Compact electromagnetic band gap structure for avoiding high-speed circuit noise | |
| Joo et al. | Design and modeling of hybrid uniplanar electromagnetic bandgap power planes for wide-band noise suppression on printed circuit boards | |
| Mollah et al. | Investigation of novel tapered hybrid defected ground structure (DGS) | |
| Huang et al. | A hierarchical tree shaped power distribution network based on constructal theory for EBG structure power plane | |
| Saleh et al. | Four-leaf-clover-shaped EBG structure to improve the H/E field ratio of stripline coil for 7 Tesla MRI | |
| CN101983006A (en) | Construction method of compact electromagnetic band gap (EBG) structure for eliminating high speed circuit noise | |
| Li et al. | A novel EBG planar for high speed PCB EMI rejection | |
| Li et al. | Numerical modeling and de-embedding of non-planar periodic guided-wave structures via short-open calibration in 3-D FEM algorithm |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |