CN219660001U - Power semiconductor module solder resist structure - Google Patents
Power semiconductor module solder resist structure Download PDFInfo
- Publication number
- CN219660001U CN219660001U CN202223265907.XU CN202223265907U CN219660001U CN 219660001 U CN219660001 U CN 219660001U CN 202223265907 U CN202223265907 U CN 202223265907U CN 219660001 U CN219660001 U CN 219660001U
- Authority
- CN
- China
- Prior art keywords
- solder resist
- substrate
- layer
- solder
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 123
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000000919 ceramic Substances 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- 239000010949 copper Substances 0.000 claims abstract description 36
- 238000003466 welding Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of power semiconductors, in particular to a power semiconductor module solder resist structure, which comprises a substrate; the ceramic copper clad laminate is arranged on the substrate, and a solder layer is arranged between the ceramic copper clad laminate and the substrate; the solder resist is arranged on the substrate, the solder resist surrounds the solder layer to form solder resist pattern wire frames corresponding to the ceramic copper-clad plate in number, and the solder layer is arranged in the corresponding solder resist pattern wire frames.
Description
Technical Field
The utility model relates to the technical field of power semiconductors, in particular to a solder resist structure of a power semiconductor module.
Background
The DBC (ceramic copper clad laminate) interval of the power semiconductor module is smaller, in the welding process, solder communication is easy to occur between the ceramic copper clad laminates on the substrate, and due to the surface tension effect of molten soldering tin, phenomena such as bridging, deflection and rotation are easy to occur on the ceramic copper clad laminates, and the uneven thickness of the solder can be caused, so that the reliability of the module is affected.
The traditional solder mask mode generally forms a solder mask layer by printing a solder mask material, the mode of adding the solder mask layer needs to additionally increase the cost of one process and the cost of the solder mask material and a steel mesh, and the time and the temperature are needed for curing the solder mask layer.
Disclosure of Invention
The utility model aims to provide a power semiconductor module solder resist structure which solves the technical problems;
a power semiconductor module solder resist structure comprises,
a substrate;
the ceramic copper clad laminate is arranged on the substrate, and a solder layer is arranged between the ceramic copper clad laminate and the substrate;
and the solder resist lines are arranged on the substrate, the solder resist lines are arranged around the solder layers to form solder resist pattern wire frames corresponding to the ceramic copper-clad plates in number, and the solder layers are positioned in the corresponding solder resist pattern wire frames.
Preferably, the ceramic copper-clad plate comprises,
the lower copper layer is arranged on the substrate, and the solder layer is arranged between the lower copper layer and the substrate;
the middle ceramic layer is arranged on the lower copper layer;
and the surface copper layer is arranged on the middle ceramic layer.
Preferably, a distance between an edge of a projection area of the lower copper layer on the substrate and the solder resist line is greater than or equal to 0.2mm and less than or equal to 1mm.
Preferably, the size of the intermediate ceramic layer is larger than the size of the lower copper layer, and the solder resist pattern wire frame is located inside the projection of the intermediate ceramic layer on the substrate or outside the projection of the intermediate ceramic layer on the substrate.
Preferably, the diameter of the solder resist line is the same as the thickness of the solder layer.
Preferably, the thickness of the solder layer is 300um or less.
Preferably, the ceramic copper-clad plate is rectangular, and the solder resist pattern wire frame is a rectangular frame.
Preferably, the four corners of the substrate are provided with feature holes, and the feature holes comprise a first feature hole positioned at the upper right corner of the substrate, a second feature hole positioned at the lower right corner of the substrate, a third feature hole positioned at the upper left corner of the substrate and a fourth feature hole positioned at the lower left corner of the substrate.
The utility model has the beneficial effects that: by adopting the technical scheme, the utility model can solve the problems of pollution to the welding surface, falling off in the welding process of the welding layer and the like in the traditional method for forming the welding layer by printing the welding-resistant material by arranging the welding-resistant pattern wire frame formed by the welding-resistant wire, and has the advantages of no pollution, high bonding strength of the welding-resistant wire and high reliability.
Drawings
FIG. 1 is a side view of a power semiconductor module solder resist structure according to an embodiment of the utility model;
FIG. 2 is a top view of a solder mask pattern wire frame in accordance with an embodiment of the present utility model;
fig. 3 is a schematic diagram illustrating steps of a solder resist method of a power semiconductor module according to an embodiment of the utility model.
In the accompanying drawings: 1. a substrate; 2. resistance welding wire; 3. a first feature aperture; 4. a second feature aperture; 5. a third feature aperture; 6. a fourth feature aperture; 7. a solder layer; 8. ceramic copper-clad plate; 81. a lower copper layer; 82. an intermediate ceramic layer; 83. and a surface copper layer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.
The utility model is further described below with reference to the drawings and specific examples, which are not intended to be limiting.
A power semiconductor module solder resist structure, as shown in fig. 1, 2, comprising,
a substrate 1;
a plurality of ceramic copper clad laminate 8, locate on base plate 1, possess the solder layer 7 between base plate 1 and the ceramic copper clad laminate 8;
and the solder resist wires 2 are arranged on the substrate 1, the solder resist wires 2 are surrounded by the solder layers 7, the solder resist pattern wire frames corresponding to the ceramic copper-clad plate 8 in number are formed, and the solder layers 7 are positioned in the corresponding solder resist pattern wire frames.
Specifically, the utility model forms the solder resist pattern wire frame for welding the ceramic copper-clad plate 8 by bonding the solder resist wires 2 at the designated positions and the wire diameters on the substrate 1 through the bonding machine, and preferably, the solder resist wires 2 are arranged in a bonding mode, so that the solder resist wires 2 are firmer, not easy to fall off and have strong reliability; the ceramic copper-clad laminate 8 is welded in the solder resist pattern wire frame on the substrate 1 through the solder layer 7, thereby playing a role in physically blocking the solder layer 7 in the solder resist pattern wire frame in height, preventing the communication of the solder layers 7 among different ceramic copper-clad laminates 8, and the phenomena of bridging, offset, rotation, uneven thickness of the solder layer 7 and the like of the ceramic copper-clad laminate 8.
In a preferred embodiment, the ceramic copper clad laminate 8 comprises,
a lower copper layer 81 disposed on the substrate 1, wherein a solder layer 7 is disposed between the lower copper layer 81 and the substrate 1;
an intermediate ceramic layer 82 provided on the lower copper layer 81;
a surface copper layer 83 provided on the intermediate ceramic layer 82.
In a preferred embodiment, the distance between the edge of the projection area of the lower copper layer 81 on the substrate 1 and the bonding-resistance wire 2 is 0.2mm or more and 1mm or less.
In a preferred embodiment, the intermediate ceramic layer 82 has a size that is larger than the size of the lower copper layer 81, and the solder resist pattern wire frame is located inside the projection of the intermediate ceramic layer 82 onto the substrate 1 or outside the projection of the intermediate ceramic layer 82 onto the substrate 1.
In a preferred embodiment, the diameter of the solder resist 2 is the same as the thickness of the solder layer 7; specifically, the solder resist 2 is a metal wire, and in actual production, the diameter of the solder resist 2 cannot be guaranteed to be absolutely the same as the thickness of the solder layer 7, and a metal wire with a model diameter closest to the thickness of the solder layer 7 defined by a drawing can be selected.
Furthermore, part of metal (such as aluminum) is not soaked in soldering tin, and the metal wire is selected as the bonding wire 2 for bonding, so that the solder resisting effect on the solder layer 7 in the solder resisting pattern wire frame is further enhanced.
In a preferred embodiment, the thickness of the solder layer 7 is 300um or less.
In a preferred embodiment, the ceramic copper clad laminate 8 is rectangular in shape and the solder resist pattern wire frame is a rectangular frame.
In a preferred embodiment, the four corners of the substrate 1 are provided with feature holes, wherein the feature holes comprise a first feature hole 3 positioned at the upper right corner of the substrate 1, a second feature hole 4 positioned at the lower right corner of the substrate 1, a third feature hole 5 positioned at the upper left corner of the substrate 1 and a fourth feature hole 6 positioned at the lower left corner of the substrate 1.
In a preferred embodiment, a method of solder mask for a power semiconductor module is provided for preparing the solder mask structure of the power semiconductor module of any of the embodiments, as shown in fig. 3, comprising,
step S1, pre-bending the base plate 1 according to the preset drawing requirements (the drawing does not require pre-bending but does not require pre-bending);
step S2, determining the position of the solder resist line 2 and the diameter of the solder resist line 2 according to a module drawing;
step S3, bonding a solder resist wire 2 on the substrate 1 to form a solder resist pattern wire frame for welding the ceramic copper-clad plate 8;
and S4, performing module mounting and reflow soldering after the bonding of the solder resist pattern wire frame is completed.
Specifically, in the step 2, according to a module drawing, the position of a solder resist 2 on the substrate 1 is determined by taking a characteristic hole, including a first characteristic hole 3, a second characteristic hole 4, a third characteristic hole 5 and a fourth characteristic hole 6, as a reference, and the unilateral distance between the edge of a projection area of a lower copper layer 81 of a ceramic copper-clad plate 8 on the substrate 1 and a solder resist pattern wire frame is more than or equal to 0.2mm and less than or equal to 1mm; and meanwhile, according to the thickness of the solder layer 7 defined by a drawing, selecting a metal wire with the diameter close to the thickness of the solder layer 7.
In this embodiment, the bonding wires are first performed on the substrate 1, and then the module mounting reflow soldering is performed, and specific steps in this embodiment are as follows: firstly, pre-bending a base plate 1 to a required radian according to drawing requirements (the drawing does not require pre-bending but does not require pre-bending); then according to the drawing, the relative position of the ceramic copper-clad plate 8 and the thickness of the solder layer 7 are determined by taking the characteristic holes as references, so that the position layout and the wire diameter of the solder resist wire 2 are determined; then placing the substrate 1 into a positioning fixture of a bonding machine, and bonding metal wires with determined wire diameters on the substrate 1 according to the determined positions of the solder resist wires 2 to form a solder resist pattern wire frame; and (5) carrying out module mounting reflow after the bonding of the solder resist 2 frame is completed. The utility model has the advantages of strong universality, simple process, high efficiency, no pollution, strong reliability and high bonding wire position precision, and is suitable for automatic production.
According to the utility model, the bonding machine is used for bonding the metal wires at the designated positions and the wire diameters on the substrate 1 to form the solder-resisting wire 2 frame, so that the solder communication between the ceramic copper-clad plates 8 can be prevented, and a solder-resisting effect is achieved; the solder resist mechanism is that the ceramic copper-clad plate 8 is welded in a solder resist pattern wire frame through solder, the diameter of the solder resist wire 2 is close to the thickness of the solder layer 7, so that the solder layer 7 plays a role in physical blocking in height, the position movement of the solder layer 7 and the ceramic copper-clad plate 8 in a melting stage can be prevented, the solder communication between the ceramic copper-clad plates 8 is prevented, and the phenomena of bridging, deflection, rotation, uneven thickness of the solder layer 7 and the like of the ceramic copper-clad plate 8 are generated.
In conclusion, the utility model has the advantages of no pollution, high bonding strength of the solder resist 2 and high reliability, and can solve the problems of pollution of the welding surface, falling off of the solder resist 2 in the welding process and the like in the traditional method for forming the solder resist 2 by printing solder resist materials.
The foregoing description is only illustrative of the preferred embodiments of the present utility model and is not to be construed as limiting the scope of the utility model, and it will be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the description and illustrations of the present utility model, and are intended to be included within the scope of the present utility model.
Claims (8)
1. A power semiconductor module solder resist structure is characterized by comprising,
a substrate;
the ceramic copper clad laminate is arranged on the substrate, and a solder layer is arranged between the ceramic copper clad laminate and the substrate;
the solder resist lines are arranged on the substrate, the solder resist lines are arranged around the solder layers to form solder resist pattern wire frames corresponding to the ceramic copper-clad plates in number, and the solder layers are positioned in the corresponding solder resist pattern wire frames;
and characteristic holes are formed in four corners of the substrate, and the positions of the solder resist lines on the substrate are determined by taking the characteristic holes as references.
2. The power semiconductor module solder resist structure of claim 1, wherein said ceramic copper clad laminate comprises,
the lower copper layer is arranged on the substrate, and the solder layer is arranged between the lower copper layer and the substrate;
the middle ceramic layer is arranged on the lower copper layer;
and the surface copper layer is arranged on the middle ceramic layer.
3. The power semiconductor module solder resist structure according to claim 2, wherein a distance between an edge of a projection area of the lower copper layer on the substrate and the solder resist line is 0.2mm or more and 1mm or less.
4. The power semiconductor module solder resist structure of claim 2, wherein the intermediate ceramic layer has a size greater than the size of the lower copper layer, and the solder resist pattern wire frame is located within or outside the projection of the intermediate ceramic layer onto the substrate.
5. The power semiconductor module solder resist structure of claim 1, wherein a diameter of the solder resist line is the same as a thickness of the solder layer.
6. The power semiconductor module solder resist structure of claim 1, wherein a thickness of the solder layer is 300um or less.
7. The power semiconductor module solder resist structure of claim 1, wherein the ceramic copper clad laminate is rectangular in shape and the solder resist pattern wire frame is a rectangular frame.
8. The power semiconductor module solder resist structure of claim 1, wherein said feature holes comprise a first feature hole located in an upper right corner of said substrate, a second feature hole located in a lower right corner of said substrate, a third feature hole located in an upper left corner of said substrate, and a fourth feature hole located in a lower left corner of said substrate, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223265907.XU CN219660001U (en) | 2022-12-07 | 2022-12-07 | Power semiconductor module solder resist structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223265907.XU CN219660001U (en) | 2022-12-07 | 2022-12-07 | Power semiconductor module solder resist structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219660001U true CN219660001U (en) | 2023-09-08 |
Family
ID=87858458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223265907.XU Active CN219660001U (en) | 2022-12-07 | 2022-12-07 | Power semiconductor module solder resist structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219660001U (en) |
-
2022
- 2022-12-07 CN CN202223265907.XU patent/CN219660001U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111050487A (en) | Solder mask layer manufacturing method, printed circuit board manufacturing method and printed circuit board | |
| CN103582302A (en) | Printed circuit board and method for manufacturing printed circuit board | |
| CN115551234A (en) | Preparation method of ultrathin high-heat-dissipation circuit board | |
| CN219660001U (en) | Power semiconductor module solder resist structure | |
| JPH07169873A (en) | Multi-layer board and manufacture thereof | |
| WO2012093509A1 (en) | Semiconductor device and method of manufacturing thereof | |
| WO2020224480A1 (en) | Package capable of preventing layered channeling of tin and manufacturing method therefor | |
| US20080000874A1 (en) | Printed wiring board and method of manufacturing the same | |
| WO2021097614A1 (en) | Integrated miniature welding plate structure and manufacturing process therefor | |
| CN101924037B (en) | Method for manufacturing coreless capsulation substrates | |
| CN102136459A (en) | Packaging structure and manufacture method thereof | |
| JP6768843B2 (en) | Manufacturing method of power semiconductor device and power semiconductor device | |
| EP0540101A1 (en) | Two-layer or multilayer printed circuit board | |
| CN211267300U (en) | Steel mesh and welded structure | |
| JP3246836U (en) | Chip package unit and stacked module thereof | |
| KR100626330B1 (en) | Both faces type package and method for manufacturing the same | |
| CN112911829B (en) | FC-BGA crosses stove protection device | |
| CN109874231A (en) | The cellular jig of large scale circuit plate | |
| CN112492755B (en) | Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate | |
| KR102126822B1 (en) | Manufacturing method of transformer circuit board and transformer thereof | |
| JP2013258330A (en) | Electronic apparatus and manufacturing method of the same | |
| JP3617264B2 (en) | Electrolytic plating method for plastic circuit boards | |
| US12016115B2 (en) | Embedded circuit board, electronic device, and fabrication method therefor | |
| CN109526155B (en) | Manufacturing method of solder joint cold solder joint | |
| US20230023144A1 (en) | Embedded circuit board, electronic device, and fabrication method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |