CN211424591U - Heat pipe heat exchange system suitable for computer lab - Google Patents
Heat pipe heat exchange system suitable for computer lab Download PDFInfo
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- CN211424591U CN211424591U CN201921935533.3U CN201921935533U CN211424591U CN 211424591 U CN211424591 U CN 211424591U CN 201921935533 U CN201921935533 U CN 201921935533U CN 211424591 U CN211424591 U CN 211424591U
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- circulation hole
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Abstract
The utility model provides a heat pipe heat transfer system suitable for computer lab, including heat absorption subassembly, radiator unit and pipe-line system, the heat absorption subassembly includes evaporating dish and first fan, the radiator unit includes condenser and second fan, the pipe-line system includes trachea and liquid pipe, the both ends of trachea respectively with evaporating dish medium export, condenser medium entry intercommunication, the both ends of liquid pipe respectively with evaporating dish medium entry, condenser medium export intercommunication; the evaporating dish comprises a heat absorbing body, the heat absorbing body is provided with a first medium circulation hole, the condenser comprises a heat radiating body, the heat radiating body is provided with a second medium circulation hole, the first medium circulation hole and/or the inner wall of the second medium circulation hole are/is provided with a heat conduction groove, the heat conduction groove is formed in the first medium circulation hole and/or the second medium circulation hole, the contact area of circulation media and the first medium circulation hole and/or the second medium circulation hole is increased, the heat conduction efficiency of the heat absorbing body and/or the heat radiating body is greatly improved, and higher heat exchange efficiency is obtained.
Description
Technical Field
The utility model relates to an indoor outer heat transfer technical field, concretely relates to heat pipe heat transfer system suitable for computer lab.
Background
Along with the development of social economy, the increase of power supply load, the transformer substation constantly increases, and for saving land, urban transformer substation adopts indoor arrangement more, but because main transformer operation calorific capacity is great, especially in summer, ambient temperature is high, and the load is big again, very easily causes main transformer high temperature, if take the improper measure, makes the heat can't in time discharge, may lead to main transformer to subtract the load and even compel the outage, seriously influences electric power safety operation.
The mode that mechanical ventilation and natural draft combined together is mostly adopted to indoor transformer substation, because the transformer room is in the confined space, the natural draft effect is not good enough, and indoor air conditioner, new trend etc. are mostly adopted to refrigerate to mechanical ventilation, and its power consumption is comparatively serious, for this reason, adopt heat pipe heat transfer system to carry out the heat exchange among the prior art mostly.
At present, an evaporator and a condenser commonly used in a heat pipe heat exchange system are light pipes, and the contact area between the evaporator and the condenser and a heat conducting medium is low, so that the heat exchange efficiency of a heat pipe heat exchanger is influenced.
In view of this, the present invention is especially provided.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model aims at providing a heat pipe heat transfer system suitable for computer lab to improve heat pipe heat exchanger's heat exchange efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a heat pipe heat exchange system suitable for a machine room comprises a heat absorption assembly, a heat dissipation assembly and a pipeline system, wherein the heat absorption assembly is arranged indoors and comprises an evaporation pan and a first fan used for blowing a heat source to the evaporation pan, the heat dissipation assembly is arranged outdoors and comprises a condenser and a second fan used for blowing the heat source generated by the condenser away, the pipeline system comprises an air pipe and a liquid pipe, two ends of the air pipe are respectively communicated with an outlet of a gaseous medium of the evaporation pan and an inlet of a gaseous medium of the condenser, and two ends of the liquid pipe are respectively communicated with an inlet of a liquid medium of the evaporation pan and an outlet of a liquid medium of the condenser;
the evaporating dish comprises a gaseous medium collecting pipe, a liquid medium flow dividing pipe and a heat absorbing body, wherein the heat absorbing body is provided with a first medium circulation hole, the liquid inlet end of the first medium circulation hole is communicated with the liquid outlet end of the liquid medium flow dividing pipe, and the liquid outlet end of the first medium circulation hole is communicated with the liquid inlet end of the gaseous medium collecting pipe;
the condenser comprises a gaseous medium flow dividing pipe, a liquid medium collecting pipe and a heat radiation body, wherein the heat radiation body is provided with a second medium circulation hole, the liquid inlet end of the second medium circulation hole is communicated with the liquid outlet end of the gaseous medium flow dividing pipe, and the liquid outlet end of the second medium circulation hole is communicated with the liquid inlet end of the liquid medium collecting pipe;
at least one heat conduction groove is formed in the inner walls of the first medium circulation hole and/or the second medium circulation hole.
The utility model provides a pair of heat pipe heat transfer system suitable for computer lab through at first medium circulation hole with, or the inner wall in second medium circulation hole sets up the heat conduction recess, increased circulation medium and first medium circulation hole with, or the area of contact in second medium circulation hole, improved the heat-absorbing body greatly with, or the heat conduction efficiency of radiator, and then obtain higher heat exchange efficiency.
Additionally, the utility model discloses a heat pipe heat transfer system suitable for computer lab can also have following additional technical characterstic:
the utility model discloses an example, the heat receiver includes many parallel arrangement's heat absorption straight tube and overcoat in every heat absorption straight tube and the flaky heat absorption fin that is parallel to each other, every the heat absorption straight tube all has first medium circulation hole.
The utility model discloses an example, the radiator includes many parallel arrangement's heat dissipation straight tube and overcoat in every heat dissipation straight tube and the slice radiating fin that is parallel to each other, every the heat dissipation straight tube all has the second medium circulation hole.
The utility model discloses an example, the heat receiver includes many parallel arrangement's absorber plate and the heliciform heat absorption fin of pressing from both sides between the absorber plate, every the absorber plate all has the first medium circulation hole of a plurality of parallels.
The utility model discloses an example, the radiator includes many parallel arrangement's heating panel and the heliciform radiating fin who presss from both sides between the heating panel, every the heating panel all has the second medium opening of a plurality of parallels.
In one example of the present invention, the inner wall of the first medium circulation hole has a plurality of parallel heat conducting grooves.
In one example of the present invention, the inner wall of the second medium circulation hole has a plurality of parallel heat conducting grooves.
In one example of the present invention, the hole walls of the first medium circulation hole and the second medium circulation hole are provided with a nano-coating.
In an example of the present invention, the heat conducting groove is a nano micro groove.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a simplified diagram of a heat pipe heat exchange system suitable for a machine room according to embodiment 1;
FIG. 2 is a schematic perspective view of FIG. 1 with the first and second fans removed;
FIG. 3 is a schematic view of the heat absorber of FIG. 2;
FIG. 4 is a schematic view of the heat sink of FIG. 2;
FIG. 5 is a perspective view of the straight heat absorption pipe of FIG. 4;
fig. 6 is a schematic perspective view of the heat pipe heat exchange system suitable for a machine room provided in embodiment 2, with the first fan and the second fan removed;
FIG. 7 is a schematic view of a portion of the heat absorber of FIG. 6;
FIG. 8 is a partial schematic view of the heat sink of FIG. 6;
fig. 9 is a perspective view of the heat sink in fig. 8.
Reference numerals:
1. an evaporating dish; 11. a gaseous medium manifold; 12. a liquid medium shunt pipe; 13. a heat absorbing body; 131. a heat absorption straight pipe; 132. a sheet-like heat absorbing fin; 133. a heat absorbing plate; 134. a helical heat absorbing fin; 135. a first media flow aperture;
2. a first fan;
3. a condenser; 31. a gaseous medium shunt tube; 32. a liquid medium manifold; 33. a heat sink; 331. a heat dissipation straight pipe; 332. a sheet-like heat dissipating fin; 333. a heat dissipation plate; 334. helical heat-dissipating fins; 34. a second media flow aperture; 335. a second media flow aperture;
4. a second fan;
5. an air tube;
6. a liquid pipe;
7. a heat conducting groove.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
Example 1
As shown in fig. 1 to 5, the present embodiment provides a heat pipe heat exchange system suitable for a machine room, which includes a heat absorption assembly, a heat dissipation assembly, and a pipeline system.
As shown in fig. 1, the heat absorbing assembly is disposed indoors, the heat absorbing assembly includes an evaporating dish 1 and a first fan 2 for blowing a heat source to the evaporating dish 1, the heat dissipating assembly is disposed outdoors, the heat dissipating assembly includes a condenser 3 and a second fan 4 for blowing the heat source generated by the condenser 3, the pipeline system includes an air pipe 5 and a liquid pipe 6, two ends of the air pipe 5 are respectively communicated with an outlet of a gaseous medium of the evaporating dish 1 and an inlet of a gaseous medium of the condenser 3, and two ends of the liquid pipe 6 are respectively communicated with an inlet of a liquid medium of the evaporating dish 1 and an outlet of a liquid medium of the condenser 3.
As shown in fig. 2 and fig. 3, the evaporating dish 1 includes a gaseous medium collecting pipe 11, a liquid medium shunt pipe 12 and a heat absorbing body 13, the heat absorbing body 13 has a first medium circulation hole 135, an inlet end of the first medium circulation hole 135 is communicated with an outlet end of the liquid medium shunt pipe 12, and an outlet end of the first medium circulation hole 135 is communicated with an inlet end of the gaseous medium collecting pipe 11;
as shown in fig. 2 and 4, the condenser 3 includes a gaseous medium flow dividing pipe 31, a liquid medium flow converging pipe 32 and a heat radiating body 33, the heat radiating body 33 has a second medium circulation hole 335, a liquid inlet end of the second medium circulation hole 335 is communicated with a liquid outlet end of the gaseous medium flow dividing pipe 31, and a liquid outlet end of the second medium circulation hole 335 is communicated with a liquid inlet end of the liquid medium flow converging pipe 32;
in this embodiment, the medium is one or a combination of water, alcohol, R22 refrigerant, R134a refrigerant, R11 refrigerant, R21 refrigerant, R717 refrigerant, and R1233zd refrigerant.
As shown in fig. 5, at least one heat conduction groove 7 is formed on the inner walls of the first medium circulation hole 135 and/or the second medium circulation hole 335.
In this embodiment, preferably, at least one heat conduction groove 7 is formed in the inner walls of the first medium circulation hole 135 and the second medium circulation hole 335, and the heat conduction effect is better when the number of the heat conduction grooves 7 is larger.
As shown in fig. 3, the heat absorbing body 13 includes a plurality of parallel heat absorbing straight pipes 131 and mutually parallel plate-shaped heat absorbing fins 132 externally covering each heat absorbing straight pipe 131, and each heat absorbing straight pipe 131 has a first medium flowing hole 135.
In this embodiment, the pipe hole of the heat absorption straight pipe 131 is the first medium flow hole 135.
As shown in fig. 4, the heat radiator 33 includes a plurality of parallel heat radiation straight pipes 331 and mutually parallel sheet-shaped heat radiation fins 332 that are externally sleeved on each heat radiation straight pipe 331, and each heat radiation straight pipe 331 has a second medium flow hole 335.
In this embodiment, the tube hole of the heat dissipation straight tube 331 is the second medium flow hole 335.
In this embodiment, preferably, the inner wall of the first medium circulation hole 135 has a plurality of parallel heat conduction grooves 7, and the inner wall of the second medium circulation hole 335 has a plurality of parallel heat conduction grooves 7, and the heat conduction grooves 7 of the first medium circulation hole 135 function to increase the contact area between the medium in the heat absorption straight pipe 131 and the heat absorption straight pipe 131, thereby increasing the medium heat absorption rate.
The heat conduction grooves 7 of the second medium circulation holes 335 are used for increasing the contact area between the medium in the heat dissipation straight pipe 331 and the heat absorption straight pipe 131, so as to improve the heat dissipation rate of the medium.
In this embodiment, the hole walls of the first medium circulation hole 135 and the second medium circulation hole 335 are provided with a nano coating, the heat conduction groove 7 is a nano micro groove, the nano coating can better realize the wettability of the first medium circulation hole 135 and the second medium circulation hole 335, and can accelerate the rate of generating bubbles after being matched with the nano micro groove, thereby realizing better heat conduction.
The heat pipe heat exchange system during operation that this embodiment provided is applicable to computer lab, through seting up heat conduction recess 7 at the inner wall of first medium circulation hole 135 and second medium circulation hole 335, make the wetting that working medium can be abundant to the roughness of contact surface has been increased, has realized the more even and efficient production of bubble, produces bigger boiling intensity, thereby takes away more heats through more violent phase transition.
Example 2
As shown in fig. 6 to 9, the present embodiment is similar to embodiment 1, and is different in that: the heat absorber 13 and the heat radiator 33 have different structures, which are specifically as follows:
as shown in fig. 7 and 9, the heat absorbing body 13 includes a plurality of heat absorbing plates 133 arranged in parallel and spiral heat absorbing fins 134 interposed between the heat absorbing plates 133, and each heat absorbing plate 133 has a plurality of parallel first medium circulation holes 135.
As shown in fig. 8 and 9, the heat radiator 33 includes a plurality of parallel heat radiating plates 333 and spiral heat radiating fins 334 interposed between the heat radiating plates 333, and each heat radiating plate 333 has a plurality of parallel second medium flow holes 335.
Compared with embodiment 1, the heat pipe heat exchange system applicable to the machine room provided by the embodiment has the advantages that the contact area of the medium is increased, and the heat conduction effect is obviously increased.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (9)
1. The utility model provides a heat pipe heat transfer system suitable for computer lab, includes heat absorption subassembly, radiator unit and pipe-line system, heat absorption subassembly is located indoorly, and this heat absorption subassembly includes evaporating dish (1) and is used for blowing first fan (2) of heat source to evaporating dish (1), radiator unit locates outdoors, and this radiator unit includes condenser (3) and blows second fan (4) that the heat source that produces condenser (3) is blown away, pipe-line system includes trachea (5) and liquid pipe (6), the both ends of trachea (5) communicate with evaporating dish (1) gaseous medium export, condenser (3) gaseous medium entry respectively, the both ends of liquid pipe (6) communicate with evaporating dish (1) liquid medium entry, condenser (3) liquid medium export respectively, its characterized in that:
the evaporation pan (1) comprises a gaseous medium collecting pipe (11), a liquid medium shunt pipe (12) and a heat absorbing body (13), wherein the heat absorbing body (13) is provided with a first medium circulation hole (135), the liquid inlet end of the first medium circulation hole (135) is communicated with the liquid outlet end of the liquid medium shunt pipe (12), and the liquid outlet end of the first medium circulation hole (135) is communicated with the liquid inlet end of the gaseous medium collecting pipe (11);
the condenser (3) comprises a gaseous medium flow dividing pipe (31), a liquid medium collecting pipe (32) and a heat radiating body (33), the heat radiating body (33) is provided with a second medium circulation hole (335), the liquid inlet end of the second medium circulation hole (335) is communicated with the liquid outlet end of the gaseous medium flow dividing pipe (31), and the liquid outlet end of the second medium circulation hole (335) is communicated with the liquid inlet end of the liquid medium collecting pipe (32);
at least one heat conduction groove (7) is formed in the inner walls of the first medium circulation hole (135) and the second medium circulation hole (335).
2. The heat pipe heat exchange system suitable for the machine room as claimed in claim 1, wherein: the heat absorbing body (13) comprises a plurality of heat absorbing straight pipes (131) which are arranged in parallel and sheet-shaped heat absorbing fins (132) which are sleeved outside each heat absorbing straight pipe (131) and are parallel to each other, and each heat absorbing straight pipe (131) is provided with a first medium circulation hole (135).
3. The heat pipe heat exchange system suitable for the machine room as claimed in claim 1, wherein: the heat radiator (33) comprises a plurality of parallel heat radiation straight pipes (331) and mutually parallel sheet-shaped heat radiation fins (332) sleeved outside each heat radiation straight pipe (331), and each heat radiation straight pipe (331) is provided with a second medium circulation hole (335).
4. The heat pipe heat exchange system suitable for the machine room as claimed in claim 1, wherein: the heat absorbing body (13) comprises a plurality of heat absorbing plates (133) arranged in parallel and spiral heat absorbing fins (134) clamped between the heat absorbing plates (133), and each heat absorbing plate (133) is provided with a plurality of parallel first medium circulation holes (135).
5. The heat pipe heat exchange system suitable for the machine room as claimed in claim 1, wherein: the heat radiator (33) comprises a plurality of parallel heat radiating plates (333) and spiral heat radiating fins (334) clamped between the heat radiating plates (333), and each heat radiating plate (333) is provided with a plurality of parallel second medium circulation holes (335).
6. The heat pipe heat exchange system suitable for the machine room as claimed in claim 2 or 4, wherein: the inner wall of the first medium circulation hole (135) is provided with a plurality of parallel heat conduction grooves (7).
7. A heat pipe heat exchange system suitable for a machine room according to claim 3 or 5, wherein: the inner wall of the second medium circulation hole (335) is provided with a plurality of parallel heat conduction grooves (7).
8. The heat pipe heat exchange system suitable for the machine room according to any one of claims 1 to 5, wherein: the pore walls of the first medium flowing pore (135) and the second medium flowing pore (335) are provided with nano coatings.
9. The heat pipe heat exchange system suitable for the machine room according to any one of claims 1 to 5, wherein: the heat conducting groove (7) is a nanometer microgroove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921935533.3U CN211424591U (en) | 2019-11-11 | 2019-11-11 | Heat pipe heat exchange system suitable for computer lab |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921935533.3U CN211424591U (en) | 2019-11-11 | 2019-11-11 | Heat pipe heat exchange system suitable for computer lab |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211424591U true CN211424591U (en) | 2020-09-04 |
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ID=72254115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921935533.3U Active CN211424591U (en) | 2019-11-11 | 2019-11-11 | Heat pipe heat exchange system suitable for computer lab |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211424591U (en) |
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2019
- 2019-11-11 CN CN201921935533.3U patent/CN211424591U/en active Active
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