CN219657664U - Wafer speed measuring device - Google Patents
Wafer speed measuring device Download PDFInfo
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- CN219657664U CN219657664U CN202321281950.7U CN202321281950U CN219657664U CN 219657664 U CN219657664 U CN 219657664U CN 202321281950 U CN202321281950 U CN 202321281950U CN 219657664 U CN219657664 U CN 219657664U
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- speed measurement
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- 238000005259 measurement Methods 0.000 claims 11
- 238000004140 cleaning Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Abstract
The utility model provides a wafer speed measuring device. The wafer speed measuring device comprises: the cavity is used for placing a wafer to be tested; the driving wheels are arranged in the cavity and are oppositely arranged at two sides of the wafer to be tested and used for driving the wafer to be tested to rotate; the speed measuring wheel is arranged in the cavity and is contacted with the wafer to be measured, and is used for measuring the speed of the wafer to be measured; and the telescopic component is fixed in the cavity and fixedly connected with the tachometer wheel, and is used for enabling the tachometer wheel to keep contact with the wafer to be measured. According to the technical scheme, the telescopic component fixedly connected with the tachometer wheel is arranged, so that the tachometer wheel is kept in contact with the wafer to be measured, the relative position between the tachometer wheel and the driving wheel is actively matched, and the self-adaptive adjustment of the tachometer wheel position is realized.
Description
Technical Field
The utility model relates to the field of semiconductor processing, in particular to a wafer speed measuring device.
Background
In semiconductor manufacturing processes, cleaning is a very important step. Generally, up to 20% of the steps in a wafer process are cleaning steps. The existing wafer cleaning modes are as follows: rolling brush cleaning, megasonic cleaning and the like, wherein the rolling brush cleaning has wider application.
A pair of driving wheels is arranged in a cleaning tank of the wafer rolling brush cleaning device, and a wafer to be cleaned is arranged in a clamping groove of the driving wheels and is driven to rotate by friction force. In order to monitor the rotational speed of the wafer, it is also necessary to provide a tachometer wheel between a pair of drive wheels. If the rotation speed of the wafer does not meet the requirement, the wafer is cleaned abnormally to cause defects. The assembly mode of the current tachometer wheel is that gaskets with various sizes are added below the tachometer wheel to increase or decrease the position of the tachometer wheel, so that the relative positions of the tachometer wheel and a pair of driving wheels are matched to ensure that the rotating speed of the wafer on the tachometer wheel is normal. However, sometimes, all the sizes of the gaskets cannot meet the position requirement, and abnormal wafer rotation speed is detected to give an alarm.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a wafer speed measuring device which can enable a speed measuring wheel to keep in contact with a wafer to be measured, so that the relative position between the speed measuring wheel and a pair of driving wheels is actively matched, and the self-adaptive adjustment of the position of the speed measuring wheel is realized.
In order to solve the above problems, the present utility model provides a wafer speed measuring device, including: the cavity is used for placing a wafer to be tested; the driving wheels are arranged in the cavity and are oppositely arranged at two sides of the wafer to be tested and used for driving the wafer to be tested to rotate; the speed measuring wheel is arranged in the cavity and is contacted with the wafer to be measured, and is used for measuring the speed of the wafer to be measured; and the telescopic component is fixed in the cavity and fixedly connected with the tachometer wheel, and is used for enabling the tachometer wheel to keep contact with the wafer to be measured.
In some embodiments, the tachometer wheel is located between and the same distance as the pair of drive wheels.
In some embodiments, the wafer speed measuring device further includes a sensor, where the sensor is connected to the tachometer wheel and is configured to measure a rotational speed of the tachometer wheel, so as to obtain a rotational speed of the wafer to be measured.
In some embodiments, the tachometer wheel comprises: a rotating shaft; the rotating wheel is sleeved on the rotating shaft, a clamping groove is formed in the outer edge of the rotating wheel, and the clamping groove is used for clamping the wafer to be tested; and the fixing piece is sleeved on the rotating shaft and is arranged concentrically with the rotating wheel, a space exists between the fixing piece and the rotating wheel, and the fixing piece is used for being fixedly connected with the telescopic component.
In some embodiments, the retractable component is a cylinder fixedly connected to the tachometer wheel via a cylinder shaft.
In some embodiments, the wafer speed measuring device further comprises a fixing block, wherein the fixing block is fixedly arranged in the cavity and is positioned at one end of the telescopic component far away from the speed measuring wheel, and the bottom of the cavity is fixedly connected with the telescopic component through the fixing block.
In some embodiments, the telescoping member is sealingly connected to the fixed block by a diaphragm.
In some embodiments, a positioning needle or a positioning hole is fixedly arranged in the cavity, a positioning hole or a positioning needle is correspondingly arranged on one side, which is contacted with the cavity, of the fixing block, and the positioning needle can be inserted into the positioning hole so that the fixing block is fixedly arranged in the cavity.
In some embodiments, a plurality of screw holes are provided on the fixing block, and the telescopic member is fixedly mounted on the fixing block by screws.
In some embodiments, the plurality of screw holes are uniformly distributed around the fixing block.
According to the technical scheme, the speed measuring wheel and the wafer to be measured can be kept in contact by arranging the telescopic component fixedly connected with the speed measuring wheel, so that the relative position between the speed measuring wheel and the driving wheel is actively matched, and the self-adaptive adjustment of the position of the speed measuring wheel is realized.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate.
Drawings
In order to more clearly illustrate the technical solutions of the specific manner of the present utility model, the drawings that are required to be used in the embodiments of the present utility model will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIGS. 1A-1D are schematic diagrams illustrating a wafer speed measuring device according to a first embodiment of the present utility model;
fig. 2A to 2C are schematic diagrams of a wafer speed measuring device according to a second embodiment of the present utility model.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are only some of the implementation manners of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
Referring to fig. 1A to fig. 1D together, fig. 1A is a schematic diagram of an architecture of a first embodiment of a wafer speed measuring device according to the present utility model, fig. 1B is a schematic diagram of a connection between a tachometer wheel and a retractable member of the first embodiment of the wafer speed measuring device according to the present utility model, fig. 1C is a schematic diagram of a contact surface between a fixing block and a chamber of the first embodiment of the wafer speed measuring device according to the present utility model, and fig. 1D is a schematic diagram of a contact surface between a fixing block and a retractable member of the first embodiment of the wafer speed measuring device according to the present utility model.
As shown in fig. 1A, the wafer speed measuring device includes: a chamber 10, a pair of drive wheels 11, a tachometer wheel 12, a retractable member 13. The chamber 10 is used for placing a wafer 14 to be tested; the pair of driving wheels 11 are disposed in the chamber 10 and are disposed opposite to two sides of the wafer 14 to be tested, for driving the wafer 14 to be tested to rotate; the tachometer wheel 12 is disposed in the chamber 10 and contacts the wafer 14 to be measured, and is used for measuring the speed of the wafer 14 to be measured; the telescopic component 13 is fixed in the chamber 10 and fixedly connected with the tachometer wheel 12, so as to keep the tachometer wheel 12 in contact with the wafer 14 to be measured.
According to the technical scheme, the telescopic component 13 fixedly connected with the tachometer wheel 12 is arranged, when the wafer 14 to be tested is cleaned, the cleaning brush can generate a vertical downward force on the wafer 14 to be tested, the tachometer wheel 12 can be pressed downwards, the telescopic component 13 can push the tachometer wheel 13 upwards, and the wafer 14 to be tested is ensured to be in contact with the tachometer wheel 12. Therefore, the height of the tachometer wheel 12 can be still kept in contact with the wafer 14 to be measured without adding a gasket, so that the relative positions of the tachometer wheel 12 and the pair of driving wheels 11 are actively matched, and the self-adaptive adjustment of the positions of the tachometer wheel 12 is realized.
In the present embodiment, the tachometer wheel 12 is located between the pair of driving wheels 11 and is the same as the distance between the pair of driving wheels 11. Specifically, the tachometer wheel 12 is located on the bisector of the pair of drive wheels 11.
As shown in fig. 1B, in the present embodiment, the tachometer wheel 12 includes: the rotating shaft 121, the rotating wheel 122 and the fixing piece 123. The rotating wheel 122 is sleeved on the rotating shaft 121, a clamping groove 124 is formed along the outer edge of the rotating wheel 122, and the clamping groove 124 is used for clamping the wafer 14 to be tested; the fixing piece 123 is sleeved on the rotating shaft 121 and concentrically arranged with the rotating wheel 122, a space exists between the fixing piece 123 and the rotating wheel 122, and the fixing piece 123 is fixedly connected with the telescopic component 13. Specifically, when the wafer 14 to be tested rotates, the rotating wheel 122 is driven to rotate. When the wafer 14 is positioned too high or too low, the retractable member 13 pushes or pulls the fixing member 123 upward or downward, so that the tachometer wheel 12 keeps in contact with the wafer 14.
In this embodiment, the wafer speed measuring device further includes a sensor (not shown in the drawing), and the sensor is connected to the tachometer wheel 12 and is configured to measure the rotational speed of the tachometer wheel 12, so as to obtain the rotational speed of the wafer 14 to be measured.
In this embodiment, the telescopic member 13 is an air cylinder 131, and the air cylinder 131 is fixedly connected with the tachometer wheel 12, specifically, the fixing member 123 through an air cylinder shaft 132. In other embodiments, the retractable member 13 may be a retractable member such as a spring.
With continued reference to fig. 1A, in this embodiment, the wafer speed measuring device further includes a fixing block 15, where the fixing block 15 is fixedly disposed in the chamber 10 and located at an end of the retractable component 13 away from the tachometer wheel 12, and the bottom of the chamber 10 is fixedly connected with the retractable component 13 through the fixing block 15.
Further, a positioning pin or a positioning hole is fixedly provided in the chamber 10, and a positioning hole or a positioning pin is correspondingly provided on a side of the fixing block 15 contacting with the chamber 10, and the positioning pin can be inserted into the positioning hole so that the fixing block 15 is fixedly provided in the chamber 10.
As shown in fig. 1C, specifically, a positioning hole 151 is provided on a side of the fixing block 15 contacting the chamber 10, and a positioning needle (not shown) is provided on a bottom of the chamber 10. In other embodiments, a positioning needle may be disposed on a side of the fixed block 15 contacting the chamber, and a positioning hole may be disposed at the bottom of the chamber 10. In this embodiment, the number of the positioning holes 151 is 1. In other embodiments, the number of the positioning holes 151 may be plural. When the number of the positioning holes 151 is plural, the diameters of the positioning holes 151 may be different, so that foolproof installation is achieved.
As shown in fig. 1D, further, a plurality of screw holes 152 are provided in the fixing block 15, and the telescopic member 13 is fixedly mounted on the fixing block 15 by screws. Specifically, the surfaces of the fixing block 15 and the retractable member 13 are provided with a plurality of screw holes, and the retractable member 13 and the fixing block 15 are fixedly connected by a plurality of screws.
In this embodiment, the plurality of screw holes 152 are uniformly distributed around the fixing block 15. In other embodiments, the plurality of screw holes 152 may be irregularly distributed on the surface of the fixed block 15.
With continued reference to fig. 1A, in this embodiment, the retractable member 13 is sealingly connected to the fixed block 15 by a diaphragm 16. The diaphragm 16 is used to separate the chamber 10 from the telescopic member 13 and the fixed block 15, and can seal the flow passage and intercept the fluid. In other embodiments, the retractable member 13 and the fixed block 15 may be sealed by other soft materials.
Example two
Referring to fig. 2A to fig. 2C, fig. 2A is a schematic structural diagram of a first embodiment of the wafer speed measuring device according to the present utility model, fig. 2B is a schematic connecting diagram of a speed measuring wheel and a retractable component of the first embodiment of the wafer speed measuring device according to the present utility model, and fig. 2C is a schematic diagram of a contact surface between a fixing block and a chamber of the first embodiment of the wafer speed measuring device according to the present utility model.
As shown in fig. 2A, the wafer speed measuring device includes: a chamber 10, a pair of drive wheels 11, a tachometer wheel 12, a retractable member 21. The chamber 10 is used for placing a wafer 14 to be tested; the pair of driving wheels 11 are disposed in the chamber 10 and are disposed opposite to two sides of the wafer 14 to be tested, for driving the wafer 14 to be tested to rotate; the tachometer wheel 12 is disposed in the chamber 10 and contacts the wafer 14 to be measured, and is used for measuring the speed of the wafer 14 to be measured; the telescopic component 21 is fixed in the chamber 10 and fixedly connected with the tachometer wheel 12, so as to keep the tachometer wheel 12 in contact with the wafer 14 to be measured.
According to the technical scheme, the telescopic component 21 fixedly connected with the tachometer wheel 12 is arranged, when the wafer 14 to be tested is cleaned, the cleaning brush can generate a vertical downward force on the wafer 14 to be tested, the tachometer wheel 12 can be pressed downwards, the telescopic component 21 can push the tachometer wheel 12 upwards, and the wafer 14 to be tested is ensured to be in contact with the tachometer wheel 12. Therefore, the height of the tachometer wheel 12 can be still kept in contact with the wafer 14 to be measured without adding a gasket, so that the relative positions of the tachometer wheel 12 and the pair of driving wheels 11 are actively matched, and the self-adaptive adjustment of the positions of the tachometer wheel 12 is realized.
In the present embodiment, the tachometer wheel 12 is located between the pair of driving wheels 11 and is the same as the distance between the pair of driving wheels 11. Specifically, the tachometer wheel 12 is located on the bisector of the pair of drive wheels 11.
As shown in fig. 2B, in the present embodiment, the tachometer wheel 12 includes: the rotating shaft 121, the rotating wheel 122 and the fixing piece 123. The rotating wheel 122 is sleeved on the rotating shaft 121, a clamping groove 124 is formed along the outer edge of the rotating wheel 122, and the clamping groove 124 is used for clamping the wafer 14 to be tested; the fixing piece 123 is sleeved on the rotating shaft 121 and concentrically arranged with the rotating wheel 122, a space exists between the fixing piece 123 and the rotating wheel 122, and the fixing piece 123 is fixedly connected with the telescopic component 21. Specifically, when the wafer 14 to be tested rotates, the rotating wheel 122 is driven to rotate. When the wafer 14 is positioned too high or too low, the retractable member 21 pushes or pulls the fixing member 123 upward or downward, so that the tachometer wheel 12 keeps in contact with the wafer 14.
In this embodiment, the wafer speed measuring device further includes a sensor (not shown in the drawing), and the sensor is connected to the tachometer wheel 12 and is configured to measure the rotational speed of the tachometer wheel 12, so as to obtain the rotational speed of the wafer 14 to be measured.
In this embodiment, the retractable member 21 is a spring, and the spring 21 is fixedly connected to the tachometer wheel 12, specifically, fixedly connected to the fixing member 123. In other embodiments, the telescopic member 21 may be a telescopic member such as a cylinder.
With continued reference to fig. 2A, in this embodiment, the wafer speed measuring device further includes a fixing block 15, where the fixing block 15 is fixedly disposed in the chamber 10 and located at an end of the retractable component 21 away from the tachometer wheel 12, and the bottom of the chamber 10 is fixedly connected with the retractable component 21 through the fixing block 15.
Further, a positioning pin or a positioning hole is fixedly provided in the chamber 10, and a positioning hole or a positioning pin is correspondingly provided on a side of the fixing block 15 contacting with the chamber 10, and the positioning pin can be inserted into the positioning hole so that the fixing block 15 is fixedly provided in the chamber 10.
As shown in fig. 2C, specifically, 2 positioning holes 151 are provided on a side of the fixing block 15 contacting the chamber 10, and 2 positioning pins (not shown) are provided on a bottom of the chamber 10. In other embodiments, a positioning needle may be disposed on a side of the fixed block 15 contacting the chamber, and a positioning hole may be disposed at the bottom of the chamber 10. In the present embodiment, the number of the positioning holes 151 is 2, and the diameters of the 2 positioning holes 151 are the same, thereby achieving foolproof installation. In other embodiments, the number of the positioning holes 151 may be 1 or more. When the number of the positioning holes 151 is plural, the diameters of the positioning holes 151 may be different, so that the fool-proof mounting effect may be further enhanced.
In this embodiment, the spring 21 is welded to the fixing block 15 for fixing.
With continued reference to fig. 2A, in this embodiment, the retractable member 21 is sealingly connected to the fixed block 15 via a diaphragm 16. The diaphragm 16 is used to separate the chamber 10 from the telescopic member 21 and the fixed block 15, and can seal the flow passage and intercept the fluid. In other embodiments, the retractable member 21 and the fixed block 15 may be sealed and connected by other soft materials.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the statement "comprises" and "comprising" does not exclude the presence of other elements than those listed in any process, method, article, or apparatus that comprises the element.
The embodiments of the present utility model are described in a related manner, and the same similar parts between the embodiments are all mutually referred, and each embodiment is mainly described in the differences from the other embodiments.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model. It should be noted that modifications and adaptations to the present utility model may occur to one skilled in the art without departing from the principles of the present utility model and are intended to be comprehended within the scope of the present utility model.
Claims (10)
1. The wafer speed measuring device is characterized by comprising:
the cavity is used for placing a wafer to be tested;
the driving wheels are arranged in the cavity and are oppositely arranged at two sides of the wafer to be tested and used for driving the wafer to be tested to rotate;
the speed measuring wheel is arranged in the cavity and is contacted with the wafer to be measured, and is used for measuring the speed of the wafer to be measured;
and the telescopic component is fixed in the cavity and fixedly connected with the tachometer wheel, and is used for enabling the tachometer wheel to keep contact with the wafer to be measured.
2. The wafer speed measurement device of claim 1, wherein the speed measurement wheel is located between and equidistant from the pair of drive wheels.
3. The wafer speed measurement device according to claim 1, further comprising a sensor connected to the speed wheel for measuring a rotational speed of the speed wheel, thereby obtaining the rotational speed of the wafer to be measured.
4. The wafer speed measurement device of claim 1, wherein the speed measurement wheel comprises:
a rotating shaft;
the rotating wheel is sleeved on the rotating shaft, a clamping groove is formed in the outer edge of the rotating wheel, and the clamping groove is used for clamping the wafer to be tested; and
the fixing piece is sleeved on the rotating shaft and is arranged concentrically with the rotating wheel, a space exists between the fixing piece and the rotating wheel, and the fixing piece is used for being fixedly connected with the telescopic component.
5. The wafer speed measurement device of claim 1, wherein the retractable member is a cylinder fixedly connected to the speed measurement wheel via a cylinder shaft.
6. The wafer speed measurement device according to claim 1, further comprising a fixing block, wherein the fixing block is fixedly arranged in the chamber and is located at one end of the retractable component away from the speed measurement wheel, and the bottom of the chamber is fixedly connected with the retractable component through the fixing block.
7. The wafer speed measurement device according to claim 6, wherein the retractable member is hermetically connected to the fixed block via a diaphragm.
8. The wafer speed measuring device according to claim 6, wherein a positioning pin or a positioning hole is fixedly arranged in the chamber, a positioning hole or a positioning pin is correspondingly arranged on one side of the fixed block, which contacts with the chamber, and the positioning pin can be inserted into the positioning hole so that the fixed block is fixedly arranged in the chamber.
9. The wafer speed measuring device according to claim 6, wherein a plurality of screw holes are provided on the fixing block, and the retractable member is fixedly mounted on the fixing block by screws.
10. The wafer speed measurement device according to claim 9, wherein the plurality of screw holes are uniformly distributed around the fixed block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321281950.7U CN219657664U (en) | 2023-05-24 | 2023-05-24 | Wafer speed measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321281950.7U CN219657664U (en) | 2023-05-24 | 2023-05-24 | Wafer speed measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219657664U true CN219657664U (en) | 2023-09-08 |
Family
ID=87855308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321281950.7U Active CN219657664U (en) | 2023-05-24 | 2023-05-24 | Wafer speed measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219657664U (en) |
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2023
- 2023-05-24 CN CN202321281950.7U patent/CN219657664U/en active Active
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