CN219678786U - Novel circuit board - Google Patents

Novel circuit board Download PDF

Info

Publication number
CN219678786U
CN219678786U CN202321169998.9U CN202321169998U CN219678786U CN 219678786 U CN219678786 U CN 219678786U CN 202321169998 U CN202321169998 U CN 202321169998U CN 219678786 U CN219678786 U CN 219678786U
Authority
CN
China
Prior art keywords
stop ring
plate body
circuit board
hole
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202321169998.9U
Other languages
Chinese (zh)
Inventor
张洪凌
曾庆锋
杨绿竹
朱利平
代发友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Shengmei Electronics Co ltd
Original Assignee
Huizhou Shengmei Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Shengmei Electronics Co ltd filed Critical Huizhou Shengmei Electronics Co ltd
Priority to CN202321169998.9U priority Critical patent/CN219678786U/en
Application granted granted Critical
Publication of CN219678786U publication Critical patent/CN219678786U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The utility model relates to a novel circuit board, comprising: the first plate body and the second plate body are provided with the first stop ring on the first plate body, the first stop ring is located on the outer side of the circumference of the first through hole, the second plate body is provided with the second stop ring, and the second stop ring is located on the outer side of the circumference of the second through hole, so that when the first plate body and the second plate body are assembled together, the first stop ring is embedded in the second stop ring, the outer side surface of the first stop ring is abutted with the inner side surface of the second stop ring, conductive substances in the first through hole and the second through hole can be prevented from entering between the first plate body and the second plate body, the blocking effect can be achieved, and the quality of the novel circuit board can be guaranteed.

Description

Novel circuit board
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a novel circuit board.
Background
The circuit board is an important electronic component, is a support body of the electronic component, is a carrier for electric connection of the electronic component, and develops towards the directions of light, thin, short and small, and also develops towards high density and high difficulty.
In the production of double-layer circuit boards, a circuit board is obtained after a pattern layer is formed by exposing, developing and etching a copper-clad plate, then the two circuit boards are assembled together, and finally, conductive glue or conductive ink is injected into the guide holes, or a circuit on the upper layer and the lower layer is conducted in a manner of tin soldering and copper plating, but after the two guide holes of the existing circuit boards are aligned, a certain gap is formed at the joint of the guide holes, and injected conductive substances easily enter between the two circuit boards through the gap, so that the wiring of the circuit boards is problematic, and the quality of the circuit boards is affected.
Disclosure of Invention
Based on this, it is necessary to provide a novel wiring board.
The technical scheme for solving the technical problems is as follows: a novel circuit board comprising: a first plate body and a second plate body;
the first plate body is provided with a first via hole, and the second plate body is provided with a second via hole;
the first plate body is provided with a first stop ring, the first stop ring is positioned at the outer side of the circumference of the first through hole, the second plate body is provided with a second stop ring, the second stop ring is positioned at the outer side of the circumference of the second through hole, and the size of the first stop ring is matched with the size of the second stop ring;
the first plate body and the second plate body are stacked, the first through holes and the second through holes are aligned, the first stop ring is embedded in the second stop ring, and the outer side surface of the first stop ring is movably abutted to the inner side surface of the second stop ring.
In one embodiment, a first side of the first stop ring is connected to the first plate, and a second side of the first stop ring has a width less than a width of the first side of the first stop ring.
In one embodiment, the first side of the second stop ring is connected to the second plate, and the second side of the second stop ring has an inner diameter greater than the inner diameter of the first side of the second stop ring.
In one embodiment, the first plate body is provided with a first heat dissipation hole, the second plate body is provided with a second heat dissipation hole, and the first heat dissipation hole and the second heat dissipation hole are aligned.
In one embodiment, the first plate body is provided with a first heat conducting groove, and one end of the first heat conducting groove is communicated with the first heat dissipation hole.
In one embodiment, the second plate body is provided with a second heat conducting groove, and one end of the second heat conducting groove is communicated with the second heat dissipation hole.
In one embodiment, the cross section of the first heat dissipation hole is square or circular, and the cross section of the second heat dissipation hole is the same as the cross section of the first heat dissipation hole.
In one embodiment, the second plate body is provided with a positioning column, the first plate body is provided with a positioning groove, and the positioning column is embedded in the positioning groove.
The beneficial effects of the utility model are as follows: according to the novel circuit board provided by the utility model, the first stop ring is arranged on the first board body and is positioned at the outer side of the circumference of the first through hole, the second stop ring is arranged on the second board body and is positioned at the outer side of the circumference of the second through hole, so that when the first board body and the second board body are assembled together, the first stop ring is embedded in the second stop ring, the outer side surface of the first stop ring is abutted with the inner side surface of the second stop ring, and thus, the conductive substances in the first through hole and the second through hole can be prevented from entering between the first board body and the second board body, the blocking effect can be realized, and the quality of the novel circuit board can be ensured.
Drawings
Fig. 1 is a schematic structural diagram of a novel circuit board according to an embodiment;
FIG. 2 is a schematic cross-sectional view of a novel circuit board according to an embodiment;
fig. 3 is an enlarged schematic view at a in fig. 2.
In the attached drawings, 10, a novel circuit board; 100. a first plate body; 110. a first via hole; 200. a second plate body; 210. a second via hole; 300. a first stop ring; 400. and a second stop ring.
Detailed Description
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The technical solution of the present utility model will be further described below with reference to the accompanying drawings of the embodiments of the present utility model, and the present utility model is not limited to the following specific embodiments.
It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components. In the description of the present utility model, it should be understood that, if there are terms such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom", etc., that indicate an azimuth or a positional relationship based on the directions or the positional relationships shown in the drawings, it is only for convenience of describing the present utility model and simplifying the description, but not for indicating or suggesting that the apparatus or element to be referred to must have a specific azimuth, be constructed and operated in a specific azimuth, so that the terms describing the positional relationship in the drawings are merely for exemplary illustration and should not be construed as limitations of the present patent, and that the specific meanings of the terms described above may be understood by those skilled in the art according to specific circumstances.
In one embodiment, as shown in fig. 1, 2 and 3, a novel circuit board 10 comprises: a first plate body 100 and a second plate body 200; the first plate 100 is provided with a first via hole 110, and the second plate 200 is provided with a second via hole 210; the first plate body 100 is provided with a first stop ring 300, the first stop ring 300 is located at the outer side of the circumference of the first through hole 110, the second plate body 200 is provided with a second stop ring 400, the second stop ring 400 is located at the outer side of the circumference of the second through hole 210, and the size of the first stop ring 300 is matched with the size of the second stop ring 400; the first plate body 100 and the second plate body 200 are stacked, the first through hole 110 and the second through hole 210 are aligned, the first stop ring 300 is embedded in the second stop ring 400, and the outer side surface of the first stop ring 300 is movably abutted against the inner side surface of the second stop ring 400.
In the present embodiment, by providing the first stop ring 300 on the first surface of the first plate body 100, and the first stop ring 300 is located outside the circumference of the first through hole 110, the second stop ring 400 is provided on the first surface of the second plate body 200, and the second stop ring 400 is located outside the circumference of the second through hole 210. Thus, when the first board body 100 and the second board body 200 are assembled together, that is, the first surface of the first board body 100 is attached to the first surface of the second board body 200, the first stop ring 300 is embedded in the second stop ring 400, and the outer side surface of the first stop ring 300 is in contact with the inner side surface of the second stop ring 400, so that the conductive substances in the first via hole 110 and the second via hole 210 can be prevented from entering between the first board body 100 and the second board body 200, and the blocking effect can be achieved, thereby ensuring the quality of the novel circuit board 10.
In this embodiment, by embedding the first stop ring in the second stop ring 400, guiding can be performed, so that the first board 100 and the second board 200 can be assembled together in alignment, and the first through hole 110 on the first board 100 and the second through hole 210 on the second board 200 can be communicated in better alignment.
In one embodiment, the first side of the first stop ring 300 is connected to the first plate body 100, and the second side of the first stop ring 300 has a smaller width than the first side of the first stop ring 300. Specifically, the width of the first stop ring 300 is the outer diameter of the first stop ring 300, and by providing a chamfer or rounded corner on the outer side surface of the second side of the first stop ring 300, the width of the second side of the first stop ring 300 can be made smaller than the width of the first side, so that the first stop ring 300 can well enter the second stop ring 400.
In one embodiment, the first side of the second stop ring 400 is connected to the second plate 200, and the second side of the second stop ring 400 has an inner diameter greater than that of the first side of the second stop ring 400. Specifically, by providing a chamfer or rounded corner on the inside surface of the second side of the second stop ring 400, the inside diameter of the second side of the second stop ring 400 can be made larger than the inside diameter of the first side, so that the first stop ring 300 can better enter the second stop ring 400.
In one embodiment, the first plate 100 is provided with a first heat dissipation hole, the second plate 200 is provided with a second heat dissipation hole, and the first heat dissipation hole is aligned with the second heat dissipation hole. Specifically, the quantity of first louvre sets up to a plurality ofly, and the quantity of second louvre is the same with the quantity of first louvre, and every first louvre aligns with a second louvre, the shape of the cross section of first louvre is square or circular, the shape of the cross section of second louvre with the shape of the cross section of first louvre is the same, through the setting of first louvre and the alignment intercommunication of second louvre, can make the two sides of novel circuit board 10 switch on, and the air of novel circuit board 10 downside and the air of upside can circulate promptly, and the air flow of being convenient for has promoted the radiating effect of novel circuit board 10.
In one embodiment, the first plate 100 is provided with a first heat conducting groove, and one end of the first heat conducting groove is communicated with the first heat dissipating hole. Specifically, the first heat conduction groove is formed in the first face of the first board body 100, extends along the outer side edge of the central area of the first board body 100, is favorable for conducting heat generated during operation of the novel circuit board 10 outwards, flows to the outside through the first heat dissipation hole, and has a better heat dissipation effect.
In one embodiment, the second plate 200 is provided with a second heat conducting groove, and one end of the second heat conducting groove is communicated with the second heat dissipating hole. Specifically, the second heat conduction groove is formed in the first face of the second board body 200, and extends to the outer side edge along the central area of the second board body 200, so that heat generated during operation of the novel circuit board 10 is conducted outwards, and flows to the outside through the second heat dissipation holes, and a better heat dissipation effect is achieved.
In one embodiment, the second plate 200 is provided with a positioning post, and the first plate 100 is provided with a positioning slot, and the positioning post is embedded in the positioning slot. Specifically, the number of the positioning columns is set to be a plurality of, the number of the positioning grooves is the same as the number of the positioning columns, the positioning columns are arranged on the first face of the second plate body 200, the positioning grooves are formed in the first face of the first plate body 100, the contact area between the first plate body 100 and the second plate body 200 can be increased, and the first plate body 100 can be connected to the second plate body 200 more stably.
It is to be understood that the above examples of the present utility model are provided by way of illustration only and not by way of limitation of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (8)

1. The utility model provides a novel circuit board which characterized in that includes: a first plate body and a second plate body;
the first plate body is provided with a first via hole, and the second plate body is provided with a second via hole;
the first plate body is provided with a first stop ring, the first stop ring is positioned at the outer side of the circumference of the first through hole, the second plate body is provided with a second stop ring, the second stop ring is positioned at the outer side of the circumference of the second through hole, and the size of the first stop ring is matched with the size of the second stop ring;
the first plate body and the second plate body are stacked, the first through holes and the second through holes are aligned, the first stop ring is embedded in the second stop ring, and the outer side surface of the first stop ring is movably abutted to the inner side surface of the second stop ring.
2. The novel circuit board of claim 1, wherein the first side of the first stop ring is connected to the first plate body, and the second side of the first stop ring has a width less than the width of the first side of the first stop ring.
3. The novel circuit board of claim 2, wherein the first side of the second stop ring is connected to the second plate body, and wherein the second side of the second stop ring has an inner diameter greater than the inner diameter of the first side of the second stop ring.
4. The novel circuit board of claim 1, wherein the first plate body is provided with a first heat dissipation hole, the second plate body is provided with a second heat dissipation hole, and the first heat dissipation hole and the second heat dissipation hole are aligned.
5. The novel circuit board of claim 4, wherein the first board body is provided with a first heat conducting groove, and one end of the first heat conducting groove is communicated with the first heat dissipation hole.
6. The novel circuit board of claim 5, wherein the second board body is provided with a second heat conducting groove, and one end of the second heat conducting groove is communicated with the second heat dissipation hole.
7. The novel circuit board of claim 6, wherein the cross-section of the first heat dissipation hole is square or circular in shape, and the cross-section of the second heat dissipation hole is the same as the cross-section of the first heat dissipation hole.
8. The novel circuit board of claim 1, wherein the second board body is provided with a positioning column, the first board body is provided with a positioning groove, and the positioning column is embedded in the positioning groove.
CN202321169998.9U 2023-05-16 2023-05-16 Novel circuit board Active CN219678786U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321169998.9U CN219678786U (en) 2023-05-16 2023-05-16 Novel circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321169998.9U CN219678786U (en) 2023-05-16 2023-05-16 Novel circuit board

Publications (1)

Publication Number Publication Date
CN219678786U true CN219678786U (en) 2023-09-12

Family

ID=87926736

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321169998.9U Active CN219678786U (en) 2023-05-16 2023-05-16 Novel circuit board

Country Status (1)

Country Link
CN (1) CN219678786U (en)

Similar Documents

Publication Publication Date Title
US9545004B2 (en) Printed circuit board having orthogonal signal routing
US8821188B2 (en) Electrical connector assembly used for shielding
TWI618457B (en) Assembly architecture employing organic support for compact and improved assembly throughput
US9525200B2 (en) Multi-layer substrate and method of manufacturing multi-layer substrate
CN109845413B (en) Method for manufacturing printed circuit board
TWI758570B (en) Electrical connector and manufacturing method of the same
TWI733235B (en) The mounting structure of electronic parts and the mounting method of electronic parts
CN109379519B (en) Camera module circuit board makeup, camera module
CN219678786U (en) Novel circuit board
US20210329809A1 (en) Power module having metallic heat-dissipation substrate
KR101565690B1 (en) Circuit board, method for menufacturing of circuit board, electronic component package and method for menufacturing of electronic component package
CN112752400A (en) Manufacturing method of double-sided copper-based PCB
TWI683603B (en) Printed circuit board and method of manufacturing the same
CN210537028U (en) Printed circuit board and electronic equipment
CN113543485A (en) Manufacturing method of printed circuit board and printed circuit board
WO2020108192A1 (en) Circuit board panel, manufacturing method therefor, photosensitive component and camera module
CN110876225A (en) Circuit board, preparation method of circuit board and optical module with circuit board
CN105530753A (en) PCB manufacturing method and PCB
CN110012598A (en) Battery protecting plate
CN210042383U (en) Flexible multilayer circuit board
CN115720404A (en) Circuit board and electronic equipment
JP2014175642A (en) Semiconductor device and semiconductor device manufacturing method
CN203072251U (en) Ceramic circuit board provided with blind hole.
CN209897339U (en) Novel mixed-compression copper-based sintered printed circuit board
CN114430609B (en) Battery protection plate, processing method and electronic equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant