CN219695703U - Industrial chassis with heat pipe - Google Patents
Industrial chassis with heat pipe Download PDFInfo
- Publication number
- CN219695703U CN219695703U CN202320782572.4U CN202320782572U CN219695703U CN 219695703 U CN219695703 U CN 219695703U CN 202320782572 U CN202320782572 U CN 202320782572U CN 219695703 U CN219695703 U CN 219695703U
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- China
- Prior art keywords
- heat pipe
- case
- printed board
- heat
- industrial
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 108010038204 cytoplasmic linker protein 190 Proteins 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the field of industrial cabinets, in particular to an industrial cabinet with a heat pipe, which comprises: the device comprises a case, wherein a substrate and a printed board are arranged in the case, a chip assembly is arranged on the printed board, and clamping side grooves are oppositely formed in the inner wall of the case; the heat pipe is arranged between the base plate and the printed board, and the base plate and the printed board are vertically fixed in the chassis through the clamping side grooves. The heat pipe is arranged between the substrate and the printed board, and the heat pipe is used for radiating the chip assembly on the printed board, so that the problem of poor cooling and radiating of the closed chassis is solved; and the base plate and the printed board are vertically fixed in the chassis through the clamping side grooves, so that the heat pipe is firmly clamped, and the heat pipe is tightly attached to the chip assembly of the printed board to efficiently dissipate heat.
Description
Technical Field
The utility model relates to the field of industrial cabinets, in particular to an industrial cabinet with a heat pipe.
Background
The chassis plays an important role in many industrial fields. Meanwhile, the heat dissipation of the case is difficult, and particularly, the closed case is extremely easy to form a closed high-temperature environment in the case, so that the electric elements in the case are greatly damaged. With global climate change, extremely high temperature environments are also becoming more frequent, and the operating environment of industrial equipment is becoming worse, and how to effectively cool the chassis and protect the internal electronics is important. The existing case cannot be used for radiating heat and guaranteeing the safety of internal devices and the installation practicability.
The disclosed patent relates to a heat radiation structure of an industrial computer, which comprises a U-shaped computer case, dust isolation clamping frames are fixedly arranged on the periphery of two sides of the U-shaped computer case, ventilation windows are formed in the middle of two sides of the U-shaped computer case, dust isolation components are fixedly clamped and connected in the two dust isolation clamping frames, and folded circulating heat pipes are fixedly arranged in the two ventilation windows. According to the heat radiation structure of the industrial computer, the heat radiation fan and the heat exchange liquid are matched to radiate heat of the computer host, but the heat radiation structure is not suitable for the closed type case and has poor cooling effect.
Disclosure of Invention
The utility model provides an industrial case with a heat pipe, which aims to overcome the defect of heat dissipation of the case in the prior art.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
the utility model provides an industrial case with a heat pipe, which comprises: the device comprises a case, wherein a substrate and a printed board are arranged in the case, a chip assembly is arranged on the printed board, and clamping side grooves are oppositely formed in the inner wall of the case; the heat pipe is arranged between the base plate and the printed board, and the base plate and the printed board are vertically fixed in the chassis through the clamping side grooves.
Through the technical scheme, the heat pipe is a phase change process of condensing the medium at the cold end after evaporating at the hot end, namely, the heat is quickly conducted by utilizing the evaporation latent heat and the condensation latent heat of the liquid. A typical heat pipe consists of a tube shell, a wick, and an end cap. The heat pipe is pumped into negative pressure state and filled with proper liquid with low boiling point and easy volatilization. The walls of the tube have a wick that is constructed of a capillary porous material. One end of the heat pipe is a evaporation end, the other end of the heat pipe is a condensation end, when one end of the heat pipe is heated, liquid in the capillary tube is rapidly vaporized, vapor flows to the other end under the power of thermal diffusion, heat is released by condensation at the cold end, and the liquid flows back to the evaporation end along the porous material by capillary action, so that the circulation is not only performed until the temperatures at the two ends of the heat pipe are equal, and the thermal diffusion of the vapor stops at the moment. This cycle is rapid and heat is conducted continuously.
The heat pipe is arranged between the substrate and the printed board, and the heat pipe is used for radiating heat of the chip assembly on the printed board. The heat pipe is closely attached to a chip component of the printed board to conduct heat to the wall of the chassis for heat dissipation at high speed and high efficiency, so that the problem of poor cooling and heat dissipation of the closed chassis is solved.
In detail, the heat pipe may be welded to the substrate, or may be glued to the substrate by high temperature glue, or may be fixed to the substrate by a small structure with screws or a pressing plate.
Preferably, the inner wall of the case is provided with a plurality of groups of opposite clamping side grooves, and a plurality of groups of substrates and printed boards are clamped on the clamping side grooves which are designed oppositely.
Preferably, the case includes an upper cover, a lower cover, and a housing, the upper cover and the lower cover being respectively fixed to a top and a bottom of the housing.
Preferably, the upper cover and the lower cover are locked and fixed with the shell through a straight locking clamp or a C-shaped locking clamp.
Preferably, there are several groups of the chip components, and several of the heat pipes are fixed on the substrate corresponding to several of the chip components.
Preferably, the base plate is provided with a clamping groove for fixing the heat pipe.
Preferably, the heat pipes are arranged at the chip assembly with the largest power preferentially.
Preferably, a heat conducting pad is arranged between the chip assembly and the substrate.
Preferably, the heat pipe is a flat heat pipe.
Preferably, a copper sheet for heat dissipation is arranged on the heat pipe, and the copper sheet connects the chip assembly to the heat pipe.
Compared with the prior art, the technical scheme of the utility model has the beneficial effects that:
the utility model provides an industrial case with a heat pipe, which comprises: the device comprises a case, wherein a substrate and a printed board are arranged in the case, a chip assembly is arranged on the printed board, and clamping side grooves are oppositely formed in the inner wall of the case; the heat pipe is arranged between the base plate and the printed board, and the base plate and the printed board are vertically fixed in the chassis through the clamping side grooves.
The heat pipe is arranged between the substrate and the printed board, and the heat pipe is used for radiating the chip assembly on the printed board, so that the problem of poor cooling and radiating of the closed chassis is solved; and the base plate and the printed board are vertically fixed in the chassis through the clamping side grooves, so that the heat pipe is firmly clamped, and the heat pipe is tightly attached to the chip assembly of the printed board to efficiently dissipate heat.
Drawings
FIG. 1 is a schematic diagram of an industrial case with heat pipes.
FIG. 2 is an exploded view of an industrial housing with heat pipes.
Wherein: 100. a chassis; 110. a substrate; 111. a clamping groove; 120. a printed board; 130. a chip assembly; 140. a clamping side groove; 150. a heat pipe; 160. an upper cover; 170. a lower cover; 180. a housing; 190. c-shaped locking clamp.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, based on the described embodiments, which a person of ordinary skill in the art would obtain without inventive faculty, are within the scope of the utility model.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
As shown in fig. 1-2, the disclosure of the present embodiment provides an industrial chassis with a heat pipe, which includes: the case 100, wherein a substrate 110 and a printed board 120 are arranged in the case 100, a chip assembly 130 is arranged on the printed board 120, and a clamping side groove 140 is oppositely arranged on the inner wall of the case 100; a heat pipe 150 is disposed between the substrate 110 and the printed board 120, and the substrate 110 and the printed board 120 are vertically fixed in the chassis 100 through the clamping side groove 140.
In detail, by arranging the heat pipe 150 between the substrate 110 and the printed board 120, the heat pipe 150 dissipates heat of the chip assembly 130 on the printed board 120, thereby solving the problem of poor cooling and heat dissipation of the closed chassis 100; and the base plate 110 and the printed board 120 are vertically fixed in the chassis 100 through the clamping side groove 140, so that the heat pipe 150 is firmly clamped, and the heat pipe 150 is tightly attached to the chip assembly 130 of the printed board 120 to efficiently dissipate heat.
In a specific implementation process, the inner wall of the chassis 100 is provided with a plurality of sets of opposite clamping side grooves 140, and a plurality of sets of substrates 110 and printed boards 120 are clamped in the plurality of sets of opposite clamping side grooves 140.
In an implementation, the chassis 100 includes an upper cover 160, a lower cover 170, and a housing 180, where the upper cover 160 and the lower cover 170 are respectively fixed to the top and bottom of the housing 180.
In a specific implementation process, the upper cover 160 and the lower cover 170 are locked and fixed with the housing 180 by a straight locking clip or a C-shaped locking clip 190. In the present embodiment, the upper and lower covers 160 and 170 are locked and fixed with the housing 180 by a straight type locking clip. In other embodiments, a C-clamp 190 may be used for locking; or sealing the case by sealing glue.
In a specific implementation, there are several groups of the chip assemblies 130, and several heat pipes 150 are fixed on the substrate 110 corresponding to several chip assemblies 130.
In a specific implementation process, the substrate 110 is provided with a clamping groove 111 for fixing the heat pipe 150.
In an implementation, the heat pipes 150 are preferably arranged at the chip assembly 130 with the highest power.
In detail, when there are a plurality of chip assemblies 130, the heat pipe 150 passes through the chip assemblies 130 overlapped with the heat pipe 150 as much as possible when the chip assemblies 130 overlap with the heat pipe 150. In the event that heat pipes 150 cannot all pass through chip assembly 130, high power chip assembly 130 is preferred. In the event that neither heat pipe 150 can pass through chip assembly 130, it is preferable to be close to high power chip assembly 130.
In an implementation, a thermal pad is disposed between the chip assembly 130 and the substrate 110.
In a specific implementation process, the heat conducting pipe is a flat heat conducting pipe. In this embodiment, the heat pipe is a flat heat pipe. In other embodiments, the heat pipe may be circular or flat.
In a specific implementation, the heat pipe 150 is provided with a copper sheet for heat dissipation, and the copper sheet connects the chip 130 to the heat pipe. In this embodiment, the copper sheet is closely attached to the chip assembly 130 and/or the heat pipe 150, so as to dissipate heat of the chip assembly 130 and/or the heat pipe 150 and strengthen the heat dissipation effect. In other embodiments, the heat dissipating copper sheet may also be in a fin structure vertically disposed on the heat pipe 150 to dissipate heat of the heat pipe 150.
The working principle of the industrial case with the heat pipe in the embodiment is as follows:
when the cabinet 100 is installed, the heat pipe 150 is disposed between the substrate 110 and the printed board 120, and the substrate 110 and the printed board 120 are vertically fixed in the cabinet 100 through the clamping side groove 140, and then the upper cover 160 and the lower cover 170 are locked through the C-shaped locking clamp 190, so that the cabinet 100 with a closed space is formed.
In the sealed enclosure 100, the heat pipe 150 starts to efficiently dissipate heat from the chip assembly 130 when the chip assembly 130 is in operation.
In this embodiment, the heat pipe 150 is disposed between the substrate 110 and the printed board 120, and the heat pipe 150 dissipates heat of the chip assembly 130 on the printed board 120, so as to solve the problem of poor cooling and heat dissipation of the closed chassis 100; and the base plate 110 and the printed board 120 are vertically fixed in the chassis 100 through the clamping side groove 140, so that the heat pipe 150 is firmly clamped, and the heat pipe 150 is tightly attached to the chip assembly 130 of the printed board 120 to efficiently dissipate heat.
It should be apparent that the above examples of the present utility model are merely illustrative of the present utility model and are not intended to limit the embodiments of the present utility model. Other variations or modifications of the above utility model will be apparent to those of ordinary skill in the art, based on the above teachings. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (10)
1. An industrial enclosure with a heat pipe, comprising: the electronic device comprises a case (100), wherein a substrate (110) and a printed board (120) are arranged in the case (100), a chip assembly (130) is arranged on the printed board (120), and a clamping side groove (140) is oppositely formed in the inner wall of the case (100);
a heat pipe (150) is arranged between the base plate (110) and the printed board (120), and the base plate (110) and the printed board (120) are vertically fixed in the case (100) through the clamping side groove (140).
2. The industrial case with the heat pipe according to claim 1, wherein a plurality of sets of opposite clamping side grooves (140) are formed in the inner wall of the case (100), and a plurality of sets of substrates (110) and printed boards (120) are clamped on the plurality of sets of opposite clamping side grooves (140).
3. The industrial case with heat pipe according to claim 1, wherein the case (100) comprises an upper cover (160), a lower cover (170) and a housing (180), and the upper cover (160) and the lower cover (170) are respectively fixed to the top and the bottom of the housing (180).
4. An industrial case with a heat pipe according to claim 3, wherein the upper cover (160) and the lower cover (170) are locked and fixed with the housing (180) by a straight locking clip or a C-shaped locking clip (190).
5. The industrial case with heat pipes according to claim 1, wherein there are several groups of the chip assemblies (130), and several of the heat pipes (150) are fixed on the substrate (110) corresponding to several of the chip assemblies (130).
6. The industrial case with heat pipes according to claim 5, wherein the base plate (110) is provided with a clamping groove (111) for fixing the heat pipe (150).
7. The industrial case with heat pipes according to claim 5, wherein the heat pipes (150) are preferentially arranged at the chip assembly (130) with the greatest power.
8. The industrial case with heat pipe according to claim 1, wherein a thermal pad is provided between the chip assembly (130) and the substrate (110).
9. The industrial case with heat pipe according to claim 1, wherein the heat pipe (150) is a flat heat pipe.
10. The industrial case with heat pipe according to claim 1, wherein the heat pipe (150) is provided with a copper sheet for heat dissipation, and the copper sheet connects the chip assembly (130) to the heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320782572.4U CN219695703U (en) | 2023-04-11 | 2023-04-11 | Industrial chassis with heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320782572.4U CN219695703U (en) | 2023-04-11 | 2023-04-11 | Industrial chassis with heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219695703U true CN219695703U (en) | 2023-09-15 |
Family
ID=87942773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320782572.4U Active CN219695703U (en) | 2023-04-11 | 2023-04-11 | Industrial chassis with heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219695703U (en) |
-
2023
- 2023-04-11 CN CN202320782572.4U patent/CN219695703U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |