CN219642799U

CN219642799U - Wafer tray

Info

Publication number: CN219642799U
Application number: CN202320512634.XU
Authority: CN
Inventors: 王国韬; 黄振洋
Original assignee: Ningbo Deli Mems Chip Technology Co ltd
Current assignee: Ningbo Deli Mems Chip Technology Co ltd
Priority date: 2023-03-09
Filing date: 2023-03-09
Publication date: 2023-09-05
Anticipated expiration: 2033-03-09

Abstract

The utility model relates to a wafer tray, comprising: the upper surface of the tray body is provided with a placement area for placing wafers; the method is characterized in that: further comprises: the first fixing keys are at least two, are circumferentially arranged around the placement area and are propped against the round outer edge of the wafer; and the second fixing keys are circumferentially arranged around the placement area and are propped against the positioning edge of the wafer, and the positions of the second fixing keys are adjusted in a mode of approaching or separating from the placement area according to the difference of the chord center distances of the positioning edge of the wafer, so that the second fixing keys are propped against the positioning edge, and the wafer is fixed. The utility model has the advantages that: the wafer tray is simple in structure, can fix the wafer, and is good in installation stability.

Description

Wafer tray

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer tray suitable for wafer manufacturing equipment such as an exposure machine.

Background

In the semiconductor manufacturing process, wafers are very common production materials, and when the wafers are subjected to surface treatment, multiple exposure and development processes are required. The wafer is generally circular and has a rectilinear alignment edge for differentiating between the P/N type and its crystal orientation.

The existing exposure machine is provided with a vacuum hole from a tray carrying wafers, the wafers are adsorbed on the tray through the vacuum hole, for example, the Chinese patent application No. CN201510608938.6 (application publication No. CN 105159035A) discloses a wafer carrying platform (also called as a wafer tray) for improving wafer deformation, but the existing tray has the following use limitations: the surface of the produced wafer is provided with grooves, and because the grooves of the vacuum holes and the wafer are easy to interfere, the wafer cannot be well adsorbed on the tray after being placed on the exposure machine, and the product is influenced during exposure. Accordingly, there is a need for further improvements in the art.

Disclosure of Invention

The utility model aims to solve the technical problem of providing a wafer tray with stable wafer installation and simple structure.

The technical scheme adopted for solving the technical problems is as follows: a wafer pallet comprising:

the upper surface of the tray body is provided with a placement area for placing wafers;

the method is characterized in that: further comprises:

the first fixing keys are at least two, are circumferentially arranged around the placement area and are propped against the round outer edge of the wafer;

at least two second fixing keys are circumferentially arranged around the placement area and are propped against the positioning edge of the wafer; and the second fixing key is adjusted to be close to or far away from the placement area according to different chord center distances of the positioning edge of the wafer, so that the second fixing key is abutted against the positioning edge, and the wafer is fixed.

In order to achieve the fixing stability of the wafer, each first fixing key comprises a first abutting part which is tangent to the circular outer edge of the wafer in a straight line, namely: the first fixed key is abutted against the round outer edge of the wafer through the first abutting part.

Further, all second fixed keys are arranged at intervals along the length direction of the positioning edge of the wafer in sequence, and each second fixed key comprises a second abutting part parallel to the positioning edge of the wafer, namely: the second fixed key is propped against the positioning edge of the wafer through the second propping part.

In order to avoid that the first and second fixing keys for fixing the wafer affect the exposure accuracy of the wafer, it is preferable that the upper surfaces of the first and second fixing keys are lower than the upper surface of the wafer.

In order to realize that the sizes of the wafer positioning edges are different and keep the mounting stability of the wafers, the placement area is positioned in the center of the tray body and is circular, the tray body is provided with sliding grooves which are positioned at the periphery of the placement area and are used for mounting the second fixing keys, the number of the sliding grooves corresponds to that of the second fixing keys, and each second fixing key can be slidably arranged in the corresponding sliding groove, so that the placement area can be relatively close to or far away from the corresponding placement area. When actually cutting the wafer, there may be an error, resulting in different dimensions of the positioning edge, so that the mounting position of the second fixing key is adjusted by mounting the second fixing key in the chute.

Preferably, the second fixing key is provided with a long hole along the sliding direction, the long hole and the mounting hole are internally provided with fasteners in a penetrating way, and the fasteners are limited at the edges of the long holes on the second fixing key so as to realize that the second fixing key can be slidably arranged in the corresponding sliding groove.

In order to realize the installation stability of the tray body, preferably, a vacuum groove is further formed in the tray body, and a plurality of vacuum holes communicated with the vacuum groove are formed in the placement area. Of course, the vacuum holes are arranged adjacent to the edge of the wafer, so that interference between the vacuum holes and the slotting of the wafer itself can be avoided.

In order to ensure the balance of the installation of the tray body, the vacuum grooves are in a radial shape as a whole by taking the center of the circle of the placement area as the center, and the vacuum holes are arranged at the end parts of the vacuum grooves.

In order to facilitate the taking of the wafer, preferably, the tray body is further provided with a preformed hole in the placement area for the wafer to be taken.

In order to realize that the tray is installed on wafer manufacturing equipment such as an exposure machine, the lower surface of the tray body is also provided with an assembling part for assembling the tray body. The assembly part can be a buckle or a detachable connection mode such as a clamping groove.

Compared with the prior art, the utility model has the advantages that: the limiting of the wafer is realized by abutting at least two first fixed keys circumferentially arranged around the placement area against the round outer edge of the wafer; and the wafer is propped against the positioning edge of the wafer through at least two second fixing keys, so that the wafer can be stably installed; in addition, the second fixing key is restrained on the tray body in a mode of approaching or separating from the placement area, so that the position of the second fixing key can be adjusted according to the chord center distance of the positioning edge of the wafer from the circle center. Therefore, the wafer tray has a simple structure, can realize the fixation of the wafer, and has good installation stability.

Drawings

FIG. 1 is a schematic view of a tray with wafers mounted thereon according to an embodiment of the present utility model;

FIG. 2 is a schematic view of another view angle structure of FIG. 1;

FIG. 3 is an exploded view of FIG. 1;

FIG. 4 is a cross-sectional view of FIG. 1;

FIG. 5 is another cross-sectional view of FIG. 1;

fig. 6 is a schematic structural view of the first and second fixing keys in fig. 1.

Detailed Description

The utility model is described in further detail below with reference to the embodiments of the drawings.

As shown in fig. 1-6, is a preferred embodiment of the present utility model. The wafer tray in this embodiment includes a tray body 1, a placement area 11 provided on an upper surface of the tray body 1 for placing the wafer 2, and first and second fixing keys 31 and 32 circumferentially arranged around the placement area 11. Wherein, at least two first fixing keys 31 are abutted against the round outer edge 21 of the wafer 2; the second fixing keys 32 are at least two and are abutted against the positioning edge 22 of the wafer 2, and the second fixing keys 32 are restrained on the tray body 1 in a mode of being capable of approaching to or separating from the placement area 11, so that the positions of the second fixing keys 32 can be adjusted according to the chord center distance of the positioning edge 22 of the wafer 2 (the chord center distance of the positioning edge 22 refers to the length from the center of the circle of the wafer 2 to the vertical line segment of the positioning edge 22) so as to fix the wafer 2. The round outer edge 21 of the wafer 2 is limited by the first fixing key 31 to prevent the wafer 2 from shifting, and the positioning edge 22 of the wafer 2 is fixed by the second fixing key 32, so that the wafer 2 can be effectively kept stably installed, and the wafer 2 is prevented from shifting to cause the influence on the product during exposure.

As shown in fig. 1, 3 and 6, each of the first fixing keys 31 includes a first abutment portion 311 which is linear and tangential to the circular outer edge 21 of the wafer 2, namely: the first fixed key 31 is abutted against the circular outer edge 21 of the wafer 2 through the first abutting portion 311; all the second fixing keys 32 are sequentially arranged at intervals along the length direction of the positioning edge 22 of the wafer 2, and each second fixing key 32 comprises a second abutting portion 321 parallel to the positioning edge 22 of the wafer 2, namely: the second fixing key 32 abuts against the positioning edge 22 of the wafer 2 through the second abutting portion 321. In this embodiment, as shown in fig. 6, the first fixing key 31 and the second fixing key 32 have the same structure, that is, the first abutting portion 311 and the second abutting portion 321 are the same component and are all in straight lines, so that both the contact with the circular outer edge 21 of the wafer 2 and the contact with the positioning edge 22 of the wafer 2 can be realized. As shown in fig. 4, when the first and second fixing keys 31 and 32 are abutted against the outer periphery of the wafer 2, the upper surfaces of the first and second fixing keys 31 and 32 are lower than the upper surface of the wafer 2, so that the influence on the exposure is reduced.

As shown in fig. 3, the placement area 11 in the present embodiment is located at the center of the tray body 1 and is circular, the tray body 1 is provided with sliding grooves 13 located at the periphery of the placement area 11 and used for installing the second fixing keys 32, the number of the sliding grooves 13 corresponds to that of the second fixing keys 32, and each second fixing key 32 can be slidably arranged in the corresponding sliding groove 13, so that the tray body can be close to or far away from the placement area 11. As shown in fig. 3, 4 and 6, the sliding groove 13 in this embodiment is provided with a mounting hole 14, the second fixing key 32 is provided with a long hole 30 arranged along the sliding direction thereof, the long hole 30 and the mounting hole 14 are internally provided with a fastener 4, and the fastener 4 is limited at the edge of the long hole 30 on the second fixing key 32, so that the second fixing key 32 with the adjusted position is fixed in the corresponding sliding groove 13. As shown in fig. 3, the fastener 4 is a screw, and the mounting hole 14 is a screw hole. Thus, when the positioning edges 22 of the wafers 2 are different in size, the positions of the second fixing keys 32 are adjusted so that the second fixing keys 32 are abutted against the positioning edges 22 of the wafers 2 with different sizes, and the fixed mounting of the wafers can be maintained.

Naturally, the tray body 1 is provided with a mounting groove 12 for mounting the first fixing key 31, the mounting groove 12 is provided with a through hole 121, and the mounting groove 12 can have the same structure as the chute 13.

In addition, in order to further improve the stability of the tray installation, a vacuum groove 15 is further provided in the tray body 1, and a plurality of vacuum holes 16 communicated with the vacuum groove 15 are provided on the placement area 11. As shown in fig. 5, in the present embodiment, the vacuum grooves 15 are entirely radial with the center of the placement area 11 as the center, and the vacuum holes 16 are provided at the ends of the respective vacuum grooves 15. And the tray body 1 is also internally provided with air pipes 19 communicated with the vacuum grooves 15, and the connecting ports of the air pipes 19 are positioned at the edge of the tray body 1, so that the vacuum grooves 15 can be vacuumized through the air pipes 19.

The tray body 1 is also provided with a preformed hole 17 for taking the wafer 2 in the placement area 11; the lower surface of the tray body 1 is also provided with an assembly part 18 for assembling the tray body 1, as shown in fig. 2, the assembly part 18 is a clamping groove, and mortise and tenon joint can be carried out with wafer manufacturing equipment such as an exposure machine through the assembly part 18, so that the disassembly is convenient.

When the wafer is exposed, the wafer tray in this embodiment can be directly fixed on the exposure machine by a worker through mortise and tenon mode, the wafer is placed on the wafer tray, then the round outer edge of the wafer 2 is fixed through the first fixing key 31, the wafer is fixed by adjusting the second fixing key 32, and finally the wafer exposure operation is executed. Therefore, the wafer tray in this embodiment adsorbs the wafer on the tray by means of vacuum adsorption, and also fixes the wafer by means of the first fixing key and the second fixing key, so as to achieve good mounting stability of the wafer; and the wafer storage device also has the functions of being convenient for placing wafers, taking the wafers, carrying and cleaning and the like.

Claims

1. A wafer pallet comprising:

the upper surface of the tray body (1) is provided with a placement area (11) for placing the wafer (2);

the method is characterized in that: further comprises:

a first fixed key (31), at least two of which are arranged circumferentially around the placement area (11) and abut against the circular outer edge (21) of the wafer (2);

the second fixing keys (32) are circumferentially arranged around the placement area (11) and are abutted against the positioning edge (22) of the wafer (2); the second fixing key (32) is adjusted to be close to or far from the placement area (11) according to the difference of the chord center distances of the positioning edge (22) of the wafer (2), so that the second fixing key (32) is abutted against the positioning edge (22) to fix the wafer (2).

2. The wafer pallet of claim 1, wherein: each first fixing key (31) comprises a first abutment (311) tangent to the circular outer edge (21) of the wafer (2) in a straight line, namely: the first fixed key (31) is abutted against the circular outer edge (21) of the wafer (2) through the first abutting part (311).

3. The wafer pallet of claim 2, wherein: the second fixed keys (32) are sequentially arranged at intervals along the length direction of the positioning edge (22) of the wafer (2), and each second fixed key (32) comprises a second abutting part (321) parallel to the positioning edge (22) of the wafer (2), namely: the second fixed key (32) is abutted against the positioning edge (22) of the wafer (2) through the second abutting part (321).

4. A wafer pallet as defined in claim 3, wherein: the upper surfaces of the first fixed key (31) and the second fixed key (32) are lower than the upper surface of the wafer (2).

5. The wafer pallet according to any one of claims 1 to 4, wherein: the tray is characterized in that the placement area (11) is located in the center of the tray body (1) and is circular, sliding grooves (13) which are located at the periphery of the placement area (11) and are used for installing second fixing keys (32) are formed in the tray body (1), the number of the sliding grooves (13) corresponds to the number of the second fixing keys (32), and each second fixing key (32) can be slidably arranged in the corresponding sliding groove (13), so that the tray can be relatively placed in the area (11) to be close to or far away from the corresponding sliding groove.

6. The wafer pallet as defined in claim 5, wherein: the mounting hole (14) has been seted up in spout (13), be equipped with slot hole (30) that set up along its slip direction in second fixed key (32), wear to be equipped with fastener (4) in slot hole (30) and mounting hole (14), fastener (4) limit are located slot hole (30) edge on second fixed key (32) to realize that second fixed key (32) can locate in corresponding spout (13) with sliding.

7. The wafer pallet as defined in claim 5, wherein: the tray is characterized in that a vacuum groove (15) is further formed in the tray body (1), and a plurality of vacuum holes (16) communicated with the vacuum groove (15) are formed in the placement area (11).

8. The wafer pallet as defined in claim 7, wherein: the vacuum grooves (15) are in a radial shape as a whole by taking the center of the placement area (11) as the center, and the vacuum holes (16) are arranged at the end parts of the vacuum grooves (15).

9. The wafer pallet as defined in claim 8, wherein: the tray body (1) is also provided with a reserved hole (17) for taking the wafer (2) in the placement area (11).

10. The wafer pallet as defined in claim 9, wherein: the lower surface of the tray body (1) is also provided with an assembling part (18) for assembling the tray body (1).