CN219644196U - Flexible circuit board bonding pad windowing - Google Patents
Flexible circuit board bonding pad windowing Download PDFInfo
- Publication number
- CN219644196U CN219644196U CN202320989504.5U CN202320989504U CN219644196U CN 219644196 U CN219644196 U CN 219644196U CN 202320989504 U CN202320989504 U CN 202320989504U CN 219644196 U CN219644196 U CN 219644196U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- copper foil
- windowing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000011889 copper foil Substances 0.000 claims abstract description 46
- 230000001681 protective effect Effects 0.000 claims abstract description 8
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Abstract
The utility model provides a flexible circuit board bonding pad windowing device, which comprises a substrate and a flexible circuit board, wherein the front side and the back side of the flexible circuit board are covered with a layer of PI protective film, the surface of the flexible circuit board is provided with a positive copper foil and a negative copper foil which are bilaterally symmetrical, and one ends of the positive copper foil and the negative copper foil are provided with windowing holes. The distance between one side surface of the positive electrode copper foil and one side surface of the negative electrode copper foil and the two side surfaces of the flexible circuit board is 1-1.2 mm. The utility model can ensure that tin plating is enough during welding, and the problems of false welding and bad generation are avoided, meanwhile, the area of the flexible circuit board is reduced, the cost is reduced, the strength of the flexible circuit board is further improved, and the flexible circuit board is not broken during soldering; the flexible circuit board can reduce the use area of the flexible circuit board, reduce the cost, and simultaneously, the problem of short circuit caused by soldering tin can not occur.
Description
Technical Field
The utility model particularly relates to a flexible circuit board bonding pad windowing.
Background
Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible, insulating substrates. The flexible circuit provides excellent electrical performance, meets the design requirements of smaller and higher density mounting, and also helps reduce assembly processes and enhance reliability.
However, the existing flexible circuit board has certain defects, for example, the window on the flexible circuit board is all the windows, (refer to fig. 2), so that the welding part of the flexible circuit board is easy to break when the flexible circuit board is welded, thereby causing the product to be poor and reducing the production yield.
Disclosure of Invention
The utility model provides a flexible circuit board bonding pad windowing device which can effectively solve the problems.
The utility model is realized in the following way:
the utility model provides a flexible circuit board pad windowing, includes base member and flexible circuit board, the positive and negative both sides of flexible circuit board are covered with one deck PI protection film, the surface of flexible circuit board just be provided with bilateral symmetry's anodal copper foil and negative pole copper foil on the PI protection film, the one end of anodal copper foil and negative pole copper foil has been seted up and has been windowed.
As a further improvement, the distance between one side surface of the positive electrode copper foil and one side surface of the negative electrode copper foil and the two side surfaces of the flexible circuit board is 1-1.2 mm.
As a further improvement, the spacing between the positive and negative copper foils is 0.3 to 0.5mm.
As a further improvement, the height of the window is 1-2 mm, and the area size of the window is 0.8-1 mm.
As a further improvement, the PI protective film is a thin film type insulating material.
The beneficial effects of the utility model are as follows:
(1) Through the windowing of improvement, can guarantee when the welding, the tin is enough, can not appear false welding and produce bad problem, simultaneously, also reduced the area of flexible line way board, reduce cost to the intensity of flexible line way board has also further been improved, can not break during soldering tin.
(2) The distance between the two windows and the copper foil is limited, so that the service area of the flexible circuit board can be reduced, the cost is reduced, and meanwhile, the problem of short circuit caused by soldering tin can be avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of the improved utility model.
Fig. 2 is a primary structural view of the present utility model.
Reference numerals illustrate:
1. a base; 2. a flexible circuit board; 3. a PI protective film; 4. a positive electrode copper foil; 5. a negative copper foil; 6. and (5) windowing.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model.
In the description of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Referring to fig. 1, a flexible circuit board pad windowing device comprises a substrate 1 and a flexible circuit board 2. Specifically, the flexible circuit board 2 is the only solution to meet the miniaturization and movement requirements of electronic products, can be freely bent, rolled and folded, can bear millions of dynamic bending without damaging wires, can be randomly arranged according to the space layout requirements, and can be randomly moved and stretched in a three-dimensional space, thereby achieving the integration of component assembly and wire connection; the flexible circuit board can greatly reduce the volume and weight of the electronic product, and is suitable for the requirements of the electronic product on high density, miniaturization and high reliability.
The front and back sides of the flexible circuit board 2 are covered with a layer of PI protective film 3, and the PI protective film 3 is made of a film type insulating material. Preferably, the PI protective film 3 is specifically a polyimide film of benzene type, which has excellent mechanical properties and high tensile strength, and at the same time, improves the strength of the flexible circuit board 2, ensuring that the flexible circuit board 2 is not broken during spot welding.
The surface of the flexible wiring board 2 is provided with a positive electrode copper foil 4 and a negative electrode copper foil 5 which are bilaterally symmetrical on the PI protective film 3. Specifically, the positive electrode copper foil 4 and the negative electrode copper foil 5 are fixed to the flexible wiring board 2 by electroplating. The positive copper foil 4 and the negative copper foil 5 serve as connection circuits for connection with other electronic components. The distance between one side surface of the positive copper foil 4 and the negative copper foil 5 and the two side surfaces of the flexible circuit board 2 is 1-1.2 mm. Specifically, in order to reduce the usage area of the flexible circuit board 2 as much as possible, the distances between the anode copper foil 4 and the cathode copper foil 5 and the two side surfaces of the flexible circuit board 2 are not too large, the limiting distance is 1-1.2 mm, a certain cost can be reduced, and if the distance is too large, the area of the flexible circuit board 2 is larger, and the cost is increased. The spacing between the positive electrode copper foil 4 and the negative electrode copper foil 5 is 0.3-0.5 mm. Specifically, if the spacing between the positive copper foil 4 and the negative copper foil 5 is too large, the area of the flexible circuit board 2 will also increase; if the pitch between the positive electrode copper foil 4 and the negative electrode copper foil 5 is too small, tin tends to adhere during soldering, and short circuit occurs, so that the pitch between the positive electrode copper foil 4 and the negative electrode copper foil 5 is preferably 0.3 to 0.5mm.
A window 6 is formed at one end of the positive copper foil 4 and one end of the negative copper foil 5, the height of the window 6 is 1-2 mm, if the height of the window 6 is too low, tin coating is insufficient during welding, false welding occurs, and defects are generated; if the height of the window 6 is too high, the length of the flexible wiring board 2 increases, and the cost increases, so the window height is preferably 1 to 2mm. The width of the window 6 is 0.5-1 mm. If the width of the window 6 is too large, the distance is too large, and the area of the flexible circuit board 2 is increased along with the too large width; if the width of the window 6 is too small, the strength of the positive electrode copper foil 4 and the negative electrode copper foil 5 is not sufficient, and the window 6 is easily broken, so that the height is preferably 0.5 to 1mm.
Further, referring to fig. 2, the original (hatched portion in the drawing) is the whole window 6, and compared with the improved window 6, the improved window 6 is more convenient to weld, has higher strength, is not broken during welding, and is more convenient to use.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and various modifications and variations may be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (5)
1. The utility model provides a flexible line way board pad windowing, includes base member (1) and flexible line way board (2), its characterized in that, the positive and negative sides of flexible line way board (2) are covered with one deck PI protection film (3), the surface of flexible line way board (2) just be provided with bilateral symmetry's anodal copper foil (4) and negative pole copper foil (5) on PI protection film (3), fenestration (6) have been seted up to the one end of anodal copper foil (4) and negative pole copper foil (5).
2. The flexible circuit board bonding pad windowing device according to claim 1, wherein the distance between one side surface of the positive copper foil (4) and one side surface of the negative copper foil (5) and two side surfaces of the flexible circuit board (2) is 1-1.2 mm.
3. The flexible circuit board bonding pad windowing according to claim 1, characterized in that the spacing between the positive copper foil (4) and the negative copper foil (5) is 0.3-0.5 mm.
4. The flexible circuit board bonding pad windowing according to claim 1, characterized in that the height of the windowing (6) is 1-2 mm, and the area size of the windowing (6) is 0.8-1 mm.
5. The flexible circuit board bonding pad windowing device according to claim 1, wherein the PI protective film (3) is a film type insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320989504.5U CN219644196U (en) | 2023-04-27 | 2023-04-27 | Flexible circuit board bonding pad windowing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320989504.5U CN219644196U (en) | 2023-04-27 | 2023-04-27 | Flexible circuit board bonding pad windowing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219644196U true CN219644196U (en) | 2023-09-05 |
Family
ID=87813347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320989504.5U Active CN219644196U (en) | 2023-04-27 | 2023-04-27 | Flexible circuit board bonding pad windowing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219644196U (en) |
-
2023
- 2023-04-27 CN CN202320989504.5U patent/CN219644196U/en active Active
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| GR01 | Patent grant |