CN219682958U - Spraying equipment - Google Patents

Abstract

The application discloses a spraying device, comprising: the spraying device comprises a base, a spraying mechanism, a transmission mechanism and a supporting mechanism, wherein a spraying area is arranged on the base; the spraying mechanism is arranged on the base and is used for spraying materials to the front surface of the silicon wafer passing through the spraying area; the supporting mechanism is movably connected with the base and is used for supporting at least part of the surface of the back surface of the silicon wafer and driving the silicon wafer to pass through the spraying area; the transmission mechanism is movably connected to the base and is used for feeding the silicon wafer into the supporting mechanism and removing the silicon wafer out of the supporting mechanism. The automatic transmission of the silicon wafer in the spraying process can be realized through the matching of the transmission mechanism and the supporting mechanism; meanwhile, the back surface of the silicon wafer is prevented from adhering to materials in the spraying and conveying processes by using the supporting mechanism to support at least part of the surface of the back surface of the silicon wafer, so that the spraying quality of the silicon wafer is improved, the cleaning link of the silicon wafer is saved, and the production cost is reduced.

Description

Spraying equipment

Technical Field

The application belongs to the technical field of spraying, and particularly relates to spraying equipment.

Background

In the field of photovoltaic cell manufacturing, forming a PN junction by diffusing on the surface of a P-type or N-type silicon wafer is an important link in photovoltaic cell production, and a doping source solution is required to be uniformly sprayed on the surface of the silicon wafer before the PN junction is manufactured, and then the PN junction is formed by heat treatment.

In the related art, a diffusion source spraying device generally adopts a roller for transmission, a plurality of silicon wafers are sequentially and respectively transmitted to the lower part of a spray head through the roller, and then a doping source solution is sprayed on the surface of the silicon wafers through the spray head. However, in the actual spraying process, because a gap exists between the front silicon wafer and the rear silicon wafer, the roller at the gap is sprayed with the doping source solution, and when the roller transfers the silicon wafer again, the doping source solution is easily adhered to the back surface of the silicon wafer, so that the spraying quality of the silicon wafer is affected; meanwhile, a cleaning link is required to be arranged in a subsequent process, so that the production cost is increased.

Disclosure of Invention

The application aims to provide spraying equipment, which at least solves one of the problems that the spraying quality of a silicon wafer is affected and the production cost is increased due to the fact that doping source solution is easily adhered to the back surface of the silicon wafer in the spraying process of the silicon wafer by the spraying equipment in the related technology.

In order to solve the technical problems, the application is realized as follows:

the embodiment of the application provides spraying equipment, which comprises the following components:

the base is provided with a spraying area;

the spraying mechanism is arranged on the base and is used for spraying materials to the front surface of the silicon wafer passing through the spraying area;

The supporting mechanism is movably connected to the base and is used for supporting at least part of the surface of the back surface of the silicon wafer and driving the silicon wafer to pass through the spraying area;

and the transmission mechanism is movably connected with the base and is used for conveying the silicon wafer into the supporting mechanism and removing the silicon wafer out of the supporting mechanism.

Optionally, the carrying mechanism includes: a first mobile module and a carrier assembly;

the first mobile module is arranged on the base, and the carrier assembly is movably connected with the first mobile module;

the first moving module is used for driving the carrier module to move and carrying the silicon wafer to pass through the spraying area through the carrier module.

Optionally, the carrier assembly includes: a carrying platform and a collecting groove;

the material collecting groove is connected to the first movable module, a groove for collecting materials is formed in the material collecting groove, the supporting platform is arranged in the groove, and the supporting platform is used for supporting at least part of the surface of the back surface of the silicon wafer.

Optionally, the first mobile module includes: a horizontal movement module and a lifting movement module;

The horizontal movement module is arranged on the base, the lifting movement module is movably connected with the horizontal movement module, and the carrier assembly is movably connected with the lifting movement module;

the lifting movement module is used for driving the carrier assembly to move up and down;

the horizontal movement module is used for driving the lifting movement module to move, and the lifting movement module drives the carrier assembly to pass through the spraying area.

Optionally, the stage assembly further comprises: the negative pressure adsorption structure is arranged in the carrying platform;

and under the condition that the silicon wafer is supported by the supporting platform, the negative pressure adsorption structure is contacted with at least part of the surface of the back surface of the silicon wafer.

Optionally, the transmission mechanism includes: a first transmission device and a second transmission device;

the first transmission device and the second transmission device are respectively arranged at two sides of the spraying area; the first conveying device is used for conveying the silicon wafers to be sprayed into the supporting mechanism, and the second conveying device is used for moving the sprayed silicon wafers out of the supporting mechanism.

Optionally, at least one of the first and second transfer devices is a belt conveyor.

Optionally, the spraying apparatus further comprises: a first sensing member;

the first sensing piece is arranged in the first transmission device and used for sensing the first position of the silicon wafer and sending out a first sensing signal, and the first transmission device is used for sending the silicon wafer into the supporting mechanism based on the first sensing signal.

Optionally, the spraying apparatus further comprises: a second sensing member;

the second sensing piece is arranged in the second transmission device and is used for sensing a second position of the silicon wafer and sending out a second sensing signal, and the second transmission device is used for moving the silicon wafer out of the supporting mechanism based on the second sensing signal.

Optionally, the spraying mechanism includes: the spray head comprises a mounting bracket, a second movable module and a spray head assembly;

the mounting bracket is mounted on the base, the second movable module is movably connected with the mounting bracket, and the spray head assembly is connected with the second movable module;

the spray head assembly is used for spraying the materials to the front surface of the silicon wafer; the second moving module is used for driving the spray head assembly to move so as to adjust the position of the spray head assembly.

Optionally, the spraying mechanism further comprises: a gas-spraying cover;

the air injection cover is connected with the second movable module and is arranged around the spray head assembly; the jet cover is used for jetting gas to form an annular gas wall, and the jet area of the material is limited by the annular gas wall.

Optionally, the spray head assembly includes: a plurality of spray heads and a controller;

the plurality of spray heads are connected to the second movable module, the controller is respectively and electrically connected with the plurality of spray heads, and the controller is used for respectively controlling the opening and closing of each spray head so as to spray the materials on the surface of the silicon wafer.

In the embodiment of the application, a spraying area is arranged on a base of the spraying equipment, a spraying mechanism is arranged on the base, materials can be sprayed on the surface of a silicon wafer passing through the spraying area by utilizing the spraying mechanism, a supporting mechanism and a transmission mechanism are movably connected on the base, the silicon wafer to be sprayed can be sent into the supporting mechanism through the transmission mechanism, the silicon wafer to be sprayed is supported on at least part of the surface of the back surface of the silicon wafer to be sprayed by the supporting mechanism, the silicon wafer is driven to pass through the spraying area by the supporting mechanism, the materials are sprayed on the front surface of the silicon wafer by the spraying mechanism, and after the material spraying on the front surface of the silicon wafer is finished, the sprayed silicon wafer is moved out of the supporting mechanism by the transmission mechanism. Therefore, the automatic transmission of the silicon wafer in the spraying process can be realized through the cooperation of the transmission mechanism and the supporting mechanism; meanwhile, the back surface of the silicon wafer is prevented from adhering to materials in the spraying and conveying processes by using the supporting mechanism to support at least part of the surface of the back surface of the silicon wafer, so that the spraying quality of the silicon wafer is improved, the cleaning link of the silicon wafer is saved, and the production cost is reduced.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a top view of a spray coating device according to an embodiment of the application;

FIG. 2 is a front view of a spray coating device according to an embodiment of the application;

FIG. 3 is a side view of a spray coating device according to an embodiment of the application;

FIG. 4 is a partial schematic view of a spray coating device according to an embodiment of the application;

FIG. 5 is a front view of a palletizing mechanism according to an embodiment of the present application;

FIG. 6 is a side view of a palletizing mechanism according to an embodiment of the present application;

FIG. 7 is a schematic illustration of a transport mechanism according to an embodiment of the application;

fig. 8 is a schematic view of a first transmission device according to an embodiment of the application;

FIG. 9 is a side view of a spray coating mechanism according to an embodiment of the application;

fig. 10 is a bottom view of a spray coating mechanism according to an embodiment of the application.

Reference numerals:

100: a base; 101: a spraying area; 200: a spraying mechanism; 210: a mounting bracket; 220: a second mobile module; 230: a spray head assembly; 231: a plurality of spray heads; 232: a controller; 240: a gas-spraying cover; 250: an induction assembly; 300: a supporting mechanism; 310: a first mobile module; 311: a horizontal movement module; 312: a lifting moving module; 320: a stage assembly; 321: a support platform; 322: a material collecting groove; 3220: a groove; 323: a negative pressure adsorption structure; 400: a transmission mechanism; 410: a first transmission device; 420: a second transmission device; 411: a belt drive mechanism; 412: a belt: 413: a driving rotating shaft; 414: a driven rotating shaft; 415: a tensioning wheel; 501: a first sensing member; 502: and a second sensing member.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

The spraying equipment provided by the embodiment of the application is described in detail through specific embodiments and application scenes thereof by combining the accompanying drawings.

As shown in fig. 1 to 4, a spray coating apparatus according to some embodiments of the present application includes: the spraying device comprises a base 100, a spraying mechanism 200, a supporting mechanism 300 and a transmission mechanism 400, wherein a spraying area 101 is arranged on the base 100; the spraying mechanism 200 is arranged on the base 100 and is used for spraying materials to the front surface of the silicon wafer passing through the spraying area 101; the supporting mechanism 300 is movably connected to the base 100, and is used for supporting at least part of the surface of the back surface of the silicon wafer and driving the silicon wafer to pass through the spraying area 101; the transfer mechanism 400 is movably connected to the base 100 for feeding silicon wafers into the carrier mechanism 300 and removing silicon wafers out of the carrier mechanism 300.

In the embodiment of the application, a spraying area 101 is arranged on a base 100 of a spraying device, a spraying mechanism 200 is arranged on the base 100, materials can be sprayed on the surface of a silicon wafer passing through the spraying area 101 by using the spraying mechanism 200, a supporting mechanism 300 and a conveying mechanism 400 are movably connected on the base 100, the silicon wafer to be sprayed can be sent into the supporting mechanism 300 by the conveying mechanism 400, the supporting mechanism 300 supports at least part of the surface of the back surface of the silicon wafer to be sprayed, the silicon wafer is driven to pass through the spraying area 101 by the supporting mechanism 300, the spraying mechanism 200 sprays materials on the front surface of the silicon wafer, and after the material spraying on the front surface of the silicon wafer is finished, the sprayed silicon wafer is moved out of the supporting mechanism 300 by the conveying mechanism 400. In this way, the automatic transmission of the silicon wafer in the spraying process can be realized through the cooperation of the transmission mechanism 400 and the supporting mechanism 300; meanwhile, the supporting mechanism 300 is used for supporting at least part of the surface of the back of the silicon wafer, so that materials can be prevented from adhering to the back of the silicon wafer in the spraying and conveying processes, the spraying quality of the silicon wafer is improved, the cleaning links of the silicon wafer are saved, and the production cost is reduced.

In particular, the spray apparatus of the present application may be used to spray a material onto the front side of a substrate, wherein the sprayed material may be a solid, a gas, a liquid, or a mixture of phases, such as may be used to spray a dopant source solution onto the front side of a silicon wafer.

It can be understood that the substrate in the embodiment of the present application may be selected according to the actual application scenario of the spraying apparatus, which is not limited in this application. The substrate comprises a front surface and a back surface which are oppositely arranged, wherein the front surface is one surface which needs to be sprayed with materials, and the back surface is one surface which does not need to be sprayed with materials. In the embodiment of the application, the substrate is used as a silicon wafer for explanation.

Specifically, the spraying apparatus may include a base 100, a spraying area 101 is provided on the base 100, a spraying mechanism 200 is provided on the base 100 and is disposed corresponding to the spraying area 101, and a material may be sprayed into the spraying area 101 by the spraying mechanism 200. As shown in the dashed box in fig. 1, the paint region 101 is a region on the base 100 preset for performing a spraying operation, and for example, a region on the base 100 corresponding to a nozzle in the spraying mechanism 200 may be set as the paint region 101. Of course, other areas on the base 100 may be set as the spraying area, and the position, size and shape of the spraying area 101 set on the base 100 may be set according to actual needs, which is not limited in the embodiment of the present application.

The base 100 is further provided with a transmission mechanism 400 and a supporting mechanism 300, the transmission mechanism 400 and the supporting mechanism 300 are both movably connected to the base 100, the transmission mechanism 400 can be used for transmitting silicon wafers, the transmission mechanism 400 sends the silicon wafers to be sprayed into the supporting mechanism 300, and the sprayed silicon wafers are moved out of the supporting mechanism 300.

In a specific application, the carrying mechanism 300 receives the silicon wafer to be sprayed from the conveying mechanism 400 and carries the silicon wafer on at least part of the surface of the back surface of the silicon wafer, meanwhile, the carrying mechanism 300 drives the silicon wafer to move through the spraying area 101, and the spraying mechanism 200 sprays materials to the front surface of the silicon wafer to finish the spraying of the front surface of the silicon wafer. After the spraying is completed, the carrying mechanism 300 transfers the silicon wafer after the spraying is completed to the transporting mechanism 400 again so that the transporting mechanism 400 transfers the silicon wafer after the spraying out of the spraying apparatus.

It will be appreciated that since the carrier 300 is in contact with at least a portion of the surface of the back side of the wafer, the carrier 300 is prevented from adhering to the sprayed material at the portion in contact with the wafer during the spraying of the wafer. Meanwhile, the conveying mechanism 400 does not pass through the spraying area 101 in the process of conveying the silicon wafer into or out of the carrying mechanism 300, so that the adhesion of materials on the conveying mechanism 400 is avoided. Thus, through the cooperation of the supporting mechanism 300 and the conveying mechanism 400, the automatic conveying of the silicon wafer in the spraying equipment can be realized, the sprayed material can be prevented from adhering to the back surface of the silicon wafer, the spraying quality of the silicon wafer is improved, and the production cost is reduced.

In some embodiments, as shown in fig. 1, at least two supporting mechanisms 300 and at least two conveying mechanisms 400 may be disposed on the base 100, where at least two supporting mechanisms 300 and at least two conveying mechanisms 400 are matched with each other, so that when one supporting mechanism 300 supports one silicon wafer spraying operation, another supporting mechanism 300 can carry another silicon wafer, thereby improving the transportation efficiency of the silicon wafer.

Further, at least two spraying mechanisms 200 may be further disposed on the base 100, and spraying operations on a plurality of silicon wafers may be simultaneously performed by using the at least two spraying mechanisms 200, thereby improving spraying efficiency.

It should be noted that the number and the arrangement positions of the spraying mechanism 200, the carrying mechanism 300, and the transporting mechanism 400 provided on the base 100 may be set reasonably according to actual production requirements, and are not limited herein.

Alternatively, as shown in fig. 5 and 6, the loading mechanism 300 includes: a first moving module 310 and a stage assembly 320; the first moving module 310 is installed on the base 100, and the carrier assembly 320 is movably connected to the first moving module 310; the stage assembly 320 is configured to be carried on at least a portion of a surface of a back surface of the silicon wafer, and the first moving module 310 is configured to drive the stage assembly 320 to move, and to carry the silicon wafer through the spray zone 101 by the stage assembly 320.

In the embodiment of the application, the supporting mechanism 300 comprises a first moving module 310 and a carrier assembly 320, the carrier assembly 320 is supported on the back surface of the silicon wafer, and can support the silicon wafer to move, and further, the carrier assembly 320 can be driven to move relative to the base 100 through the first moving module 310, the silicon wafer to be sprayed is supported by the carrier assembly 320 to pass through the spraying area 101, and the spraying mechanism 200 sprays materials on the front surface of the silicon wafer, so that the spraying operation of the surface of the silicon wafer is realized. Meanwhile, the carrier assembly 320 is supported on at least part of the surface of the back surface of the silicon wafer, so that the sprayed material of the carrier assembly 320 is prevented from being adhered to the part contacted with the back surface of the silicon wafer, and the cleanliness of the back surface of the silicon wafer is ensured.

Specifically, the first movement module 310 may enable movement in multiple dimensions so that the stage assembly 320 may be driven to move in different directions to change the adjustment of the wafer relative to the susceptor 100 to ensure that the wafer is able to move through the spray zone 101.

The first moving module 310 may include a driving mechanism and a moving mechanism, the moving mechanism is movably connected to the base 100, the carrier assembly 320 is connected to the moving mechanism, and the driving mechanism can drive the moving mechanism to move relative to the base 100, so as to drive the silicon wafer to move.

Illustratively, the movement mechanism may include, but is not limited to: a sliding groove and sliding block moving mechanism, a guide rail moving mechanism, a gear rack moving mechanism and the like. Alternatively, the moving mechanism may be a linear moving mechanism, or may be a curved moving module, or may be any other type of moving mechanism, which may be set by those skilled in the art according to actual needs, and the embodiment of the present application is not limited thereto.

Alternatively, as shown in fig. 4, the stage assembly 320 includes: a carrier 321 and a collector tank 322; the material collecting tank 322 is connected to the first moving module 310, a groove 3220 for collecting materials is formed in the material collecting tank 322, the supporting platform 321 is arranged in the groove 3220, and the supporting platform 321 is used for supporting at least part of the surface of the back of the silicon wafer.

In the embodiment of the application, the supporting platform 321 is arranged to support at least part of the surface of the back surface of the silicon wafer, so that the silicon wafer can be supported to move, and meanwhile, the situation that materials are sprayed on the supporting platform 321 in the spraying process is avoided. Meanwhile, by arranging the material collecting groove 322, the groove 3220 is arranged in the material collecting groove 322, the supporting platform 321 is arranged in the groove 3220, in the spraying process, materials sprayed to the outer area of the silicon wafer can be collected by using the material collecting groove 322, the sprayed materials are prevented from being adhered to other parts of the supporting mechanism 300, and the problem that the materials are adhered to the back of the silicon wafer when the supporting mechanism 300 supports the silicon wafer can be further avoided.

Specifically, the carrier assembly 320 includes a carrier 321 and a chute 322, and the carrier 321 and the chute 322 are mounted on the first moving module 310, and the carrier 321 and the chute 322 can be simultaneously driven to move by the first moving module. A recess 3220 is provided on a side of the collection trough 322 facing away from the base 100, and the carrier 321 is positioned within the recess 3220.

The structure of the groove 3220 may be matched with that of the silicon wafer, and the area of the groove 3220 is larger than that of the front surface of the silicon wafer, so that the silicon wafer sprayed outside the edge of the silicon wafer may be collected by the groove 3220 of the material collecting groove 322 in the process of spraying the material to the front surface of the silicon wafer by using the spraying mechanism 200.

It should be noted that, the specific shape and size of the groove 3220 provided in the material collecting groove 322 in the embodiment of the present application may be set according to the structure of the silicon wafer, which is not limited in the embodiment of the present application.

In some embodiments, the height of the carrier 321 is greater than the height of the walls of the grooves 3220 in a direction perpendicular to the bottoms of the grooves 3220, thereby avoiding that the edges of the silicon wafer hit the walls of the grooves 3220 during the carrier 321 is carrying the silicon wafer, resulting in the adhesion of the back edge portion of the silicon wafer to the material.

Optionally, as shown in fig. 5 and 6, the first mobile module 310 includes: a horizontal movement module 311 and a lifting movement module 312; the horizontal moving module 311 is installed on the base 100, the lifting moving module 312 is movably connected to the horizontal moving module 311, and the carrier assembly 320 is movably connected to the lifting moving module 312; the lifting moving module 312 is used for driving the stage assembly 320 to move up and down; the horizontal moving module 311 is used for driving the lifting moving module 312 to move, and driving the stage assembly 320 to pass through the spraying area 101 through the lifting moving module 312.

In the embodiment of the present application, the horizontal movement module 311 can adjust the movement of the carrier assembly 320 along the direction parallel to the installation plane of the base 100, and the lifting movement module 312 can adjust the movement of the carrier assembly 320 along the direction perpendicular to the installation plane of the base 100, so that the movement of the carrier assembly 320 along different directions can be realized by the cooperation of the horizontal movement module 311 and the lifting movement module 312, and the position of the silicon wafer in the carrier assembly 320 relative to the base 100 can be adjusted.

Specifically, the base 100 has a mounting plane, the horizontal moving module 311 is mounted on the mounting plane of the base 100, the lifting moving module 312 is movably connected to the horizontal moving module 311, and the lifting moving module 312 and the carrier assembly 320 can be driven to move along a direction parallel to the mounting plane by the horizontal moving module 311, so that the carrier assembly 320 supports the silicon wafer to move through the spraying area 101 on the base 100, so that the spraying mechanism 200 sprays materials on the front surface of the silicon wafer.

Further, the carrier assembly 320 is movably connected to the lifting moving module 312, and the lifting moving module 312 can drive the carrier assembly 320 to move up and down along a direction perpendicular to the installation plane.

It will be appreciated that the coating mechanism 200 typically sprays material from above the wafer to the front surface of the wafer, and that the distance between the wafer and the coating mechanism 200 can affect the quality of the coating. Therefore, the relative height of the silicon wafer on the base 100 can be adjusted by arranging the lifting moving module 312, so that the distance between the silicon wafer and the spraying mechanism 200 is adjusted, the position of the silicon wafer relative to the spraying mechanism 200 is conveniently adjusted according to the actual process requirement, and the spraying quality of the surface of the silicon wafer is improved.

In some embodiments, the horizontal moving module 311 may include a first horizontal module and a second horizontal module, the first horizontal module is mounted on the mounting plane of the base 100, the second horizontal module is movably connected to the first horizontal module, and the lifting moving module 312 is movably connected to the second horizontal module.

Specifically, the first horizontal module may drive the second horizontal module to move along a first direction, and the second horizontal module may drive the lifting moving module 312 to move along a second direction, where the first direction and the second direction are parallel to the mounting plane, and the first direction and the second direction are perpendicular to each other. Through the cooperation of the first horizontal module and the second horizontal module, the position adjustment of the carrier assembly 320 in two different directions along the direction parallel to the installation plane can be realized, so as to ensure that the carrier assembly 320 can support all the silicon wafer to enter the spraying area 101.

Optionally, as shown in fig. 4, the stage assembly 320 further includes: a negative pressure adsorption structure 323, wherein the negative pressure adsorption structure 323 is arranged in the carrying platform 321; in the case where the carrier 321 carries the silicon wafer, the negative pressure adsorption structure 323 is in contact with at least part of the surface of the back surface of the silicon wafer.

In the embodiment of the application, the negative pressure adsorption structure 323 is arranged in the support carrier 321, the negative pressure adsorption structure 323 can be in contact with at least part of the surface of the back surface of the silicon wafer, the silicon wafer is adsorbed and fixed on the support carrier 321 through the negative pressure adsorption structure 323 under the action of negative pressure, the relative movement between the silicon wafer and the support carrier 321 in the moving process of the support carrier 321 is avoided, and the stability and the safety of equipment are improved.

In some embodiments, the negative pressure adsorption structure 323 may include an air hole arranged in the carrier 321 and a vacuum device communicated with the air hole, when the carrier 321 contacts with the back surface of the silicon wafer, the back surface of the silicon wafer covers the air hole, and the vacuum device is used for vacuumizing the air hole, so that a negative pressure adsorption effect can be generated at a position corresponding to the back surface of the silicon wafer and the air hole, thereby fixing the silicon wafer.

Specifically, a plurality of air holes can be arranged in the supporting platform 321 at intervals, the air holes are respectively communicated with the vacuum device, the negative pressure adsorption effect on the silicon wafer can be increased through the air holes, and the fixing effect on the silicon wafer is improved. The setting positions and the setting number of the air holes in the carrier 321 may be set according to actual needs, which is not limited in the embodiment of the present application.

In some implementations, the negative pressure suction structure 323 can include a flexible suction cup disposed on a side of the carrier 321 facing the silicon wafer, the flexible suction cup conforming to the back of the silicon wafer when the carrier 321 carries the silicon wafer, thereby securing the silicon wafer to the carrier 321. Wherein, a plurality of flexible suckers can be arranged on the carrying platform 321 to increase the adsorption and fixation effects on the silicon wafers, and the specific number of the flexible suckers can be set according to actual needs, which is not limited by the application.

Alternatively, as shown in fig. 1 and 7, the transmission mechanism 400 includes: a first transmission means 410 and a second transmission means 420; the first conveying device 410 and the second conveying device 420 are respectively arranged at two sides of the spraying area 101; the first transporting device 410 is used for feeding the silicon wafer to be sprayed into the supporting mechanism 300, and the second transporting device 420 is used for moving the sprayed silicon wafer out of the supporting mechanism 300.

In the embodiment of the application, the first conveying device 410 and the second conveying device 420 are respectively arranged at two sides of the spraying area 101, so that the silicon wafer to be sprayed can be sent into the supporting mechanism 300 by using the first conveying device 410, the silicon wafer supported by the supporting mechanism 300 can finish spraying operation, and the silicon wafer sprayed in the supporting mechanism 300 can be removed by using the second conveying device 420, so that feeding and discharging transportation of the silicon wafer in the spraying equipment can be realized, and the cleanliness of the conveying mechanism 400 is ensured because the conveying mechanism 400 does not pass through the spraying area 101, and the back surface of the silicon wafer is prevented from adhering to materials when the silicon wafer is conveyed in the conveying mechanism 400.

Specifically, the first conveying device 410 and the second conveying device 420 are respectively disposed at two sides of the spraying area 101, the first conveying device 410 and the second conveying device 420 are both movably connected to the base 100, the first conveying device 410 can be used for feeding and transporting the silicon wafer, and the second conveying device 420 can be used for discharging and transporting the silicon wafer.

The first and second transfer devices 410 and 420 may be disposed at two sides of the spraying area 101 along a moving direction of the silicon wafer in the spraying area 101, so as to facilitate transfer of the silicon wafer between the first and second transfer devices 410 and 420 and the supporting mechanism 300.

Alternatively, as shown in fig. 8, at least one of the first conveyor 410 and the second conveyor 420 is a belt 412 conveyor mechanism.

In the embodiment of the application, at least one of the first transmission device 410 and the second transmission device 420 can be set as a belt 412 transmission mechanism, and the transmission of the silicon wafer is realized by utilizing the belt 412 transmission mechanism, so that the structure is simple, the installation and the use are convenient, and the use cost is low.

Specifically, the first conveying device 410 may be configured as a belt 412 conveying mechanism, and the belt 412 conveying mechanism may include: the belt 412 actuating mechanism 411, belt 412, initiative pivot 413 and driven shaft 414 all rotate and connect in base 100, and the parallel interval of both axis sets up, and belt 412 cover is established in initiative pivot 413 and driven shaft 414 outside, and initiative pivot 413 is connected with belt 412 actuating mechanism 411, can drive initiative pivot 413 through belt 412 actuating mechanism 411 and rotate to drive belt 412 and rotate, realize the transmission to the silicon chip of placing on the belt 412.

The belt 412 driving mechanism 411 may be a servo motor or a stepper motor, or may be other driving mechanisms, and those skilled in the art may select them according to actual needs, which is not limited herein.

In some embodiments, as shown in fig. 8, the belt 412 conveying mechanism further includes a tensioning wheel 415, where the tensioning wheel 415 is rotatably connected to the base 100 and abuts against the belt 412, and the tensioning action of the belt 412 can be achieved through the tensioning wheel 415, so as to ensure the stability of the belt 412 conveying.

In some embodiments, the second conveying device 420 may also be configured as a belt 412 conveying mechanism, and the specific structure of the second conveying device 420 may be referred to as the structure of the first conveying device 410 in fig. 8.

It should be noted that, the first transporting device 410 and the second transporting device 420 may also use other transporting mechanisms 400 to transport the silicon wafer with the coating by the first transporting device 410, and send the silicon wafer into the supporting mechanism 300, and remove the silicon wafer from the supporting mechanism 300 by the second transporting device 420. The specific structures of the first and second transmission devices 410 and 420 may be set according to actual needs, and are not limited herein.

Optionally, as shown in fig. 7, the spraying apparatus further includes: a first sensing element 501; the first sensing element 501 is disposed in the first conveying device 410, the first sensing element 501 is configured to sense a first position of a silicon wafer and send a first sensing signal, and the first conveying device 410 is configured to send the silicon wafer into the carrier mechanism 300 based on the first sensing signal.

In the embodiment of the present application, by arranging the first sensing element 501 in the first transmission device 410, when the silicon wafer moves to the first position on the first transmission device 410 during the transmission of the silicon wafer by the first transmission device 410, the first sensing element 501 can sense the silicon wafer and send out the first sensing signal, so that the first transmission device 410 stops transmitting the silicon wafer based on the first sensing signal and sends the silicon wafer into the supporting mechanism 300, thereby realizing the accurate transfer of the silicon wafer between the first transmission device 410 and the supporting mechanism 300.

Specifically, the first sensing element 501 may be installed at a first position in the first conveying device 410, and when the silicon wafer moves near the first sensing element 501, the first sensing element 501 can sense the silicon wafer and send a first sensing signal so as to transfer the silicon wafer between the carrier mechanism 300 and the first conveying device 410.

The first position may be preset in the first conveying device 410, where the first conveying device 410 and the movement track of the carrier mechanism 300 meet. Of course, the first position in the first transmission device 410 may be set according to actual needs, which is not limited herein.

In some embodiments, the spraying apparatus may further include a controller 232, where the controller 232 may receive the first sensing signal sent by the first sensing element 501 by connecting the first transmission device 410, the supporting mechanism 300 and the first sensing element 501 to the controller 232, and based on the first sensing signal, the controller 232 may control the supporting mechanism 300 to move to the first position corresponding area, so that the silicon wafer supported by the supporting mechanism 300 leaves the first transmission device 410, to implement the silicon wafer transferring operation between the first transmission device 410 and the supporting mechanism 300.

In some embodiments, the first sensing element 501 may comprise: other types of sensors may be selected, such as photo sensors, electric sensors, magnetic sensors, pressure sensors, etc., and those skilled in the art may select them according to actual needs, which is not limited in this embodiment of the present application.

Optionally, as shown in fig. 7, the spraying apparatus further includes: a second sensing piece 502; the second sensing element 502 is disposed in the second conveying device 420, the second sensing element 502 is configured to sense a second position of the silicon wafer and send a second sensing signal, and the second conveying device 420 is configured to move the silicon wafer out of the carrier 300 based on the second sensing signal.

In the embodiment of the application, by arranging the second sensing piece 502 in the second transmission device 420, when the silicon wafer moves to the second position on the second transmission device 420 in the process of transmitting the silicon wafer by the second transmission device 420, the second sensing piece 502 can sense the silicon wafer and send out the second sensing signal, so that the second transmission device 420 stops transmitting the silicon wafer based on the second sensing signal and sends the silicon wafer into the supporting mechanism 300, thereby realizing the accurate transfer of the silicon wafer between the second transmission device 420 and the supporting mechanism 300.

Specifically, the second sensing element 502 may be installed at a second position in the second conveying device 420, and when the silicon wafer moves to the vicinity of the second sensing element 502, the second sensing element 502 can sense the silicon wafer and send out a second sensing signal so as to perform the transfer of the silicon wafer between the carrier mechanism 300 and the second conveying device 420.

The second position may be preset in the second conveying device 420, where the movement track of the second conveying device 420 and the movement track of the carrier mechanism 300 meet. Of course, the second position in the second transmission device 420 may be set according to actual needs, which is not limited herein.

In some embodiments, the spraying apparatus may further include a controller 232, where the controller 232 may receive a second sensing signal sent by the second sensing element 502 by connecting the second transmission device 420, the supporting mechanism 300 and the second sensing element 502 to the controller 232, and based on the second sensing signal, the controller 232 may control the supporting mechanism 300 to move to a second position corresponding area, so that a silicon wafer supported by the supporting mechanism 300 leaves the second transmission device 420, and a silicon wafer transferring operation between the second transmission device 420 and the supporting mechanism 300 is implemented.

In some embodiments, the second sensing element 502 may include: other types of sensors may be selected, such as photo sensors, electric sensors, magnetic sensors, pressure sensors, etc., and those skilled in the art may select them according to actual needs, which is not limited in this embodiment of the present application.

Alternatively, as shown in fig. 2 and 9, the spraying mechanism 200 includes: a mounting bracket 210, a second moving module 220, and a showerhead assembly 230; the mounting bracket 210 is mounted on the base 100, the second moving module 220 is movably connected to the mounting bracket 210, and the nozzle assembly 230 is connected to the second moving module 220; the nozzle assembly 230 is used for spraying materials to the front surface of the silicon wafer; the second moving module 220 is used for driving the spray head assembly 230 to move so as to adjust the position of the spray head assembly 230.

In the embodiment of the application, the mounting bracket 210 is arranged on the base 100, the second moving module 220 is movably connected to the mounting bracket 210, the nozzle assembly 230 is connected to the second moving module 220, and the nozzle assembly 230 can be driven to move by the second moving module 220 so as to adjust the position of the nozzle assembly 230 relative to the spraying area 101, and further, the nozzle assembly 230 is utilized to spray materials to the front surface of the silicon wafer in the spraying area 101, so that the spraying position of the nozzle assembly 230 is conveniently and reasonably adjusted, and the spraying quality of the silicon wafer is improved.

Specifically, the silicon wafer in the coating region 101 moves in a first direction, and the second movement module 220 may drive the showerhead assembly 230 to move relative to the susceptor 100 in a second direction, so as to adjust the position of the showerhead assembly 230 relative to the coating region 101, such that the material can be coated into the coating region 101 by the showerhead assembly 230, the second direction being perpendicular to the first direction and parallel to the mounting plane of the susceptor 100.

Further, the second moving module 220 can also drive the showerhead assembly 230 to move up and down along a direction perpendicular to the mounting plane, so as to adjust the height of the showerhead assembly 230 relative to the susceptor 100, so that the showerhead assembly 230 sprays material more uniformly onto the front surface of the silicon wafer.

Optionally, as shown in fig. 9 and 10, the spraying mechanism 200 further includes: a gas-jet hood 240; the gas spraying cover 240 is connected to the second moving module 220, and the gas spraying cover 240 is disposed around the nozzle assembly 230; the gas spraying cover 240 is used to spray gas to form an annular gas wall, and the spraying area of the material is limited by the annular gas wall.

In the embodiment of the present application, the gas spraying cover 240 is disposed in the spraying mechanism 200, the gas spraying cover 240 is disposed around the nozzle assembly 230, and the gas can be sprayed by using the gas spraying cover 240 to form an annular gas wall around the nozzle assembly 230, so that the spraying area of the material can be limited by the annular gas wall, the nozzle assembly 230 is prevented from spraying the material to the area outside the silicon wafer in the supporting mechanism 300, thereby improving the spraying accuracy and preventing the sprayed material from adhering to other components in the supporting mechanism 300.

Specifically, a plurality of air holes may be provided around the air injection cover 240, and the plurality of air holes may be communicated with an external air source, so that an annular air wall surrounding the injection area can be formed when air is injected from the plurality of air holes. When the nozzle assembly 230 sprays material, the material may be sprayed in the spray zone due to the restriction of the annular air wall. Due to the limiting effect of the annular air wall, the material is prevented from being sprayed to the places outside the spraying area.

It should be noted that, the position and the size of the spraying area may be set according to the position of the spraying area 101 and the size of the silicon wafer, and by setting the spraying area, the material may be sprayed from the nozzle assembly 230 and then just sprayed onto the front surface of the silicon wafer, so as to avoid the material being sprayed onto the area outside the silicon wafer.

In some embodiments, the air holes in the air cap 240 may be provided as one or a combination of at least two of circular holes, oval holes, bar holes, polygonal holes, and kidney-shaped holes.

Alternatively, as shown in fig. 9, the showerhead assembly 230 includes: a plurality of spray heads 231 and a controller 232; the plurality of spray heads 231 are connected to the second moving module 220, the controller 232 is electrically connected to the plurality of spray heads 231, and the controller 232 is used for controlling the opening and closing of each spray head respectively so as to spray materials on the surface of the silicon wafer.

In the embodiment of the application, by arranging the plurality of spray heads 231, the front surface of the silicon wafer can be sprayed by using the plurality of spray heads 231 in the actual spraying process, so that the spraying uniformity is improved. Meanwhile, the controller 232 can be used for controlling the opening and closing of each spray head, so that the corresponding spray heads can be flexibly opened according to the spraying requirement of the surface of the silicon wafer, the requirement of graphical spraying of the surface of the silicon wafer is met, and the spraying operation is more flexible.

Specifically, the nozzle assembly 230 may include a plurality of nozzles 231, where the plurality of nozzles 231 are arranged at intervals, and each nozzle is only responsible for spraying in a smaller area during the spraying process, so that scattering of the material sprayed from the nozzles can be avoided, and the surface of the silicon wafer is sprayed more uniformly.

Further, the nozzle assembly 230 further includes a controller 232, and the opening and closing of each nozzle can be controlled by the controller 232, and in the spraying process, the nozzle to be opened is reasonably selected according to the area of the silicon wafer to be sprayed, so that the spraying requirements of different patterns on the surface of the silicon wafer can be realized.

In some embodiments, uniformity of spray from the spray head assembly 230 may be ensured by providing a distance between adjacent two spray heads. For example, the distance between adjacent two heads may be set to 15 to 25 μm, alternatively, the distance may be set to: any one of 15 μm, 17 μm, 20 μm, 22 μm, 25 μm, etc.

In some embodiments, as shown in fig. 10, the spraying mechanism 200 is further provided with a sensing component 250, through which the position of the silicon wafer in the spraying area 101 can be sensed by the sensing component 250, the nozzle component 230 can be connected with the sensing component 250, and the nozzle component 230 can start the spraying operation and stop the spraying operation based on the sensing result of the sensing component 250.

In particular applications, the sensing assembly 250 may be disposed on the side of the coating mechanism 200 facing the coating zone 101, and when the carrier mechanism 300 carries a silicon wafer into the coating zone 101, the sensing assembly 250 outputs a first sensing result to the coating mechanism 200, and the coating mechanism 200 initiates a coating operation based on the first sensing result to spray material onto the front side of the silicon wafer. As the carrier 300 moves within the coating area 101, the sensing assembly 250 outputs a second sensing result to the coating mechanism 200 when the carrier 300 moves out of the coating area 101, and the coating mechanism 200 stops the coating operation based on the second sensing result. Thus, the accurate spraying of the silicon wafer can be realized, and the waste of materials is reduced. The production cost is saved.

In some embodiments, as shown in fig. 1, the workflow of the spray coating device of the present application is as follows:

after the silicon wafer in the previous process is transferred to the station where the spraying equipment is located, the silicon wafer is received by the first conveying device 410 and conveyed to the first position, and after the first sensing piece 501 detects the silicon wafer, the first conveying device 410 stops running. Then, the supporting mechanism 300 moves to the first position, the supporting stage 321 in the stage assembly 320 supports the silicon wafer from the lower side of the silicon wafer, and the silicon wafer is adsorbed and fixed by the negative pressure adsorption structure 323, and then the lifting moving module 312 rises to drive the silicon wafer to separate from the first conveying device 410, and then the horizontal moving module 311 drives the supporting stage 321 to support the silicon wafer to move and pass through the spraying area 101.

Further, the sensing assembly 250 in the spraying mechanism 200 detects the silicon wafer, and the plurality of sprayers 231 in the sprayer assembly 230 are started to spray the material on the front surface of the silicon wafer at the same time, and meanwhile, the air-jet cover 240 works to form an annular air wall to limit the material sprayed by the sprayers to a preset spraying area, so that even if the material is just sprayed on the surface of the silicon wafer, the material is prevented from being sprayed on other areas. After the wafer is moved out of the coating area 101 by the carrier mechanism 300, the sensing assembly 250 in the coating mechanism 200 can not detect the wafer, and the plurality of nozzles 231 can be turned off.

Meanwhile, when the supporting mechanism 300 supports the silicon wafer to move to the second position, the second sensing piece 502 detects the silicon wafer, the lifting moving module 312 descends, the sprayed silicon wafer is placed in the second conveying device 420, and the second conveying device 420 transfers the silicon wafer to the next process, so that one spraying operation is completed.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (12)

1. A spray coating device, comprising:

the base is provided with a spraying area;

the spraying mechanism is arranged on the base and is used for spraying materials to the front surface of the silicon wafer passing through the spraying area;

the supporting mechanism is movably connected to the base and is used for supporting at least part of the surface of the back surface of the silicon wafer and driving the silicon wafer to pass through the spraying area;

and the transmission mechanism is movably connected with the base and is used for conveying the silicon wafer into the supporting mechanism and removing the silicon wafer out of the supporting mechanism.

2. The spray apparatus of claim 1 wherein said carriage mechanism comprises: a first mobile module and a carrier assembly;

the first mobile module is arranged on the base, and the carrier assembly is movably connected with the first mobile module;

The first moving module is used for driving the carrier module to move and carrying the silicon wafer to pass through the spraying area through the carrier module.

3. The spray apparatus of claim 2 wherein said stage assembly comprises: a carrying platform and a collecting groove;

the material collecting groove is connected to the first movable module, a groove for collecting materials is formed in the material collecting groove, the supporting platform is arranged in the groove, and the supporting platform is used for supporting at least part of the surface of the back surface of the silicon wafer.

4. The spray apparatus of claim 2 wherein said first moving module comprises: a horizontal movement module and a lifting movement module;

the horizontal movement module is arranged on the base, the lifting movement module is movably connected with the horizontal movement module, and the carrier assembly is movably connected with the lifting movement module;

the lifting movement module is used for driving the carrier assembly to move up and down;

the horizontal movement module is used for driving the lifting movement module to move, and the lifting movement module drives the carrier assembly to pass through the spraying area.

5. The spray apparatus of claim 3 wherein said stage assembly further comprises: the negative pressure adsorption structure is arranged in the carrying platform;

and under the condition that the silicon wafer is supported by the supporting platform, the negative pressure adsorption structure is contacted with at least part of the surface of the back surface of the silicon wafer.

6. The spraying apparatus of claim 1, wherein the transport mechanism comprises: a first transmission device and a second transmission device;

the first transmission device and the second transmission device are respectively arranged at two sides of the spraying area; the first conveying device is used for conveying the silicon wafers to be sprayed into the supporting mechanism, and the second conveying device is used for moving the sprayed silicon wafers out of the supporting mechanism.

7. The spray apparatus of claim 6 wherein at least one of said first conveyor and said second conveyor is a belt conveyor.

8. The spray apparatus of claim 6, further comprising: a first sensing member;

the first sensing piece is arranged in the first transmission device and used for sensing the first position of the silicon wafer and sending out a first sensing signal, and the first transmission device is used for sending the silicon wafer into the supporting mechanism based on the first sensing signal.

9. The spray apparatus of claim 6, further comprising: a second sensing member;

the second sensing piece is arranged in the second transmission device and is used for sensing a second position of the silicon wafer and sending out a second sensing signal, and the second transmission device is used for moving the silicon wafer out of the supporting mechanism based on the second sensing signal.

10. The spraying apparatus of claim 1, wherein the spraying mechanism comprises: the spray head comprises a mounting bracket, a second movable module and a spray head assembly;

the mounting bracket is mounted on the base, the second movable module is movably connected with the mounting bracket, and the spray head assembly is connected with the second movable module;

the spray head assembly is used for spraying the materials to the front surface of the silicon wafer; the second moving module is used for driving the spray head assembly to move so as to adjust the position of the spray head assembly.

11. The spray apparatus of claim 10 wherein said spray mechanism further comprises: a gas-spraying cover;

the air injection cover is connected with the second movable module and is arranged around the spray head assembly; the jet cover is used for jetting gas to form an annular gas wall, and the jet area of the material is limited by the annular gas wall.

12. The spray apparatus of claim 10 wherein said spray head assembly comprises: a plurality of spray heads and a controller;

the plurality of spray heads are connected to the second movable module, the controller is respectively and electrically connected with the plurality of spray heads, and the controller is used for respectively controlling the opening and closing of each spray head so as to spray the materials on the surface of the silicon wafer.