CN219693485U - Performance strengthening device of evaporative cooling air conditioner - Google Patents
Performance strengthening device of evaporative cooling air conditioner Download PDFInfo
- Publication number
- CN219693485U CN219693485U CN202320754215.7U CN202320754215U CN219693485U CN 219693485 U CN219693485 U CN 219693485U CN 202320754215 U CN202320754215 U CN 202320754215U CN 219693485 U CN219693485 U CN 219693485U
- Authority
- CN
- China
- Prior art keywords
- licl
- cold water
- box
- water tank
- evaporative cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 40
- 238000005728 strengthening Methods 0.000 title claims description 4
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 claims abstract description 108
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 85
- 239000004065 semiconductor Substances 0.000 claims abstract description 52
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000005057 refrigeration Methods 0.000 claims abstract description 16
- 238000000926 separation method Methods 0.000 claims description 29
- 239000007921 spray Substances 0.000 claims description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- 229910001220 stainless steel Inorganic materials 0.000 claims description 9
- 239000010935 stainless steel Substances 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 5
- 229920000742 Cotton Polymers 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000005192 partition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model provides a performance enhancement device of an evaporative cooling air conditioner, and particularly relates to the technical field of evaporative cooling. The utility model provides an evaporative cooling air conditioner performance enhancement device, includes box shell, liCl concentrated solution case, cold water tank, liCl thin solution heating box, liCl thin solution case, and the inside LiCl concentrated solution case, cold water tank, liCl thin solution heating box, liCl thin solution case that is provided with of box shell, and the cold water tank outside is provided with cold water tank shell. The utility model has the beneficial effects that: the semiconductor refrigeration device has the advantages of no noise, no vibration, small volume, light weight, reliable operation, simple and convenient operation, long service life, no need of refrigerant, rapid refrigeration, accurate temperature control, environmental protection and the like, the semiconductor refrigeration piece is used for preparing cold water with lower temperature to be supplied to the evaporative cooling air conditioner, and meanwhile, the high energy efficiency ratio of the semiconductor refrigeration piece is ensured, and the heat end of the semiconductor refrigeration piece on the wall of the cold water tank is cooled by adopting a mode that LiCl dilute solution absorbs heat generated by the heat end.
Description
Technical Field
The utility model mainly relates to the technical field of evaporative cooling, in particular to a performance strengthening device of an evaporative cooling air conditioner.
Background
The evaporative cooling technology utilizes the dry and wet bulb temperature difference of air in natural environment to obtain cold energy, takes water as a refrigerant, and when the air in an unsaturated state is contacted with the water, the water evaporates to reduce the temperature of the air or the water temperature, so that the energy-saving, low-carbon, economical and healthy refrigeration air conditioning technology is developed and perfected gradually in recent years.
However, the independent evaporative cooling system still faces some difficulties in operation, the driving force of evaporative cooling is the difference between the dry bulb temperature and the wet bulb temperature or the dew point temperature, which depends on climate conditions, so that the cooling potential of the evaporative cooling system is limited, and especially in humid or temperate climate areas, the temperature of air and circulating water prepared by the evaporative cooling system can only approach the wet bulb temperature or the dew point temperature of the air to be treated theoretically, the cooling capacity is low, the air temperature is reduced less, the size is larger, and therefore, the exploration of combining the evaporative cooling system with other types of cooling systems is of great significance, and the semiconductor refrigeration has certain advantages compared with other refrigeration modes, so that the utility model provides an evaporative cooling air conditioner performance enhancing device utilizing the semiconductor refrigeration.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model provides the evaporative cooling air conditioner performance enhancement device which is novel in structural design, convenient to use and environment-friendly.
The utility model aims to achieve the aim, and the aim is achieved by the following technical scheme:
the utility model provides an evaporative cooling air conditioner performance enhancement device, includes box shell, liCl concentrated solution case, cold water tank, liCl thin solution heating box, liCl thin solution case, its characterized in that, box shell inside is provided with LiCl concentrated solution case, cold water tank, liCl thin solution heating box, liCl thin solution case, the cold water tank outside is provided with the cold water tank shell, the cold water tank is located the middle part of whole box shell.
Four area separation risers with different heights are arranged in the box body shell and are a box body left upper area separation riser, a box body middle upper area separation riser 5, a box body right lower area separation riser and a box body left lower area separation riser 5, the box body left upper area separation riser separates a LiCl thin solution box and a LiCl thick solution box, the box body right lower area separation riser separates a LiCl thin solution heating box and a LiCl thick solution box, and the box body left lower area separation riser 5 separates the LiCl thin solution box and the LiCl thin solution heating box.
The LiCl dilute solution tank is internally provided with a spray device consisting of a spray pipe and a spray head, an air inlet is formed in the outer wall of the shell of the tank body below the spray pipe, a resistance wire and a circulating water pump are arranged in the LiCl concentrated solution tank, and the circulating water pump is connected with the spray pipe in the LiCl dilute solution tank by connecting a stainless steel pipe.
The four walls of the cold water tank are composed of a cold water tank outer shell, a semiconductor module and a cold water tank inner shell, the cold water tank outer shell and the cold water tank inner shell are made of aluminum plates, an aluminum strip is arranged on the periphery of the cold water tank outer shell on the semiconductor module, corresponding threaded holes are formed in the positions, corresponding to the aluminum strip and the aluminum plate, of the semiconductor refrigerating sheets, the inner walls of the cold water tank outer shell are connected in series, heat insulation cotton is filled in the periphery of each semiconductor refrigerating sheet, heat conduction silicone grease is evenly coated on the cold end surface and the hot end surface of each semiconductor refrigerating sheet, the cold water tank inner shell is finally covered, and the semiconductor refrigerating sheets are fixed and connected through bolts.
The upper region separation vertical plate in the box body is higher than the left lower region separation vertical plate of the box body and the right lower region separation vertical plate of the box body.
The whole box body shell and the four area separation vertical plates are made of stainless steel plates.
And a cold water spray device is arranged in the cold water tank, so that the cold water of the air conditioner can be conveniently used for evaporative cooling in the later stage.
The semiconductor refrigerating piece is positioned on the semiconductor module, the cold end of the semiconductor refrigerating piece faces the inner shell of the cold water tank, and the hot end of the semiconductor refrigerating piece faces the outer shell of the cold water tank.
Compared with the prior art, the utility model has the beneficial effects that:
1. the performance enhancement device of the evaporative cooling air conditioner has the advantages of no noise, no vibration, small volume, light weight, reliable work, simple and convenient operation, long service life, no need of refrigerant, rapid refrigeration, accurate temperature control, environmental protection and the like by adopting semiconductor refrigeration.
2. The performance enhancement device of the evaporative cooling air conditioner utilizes the semiconductor refrigerating sheet to prepare cold water with lower temperature to be supplied to the evaporative cooling air conditioner, and simultaneously ensures higher energy efficiency ratio. Water is used as both refrigerant and secondary refrigerant to replace traditional refrigerant, and has positive effect of improving environment.
3. The utility model relates to a performance enhancement device of an evaporative cooling air conditioner, wherein the hot end of a semiconductor refrigerating sheet on the wall of a cold water tank dissipates heat in a way that LiCl dilute solution absorbs heat generated by the hot end. The heat dissipation mode has good heat dissipation effect, does not generate electric power and has good energy saving effect.
4. According to the performance enhancement device for the evaporative cooling air conditioner, the LiCl solution is regenerated by heat and mass exchange with the wet air, the wet air is dehumidified, and the dehumidified air is introduced into the evaporative cooling air conditioner, so that the evaporative cooling air conditioner can meet the requirements of higher occasions.
5. The performance enhancement device for the evaporative cooling air conditioner reduces the consumption of electric power by utilizing the overflow mode of concentration difference in the flowing mode of LiCl solution.
Drawings
FIG. 1 is a schematic diagram of a three-dimensional system according to the present utility model;
FIG. 2 is a schematic flow diagram of LiCl solution of the present utility model;
FIG. 3 is a schematic diagram of a semiconductor module structure;
fig. 4 is a schematic structural view of a semiconductor refrigeration sheet.
The reference numbers shown in the drawings: 1. a case housing; 2. stainless steel plate material; 3. the upper left side area of the box body is divided into vertical plates; 4. stainless steel tube; 5. the upper region of the box body separates the riser; 6. a cold water tank housing; 7. a cold water tank inner shell; 8. a circulating water pump; 9. a resistance wire; 10. a cold water spray device; 11. LiCl concentrated solution tank; 12. the right lower side area of the box body is divided into a vertical plate; 13. a cold water tank; 14. a LiCl dilute solution heating box; 15. the left lower side area of the box body is divided into a vertical plate; 16. a LiCl dilute solution tank; 17. a shower pipe; 18. a spray head; 19. an air inlet; 20. a wire outlet; 21. a semiconductor refrigeration sheet; 22. thermal insulation cotton; 23. an aluminum strip; 24. and (3) a threaded hole.
Detailed Description
The utility model will be further described with reference to the accompanying drawings and specific embodiments. It is to be understood that these examples are illustrative of the present utility model and are not intended to limit the scope of the present utility model. Further, it will be understood that various changes and modifications may be made by those skilled in the art after reading the teachings of the utility model, and equivalents thereof fall within the scope of the utility model as defined by the claims.
Standard parts used in the utility model can be purchased from the market, special-shaped parts can be customized according to the description of the specification and the drawings, the specific connection modes of the parts adopt conventional means such as mature bolts, rivets, welding, pasting and the like in the prior art, and meanwhile, in order to clearly express the connection relation and working principle among the components, the drawings of the specification are arranged and drawn in a mode of a mechanism motion diagram, and are not described in detail.
The utility model provides an evaporative cooling air conditioner performance enhancement device, includes box shell 1, liCl concentrated solution case 11, cold water tank 13, liCl thin solution heating case 14, liCl thin solution case 16, and box shell 1 inside is provided with LiCl concentrated solution case 11, cold water tank 13, liCl thin solution heating case 14, liCl thin solution case 16, and cold water tank 13 outside is provided with cold water tank shell 6, and cold water tank 13 is located the middle part of whole box shell 1.
Four area separation risers with different heights are arranged inside the box shell 1 and are a box left upper area separation riser 3, a box middle upper area separation riser 5, a box right lower area separation riser 12 and a box left lower area separation riser 15, the box left upper area separation riser 3 separates a LiCl dilute solution tank 16 and a LiCl concentrated solution tank 11, the box right lower area separation riser 12 separates a LiCl dilute solution heating tank 14 and a LiCl concentrated solution tank 11, and the box left lower area separation riser 15 separates the LiCl dilute solution tank 16 and the LiCl dilute solution heating tank 14.
The LiCl dilute solution tank 16 is internally provided with a spray device consisting of a spray pipe 17 and a spray head 18, an air inlet 19 is arranged on the outer wall of the shell of the tank body below the spray pipe 17, a resistance wire 9 and a circulating water pump 8 are arranged in the LiCl concentrated solution tank 11, and the circulating water pump 8 is connected with the spray pipe 17 in the LiCl dilute solution tank 16 by connecting a stainless steel pipe 4.
Further, as shown in the schematic structural diagram of the semiconductor module in fig. 3, four walls of the cold water tank 13 are each composed of a cold water tank outer shell 6, a semiconductor module and a cold water tank inner shell 7, the cold water tank outer shell 6 and the cold water tank inner shell 7 are made of aluminum plates, an aluminum strip 23 is arranged on the periphery of the cold water tank outer shell 6 on the semiconductor module, corresponding threaded holes 24 are formed in the positions corresponding to the aluminum strip 23 and the aluminum plate, the semiconductor refrigerating sheets 21 are connected in series on the inner wall of the cold water tank outer shell 6, heat insulation cotton 22 is filled around each semiconductor refrigerating sheet 21, heat conduction silicone grease is uniformly coated on the cold end surface and the hot end surface of the semiconductor refrigerating sheet 21, finally the upper cold water tank inner shell 7 is covered, the semiconductor refrigerating sheets are formed by adopting a plurality of N-type semiconductors and a P-type semiconductor, the semiconductor refrigerating sheets are located on the semiconductor module, the refrigerating end surfaces of the semiconductor refrigerating sheets face the cold water tank inner shell 7, the refrigerating end surfaces of the semiconductor refrigerating sheets face the cold water tank outer shell 6, after direct current power is added, one end of the semiconductor refrigerating sheets and one end of the semiconductor refrigerating sheets are heated by using the peltier effect, the semiconductor refrigerating sheets are heated, the thin LiCl solution in the cooling water tank 13 is heated by the thin solution in the cooling tank 13.
Further, the upper-region partition riser 5 and the cold water tank case 6 in the tank are identical in height and higher than the lower-left-side-region partition riser 15 and the lower-right-side-region partition riser 12.
As optimization, the whole case housing 1 and four area separation risers are composed of stainless steel plates,
further, a cold water spray device 10 is arranged in the cold water tank 13, so that cold water of the air conditioner can be conveniently introduced in the later stage of evaporative cooling.
Further, the semiconductor refrigerating piece 21 is located on the semiconductor module, the cold end of the semiconductor refrigerating piece 21 faces the inner shell 7 of the cold water tank, and the hot end of the semiconductor refrigerating piece 21 faces the outer shell 6 of the cold water tank.
The utility model relates to a working flow of a performance enhancement device of an evaporative cooling air conditioner, which comprises the following steps:
as shown in fig. 2, liCl thin solution in LiCl thin solution tank 16 overflows to LiCl thin solution heating tank 14, the hot end surface of semiconductor module on the wall of cold water tank 13 is heated, liCl thin solution concentration gradually increases, and overflows to LiCl thick solution tank 11 again, liCl thick solution is heated by resistance wire 9, the regulation of LiCl solution concentration is facilitated, heated LiCl thick solution flows into spray pipe 17 through stainless steel pipe 4 via circulating water pump 8, at this time, air inlet 19 on the left side wall of spray device enters wet air, wet air exchanges heat and humidity with LiCl thick solution in spray pipe 17, liCl thick solution is regenerated into LiCl thin solution, and at the same time dehumidifies the wet air, and the generated LiCl thin solution drops down to LiCl thin solution tank 16, thus circulating work.
Claims (6)
1. The evaporative cooling air conditioner performance strengthening device comprises a box body shell (1), a LiCl concentrated solution box (11), a cold water box (13), a LiCl thin solution heating box (14) and a LiCl thin solution box (16), and is characterized in that the LiCl concentrated solution box (11), the cold water box (13), the LiCl thin solution heating box (14) and the LiCl thin solution box (16) are arranged inside the box body shell (1), a cold water box shell (6) is arranged outside the cold water box (13), and the cold water box (13) is positioned in the middle of the whole box body shell (1);
four area separation vertical plates with different heights are arranged in the box shell (1) and are a box body upper left area separation vertical plate (3), a box body middle and upper area separation vertical plate (5), a box body lower right area separation vertical plate (12) and a box body lower left area separation vertical plate (15), the box body upper left area separation vertical plate (3) separates a LiCl thin solution box (16) and a LiCl thick solution box (11), the box body lower right area separation vertical plate (12) separates a LiCl thin solution heating box (14) and a LiCl thick solution box (11), and the box body lower left area separation vertical plate (15) separates the LiCl thin solution box (16) and the LiCl thin solution heating box (14);
the LiCl dilute solution tank (16) is internally provided with a spray device consisting of a spray pipe (17) and a spray head (18), an air inlet (19) is formed in the outer wall of the shell of the tank body below the spray pipe (17), a resistance wire (9) and a circulating water pump (8) are arranged in the LiCl concentrated solution tank (11), and the circulating water pump (8) is connected with the spray pipe (17) in the LiCl dilute solution tank (16) through a stainless steel pipe (4).
2. The evaporative cooling air conditioner performance enhancement device according to claim 1, wherein the four tank walls of the cold water tank (13) are composed of a cold water tank outer shell (6), a semiconductor module and a cold water tank inner shell (7), the cold water tank outer shell (6) and the cold water tank inner shell (7) are made of aluminum plates, an aluminum strip (23) is arranged on the periphery of the cold water tank outer shell (6) on the semiconductor module, corresponding threaded holes (24) are formed in the positions corresponding to the aluminum strip (23) and the aluminum plate, the semiconductor refrigerating sheets (21) are connected in series on the inner wall of the cold water tank outer shell (6), heat insulation cotton (22) is filled around each semiconductor refrigerating sheet (21), heat conduction silicone grease is uniformly smeared on the cold and hot end surfaces of the semiconductor refrigerating sheets (21), and finally the cold water tank inner shell (7) is covered, and the heat insulation silicone grease is fixed and connected through bolts.
3. The evaporative cooling air conditioner performance enhancement device according to claim 1, wherein the upper region dividing riser (5) in the tank body and the cold water tank case (6) are identical in height and higher than the lower left region dividing riser (15) and the lower right region dividing riser (12) in the tank body.
4. An evaporative cooling air conditioner performance enhancement device according to claim 1, wherein the entire housing (1) and four zone separating risers are comprised of stainless steel plates.
5. The evaporative cooling air conditioner performance enhancement device according to claim 1, wherein a cold water spray device (10) is arranged in the cold water tank (13) so as to facilitate the introduction of cold water of the evaporative cooling air conditioner in the later stage.
6. An evaporative cooling air conditioner performance enhancement device according to claim 2, wherein the semiconductor refrigeration sheet (21) is located on a semiconductor module, the cold end of the semiconductor refrigeration sheet (21) faces the cold water tank inner case (7), and the hot end of the semiconductor refrigeration sheet (21) faces the cold water tank outer case (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320754215.7U CN219693485U (en) | 2023-04-07 | 2023-04-07 | Performance strengthening device of evaporative cooling air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320754215.7U CN219693485U (en) | 2023-04-07 | 2023-04-07 | Performance strengthening device of evaporative cooling air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219693485U true CN219693485U (en) | 2023-09-15 |
Family
ID=87962146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320754215.7U Active CN219693485U (en) | 2023-04-07 | 2023-04-07 | Performance strengthening device of evaporative cooling air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219693485U (en) |
-
2023
- 2023-04-07 CN CN202320754215.7U patent/CN219693485U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100504249C (en) | Superposition type multilevel evaporation core body | |
| CN105737439A (en) | Air conditioner system utilizing solar energy and thermoelectricity supercooling device | |
| CN203442998U (en) | Airplane ground air conditioning unit | |
| CN103047724B (en) | Multi-energy complementally driven dehumidification air-conditioning system | |
| CN109378555B (en) | Electric automobile battery pack thermal management system based on absorption refrigeration technology | |
| CN219693485U (en) | Performance strengthening device of evaporative cooling air conditioner | |
| CN101592385B (en) | Absolute reverse flow plate-fin dew point indirect evaporation cooling and direct evaporation cooling combined air conditioner | |
| CN110836427A (en) | Elevator air conditioner adopting semiconductor refrigeration technology | |
| CN202350209U (en) | Semiconductor air conditioner | |
| CN213713626U (en) | Novel efficient energy-saving air conditioner evaporator | |
| CN211503093U (en) | Elevator air conditioner | |
| CN204786979U (en) | Indirect evaporative cooling air -conditioning unit of vertical high efficiency | |
| CN108076616B (en) | Photovoltaic centrifuge system | |
| CN208890147U (en) | A kind of power distribution cabinet | |
| CN110657536A (en) | Heat pipe heat exchange system suitable for computer lab | |
| CN208967953U (en) | A kind of efficient refrigeration system of pumping phase transformation circulation | |
| CN202915484U (en) | Solar energy electronic air-conditioner | |
| CN201104056Y (en) | Overlapping type multilevel evaporating core body | |
| CN205784692U (en) | Three dimension high efficiency evaporation and heat-exchange system | |
| CN208504569U (en) | Window-mounted air conditioner | |
| CN211424591U (en) | Heat pipe heat exchange system suitable for computer lab | |
| CN214148181U (en) | Water circulation heat dissipation device of refrigeration central air conditioner | |
| CN213542714U (en) | Natural layering water cold-storage central air conditioning system | |
| CN218966622U (en) | New material roof air conditioner for electric vehicle | |
| CN220355614U (en) | Solar auxiliary heat exchange unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |